Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. In-depth Analysis of Technical Parameters
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- The specification sheet indicates that the product is "graded by luminous intensity." This refers to a classification process after production, known as "binning." After manufacturing is complete, each display is tested and sorted into different performance groups (bins) based on key parameters. For the LTS-5601AJG, the primary binning characteristic is its luminous intensity at a standard test current (which may be 1mA or 20mA). This ensures customers receive products with consistent brightness levels. While the specification sheet provides the full Min/Typ range, production batches are typically offered within a narrower intensity range. Designers should consult specific procurement documents or contact the manufacturer to obtain available binning codes. For applications where multiple displays are used side-by-side, consistent binning is crucial to prevent noticeable brightness variations between units. 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Luminous Intensity vs. Ambient Temperature
- 4.4 Dangi Ƙarfi vs. Tsawon Zango (Bakan)
- 5. Mechanical and Packaging Information
- 6. Soldering and Assembly Guide
- 7. Shawarwari na aikace-aikace
- 7.1 Da'irar aikace-aikace ta yau da kullun
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Parameter-Based)
- 9.1 Why are there two common anode pins (3 and 8)?
- 9.2 Can I drive this display with a 3.3V microcontroller system?
- 9.3 Jinsi ya kuhesabu matumizi ya jumla ya nguvu ya skrini?
- 10. Practical Design Case Studies
- 11. Working Principles
- 12. Technology Trends
1. Product Overview
LTS-5601AJG is a high-performance, single-digit, seven-segment display module. Its primary function is to provide clear and bright numeric and limited alphabetic character displays in electronic devices. Its core technology is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material, which is specifically designed for efficient light emission within the green-yellow spectral range. The device features a common anode configuration, meaning the anodes of all LED segments are internally connected to a common pin, thereby simplifying the current drive circuitry. The display utilizes a gray panel, which enhances contrast and improves readability under various ambient lighting conditions by reducing reflections. The segments themselves emit a distinctive green light, chosen for its high luminous efficiency and excellent visibility to the human eye. This product is specifically designed for digital indication applications requiring reliability, longevity, and energy efficiency.
1.1 Core Advantages and Target Market
Wannan nuni yana da fa'idodi masu mahimmanci da yawa, wanda ya sa ya dace da aikace-aikacen masana'antu da na mabukaci. Ƙarancin amfani da wutar lantarki shine fa'ida mai mahimmanci, yana sauƙaƙe haɗawa cikin tsarin da ake amfani da baturi ko kuma mai kulawa da amfani da wutar lantarki. Haskakawa da bambanci mai girma suna tabbatar da karantawa a sarari ko da a cikin yanayi mai haske. Faɗin kusurwar gani yana ba da aikin gani iri ɗaya daga kusurwoyi daban-daban, wanda ke da mahimmanci ga ma'auni da kayan aikin panel. Tsayayyen amincin fasahar LED, ba tare da sassan motsi ba, mai juriya ga girgiza da rawar jiki, yana tabbatar da tsawon rayuwa. Na'urar kuma tana da matsayi bisa ƙarfin haske, ma'ana an gwada samfurin don cika takamaiman ma'auni na haske, yana tabbatar da daidaiton aiki a cikin rukunin samarwa. Kasuwar da aka yi niyya don wannan ɓangaren ta haɗa da na'urorin aunawa da aunawa, panel iko na masana'antu, na'urorin kiwon lafiya, dashboard na mota (don nunin bayan saye ko taimako), na'urorin mabukaci, da kowane tsarin lantarki da ke buƙatar karatun lamba mai ƙarfi da bayyananne.
2. In-depth Analysis of Technical Parameters
Wannan sashe yana ba da cikakken bincike na gaskiya akan mahimman sigogi na lantarki, na gani, da na zafi da aka ƙayyade a cikin takardar ƙayyadaddun bayanai. Fahimtar waɗannan ƙididdiga yana da mahimmanci don ƙirar da'ira daidai da kuma tabbatar da cewa nuni yana aiki a cikin amintaccen taga mafi kyawun aiki.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.
- Power consumption per segment:70 mW. This is the maximum electrical power that a single segment can convert into heat (and light) without risk of damage. Exceeding this value, especially continuously, may lead to overheating, accelerated luminous flux degradation, and ultimately failure.
