LTST-FS63HBGED SMD LED Specification Sheet - Side-View Full Color - 0.30mm Ultra-Thin - Blue/Green/Red - Simplified Chinese Technical Documentation

1. Product Overview

LTST-FS63HBGED is a highly integrated surface-mount device (SMD) LED lamp, specifically designed for modern space-constrained electronic applications. It represents a special configuration within the micro-LED series, engineered for automated printed circuit board (PCB) assembly processes. The device integrates three distinct semiconductor light sources into an extremely slim package, achieving full-color display capability within a minimal footprint.

1.1 Core Advantages and Product Positioning

The primary competitive advantage of this LED lies in its ultra-thin profile of 0.30 mm, making it a side-emitting component. This form factor is crucial for applications with extremely limited vertical space, such as ultra-thin mobile devices, wearable technology, and edge-lit panels. The integration of blue (InGaN), green (InGaN), and red (AlInGaP) chips enables the generation of a wide color gamut through individual or combined control, eliminating the need for multiple discrete monochromatic LEDs. The package features a white diffused lens, which aids in mixing light from the three chips and provides a more uniform appearance when viewed off-axis.

1.2 Target Market and Applications

This device targets a broad range of electronic equipment manufacturers. Its main application areas include:

• Consumer Electronics:Backlighting for keyboards, keypads, and status indicators in cordless/ mobile phones, laptops, tablets, and remote controls.
• Office Automation & Network Systems:Status and activity indicators in routers, switches, modems, printers, and external storage devices.
• Home Appliances and Industrial Equipment:User interface lighting, operational status lights, and symbol indicators on control panels.
• Display Technology:Suitable for micro-displays and can serve as a compact light source for small signals and symbol illumination.

The device is fully compatible with high-volume automated placement equipment and infrared (IR) reflow soldering processes, meeting the requirements of modern, RoHS-compliant production lines.

2. In-depth Technical Parameter Analysis

A thorough understanding of electrical and optical characteristics is crucial for reliable circuit design and achieving the intended performance.

2.1 Absolute Maximum Ratings

These ratings define stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not guaranteed.

• Power Dissipation (Pd):Varies by color: Blue: 97.5 mW, Green: 100.5 mW, Red: 81.0 mW. This parameter, together with the thermal resistance (implied by the derating curve), determines the maximum sustainable forward current at elevated ambient temperatures.
• Forward Current:The continuous DC forward current rating for all three colors is 30 mA. Higher peak forward currents up to 100 mA are permitted, but only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to manage junction temperature.
• Electrostatic Discharge (ESD) Threshold:Rated at 2000V (Human Body Model). This is the standard level for consumer-grade components, requiring standard ESD handling precautions during assembly.
• Temperature Range:Operating Temperature: -40°C to +85°C; Storage Temperature: -40°C to +100°C. The wide operating temperature range makes it suitable for consumer and some industrial environments.
• Soldering Conditions:Capable of withstanding infrared reflow soldering with a peak temperature of 260°C for 10 seconds, compatible with lead-free (Pb-free) soldering processes.

2.2 Electrical and Optical Characteristics (Typical Values, Ta=25°C)

These are standard test conditions and typical performance values used for design and binning.

• Luminous Intensity (Iv):Measured at specific test currents (Blue: 12mA, Green: 30mA, Red: 30mA). Typical value is 2750 mcd, minimum is 1735 mcd, maximum is 4265 mcd. The binning system handles this variation.
• Viewing Angle (2θ1/2):Very wide 130 degrees (typical). This is the full angle at which the luminous intensity drops to half of its axial value, characteristic of side-emitting LEDs with diffused lenses, providing broad and uniform illumination.
• Wavelength Parameters:
  • Peak Emission Wavelength (λP): Blue: 466 nm, Green: 516 nm, Red: 632 nm (typical).
  • Dominant Wavelength (λd): This range defines the perceived color. Blue: 467-477 nm, Green: 516-526 nm, Red: 618-628 nm.
  • Spectral Line Half-Width (Δλ): Blue: 25 nm, Green: 35 nm, Red: 20 nm (Typical). This indicates spectral purity; a smaller Δλ means the light is closer to monochromatic.
• Forward Voltage (Vf):The voltage drop across the LED under test current. The range is as follows: Blue: 2.45-3.25V, Green: 2.55-3.35V, Red: 1.90-2.70V. This range must be considered when designing the driver, especially for constant voltage power supplies.
• Reverse Current (Ir):At a reverse voltage (Vr) of 5V, the maximum is 10 μA. This test is for quality assurance; the device is not designed for reverse bias operation.

3. Binning System Description

To ensure color and brightness consistency in production, LEDs are sorted into different bins. The LTST-FS63HBGED uses two main binning criteria.

3.1 Luminous Intensity (Iv) Grade

LEDs are classified according to their luminous intensity measured at the standard test current. The bin definitions are as follows:
- Bin BB:1735 mcd (minimum) to 2340 mcd (maximum).
- Gear CC:2340 mcd (minimum) to 3160 mcd (maximum).
- Gear DD:3160 mcd (minimum) to 4265 mcd (maximum).
Apply a +/-15% tolerance within each gear. Designers must specify the required gear to guarantee the minimum brightness level for their application.

