Table of Contents
- 1. Product Overview
- 2. Technical Specifications and Deep Objective Interpretation
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Current Limiting
- 6.2 Storage and Moisture Sensitivity
- 6.3 Reflow Soldering Profile
- 6.4 Hand Soldering and Rework
- 7. Packaging and Ordering Information
- 7.1 Reel and Tape Specifications
- 7.2 Label Information
- 8. Application Suggestions
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Practical Application Case Study
- 12. Technical Principle Introduction
- 13. Industry Trends and Developments
1. Product Overview
17-21 SMD LED na'urar da ake hawa a saman allo ce wacce aka tsara don aikace-aikacen PCB masu yawan taro. Tana amfani da fasahar semiconductor na AlGaInP don samar da fitilar haske mai haske mai launin rawaya. Babban fa'idar wannan kayan aiki shine ƙaramin sawun sa, wanda yake auna 1.6mm x 0.8mm x 0.6mm, wanda ke ba da damar ajiye sarari sosai akan allunan da'ira idan aka kwatanta da LED na gargajiya masu igiya. Wannan raguwar girma yana ba da gudummawa kai tsaye ga ƙananan ƙirar samfur na ƙarshe, rage buƙatun ajiya na kayan aiki, da kuma mafi girman yawan taro akan PCBs. Na'urar kuma tana da nauyi mai sauƙi, wanda ya sa ta dace da aikace-aikacen lantarki masu ɗaukar kaya da ƙananan ƙira inda nauyi ke da muhimmanci.
An rarraba LED a matsayin nau'in launi guda kuma an gina shi ta amfani da kayan da ba su da gubar (Pb-free). Ya bi manyan ka'idojin muhalli da aminci, gami da umarnin EU RoHS, ƙa'idodin EU REACH, kuma an rarraba shi a matsayin maras halogen, tare da abun ciki na bromine (Br) da chlorine (Cl) kowanne ƙasa da 900 ppm kuma jimlar su ƙasa da 1500 ppm. Ana samar da samfurin akan tef mai 8mm, wanda aka nannade akan reels masu diamita 7-inch, wanda ya sa ya dace da daidaitattun kayan aikin haɗawa da zaɓi da wuri ta atomatik. An kuma tsara shi don jurewa hanyoyin gishiri na gama gari, gami da infrared da lokacin sake kwarara.
2. Technical Specifications and Deep Objective Interpretation
2.1 Absolute Maximum Ratings
Absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These values are not intended for normal operation.
- Reverse Voltage (VR): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
- Forward Current (IF): 25mA DC. O yɛ mfomso a ɛkɔ anim kɛse a wɔpene sɛ wɔde bɛyɛ adwuma a wɔde wɔn ani begu so.
- Peak Forward Current (IFP): 60mA. Wannan ƙimar ta shafi yanayin bugun jini tare da aikin aiki na 1/10 a 1kHz. Yana ba da damar ɗan gajeren lokaci na haske mafi girma amma bai kamata a yi amfani da shi don tuƙi ci gaba ba.
- Ragewar Wutar Lantarki (Pd): 60mW. Wannan shine matsakaicin wutar lantarki da fakiti zai iya ɓata a matsayin zafi a yanayin yanayi (Ta) na 25°C. Rage ƙima na iya zama dole a yanayin zafi mafi girma.
- Electrostatic Discharge (ESD): 2000V (Human Body Model). This indicates a moderate level of ESD sensitivity. Proper ESD handling procedures are essential during assembly and handling.
- Operating Temperature (Topr): -40°C to +85°C. The device is rated for industrial temperature range applications.
- Storage Temperature (Tstg): -40°C to +90°C.
- Soldering Temperature: Na'urar na iya jure reflow soldering tare da kololuwar zafin jiki na 260°C har zuwa dakika 10. Don soldering da hannu, zafin ƙarfen ƙarfe bai kamata ya wuce 350°C ba, kuma lokacin tuntuɓar ya kamata a iyakance zuwa dakika 3 a kowace tasha.
