SMD LED 12-22/BHR6C-A01/2C Datasheet - 1.2x2.2x1.1mm - Blue (2.7-3.1V) & Red (1.7-2.2V) - 40-60mW - English Technical Document

1. Product Overview

12-22 SMD LED wani ƙaramin na'ura ne mai haɗawa da saman, wanda aka ƙera don aikace-aikacen PCB masu yawan girma. Yana samuwa a cikin tsarin launuka da yawa, musamman yana haɗa LED shuɗi (guntun BH) da LED ja mai haske (guntun R6) a cikin fakit ɗaya. Wannan ɓangaren ya fi ƙanƙanta sosai idan aka kwatanta da LED na tsohuwar nau'in firam ɗin jagora, wanda ke ba da damar rage girman allon sosai, ƙara yawan tattarawa, rage buƙatun ajiya, kuma a ƙarshe yana ba da gudummawa ga haɓaka ƙananan kayan aikin mai amfani. Ginin sa mai sauƙi ya sa ya dace musamman don ƙananan aikace-aikace da waɗanda ke da ƙarancin sarari.

1.1 Core Advantages

• Miniaturization: The small footprint (1.2mm x 2.2mm) allows for high-density placement on PCBs.
• Compatibility: Packaged in 8mm tape on 7-inch diameter reels, making it fully compatible with standard automatic placement (pick-and-place) equipment.
• Robust Manufacturing: Compatible with both infrared (IR) and vapor phase reflow soldering processes.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

• Automotive/Industrial: Backlighting for instrument panels, dashboards, and switches.
• Telecommunications: Status indicators and keypad backlighting in telephones and fax machines.
• Consumer Electronics: Flat backlighting for LCDs, switch illumination, and symbol lighting.
• General Purpose: Any application requiring a reliable, compact indicator light.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the device's electrical, optical, and thermal specifications. All parameters are measured at an ambient temperature (Ta) of 25°C unless otherwise specified.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

Parameter	Symbol	Code	Rating	Unit
Reverse Voltage	VR	-	5	V
Forward Current	IF	BH	10	mA
		R6	25	mA
Peak Forward Current (Duty 1/10 @1KHz)	IFP	BH	40	mA
		R6	50	mA
Power Dissipation	Pd	BH	40	mW
		R6	60	mW
Electrostatic Discharge (HBM)	ESD	BH	150	V
		R6	2000	V
Operating Temperature	Topr	-	-40 ~ +85	°C
Storage Temperature	Tstg	-	-40 ~ +90	°C
Soldering Temperature	Tsol	Reflow	260°C for 10 sec.	-
		Hand	350°C for 3 sec.	-

Key Observations: The red (R6) chip has a higher current and power handling capability compared to the blue (BH) chip. Notably, the ESD sensitivity differs significantly, with the BH (blue) chip being highly sensitive (150V HBM), requiring stringent ESD protection during handling, while the R6 (red) chip is more robust (2000V HBM).

2.2 Electro-Optical Characteristics

These are the typical performance parameters under normal operating conditions.

Parameter	Symbol	Code	Min.	Typ.	Max.	Unit	Condition
Luminous Intensity	Iv	BH	18.0	26.0	-----	mcd	IF=5mA
		R6	22.5	30.0	-----	mcd	IF=5mA
Viewing Angle (2θ1/2)	-	-	-----	120	-----	deg	-
Peak Wavelength	λp	BH	-----	468	-----	nm	-
		R6	-----	632	-----	nm	-
Dominant Wavelength	λd	BH	-----	470	-----	nm	-
		R6	-----	624	-----	nm	-
Spectrum Bandwidth (Δλ)	-	BH	-----	25	-----	nm	-
		R6	-----	20	-----	nm	-
Forward Voltage	VF	BH	2.7	-----	3.1	V	-
		R6	1.7	-----	2.2	V	-
Reverse Current	IR	BH	-----	-----	50	μA	VR=5V
		R6	-----	-----	10	μA	VR=5V

Notes:

