0201 Package Blue SMD LED Datasheet - Dimensions 0.6x0.3x0.25mm - Voltage 2.4-3.3V - Power Consumption 99mW - Technical Documentation

1. Product Overview

This document details the technical specifications of a miniature surface-mount device (SMD) light-emitting diode (LED) in an 0201 package format. Designed for automated printed circuit board (PCB) assembly, it is ideal for space-constrained applications. Utilizing indium gallium nitride (InGaN) semiconductor material with a water-clear lens to emit blue light, it offers a wide viewing angle, suitable for various indicator and backlighting purposes.

1.1 Product Features

• Complies with RoHS (Restriction of Hazardous Substances) directive requirements.
• Packaged in 12mm carrier tape, wound on 7-inch diameter reels for automated SMT assembly.
• Conforms to standardized EIA (Electronic Industries Alliance) package land pattern dimensions.
• Input compatible with standard integrated circuit (IC) logic levels.
• Designed for compatibility with automated surface-mount equipment.
• Suitable for infrared (IR) reflow soldering processes.
• Preconditioned to accelerate attainment of JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Application Fields

This LED is suitable for various electronic devices requiring reliable and compact status indication. Typical application fields include:

• Communication equipment (e.g., cordless phones, mobile phones).
• Office automation equipment (e.g., laptops, network systems).
• Household appliances and consumer electronics.
• Industrial control and monitoring equipment.
• Status and power indicators.
• Signal and symbol illumination.
• Front Panel and Keyboard Backlight.

2. In-depth Interpretation of Technical Parameters

2.1 Absolute Maximum Ratings

The following parameters define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd):99 mW. This is the maximum power that the LED package can dissipate in the form of heat without exceeding its maximum junction temperature.
• Peak Forward Current (I_FP):100 mA. This is the maximum allowable instantaneous forward current, typically specified under pulse conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (I_F):30 mA. This is the recommended maximum continuous forward current to ensure long-term reliable operation.
• Operating Temperature Range (T_opr):-40°C to +85°C. The ambient temperature range over which the device is designed to operate.
• Storage temperature range (T_stg):-40°C to +100°C. Storage temperature range when the device is not powered.

2.2 Electrical/Optical Characteristics

These parameters are at standard ambient temperature (T_a) Measured at 25°C, defining the typical performance of the device.

• Luminous intensity (I_V):400 - 1040 mcd (millicandela), tested under the condition of I_F= 20mA. This parameter measures the brightness of the LED as perceived by the human eye, filtered through the CIE photopic response curve. The wide range indicates the use of a binning system.
• Viewing angle (2θ_1/2):110 degrees (typical). This is the full angle at which the luminous intensity drops to half of its axial peak value. The 110° viewing angle provides a very wide light emission pattern.
• Peak emission wavelength (λ_P):466 nm (typical). The wavelength at which the optical output power reaches its maximum value.
• Dominant Wavelength (λ_d):466 - 476 nm, tested under the condition of I_F= 20mA. This is the single wavelength that best represents the color of light perceived by the human eye, calculated based on the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ):35 nm (typical value). Spectral bandwidth measured at half maximum intensity (Full Width at Half Maximum - FWHM). The value of 35nm is typical for InGaN blue LEDs.
• Forward voltage (V_F):2.4 - 3.3 V, test condition is I_F= 20mA. The voltage drop when the LED operates at the specified current. This range indicates different voltage bins.
• Reverse current (I_R):10 μA (maximum), tested under the condition V_R= 5V. The small leakage current when a reverse bias is applied. This device is not designed for reverse operation; this parameter is primarily used for IR test verification in production.

3. Bin System Description

To ensure production consistency, LEDs are sorted into different bins based on key parameters. This allows designers to select devices that meet specific requirements for color, brightness, and forward voltage.

3.1 Forward Voltage (V_F) Binning

Ana rarraba a ƙarashin gwajin na 20mA. Kowane nau'in yana da ƙimar saɓo na ±0.1V.

• Gear F4:2.4V (minimum) to 2.7V (maximum)
• Gear F5:2.7V (minimum) to 3.0V (maximum)
• Gear F6:3.0V (minimum) to 3.3V (maximum)

3.2 Luminous Intensity (I_V) Binning

Grading is performed at a test current of 20mA. The tolerance for each brightness grade is ±11%.

• Grade T2:400.0 mcd (minimum) to 540.0 mcd (maximum)
• Gear U1:540.0 mcd (minimum) to 750.0 mcd (maximum)
• Gear U2:750.0 mcd (minimum) to 1040.0 mcd (maximum)

3.3 Hue (Dominant Wavelength) Binning

Binning is performed at a test current of 20mA. The tolerance for each bin is ±1nm.