2.2 Electro-Optical Characteristics
Ana auna waɗannan sigogi a daidaitaccen yanayin gwaji na Ta=25°C da IF=20mA, sai dai idan an faɗi daban. Suna ayyana aikin gani da na lantarki na LED.
- Luminous Intensity (Iv): Ranges from a minimum of 28.50 mcd to a maximum of 72.00 mcd. The typical value falls within this range. A tolerance of ±11% applies to the luminous intensity.
- Viewing Angle (2θ1/2): Yawanci 140 digiri. Wannan fadi na kallon yana sa LED ya dace da aikace-aikacen da ke buƙatar haske mai faɗi ko ganuwa daga kusurwoyi da yawa.
- Peak Wavelength (λp): Yawanci 591 nm. Wannan shine tsayin raƙuman ruwa wanda rarraba ƙarfin bakan ya fi girma.
- Dominant Wavelength (λd): Ranges from 585.50 nm to 591.50 nm. This is the single wavelength perceived by the human eye that matches the color of the LED light. A tight tolerance of ±1nm is specified.
- Spectral Bandwidth (Δλ): Typically 15 nm. This defines the width of the emitted spectrum at half the maximum intensity (FWHM).
- Forward Voltage (VF): Ranges from 1.75V to 2.35V at IF=20mA. A tolerance of ±0.1V is noted. This parameter is crucial for designing the current-limiting circuit.
- Reverse Current (IR): Maximum 10 μA at VR=5V. The datasheet explicitly states the device is not designed for reverse operation; this test is for characterization only.
3. Binning System Explanation
To ensure consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific performance criteria for their application.
3.1 Luminous Intensity Binning
LEDs are categorized into four bins (N1, N2, P1, P2) based on their measured luminous intensity at 20mA.
- N1: 28.50 - 36.00 mcd
- N2: 36.00 - 45.00 mcd
- P1: 45.00 - 57.00 mcd
- P2: 57.00 - 72.00 mcd
3.2 Dominant Wavelength Binning
The color (hue) is controlled by binning the dominant wavelength into two groups.
- D3: 585.50 - 588.50 nm
- D4: 588.50 - 591.50 nm
3.3 Forward Voltage Binning
Forward voltage is binned to aid in power supply design and to group LEDs with similar electrical characteristics.
- Bin 0: 1.75 - 1.95 V
- Bin 1: 1.95 - 2.15 V
- Bin 2: 2.15 - 2.35 V
The combination of these bin codes (e.g., CAT for intensity, HUE for wavelength, REF for voltage) is typically indicated on the product packaging label, allowing for precise component selection.
4. Performance Curve Analysis
The datasheet references typical electro-optical characteristic curves. While the specific graphs are not provided in the text, standard curves for such LEDs would typically include:
- Relative Luminous Intensity vs. Forward Current: This curve shows how light output increases with current, usually in a sub-linear fashion at higher currents due to heating effects.
- Forward Voltage vs. Forward Current: This is the diode's I-V characteristic, showing the exponential relationship.
- Relative Luminous Intensity vs. Ambient Temperature: This curve demonstrates the thermal quenching effect, where light output decreases as junction temperature rises.
- Spectral Power Distribution: A plot showing the intensity of emitted light across wavelengths, centered around the peak wavelength of 591 nm with a typical bandwidth of 15 nm.
These curves are essential for understanding the device's behavior under non-standard conditions (different currents or temperatures) and for optimizing the drive circuitry for efficiency and longevity.
5. Mechanical and Package Information
5.1 Package Dimensions
The 17-21 SMD LED has a compact rectangular package. Key dimensions (in mm) include a body length of 1.6, width of 0.8, and height of 0.6. The terminal pads are designed for reliable soldering. A cathode identification mark is present on the package, which is critical for correct orientation during assembly. All unspecified tolerances are ±0.1mm.
5.2 Polarity Identification
Polarity e tatau mo le faagaioiina o le LED. O le afifi o loʻo iai se faʻailoga manino e iloa ai le cathode (-) terminal. E tatau i tagata mamanu ona mautinoa o loʻo i ai i le PCB footprint se faʻailoga tutusa ma o le faʻapotopotoga e faʻaoga saʻo le vaega.