1. Tolerance of Luminous Intensity is ±11%.
2. Tolerance of Forward Voltage is ±0.05V.

Analysis: LED bulu (BH) yana aiki a mafi girma na gaba wutar lantarki (2.7-3.1V) na yau da kullun na InGaN-based guntu, yayin da ja LED (R6) yana da ƙarancin wutar lantarki (1.7-2.2V) halayyar AlGaInP fasaha. Hasken haske an ƙayyade shi a ƙananan kuzarin tuƙi na 5mA, yana nuna ingantaccen aiki. Faɗin kusurwar kallo na digiri 120 yana ba da tsarin fitarwa mai faɗi wanda ya dace da aikace-aikacen nuna alama.

3. Performance Curve Analysis

Takardar bayanai tana ba da madaidaicin halayen lanƙwasa na duka BH (Bulu) da R6 (Ja) guntu, waɗanda ke da mahimmanci don fahimtar halayyar na'ura a ƙarƙashin yanayi daban-daban.

3.1 Relative Luminous Intensity vs. Ambient Temperature

The curves show that luminous output decreases as ambient temperature increases. This thermal quenching effect is a fundamental property of LED semiconductors. Designers must account for this derating when operating at high ambient temperatures to ensure sufficient light output.

3.2 Relative Luminous Intensity vs. Forward Current

These plots illustrate the sub-linear relationship between drive current and light output. Increasing current yields diminishing returns in brightness while generating more heat. Operating near the absolute maximum current rating is inefficient and reduces device lifetime.

3.3 Forward Current Derating Curve

This critical graph defines the maximum allowable continuous forward current as a function of ambient temperature. As temperature rises, the maximum permissible current must be reduced to prevent exceeding the device's power dissipation limit and causing thermal runaway.

3.4 Forward Voltage vs. Forward Current (I-V Curve)

The I-V curve shows the exponential relationship typical of a diode. The "knee" voltage is the approximate forward voltage (V_F). The curve's slope in the conducting region relates to the dynamic resistance of the LED.

3.5 Radiation Diagram

The polar plot visualizes the spatial distribution of light intensity, confirming the 120-degree viewing angle. The pattern is typically Lambertian or near-Lambertian for this type of LED package.

3.6 Spectrum Distribution

The spectral plots show the emission profiles:

• BH (Blue): Peak wavelength ~468nm, dominant wavelength ~470nm, with a spectral bandwidth (FWHM) of ~25nm.
• R6 (Red): Peak wavelength ~632nm, dominant wavelength ~624nm, with a narrower spectral bandwidth of ~20nm.

These characteristics determine the perceived color purity of the LED.

4. Mechanical and Package Information

4.1 Package Dimensions

The 12-22 SMD LED has a compact rectangular package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:

• Overall length: 2.2 mm
• Overall width: 1.2 mm
• Overall height: 1.1 mm
• Lead (terminal) dimensions and spacing as per the detailed drawing.

The datasheet includes a detailed dimensioned drawing specifying all critical lengths, widths, heights, and pad positions necessary for PCB footprint design.

4.2 Polarity Identification

The component features a polarity marker, typically a notch or a dot on the package or a cut corner on the carrier tape pocket, to indicate the cathode. Correct orientation is essential for circuit operation.

5. Soldering and Assembly Guidelines

Proper handling is critical for reliability. The device is moisture-sensitive (MSL) and requires specific soldering profiles.

5.1 Storage and Moisture Sensitivity

• Before Opening: Ajiya a ≤30°C da ≤90% RH.
• Bayan Budewa (Rayuwar Benen): Shekara 1 a ≤30°C da ≤60% RH. Dole ne a sake rufe sassan da ba a yi amfani da su ba a cikin marufi mai hana danshi tare da desiccant.
• Baking: If the desiccant indicates moisture absorption or storage time is exceeded, bake at 60 ±5°C for 24 hours before use.