- Peak forward current per segment:60 mA (duty cycle 1/10, pulse width 0.1ms). This rating allows higher current short pulses to achieve instantaneous brightness peaks, suitable for multiplexing schemes or high-brightness display. The specified duty cycle and pulse width are crucial; the average current must still comply with the continuous rating.
- Continuous forward current per segment:25 mA (at 25°C). This is the recommended maximum current for steady-state continuous illumination of a segment. The datasheet specifies a derating factor of 0.33 mA/°C above 25°C. This means if the ambient temperature (Ta) increases, the maximum allowable continuous current must be linearly reduced to prevent overheating. For example, at 50°C, the maximum current is 25 mA - (0.33 mA/°C * 25°C) = 16.75 mA.
- Reverse voltage per segment:5 V. The reverse breakdown voltage of an LED is relatively low. Applying a reverse bias exceeding 5V may cause a sudden increase in reverse current, potentially damaging the PN junction.
- Operating and storage temperature range:-35°C to +85°C. The device is rated for operation and storage within this wide temperature range, making it suitable for harsh environments.
- Welding Temperature:260°C for 3 seconds, measured at 1/16 inch (≈1.6mm) below the mounting surface. This defines the reflow soldering profile to avoid thermal damage to the LED chip during assembly.
2.2 Electrical and Optical Characteristics
These parameters are measured under specific test conditions (typically Ta=25°C) and define the typical performance of the device.
- Average luminous intensity (IV):320 μcd (min), 900 μcd (typ), at IFAt I_F = 1mA. This is a measure of the perceived luminous power emitted by the segment. The wide range (minimum to typical) indicates natural variations in manufacturing; designers should use the minimum value for worst-case brightness calculations. The 1mA test current is a standard low-current condition for characterizing luminous efficiency.
- Peak Emission Wavelength (λp):571 nm (typical), at I_FF=20mA. This is the wavelength at which the spectral power distribution of the emitted light reaches its maximum. 571 nm is located in the green-yellow region of the visible spectrum.
- Spectral Line Half-Width (Δλ):15 nm (typical value). This indicates the spectral purity or bandwidth of the emitted light. The value of 15 nm is relatively narrow, characteristic of AlInGaP LEDs, producing a saturated green.
- Dominant wavelength (λd):572 nm (typical value). This is the single wavelength that most closely matches the perceived color of the light to the human eye. In this case, it is very close to the peak wavelength.
- Forward voltage per segment (VF):2.05V (minimum), 2.6V (typical), at IF=20mA. This is the forward voltage drop when the LED segment is operating. It is crucial for designing the current limiting circuit. The driving supply voltage must be higher than VF. The typical 2.6V is higher than standard GaAsP red LEDs, but lower than many blue/white LEDs.
- Reverse current per segment (IR):100 μA (maximum), at VRWhen =5V. This is the leakage current when the maximum reverse voltage is applied.
- Luminous intensity matching ratio (IV-m):2:1 (maximum). This specifies that under the same driving conditions (IFAt a specified test current (e.g., =1mA), the maximum allowable ratio between the brightest and darkest segments within a single device. A 2:1 ratio ensures a reasonably uniform appearance.
3. Explanation of the Binning System
The datasheet states that the product is "graded by luminous intensity." This refers to a post-production sorting process called "binning." After manufacturing, each display is tested and sorted into different performance groups (bins) based on key parameters. For the LTS-5601AJG, the primary binning characteristic is its luminous intensity at a standard test current (likely 1mA or 20mA). This ensures customers receive products with consistent brightness levels. While the datasheet provides the full Min/Typ range, production batches are typically offered within a narrower intensity range. Designers should consult specific procurement documents or contact the manufacturer for available bin codes. For applications using multiple displays side-by-side, consistent binning is crucial to prevent noticeable brightness variations between units.
4. Performance Curve Analysis
The datasheet references "Typical Electrical/Optical Characteristic Curves." Although specific graphs are not provided in the text, we can infer their standard content and importance. These curves visually represent the relationships between key parameters, offering deeper insights than single-point data.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
This fundamental curve shows the exponential relationship between the current flowing through an LED and the voltage across its terminals. It graphically illustrates the forward voltage (VF) Specification. The curve will show a "knee" voltage (approximately 2V), after which the current increases rapidly with a small increase in voltage. This highlights why an LED must be driven by a current-limited source, not a voltage source, to prevent thermal runaway.