6. Soldering and Assembly Guidelines
Proper handling is crucial to maintain device reliability and performance.
6.1 Current Limiting
An external current-limiting resistor is mandatory. The LED's exponential I-V characteristic means a small increase in voltage can cause a large, potentially destructive, increase in current. The resistor value should be calculated based on the supply voltage, the LED's forward voltage (using the maximum value from the bin or datasheet for safety), and the desired forward current (not exceeding 25mA continuous).
6.2 Storage and Moisture Sensitivity
The product is packaged in a moisture-resistant bag with desiccant. To prevent moisture-induced damage during reflow ("popcorning"), the following precautions must be taken:
- Do not open the moisture-proof bag until ready for use.
- After opening, use the components within 168 hours (7 days) if stored at conditions ≤30°C and ≤60% RH.
- If the exposure time is exceeded or the desiccant indicates saturation, a bake-out at 60±5°C for 24 hours is required before reflow.
6.3 Reflow Soldering Profile
A lead-free (Pb-free) reflow profile is specified:
- Pre-heating: 150-200°C for 60-120 seconds.
- Time Above Liquidus (217°C): 60-150 seconds.
- Peak Temperature: Maximum 260°C, held for a maximum of 10 seconds.
- Heating Rate: Maximum 6°C/second up to 255°C.
- Cooling Rate: Maximum 3°C/second.
Reflow should not be performed more than two times. Avoid mechanical stress on the package during heating and do not warp the PCB after soldering.
6.4 Hand Soldering and Rework
Idan an yi amfani da gishiri na hannu ya zama dole, yi amfani da ƙarfe mai ƙarfe tare da zafin tip ≤350°C da wutar lantarki ≤25W. Lokacin tuntuɓar kowane tasha dole ya zama ≤3 seconds. Bari tazarar sanyi aƙalla 2 seconds tsakanin gishiri kowane tasha. Ana ƙarfafa hana sake aiki. Idan ba za a iya kaucewa ba, dole ne a yi amfani da ƙarfe na gishiri na musamman mai kai biyu don dumama tashoshi biyu lokaci guda, don hana damuwa na zafi akan silicon die. Dole ne a tabbatar da tasirin sake aiki akan halayen LED a baya.
7. Packaging and Ordering Information
7.1 Reel and Tape Specifications
The LEDs are supplied in embossed carrier tape with pockets suitable for the 17-21 package. The tape width is 8mm, wound on a standard 7-inch (178mm) diameter reel. Each reel contains 3000 pieces. Detailed reel and carrier tape dimensions are provided in the datasheet for compatibility with automated feeders.
7.2 Label Information
The packaging label contains several key codes:
- P/N: Product Number (e.g., 17-21/Y2C-CN1P2B/3T).
- QTY: Packing Quantity (3000 pcs/reel).
- CAT: Luminous Intensity Rank (e.g., N1, P2).
- HUE: Chromaticity/Dominant Wavelength Rank (e.g., D3, D4).
- REF: Forward Voltage Rank (e.g., 0, 1, 2).
- LOT No: Traceability lot number.
8. Application Suggestions
8.1 Typical Application Scenarios
- Backlighting: Ideal for backlighting indicators, symbols, and switches in automotive dashboards, consumer electronics, and industrial control panels.
- Status Indicators: Perfect for power, connectivity, and status indicators in telecommunications equipment (phones, faxes), networking hardware, and home appliances.
- LCD Flat Backlighting: Can be used in arrays to provide uniform backlighting for small monochrome or segmented LCD displays.
- General Purpose Indication: Suitable for any application requiring a bright, reliable, and compact visual indicator.
8.2 Design Considerations
- Drive Circuit: Always use a constant-current driver or a voltage source with a series resistor. Consider the forward voltage binning when calculating resistor values to ensure consistent brightness across different production batches.
- Thermal Management: While the power is low, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near the maximum current to manage junction temperature and maintain light output and lifespan.
- ESD Protection: Incorporate ESD protection diodes on sensitive lines if the LED is in an exposed location (e.g., a panel indicator).