5.2 Reflow Soldering Profile (Pb-free)

The recommended profile is for lead-free solder (e.g., SAC305):

• Preheat: Gradual ramp to activate flux.
• Soak Zone: To evenly heat the board and component.
• Reflow: Peak temperature of 260°C for a maximum of 10 seconds.
• Cooling: Controlled cool-down to minimize thermal stress.

Important: Reflow soldering should not be performed more than two times. Avoid mechanical stress on the LED during heating and do not warp the PCB after soldering.

5.3 Hand Soldering

If manual soldering is unavoidable:

• Use a soldering iron with a tip temperature <350°C.
• Limit contact time to ≤3 seconds per terminal.
• Use an iron with power ≤25W.
• Allow ≥2 seconds between soldering each terminal to avoid overheating.
• Hand soldering carries a higher risk of damage.

5.4 Rework and Repair

Repair after soldering is strongly discouraged. If absolutely necessary:

• Use a specialized double-head soldering iron designed for SMD removal to apply simultaneous, balanced heat to both terminals.
• Always verify that the repair process does not degrade the LED's characteristics.

6. Packaging and Ordering Information

6.1 Standard Packaging

LEDs are supplied in moisture-resistant packaging:

• Carrier Tape: 8mm wide tape.
• Reel: 7-inch (178mm) diameter.
• Quantity: 2000 pieces per reel.
• The packaging includes a desiccant and is sealed in an aluminum moisture-proof bag.

6.2 Label Explanation

The reel label contains several codes:

• CPN: Customer's Product Number.
• P/N: Product Number (e.g., 12-22/BHR6C-A01/2C).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank.
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Forward Voltage Rank.
• LOT No: Manufacturing Lot Number for traceability.

7. Application Design Considerations

7.1 Current Limiting is Mandatory

LEDs are current-driven devices. An external current-limiting resistor (or constant current driver) is absolutely required for each chip (BH and R6). The forward voltage (V_F) has a tolerance and a negative temperature coefficient (decreases as temperature rises). Connecting an LED directly to a voltage source, even one close to its nominal V_F, can cause a small voltage increase to drive a large, uncontrolled current surge, leading to instantaneous failure (burn-out). The resistor value is calculated using Ohm's Law: R = (V_supply - V_F) / I_F.

7.2 Thermal Management

Ko package ya yi ƙanƙanta, ɓarnawar wutar lantarki (40mW don BH, 60mW don R6) tana haifar da zafi. Don aiki mai dogon lokaci da ya dace:

• Ku bi daidai da lanƙwasar lanƙwasa na halin yanzu na gaba a yanayin yanayi mai girma.
• Ensure adequate PCB copper area (thermal relief pads) to conduct heat away from the LED solder joints.
• Avoid placing the LED near other heat-generating components.

7.3 ESD Protection

Chip ya buluu (BH) ni nyeti sana kwa ESD (150V HBM). Tekeleza ulinzi wa ESD katika mchakato mzima wa uzalishaji:

• Tumia vituo vya kazi vilivyogunduliwa na vifungo vya mkono wakati wa kushughulikia na kukusanyika.
• Fikiria kuongeza diode za kukandamiza voltage za muda mfupi (TVS) au saketi nyingine za ulinzi kwenye PCB ikiwa LED imeunganishwa na interfaces za nje zinazoweza kupata matukio ya ESD.

8. Technical Comparison and Positioning

The 12-22/BHR6C-A01/2C offers a specific combination of features:

• vs. Larger SMD LEDs (e.g., 3528, 5050): It provides a much smaller footprint for ultra-compact designs but with correspondingly lower maximum light output and power handling.
• vs. Single-Color 12-22 LEDs: The multi-color (blue+red) configuration in one package saves board space compared to using two separate single-color LEDs, simplifying assembly and inventory.
• vs. Leaded LEDs: It eliminates the need for through-holes, enables automated assembly, and reduces overall product size and weight.

Its primary advantage is enabling miniaturization in cost-sensitive, space-constrained indicator and backlight applications.