4.2 Luminous Intensity vs. Forward Current
This curve shows how light output increases with drive current. For AlInGaP LEDs, the relationship is typically linear over a wide current range, but becomes sublinear at very high currents due to efficiency droop (increased heating). This curve helps designers select an operating current to achieve the desired brightness while balancing efficiency and lifetime.
4.3 Luminous Intensity vs. Ambient Temperature
This curve describes the thermal dependence of light output. As the LED junction temperature increases, its luminous intensity typically decreases. The slope of this curve quantifies the thermal derating of brightness. This is crucial for designs operating in high-temperature environments, as the display may appear dimmer than expected at room temperature.
4.4 Dangi Ƙarfi vs. Tsawon Zango (Bakan)
This graph plots the spectral power distribution, showing the intensity of light emitted at each wavelength. It will center around a peak/dominant wavelength of 571-572 nm, with a shape defined by a 15 nm half-width. This curve confirms the LED's color characteristics.
5. Mechanical and Packaging Information
The device comes with a detailed package dimension drawing (mentioned but not detailed in the text). Key mechanical features include a 0.56-inch (14.22 mm) character height, which is standard for medium-to-large numeric displays. The package is through-hole type (DIP - Dual In-line Package) with 10 pins on a 0.1-inch (2.54 mm) pitch, a universal standard for easy PCB mounting and hand-built prototyping. The gray panel and green segments are part of the package design. The "Rt. Hand Decimal" note in the description indicates the position of the decimal point relative to the digits. A right-hand decimal is standard for most numeric displays. The internal schematic shows a common anode connection: pins 3 and 8 are internally tied together as the common anode for all segments, while pins 1, 2, 4, 5, 6, 7, 9, and 10 are the individual cathodes for segments E, D, C, DP, B, A, F, and G, respectively. This configuration is well-suited for multiplexing with a microcontroller, where the common anodes are driven sequentially (supplied current), and the cathodes are grounded through current-limiting resistors to illuminate specific segments.
6. Soldering and Assembly Guide
Proper handling is critical for maintaining reliability. The absolute maximum ratings specify a soldering temperature of 260°C for 3 seconds, measured 1.6mm below the seating plane. This aligns with standard lead-free reflow profiles (e.g., IPC/JEDEC J-STD-020). During wave soldering or hand soldering, care must be taken to minimize total heat exposure time to prevent damage to the LED chip, bond wires, or plastic package. The use of a heat sink on the leads is recommended during hand soldering. Avoid applying mechanical stress to the package or leads. Storage should be in a dry, anti-static environment within the specified temperature range of -35°C to +85°C to prevent moisture absorption (which can cause "popcorning" during reflow) and material degradation.
7. Shawarwari na aikace-aikace
7.1 Da'irar aikace-aikace ta yau da kullun
For common anode displays like the LTS-5601AJG, the most common driving method is multiplexing. In a multiplexing circuit, the common anode pins (3 and 8) are connected to the collector (or drain) of an NPN transistor (or N-channel MOSFET), which acts as a high-side switch. The emitter/source is connected to the positive supply (Vcc). The base/gate is controlled by a microcontroller GPIO pin. Each segment cathode pin is connected to a current-limiting resistor, then to a second transistor or a dedicated LED driver IC (configured as a current sink) controlled by the microcontroller. The microcontroller cycles rapidly, turning on the anode transistor for one digit at a time while setting the corresponding cathode pattern for that digit. Persistence of vision makes all digits appear continuously lit. Each segment typically uses a forward current of 10-20 mA, and the resistor is calculated using the formula R = (Vcc - VF- VCE(sat)) / IF. For a 5V power supply, VF=2.6V, and VCE(sat)=0.2V, target IF=15mA, then R = (5 - 2.6 - 0.2) / 0.015 ≈ 147 Ω (use 150 Ω).
7.2 Design Considerations
- Current Limiting:Always use a series resistor or constant current driver. Never connect an LED directly to a voltage source.