3.2 Hue (Chromaticity) Grade

This is a more complex two-dimensional binning based on CIE 1931 (x, y) chromaticity coordinates. The datasheet provides a bin matrix (e.g., B0, B1, B2, B3, C0, C1... D3). Each bin is defined by a quadrilateral area on the chromaticity diagram. For example, bin B0 covers coordinates within the boundaries defined by (x: 0.2685-0.2885, y: 0.2730-0.3010). A tolerance of +/- 0.01 is allowed for each (x, y) coordinate within the bin. This system ensures that all LEDs within a specific hue bin appear exactly the same color under standard conditions, which is crucial for applications requiring consistent color appearance across multiple indicator lights.

4. Performance Curve Analysis

The provided characteristic curves offer deeper insight into the device's behavior under various conditions.

4.1 Relative Intensity vs. Wavelength (Figure 1)

This spectral distribution curve shows the relative light output power at each wavelength. It visually confirms the peak wavelength (λP) and spectral half-width (Δλ) for each color chip. Compared to AlInGaP (red light), the curves for InGaN (blue and green light) typically show sharper peaks, while the AlInGaP spectrum may be slightly broader.

4.2 Forward Current vs. Forward Voltage (Figure 2)

This IV curve is inherently nonlinear and exponential, which is a typical characteristic of a diode. The curve will show the different turn-on voltages for red light (AlInGaP, approximately 1.9V) and blue/green light (InGaN, approximately 2.5-3.0V). The slope of the curve in the operating region represents the dynamic resistance of the LED. This graph is crucial for designing constant current drivers to ensure stable operation across the entire forward voltage range.

4.3 Forward Current Derating Curve (Figure 3)

This is one of the most critical charts for reliability. It shows the maximum allowable continuous forward current as a function of ambient temperature (Ta). As Ta increases, the maximum current must be reduced to prevent the LED junction temperature from exceeding its limit, otherwise it will accelerate lumen depreciation and shorten lifespan. This curve typically shows a linear derating from the specified current at 25°C to zero current at the maximum junction temperature (implied by the maximum operating temperature).

4.4 Relative Luminous Intensity vs. Forward Current (Figure 4)

This curve shows that the light output (luminous intensity) increases with the forward current, but the relationship is not entirely linear, especially at higher currents where efficiency may decrease due to increased heat. It helps designers select an operating current that balances brightness, efficiency, and lifespan.

4.5 Radiation Pattern (Figure 5 and Figure 6)

These polar plots illustrate the spatial distribution of light intensity. Side-emitting LEDs with diffuser lenses typically exhibit a broad, Lambertian-like emission pattern. Figure 5 (horizontal) and Figure 6 (vertical) will show light intensity as a function of the angle from the central axis, confirming a 130-degree viewing angle. The pattern should be symmetrical to ensure consistent off-axis appearance.

5. Mechanical, Packaging and Assembly Information

5.1 Package Dimensions and Pin Assignment

The device conforms to the EIA standard package outline. Key dimensions include overall length, width, and the critical 0.30 mm thickness. Pin assignment is clearly defined: Pin 3 is the common cathode (or anode, depending on internal structure; the datasheet designates it as the common pin for all three colors). The anode for the red chip is Pin 1, green is Pin 2, and blue is Pin 4. This information is crucial for correct PCB layout and orientation during assembly.

5.2 Recommended PCB Land Pattern Design and Soldering Orientation

The datasheet includes the recommended land pattern. This shows the optimal size and shape of the copper pads on the PCB to ensure reliable solder joints while minimizing tombstoning (component lifting on one end during reflow). It also indicates the correct orientation of the LED on the carrier tape relative to the PCB for use by automated pick-and-place machines.

5.3 Carrier Tape and Reel Packaging Specifications

LEDs are supplied in 8mm wide embossed carrier tape, wound onto reels with a diameter of 7 inches (178mm). Key specifications include:
- Pocket Dimensions:Precise cavity dimensions to securely hold the LED.
- Pitch:Distance between component bags (e.g., 4 mm).
- Reel size:Core diameter, flange diameter, and overall width.
- Quantity:Each full reel contains 4000 pieces.
- Cover tape:Used for sealing material bags; its peel strength must be suitable for the placement machine.
- Packaging standard:Compliant with ANSI/EIA-481.
- Quality Rule:A maximum of two consecutive missing components is allowed; the minimum remaining package quantity is 500 pieces.

6. Assembly, Handling, and Application Guidelines

6.1 Welding Process

This device is suitable for infrared (IR) reflow soldering using lead-free process profiles. Key parameters, as defined in the Absolute Maximum Ratings, are a peak temperature of 260°C for a duration of 10 seconds. Designers must ensure their reflow oven temperature profile remains within these limits to avoid damage to the plastic package or internal bond wires.