9. Frequently Asked Questions (FAQs)

9.1 Ina iya tuƙa guntu na shuɗi da ja tare daga tushen wutar lantarki ɗaya?

Not directly in a simple series or parallel configuration due to their different forward voltages (V_F). The blue chip requires ~3V, while the red chip requires ~2V. If connected in parallel to a 3V source, the red chip would experience excessive current. If connected in series, a 5V+ source would be needed, and current matching would be poor. The recommended approach is to use separate current-limiting resistors for each chip, even if they share a common voltage rail, or to drive them independently.

9.2 Me ya sa ƙimar ESD ta bambanta sosai tsakanin guntu na shuɗi da ja?

Wannan ya samo asali ne daga bambance-bambance na asali a fasahar kayan semiconductor. LED shuɗin yana amfani da tsarin InGaN (Indium Gallium Nitride) da aka girma akan abubuwan kamar sapphire ko silicon carbide, wanda zai iya zama mafi saukin lalacewa ta hanyar fitar da wutar lantarki a matakin haɗin microscopic. LED ja yana amfani da tsarin AlGaInP (Aluminum Gallium Indium Phosphide), wanda a asalinsa ya fi ƙarfi a kan ESD. Wannan yana buƙatar ƙarin kulawa lokacin sarrafa kayan shuɗi.

9.3 What does the "A01/2C" in the part number signify?

While the full internal coding isn't detailed in this excerpt, suffixes like these typically denote specific bins for key parameters such as luminous intensity (CAT), dominant wavelength/chromaticity (HUE), and forward voltage (REF). "A01" and "2C" likely specify the exact performance bins for the blue and red chips, respectively, ensuring color and brightness consistency within a production run.

10. Practical Design Example

Scenario: Design a bi-color status indicator using the 12-22/BHR6C-A01/2C. The LED will be powered from a 5V microcontroller GPIO pin. The goal is to drive each chip at approximately 5mA.

Calculation for Current-Limiting Resistors:

• For Blue Chip (BH, V_F ≈ 2.9V typ): R_blue = (5V - 2.9V) / 0.005A = 420 Ω. Use a standard 430 Ω resistor. Power dissipation in resistor: P = I²R = (0.005)² * 430 = 0.01075W (a 1/10W or 1/8W resistor is sufficient).
• For Red Chip (R6, V_F ≈ 1.95V typ): R_red = (5V - 1.95V) / 0.005A = 610 Ω. Use a standard 620 Ω resistor. Power dissipation: (0.005)² * 620 = 0.0155W.

Circuit: Kulla chip ya LED anode iyakar da wutar lantarki ta 5V ta hanyar resistor da aka lissafta. Cathodes su haɗa su zuwa GPIO pins na microcontroller waɗanda aka saita a matsayin buɗe-drain/ƙananan fitarwa. Don haskaka LED shuɗi, saita GPIO pin ɗinsa ƙasa. Don haskaka ja, saita pin ɗinsa ƙasa. Tabbatar cewa pin na microcontroller zai iya ɗaukar kwararar 5mA.

11. Operating Principle

Light Emitting Diodes (LEDs) na'urori ne na semiconductor p-n junction. Lokacin da ake amfani da ƙarfin lantarki na gaba wanda ya wuce ƙarfin da aka gina a cikin junction, electrons daga yankin n-type suna haɗuwa da ramuka daga yankin p-type a cikin Layer mai aiki. Wannan tsarin haɗuwa yana sakin makamashi a cikin nau'in photons (haske). Takamaiman tsayin raƙuman ruwa (launi) na hasken da aka fitar an ƙaddara shi ta hanyar makamashin bandgap na kayan semiconductor da aka yi amfani da su a yankin mai aiki. LED shuɗi (BH) yana amfani da wani fili na InGaN, wanda ke da babban bandgap, yana fitar da mafi girman makamashin photons a cikin bakan shuɗi. LED ja (R6) yana amfani da wani fili na AlGaInP, wanda ke da ƙaramin bandgap, yana fitar da ƙananan makamashin photons a cikin bakan ja. Ruwan tabarau na epoxy yana siffanta fitarwar haske kuma yana ba da kariya ta injiniya da muhalli.

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