- Multiplexing frequency:使用足够高的刷新率以避免可见闪烁,通常每个数字>60 Hz。对于4位多路复用,扫描速率应>240 Hz。
- Peak current in multiplexing:Since each digit is only illuminated for a portion of the time (duty cycle = 1/N, where N is the number of digits), the instantaneous current per segment can be set higher than the continuous DC rating to achieve the desired average brightness, but must not exceed the peak forward current rating. For example, in 4-digit multiplexing (1/4 duty cycle), to achieve an average brightness equivalent to 10mA DC, you can drive with 40mA pulses, which is within a 60mA peak rating.
- Viewing Angle:ESD Protection:
- Although not explicitly stated as sensitive devices, it is recommended to take standard ESD precautions during handling and assembly for all semiconductor devices.8. Technical Comparison and Differentiation
The LTS-5601AJG is primarily differentiated by its use of AlInGaP technology. Compared to older technologies like standard GaAsP used for red and yellow LEDs, AlInGaP offers significantly higher luminous efficiency, resulting in brighter displays at the same input current or equivalent brightness at lower power. It also provides better temperature stability and color saturation. Compared to GaP green LEDs, AlInGaP green typically offers a purer green (shorter wavelength) and higher efficiency. Compared to modern InGaN blue/green/white LEDs, AlInGaP is generally more efficient in the red-amber-yellow-green spectrum but cannot produce blue or white light. For pure green numeric displays, AlInGaP represents a high-performance, mature technology choice. Its common-anode configuration is also a practical advantage for microcontroller-based systems, as it simplifies the power supply side of the driving circuit.
9. Frequently Asked Questions (Parameter-Based)
9.1 Why are there two common anode pins (3 and 8)?
These two pins are internally connected. This design serves multiple purposes: 1) To provide symmetry and mechanical stability for the package. 2) To allow for better current distribution, reducing the current density through a single pin, which is beneficial for high-brightness applications. 3) To offer flexibility in PCB layout; designers can choose to connect one or both pins to the driving circuit.
9.2 Can I drive this display with a 3.3V microcontroller system?
Yes, but careful design is required. The typical forward voltage (2.6V) is less than 3.3V, so it is feasible. However, for a simple series resistor, the voltage headroom (3.3V - 2.6V = 0.7V) is low. This small voltage difference means V
or small variations in the supply voltage will cause large changes in current. For stable operation, it is better to use a dedicated constant-current LED driver IC or a transistor-based current source, which can operate with low headroom voltage, rather than a simple resistor.F9.3 Jinsi ya kuhesabu matumizi ya jumla ya nguvu ya skrini?
For a static (non-multiplexed) display with all segments and decimal points lit: Power = Number of lit segments * I
* VF. For 8 segments (7 segments + DP), with IF=20mA and VF=2.6V, P = 8 * 0.02 * 2.6 = 0.416 W. In multiplexed applications, the average power is the sum of the power of each lit segment averaged over time. For 4-digit multiplexing lighting one digit at a time, the average current per segment is IF/ 4.F10. Practical Design Case Studies
Scenario:
Design a simple 4-digit voltmeter display using a microcontroller.Implementation:
Use four LTS-5601AJG displays. The common anode of each digit is connected to four independent GPIO pins via NPN transistors (e.g., 2N3904). The eight segment cathodes (A-G and DP) from all four displays are tied together and then connected to another eight GPIO pins through 150Ω current-limiting resistors. The microcontroller measures the voltage with its ADC, converts it to a decimal number, and extracts the four digits. It then enters a continuous loop: turn off all anode transistors, set the cathode pattern for digit 1's value, turn on digit 1's anode transistor, wait a short time (about 2ms), then repeat this process for digits 2, 3, and 4. This loop repeats at a rate exceeding 100 Hz, making the display appear stable. Brightness is controlled by the value of the current-limiting resistors and/or the duty cycle (on-time) within each digit's cycle.11. Working Principles
The LTS-5601AJG is based on the principle of electroluminescence in a semiconductor PN junction. The active region consists of AlInGaP layers grown on an opaque GaAs substrate. When a forward bias exceeding the junction's built-in potential is applied (anode positive relative to cathode), electrons from the N-type material and holes from the P-type material are injected into the active region. There, they recombine, releasing energy in the form of photons. The specific composition of the AlInGaP alloy determines the bandgap energy, which in turn determines the wavelength (color) of the emitted light—in this case, green (approximately 572 nm). The opaque substrate helps reflect the emitted light outward, improving overall light extraction efficiency. The gray panel filter absorbs ambient light, increasing contrast by reducing reflections from the underlying material.