6.2 Cleaning

Post-soldering cleaning must be performed carefully. Only specified solvents should be used. The datasheet recommends immersion in ethanol or isopropyl alcohol at room temperature for no longer than one minute. The use of harsher chemicals or prolonged exposure may damage the epoxy lens or package markings.

6.3 Electrostatic Discharge (ESD) Precautions

Despite a 2000V HBM rating, this device is susceptible to ESD damage. Proper handling procedures must be followed: use grounded wrist straps, anti-static mats, and ensure all equipment is properly grounded. Do not directly touch the LEDs with bare hands.

6.4 Storage Conditions

To maintain shelf life, LEDs should be stored in their original moisture barrier bag at 30°C or lower and 90% relative humidity or lower. It is recommended to use them within one year from the shipping date under these conditions. If the bag is opened or the humidity indicator card shows excessive moisture, baking may be required before reflow soldering to prevent "popcorn" phenomenon (package cracking caused by rapid moisture expansion).

6.5 Application Notes

The datasheet clearly states its intended use is for "general electronic equipment". For applications requiring extremely high reliability, where failure could endanger life or health (aviation, medical, traffic safety systems), prior consultation and certification with the manufacturer are required. This highlights the component's classification for commercial/industrial use, and it may not be suitable for safety-critical applications without further review.

7. Design Considerations and Typical Application Circuits

7.1 LED Drive

Because of the exponential IV characteristic, to achieve stable light output, an LED must be driven by a current source, not a voltage source. The simplest method is to use a series current-limiting resistor with a voltage source. The formula for calculating the resistor value (R) is R = (Power Supply Voltage - LED Forward Voltage) / Forward Current, where the LED forward voltage is the forward voltage of the specific color chip at the desired current. Since the forward voltage has a range, when selecting the resistor, ensure that the forward current does not exceed the maximum rating even when the forward voltage is at its minimum. For precision or battery-powered applications, dedicated constant-current LED driver ICs are recommended. Each color chip must be driven independently to achieve full-color mixing.

7.2 Thermal Management

Duk da girma, sarrafa zafin jiki shine mabuɗin tsawaita rayuwa. Babbar hanyar sanyaya ita ce ta hanyar gindin haɗawa zuwa cikin tagulla na PCB. Saboda haka, yana da mahimmanci a yi amfani da shimfidar gindin haɗawa da aka ba da shawarar kuma a ƙara yawan tagulla da ke haɗe da gindin haɗawa (gindin sanyaya). Guji aiki a ƙarƙashin matsakaicin ƙarfin yanzu, musamman a cikin yanayin zafi mai girma, kuma koma ga lanƙwan rage ƙarfi.

7.3 Optical Integration

Ruwan tabarau mai watsawa mai farin ciki yana ba da fitar da haske gauraye. Don aikace-aikacen da ke buƙatar takamaiman tsarin haske, ana iya ƙirƙira kayan aikin gani na biyu (shugaban haske, mai nuna haske) a kusa da LED. Faɗin kallon yana sa ya dace da siririn shugaban haske na gefen haske wanda aka saba amfani dashi don hasken maɓalli.

8. Technical Comparison and Differentiation

The main differentiating features of the LTST-FS63HBGED in the market include:
1. Overall Dimensions:A thickness of 0.30mm is key to achieving an ultra-thin design, distinguishing it from typically taller standard top-emitting SMD LEDs.
2. Integration Level:Integrating three primary color chips within a single package saves PCB space and simplifies assembly compared to using three separate LEDs.
3. Performance:InGaN yana ba da inganci mai girma da kuma kyakkyawan jikar launi don haske mai shuɗi/kore, yayin da AlInGaP ke ba da inganci mai girma don haske ja.
4. Abubuwan da za a iya kera:Ya dace gaba ɗaya da layin haɗa SMT mai sarrafa kansa da sauri, wanda ke sa ya zama mai tsada a cikin samarwa mai girma.

9. Frequently Asked Questions (Based on Technical Specifications)

Q: Can I drive all three colors simultaneously at the maximum DC current of 30mA per color?
A: No. Total power dissipation must be considered. Operating simultaneously at 30mA per color may exceed the total power dissipation capability of the package, leading to overheating. Safe simultaneous operating currents must be determined using the derating curve and respective Pd ratings based on the ambient temperature.

Q: Why are the test currents different for blue light (12mA) and green/red light (30mA) chips?
A: This is related to the inherent efficiency and operating characteristics of different semiconductor materials (InGaN vs. AlInGaP). Manufacturers select a test current for each chip that represents a typical, efficient operating point to achieve the target luminous intensity while managing heat and lifespan.

Q: How to use this RGB LED to achieve white light?
A: White light is generated by mixing the three primary colors in specific intensity ratios. This requires independent pulse width modulation (PWM) or analog current control for each chip. The exact ratio depends on the specific chromaticity bin of the LEDs used and the target white point (e.g., cool white, warm white).

Q: Is reverse voltage protection required?
A: Although the device can withstand a 5V reverse bias test, it is not designed to operate in reverse. If there is a possibility of reverse voltage being applied in the circuit (e.g., with inductive loads or AC-coupled signals), an external protection diode in series or parallel (depending on the configuration) should be used.