- Optical Design: The wide 140-degree viewing angle may require light guides or diffusers if a more focused beam is needed. For optimal visibility, consider the contrast ratio against the background.
9. Technical Comparison and Differentiation
The 17-21 LED offers specific advantages in its category:
- vs. Larger SMD LEDs (e.g., 3528, 5050): The 17-21 provides a significantly smaller footprint, enabling ultra-miniaturized designs. The trade-off is generally lower maximum light output and power handling.
- vs. Leaded LEDs: It eliminates the need for through-hole mounting, enabling fully automated assembly, reducing board size, and improving mechanical robustness by eliminating bent leads.
- vs. Other Yellow LEDs: The use of AlGaInP technology typically offers higher luminous efficiency and better color saturation for yellow and amber colors compared to older technologies like GaAsP on GaP.
- Key Differentiators: Its combination of a very small 1.6x0.8mm footprint, a wide 140-degree viewing angle, compliance with halogen-free and other environmental standards, and detailed binning for color and intensity consistency.
10. Frequently Asked Questions (Based on Technical Parameters)
Q1: What resistor value should I use with a 5V supply?
A: Yana amfani da mafi girman VF na 2.35V (daga Bin 2) da kuma manufar IF na 20mA don aminci: R = (Vsupply - VF) / IF = (5V - 2.35V) / 0.020A = 132.5 Ohms. Yi amfani da ƙimar daidaitaccen ƙima mafi kusa (misali, 130 ko 150 Ohms). Koyaushe tabbatar da ainihin halin yanzu a cikin kewaye.
Q2: Shin zan iya tuka wannan LED a 30mA don ƙarin haske?
A: A'a. Matsakaicin Matsakaicin Ƙimar don ci gaba da gaba na gaba (IF) shine 25mA. Yin aiki a 30mA ya wuce wannan ƙimar, wanda zai rage amincin da tsawon rayuwa, kuma yana iya haifar da gazawar nan take saboda zafi mai yawa.
Q3: Kusurwar kallo shine digiri 140. Ta yaya zan sami ƙarin haske mai mai da hankali?
A: Ungehitaji kutumia sehemu ya ziada ya macho, kama vile lenzi iliyowekwa juu ya LED. Kifurushi cha asili kinatoa muundo mpana, wa lambertian.
Q4: Mfumo wangu wa ukaguzi wa macho wa kiotomatiki (AOI) una shida na alama ya cathode. Je, kuna njia inayopendekezwa ya kutambua polarity kwenye PCB?
A: Ndio. Uwiano wa PCB unapaswa kujumuisha alama ya silkscreen au sehemu ya shaba inayolingana na alama ya cathode ya kifurushi. Hakikisha mfumo wa maono wa mashine ya pick-and-place umepangwa kutambua hii tofauti ya ulinganifu. Rejelea mchoro wa vipimo vya kifurushi kwa eneo halisi la alama hiyo.
Q5: Do I need to bake the components if the bag has been open for 10 days?
A: Yes. The specification states a "floor life" of 168 hours (7 days) after opening the moisture barrier bag. Since 10 days (240 hours) exceeds this, you must perform the baking treatment (60±5°C for 24 hours) before subjecting the LEDs to reflow soldering to prevent moisture-related damage.
11. Practical Application Case Study
Scenario: Designing a compact multi-status indicator panel for a portable medical device.
Requirements: The device needs 6 independent status indicators (Power, Battery Low, Bluetooth, Error, Mode A, Mode B) in a very limited space on the front panel. The indicators must be clearly visible in various lighting conditions, consume minimal power, and withstand cleaning with disinfectants.
Design Implementation:
- Component Selection: 17-21 brilliant yellow LED yanã ake zaɓi don duk alamomin saboda ƙaramin girmansa (wanda ke ba da damar 6 LEDs su dace a jere tare da tazara), haske mai kyau, da kuma faɗin kusurwar kallo wanda ke tabbatar da ganuwa daga kusurwoyi daban-daban.
- Circuit Design: Ana amfani da layin 3.3V na gama-gari. Ta amfani da VF na yau da kullun na 2.0V da IF=15mA (don daidaita haske da ceton wutar lantarki), an ƙididdige resistor mai iyakancewar halin yanzu: R = (3.3V - 2.0V) / 0.015A ≈ 87 Ohms. An zaɓi resistor na 91 Ohm, 1% haƙuri ga kowane LED don tabbatar da daidaitaccen haske.
- PCB Layout: The LEDs are placed on 3mm centers. The PCB footprint is designed according to the datasheet's recommended pad layout, with a clear silkscreen dot next to the cathode pad. A small ground pour around the LEDs is omitted to simplify soldering and cleaning.
- Panel Design: The front panel has 1.2mm diameter apertures aligned with each LED. A thin, milky-white diffuser film is placed behind the panel to soften the LED's hotspot and create a uniform illuminated dot.
- Software Control: The microcontroller drives each LED via a GPIO pin configured as an open-drain output with an internal pull-up disabled, sinking current through the LED/resistor pair to ground.
- Result: Un panel de indicador limpio y de aspecto profesional que cumple con todos los requisitos de tamaño, visibilidad y fiabilidad. La clasificación consistente (especificando CAT=P1 o superior, HUE=D4) en la lista de materiales garantiza que todas las unidades tengan color y brillo uniformes.
12. Technical Principle Introduction
El LED 17-21 se basa en material semiconductor de Fosfuro de Aluminio, Galio e Indio (AlGaInP) crecido sobre un sustrato. Cuando se aplica un voltaje directo que excede el voltaje de encendido del diodo (aproximadamente 1.8V), los electrones y los huecos se inyectan en la región activa desde las capas tipo n y tipo p, respectivamente. Estos portadores de carga se recombinan radiativamente, liberando energía en forma de fotones. La composición específica de la aleación de AlGaInP determina la energía de la banda prohibida, que define directamente la longitud de onda (color) de la luz emitida. Para el amarillo brillante, la longitud de onda pico se diseña para ser alrededor de 591 nm. El encapsulante de resina epoxi transparente protege el chip semiconductor, actúa como una lente para dar forma a la salida de luz (contribuyendo al ángulo de visión de 140 grados) y puede contener fósforos o tintes, aunque para este tipo monocromático, es probable que no esté modificado para preservar la pureza del color.
13. Industry Trends and Developments
The market for miniature SMD LEDs like the 17-21 continues to evolve. Key trends influencing this product segment include:
- Increased Efficiency: Ongoing material science and chip design improvements aim to deliver higher luminous efficacy (more light output per unit of electrical power) from the same or smaller package sizes.
- Enhanced Reliability: Demands from automotive and industrial applications are driving improvements in high-temperature performance, moisture resistance, and longevity.
- Tighter Color Binning: Applications requiring precise color matching, such as multi-LED indicators or backlighting arrays, are pushing manufacturers towards narrower binning tolerances for dominant wavelength and luminous intensity.
- Integration: A trend towards integrating multiple LED chips, current-limiting resistors, or even control ICs into a single package module to simplify end-user circuit design and save board space.
- Environmental Compliance: Regulations like RoHS and REACH are becoming stricter and more global, making full material declaration and halogen-free compliance standard expectations, not differentiators.
O mea fa'apena o le 17-21 e fai ma sui o se fofo ua matua ma sili ona lelei mo mana'oga fa'ailoga fa'avae, ma o fa'asologa i le lumana'i e foliga mai o le a taula'i i faiga o lo'o ta'ua i luga nai lo suiga tetele i foliga mo lenei vasega sili ona la'ititi.
LED Specification Terminology
Fa'amatalaga atoa o upu fa'atekinisi LED
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: kona mafuta mazuri zaidi, ufanisi wa juu, kwa nguvu kubwa. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | E tabeta mwadogo wa mwanga sawa katika kundi moja. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Yana tabbatar da babu abubuwa masu cutarwa (gubar, mercury). | Bukatar shiga kasuwa a duniya. |
| ENERGY STAR / DLC | Ha'apipita ʻeneʻene | Ha'apipita ʻeneʻene a me ka hoʻokō no ka hoʻomālamalama. | Used in government procurement, subsidy programs, enhances competitiveness. |