• Gear AC:466.0 nm (minimum) to 471.0 nm (maximum)
• Gear AD:471.0 nm (minimum) to 476.0 nm (maximum)

4. Performance Curve Analysis

The datasheet references typical performance curves, which are crucial for understanding the device's behavior under various conditions. Although the specific graphs are not reproduced in the text, their implications are analyzed as follows.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V characteristic is nonlinear, which is typical for diodes. The forward voltage (V_F) has a positive temperature coefficient, meaning it decreases slightly with increasing junction temperature at a given current. Designers must consider this when designing current-limiting circuits to ensure stable operation across the entire temperature range.

4.2 Luminous Intensity vs. Forward Current

Within the safe operating area, luminous intensity is typically proportional to the forward current. However, at extremely high currents, efficiency may decrease due to increased heat generation (efficiency droop effect). Operating at the recommended 20mA or below ensures optimal efficiency and lifespan.

4.3 Spectral Distribution

The spectral output curve is centered at a peak wavelength of 466nm, with a full width at half maximum of approximately 35nm. This defines the color purity of the blue. The dominant wavelength used for binning is calculated from this spectrum, weighted by human eye sensitivity.

4.4 Temperature Characteristics

LED performance is temperature-dependent. Luminous intensity typically decreases as the junction temperature increases. The operating temperature range (-40°C to +85°C) and storage temperature range (-40°C to +100°C) ensure the maintenance of semiconductor material and package integrity.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The device complies with the 0201 package standard. Key dimensions (unit: mm) include: body length approximately 0.6mm, width 0.3mm, height 0.25mm. Unless otherwise specified, all dimensional tolerances are ±0.2mm. The anode and cathode terminals are clearly marked to ensure correct PCB orientation.

5.2 Recommended PCB Land Pattern

A land pattern (package outline) suitable for infrared or vapor phase reflow soldering is provided. Adhering to this recommended land layout is crucial for achieving reliable solder joints, proper self-alignment during reflow, and effective heat dissipation from the LED chip.

5.3 Carrier Tape and Reel Packaging

LEDs are supplied in embossed carrier tape with a width of 12mm. The tape is wound onto reels with a diameter of 7 inches (178mm). The standard reel quantity is 4000 pieces per reel, with a minimum packaging quantity of 500 pieces for remaining lots. The packaging complies with the ANSI/EIA-481 specification to ensure compatibility with automated assembly equipment.

6. Soldering and Assembly Guide

6.1 Infrared Reflow Soldering Profile

Provides a reflow profile that complies with the J-STD-020B lead-free process recommendations. Key parameters include:

• Preheat:Maximum 150-200°C.
• Preheat time:Maximum 120 seconds.
• Peak temperature:Maximum 260°C.
• Time above liquidus:Maximum 10 seconds (it is recommended to perform a maximum of two reflow cycles).

It must be noted that the optimal profile depends on the specific PCB design, solder paste, and oven. The provided profile is a general target based on JEDEC standards.

6.2 Manual Soldering

If manual soldering must be performed, extra caution is required due to the minute size. Recommendations include:

• Soldering iron temperature:Maximum 300°C.
• Soldering time:Maximum 3 seconds per solder joint.
• Heat the PCB pad, do not directly heat the LED body.

6.3 Cleaning

If post-soldering cleaning is required, only specified solvents should be used. It is acceptable to immerse the LED in ethanol or isopropyl alcohol at room temperature for no more than one minute. Unspecified chemicals may damage the epoxy lens or package.

6.4 Storage and Moisture Sensitivity

This LED is moisture sensitive (MSL Level 3).

• Sealed packaging:Store at ≤30°C and ≤70% relative humidity (RH). Use within one year after the packaging date.
• Opened packaging:Store at ≤30°C and ≤60% RH. It is recommended to complete infrared reflow soldering within 168 hours (7 days) after opening.
• Long-term storage (opened):Store in a sealed container with desiccant or in a nitrogen dry cabinet.
• 暴露时间 >168小时：LEDs must be baked at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent the "popcorn" effect during reflow.

7. Application Recommendations

7.1 Typical Application Circuit

When driven by a voltage source higher than its forward voltage, this LED requires a current-limiting mechanism. The simplest method is to connect a resistor in series. The resistor value (R_s) can be calculated using Ohm's Law: R_s= (V_supply- V_F) / I_F. For example, using a 5V power supply, V_Fis 3.0V (typical value), the desired I_FIf it is 20mA, then R_s= (5V - 3.0V) / 0.020A = 100 Ω. The rated power of the resistor should be at least I_F²* R_s.

。

• 7.2 Design ConsiderationsCurrent Drive:_FAlways use a constant current source or a voltage source with a series resistor to drive the LED. Direct connection to a voltage source exceeding V
• will cause excessive current and rapid failure.Thermal Management:
• Although power consumption is low, ensuring sufficient PCB copper foil area around the pads helps with heat dissipation, especially under high ambient temperatures or when driven with higher current.ESD Protection:
• Although not explicitly stated as sensitive to static electricity, it is good practice to take appropriate ESD (Electrostatic Discharge) precautions when handling all semiconductor devices.Optical Design:

The 110° wide viewing angle makes it suitable for applications requiring extensive visibility. For focused light, external lenses or light guide structures may be necessary.