12. Technology Trends
AlInGaP technology is a mature and highly optimized solution for high-efficiency red, amber, and pure green LEDs. Current trends in display technology for such indicators include a continued push for even higher luminous efficacy (more lumens per watt) to enable lower power consumption and reduced heat generation. There is also ongoing development in packaging to allow for higher maximum drive currents and better thermal management, enabling brighter displays. Furthermore, integration is a key trend; while discrete seven-segment displays remain popular for their simplicity and cost-effectiveness, there is a growing market for integrated display modules that include the driver IC, microcontroller interface (like I2C or SPI), and sometimes even a character generator, simplifying the design process for end engineers. However, for applications requiring customization, high brightness, or specific mechanical form factors, discrete components like the LTS-5601AJG continue to be a vital and reliable choice.
AlInGaP technology is a mature and highly optimized solution for high-efficiency red, amber, and pure green LEDs. Current trends in display technology for such indicators include a continued push for even higher luminous efficacy (more lumens per watt) to enable lower power consumption and reduced heat generation. There is also ongoing development in packaging to allow for higher maximum drive currents and better thermal management, enabling brighter displays. Furthermore, integration is a key trend; while discrete seven-segment displays remain popular for their simplicity and cost-effectiveness, there is a growing market for integrated display modules that include the driver IC, microcontroller interface (like I2C or SPI), and sometimes even a character generator, simplifying the design process for end engineers. However, for applications requiring customization, high brightness, or specific mechanical form factors, discrete components like the LTS-5601AJG continue to be a vital and reliable choice.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Units/Representation | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient it is. | Directly determines the energy efficiency rating and electricity cost of the luminaire. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether a luminaire is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | The angle at which the light intensity drops to half determines the beam width. | Affects the illumination range and uniformity. |
| Color Temperature (CCT) | K (Kelvin), e.g., 2700K/6500K | The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. | Determining the lighting atmosphere and applicable scenarios. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to restore the true color of an object, Ra≥80 is recommended. | Affects color authenticity, used in high-demand places such as shopping malls and art galleries. |
| SDCM (Standard Deviation of Color Matching) | MacAdam ellipse steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. | Ensure no color difference among the same batch of luminaires. |
| Dominant Wavelength | nm (nanometer), misali 620nm (ja) | Rangi ya LED zenye rangi zinazolingana na thamani ya urefu wa wimbi. | Kuamua rangi ya LED moja kama nyekundu, manjano, kijani, n.k. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Display the intensity distribution of light emitted by the LED across various wavelengths. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbol | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Matsakaicin ƙarfin bugun jini (Pulse Current) | Ifp | Peak current that can be sustained for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | The circuit must be protected against reverse polarity or voltage surges. |
| Thermal Resistance | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires a more robust thermal design; otherwise, the junction temperature will increase. |
| ESD Immunity | V (HBM), such as 1000V | The ability to withstand electrostatic discharge; a higher value indicates greater resistance to damage from static electricity. | Anti-static measures must be taken during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Metrics | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for brightness to drop to 70% or 80% of its initial value. | Directly defines the "lifetime" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Deterioration of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Terminology | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Packaging Type | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC tahan panas baik, biaya rendah; keramik pendinginan unggul, umur panjang. |
| Struktur chip | Face-up, Flip Chip | Chip electrode arrangement method. | Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical design | Flat, Microlens, Total Internal Reflection | Optical structure on the encapsulation surface, controlling light distribution. | Determine the beam angle and light distribution curve. |
V. Quality Control and Binning
| Terminology | Binning Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Classification | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for the same batch of products. |
| Voltage binning | Codes such as 6W, 6X | Group by forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color binning. | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven color within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Grouped by color temperature, each group has a corresponding coordinate range. | To meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standards/Testing | Popular Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Record brightness attenuation data under constant temperature conditions over a long period of illumination. | Used to estimate LED lifespan (combined with TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifetime under actual use conditions based on LM-80 data. | Provide scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure products are free from hazardous substances (e.g., lead, mercury). | Access conditions for entering the international market. |
| ENERGY STAR / DLC | Energy Efficiency Certification | Energy Efficiency and Performance Certification for Lighting Products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |