SMD LED LTST-S06WGEBD Datasheet - Package Dimensions - White/Green/Red/Blue - 30mA - Technical Documentation

1. Product Overview

LTST-S06WGEBD is a surface-mount device (SMD) LED specifically designed for automated printed circuit board (PCB) assembly. Its miniature size makes it suitable for space-constrained applications in various electronic devices.

1.1 Features

• Compliant with the RoHS (Restriction of Hazardous Substances) Directive.
• Packaged in 12mm carrier tape on 7-inch reels for automated handling.
• Standard EIA (Electronic Industries Alliance) package outline.
• Compatible integrated circuit, suitable for direct interface with logic circuits.
• Compatible with automatic surface-mount assembly equipment.
• Withstands standard infrared (IR) reflow soldering processes.
• Preconditioned per JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Application Fields

• Communication equipment (cordless/cellular telephones).
• Office automation equipment and laptop computers.
• Network systems and household appliances.
• Indoor signage and status indicator lights.
• Front panel backlighting and signal/symbol illumination.

2. Package Dimensions and Configuration

LED huyu standard SMD package. Sai dai an bayyana, duk ma'auni na girma sune millimeters, daidaitaccen tolerance shine ±0.1mm. Model LTST-S06WGEBD yana haɗa nau'ikan LED guda da yawa a cikin fakitin guda ɗaya, ta hanyar rarraba fil ɗin za a iya samun launuka daban-daban.

3. Ratings and Characteristics

3.1 Absolute Maximum Ratings

Ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these values may cause permanent damage.

3.2 Recommended Infrared Reflow Soldering Profile

For lead-free soldering processes, the recommended reflow soldering profile should comply with the J-STD-020B standard. This ensures reliable solder joints while avoiding damage to the LED package due to excessive thermal stress.

3.3 Electrical and Optical Characteristics

Typical performance is measured at Ta=25°C and forward current (IF) of 20mA, unless otherwise specified.

Note:

• Tolerance: Luminous flux ±10%, Dominant wavelength ±1nm, Forward voltage ±0.1V.
• ESD Warning: LEDs are sensitive to electrostatic discharge (ESD). Proper ESD precautions (e.g., wearing an anti-static wrist strap, using grounded equipment) must be taken during handling.
• Chromaticity coordinates are tested per chip/channel according to the CAS140B standard.

4. Bin Code System

LEDs are sorted (binned) based on key optical parameters to ensure consistency across production batches.

4.1 RGB Luminous Intensity (IV) Binning

LEDs are classified based on their minimum and maximum luminous flux output at 20mA.

4.1.1 Kowane matakin launi

Green:G1 (4.00-5.65 lm), G2 (5.65-8.00 lm).
Red:R1 (1.92-2.75 lm), R2 (2.75-4.00 lm).
Blue:B1 (0.77-1.08 lm), B2 (1.08-1.58 lm).
The tolerance for each bin is ±10%.

4.1.2 Haɗa lambobin rarrabawar RGB

The single alphanumeric code on the product label represents a specific combination of green, red, and blue intensity bins. For example, code A1 corresponds to G1, R1, B1.

4.2 RGB Dominant Wavelength (WD) Binning

LEDs are also binned according to the peak wavelength of their emitted light.

4.2.1 Each Wavelength Grade

Green:AP (520-525 nm), AQ (525-530 nm).
Red:Single range (617-630 nm).
Blue:AC (465-470 nm), AD (470-475 nm).
The tolerance for each grade is ±1nm.

4.2.2 Combined RGB Wavelength Binning Code

Similar to intensity, a code (D1-D4) specifies the wavelength binning combination for the green, red, and blue chips.

4.3 White Luminous Intensity Binning

White LED individual binning: W1 (4.40-5.85 lm), W2 (5.85-7.80 lm). Tolerance is ±10%.

4.4 White Chromaticity (CIE) Binning

White LEDs are further classified based on their chromaticity coordinates (x, y) on the CIE 1931 chromaticity diagram. Binning (e.g., D1, D2, E1, E2, F1, F2) defines specific quadrilateral regions on this chart to ensure a consistent white appearance. The tolerance for each (x, y) coordinate is ±0.01.

5. Typical Performance Curves

This datasheet contains graphical representations of key characteristics, typically plotted against forward current or ambient temperature. These curves are essential for design engineers to predict LED behavior under non-standard conditions.

• Forward Current vs. Forward Voltage (I-V Curve):It displays a nonlinear relationship, which is crucial for designing current-limiting circuits.
• Forward Current vs. Luminous Intensity/Luminous Flux:Shows how light output increases with current until reaching the maximum rated value.
• Ambient Temperature vs. Relative Luminous Intensity:Illustrates that light output decreases as junction temperature rises, emphasizing the importance of thermal management.
• Spectral Power Distribution:For colored LEDs, this graph shows the relative intensity at each wavelength, defining the color purity and dominant wavelength.

6. User Guide and Operation

6.1 Cleaning

Do not use unspecified chemicals. For cleaning, the LED can be immersed in ethanol or isopropanol at room temperature for no more than one minute. Stirring or ultrasonic cleaning may damage the package.