8. Technical Comparison and Differentiation

Babban abin da ya bambanta wannan LED shine girman fakitin sa na 0201 mai matuƙar ƙanƙanta da takamaiman ma'anar shuɗi (babban tsawon raƙuman ruwa 466-476nm). Idan aka kwatanta da manyan fakiti (kamar 0603, 0805), 0201 yana iya adana sarari sosai akan PCB, yana ba da damar ƙirar da ta fi girma. Fasahar InGaN tana ba da fitar da hasken shuɗi mai inganci. Haɗuwar faɗin hangen nesa da ruwan tabarau mai gaskiya, sun haifar da tushen haske mai haske, watsawa, wanda ya dace sosai don aikace-aikacen nuna yanayin da ba a taƙaita hangen nesa ba. Cikakken tsarin rarrabuwa yana ba da damar zaɓi daidai a cikin aikace-aikacen da ke buƙatar daidaitaccen launi ko haske tsakanin LED da yawa.

9. Tambayoyin da ake yawan yi (bisa sigogin fasaha)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?_PPeak wavelength (λ_d) is the physical wavelength at which an LED emits its maximum optical power. Dominant wavelength (λ_d) is a calculated value representing the wavelength of monochromatic light that appears to the human eye to have the same color as the light emitted by the LED. Therefore, λ

More relevant to color specifications and grading.

9.2 Ina iya amfani da 30mA don tuka wannan LED akai-akai?

Ko yanzu mada DC na gaba na halin yanzu na cikakken iyakar ƙididdiga shine 30mA, amma yanayin gwaji na al'ada da aka buga na ƙayyadaddun gani da wurin aiki da aka ba da shawarar shine 20mA. Yin aiki a 30mA na iya haifar da mafi girman fitowar haske, amma yana haifar da ƙarin zafi, yana iya rage tsawon rayuwa kuma ya haifar da canjin launi. Don dogon lokaci mai aminci aiki, ana ba da shawarar tsara da'ira zuwa 20mA ko ƙasa.

9.3 Idan na'urar ba a yi amfani da ita don aikin baya ba, me yasa har yanzu akwai ƙayyadaddun halin yanzu na baya?_RReverse current (I

) Ƙayyadaddun sigogi shine sigar sarrafa ingancin da aka auna a cikin gwajin samarwa (gwajin IR). Yana tabbatar da cikakkiyar haɗin semiconductor. A aikace, bai kamata a yi niyya ta amfani da ƙarfin baya ba, saboda ba a ƙirƙira shi don hana mahimmancin ƙarfin baya ba, yana iya lalacewa.

9.4 How to interpret the bin code when ordering?

To ensure receiving LEDs with consistent performance, you should specify the binning codes for forward voltage (F4/F5/F6), luminous intensity (T2/U1/U2), and dominant wavelength (AC/AD) according to the design requirements. For example, an order might specify devices from bins F5, U1, AC to obtain medium voltage, medium-high brightness, and a bluish tint.

10. Practical Application CasesScenario: Designing a compact wearable device status indicator._FThe PCB space for this device is limited. A blue power indicator LED is required. The 0201 LED was chosen due to its extremely small package size. The design uses a 3.3V microcontroller GPIO pin to control the LED. The series resistor calculation uses the maximum V_F(e.g., 3.3V max for the F6 range) to ensure sufficient current even under worst-case V_sconditions: R_F= (3.3V - 3.3V) / 0.020A = 0 Ω. This is not feasible. Therefore, a lower V_Frange (F4 or F5) must be selected, or the supply voltage must be increased. The F5 range (max V_s=3.0V) kuma ƙara ƙaramin maɓalli mai haɓakawa don samar da 3.6V, to R

= (3.6V - 3.0V) / 0.020A = 30 Ω. The PCB layout provides a moderate copper foil area on the LED pads for heat dissipation. The LEDs are placed onto the circuit board by an automated pick-and-place machine from a 12mm carrier tape reel.

11. Gabatarwar Aikin Tsari

Wannan LED na'urar photon ne na semiconductor. Ya dogara ne akan tsarin heterojunction na Indium Gallium Nitride (InGaN). Lokacin da aka yi amfani da ƙarfin lantarki mai kyau, electrons da ramuka suna shiga cikin yanki mai aiki daga Layer na semiconductor na n-type da p-type, bi da bi. Waɗannan masu ɗaukar kaya suna haɗuwa ta hanyar radiation, suna sakin makamashi a cikin nau'in photons. Takamaiman abun da ke cikin gawa na InGaN yana ƙayyade ƙarfin bandgap, wanda kuma ke ƙayyade tsawon zango (launi) na hasken da ake fitarwa—a cikin wannan misali, shuɗi. Ruwan ruwa na epoxy lens yana rufe guntuwar semiconductor, yana ba da kariya ta injiniya, kuma yana tsara yanayin fitar da haske don cimma kusurwar hangen nesa mai digiri 110 da aka ƙayyade.

12. Development Trends