6.2 Recommended PCB Pad Layout

The recommended PCB pad pattern (footprint) is provided to ensure proper soldering, mechanical stability, and heat dissipation. Following this layout prevents tombstoning and solder joint defects.

6.3 Carrier Tape and Reel Packaging Specifications

LED is provided in embossed carrier tape with protective cover tape. The key dimensions of the carrier tape pocket, pitch, and reel are specified to be compatible with standard automated assembly equipment.

6.4 Reel Specifications

• Reel Diameter: 7 inches.
• Idadi kwa kila spool: vipande 3000.
• Idadi ndogo iliyobaki ya kuagiza: vipande 500.
• Maximum number of consecutive missing components in the carrier tape: 2.
• Packaging conforms to EIA-481-1-B specification.

7. Application Notes

7.1 Intended Use and Reliability

These LEDs are designed for general-purpose electronic equipment. For applications requiring extremely high reliability or where failure could endanger life or health (e.g., aviation, medical equipment, traffic safety systems), specialized reliability assessment and consultation with the manufacturer are mandatory. Standard products may not be certified for such safety-critical applications.

7.2 General Design Considerations

• Current Limiting:Always use a series current-limiting resistor or constant-current driver to operate the LED to prevent exceeding the absolute maximum DC forward current, which can cause rapid aging or failure.
• Thermal Management:Although power consumption is low, ensuring sufficient PCB copper foil area or thermal vias helps maintain a lower junction temperature, thereby preserving light output and service life.
• Reverse Voltage Protection:The maximum reverse voltage is only 5V. If the LED may be exposed to reverse bias conditions, protective measures (such as a parallel diode) should be incorporated.
• Electrostatic Discharge Protection:If there is an ESD risk in the assembly environment or final application, ESD protection components should be implemented on the PCB traces connected to the LED.

8. In-depth Technical Analysis and Comparison

8.1 Semiconductor Materials and Color

Different colors are achieved by using different semiconductor material systems:
- InGaN (Indium Gallium Nitride):Used for green and blue LEDs. This material system enables efficient light emission in the blue-green spectral range.
- AlInGaP (Aluminum Indium Gallium Phosphide):Used for red LEDs. This material has high efficiency for red and amber wavelengths.
- White Light:Typically produced by a blue InGaN chip coated with yellow phosphor. The mixture of blue and yellow light appears white to the human eye. Binning for white LEDs focuses on chromaticity coordinates to define "whiteness" (e.g., cool white, neutral white).

8.2 Understanding the Significance of Binning for Design

Detailed binning systems serve an important purpose. For aesthetic applications (such as status indicators or backlighting, where multiple LEDs are used side-by-side), selecting LEDs from the same intensity and chromaticity bins ensures uniform brightness and color, preventing a patchy or uneven appearance. For color-mixing applications (such as using RGB LEDs to create tunable white light), understanding the precise wavelength and intensity binning aids in achieving more accurate color calibration and the development of control algorithms.

8.3 Key Differentiating Advantages

This multi-chip package (combining white and separate RGB colors) offers design flexibility within a single package footprint, saving PCB space compared to using four discrete LEDs. Preconditioning to JEDEC Level 3 indicates it can withstand 168 hours of floor life at ≤30°C/60% RH prior to reflow soldering, which is important for manufacturing logistics.

9. FAQ (Parameter-based)

Q: What is the typical forward voltage of the green LED at 20mA?
A: The forward voltage (VF) range of the green chip at 20mA is from 2.4V (minimum) to 3.3V (maximum). The typical reference value for design is approximately 2.8-3.0V, but the circuit design should be able to withstand the maximum value.

Q: Can I drive this LED continuously at 30mA?
A: Yes, 30mA is the absolute maximum DC forward current rating. To ensure long-term reliable operation, it is generally recommended to drive the LED at a lower current (e.g., 20mA) to reduce thermal stress and extend its lifespan.

Q: How to interpret the binning code "A3" on the label?
A: Referring to the cross-reference table, code A3 corresponds to: Green is G2 bin (5.65-8.00 lm), Red is R1 bin (1.92-2.75 lm), Blue is B1 bin (0.77-1.08 lm).

Q: Is this LED suitable for outdoor use?
A: Its operating temperature range is -40°C to +85°C, covering many outdoor conditions. However, the datasheet does not specify an Ingress Protection (IP) rating against dust and water. For outdoor use, additional sealing or conformal coating on the PCB is required to protect the LED and its solder joints from moisture and contaminants.

10. Design and Application Examples

Scenario: Designing a multi-color status indicator light for a network router.

1. Demand:A single component that can display white (power on), green (connected), red (error), and blue (pairing mode).
2. Component Selection:LTST-S06WGEBD shine ne, sabab u dört rengni birleştirgen.
3. Elektrik döwresi dizaýny:
   • Her bir reňk kanalyny kontrol etmek üçin mikro kontrolýer GPIO pinlerini ulanyp, ýönekeý NPN tranzistor ýa-da MOSFET aşaky tarap açary hökmünde ulanyň.
   • Calculate the current-limiting resistor for each channel. For the green chip, at 20mA, VF(max) of 3.3V, and a power supply of 5V: R = (5V - 3.3V) / 0.02A = 85Ω. Use the next standard value (e.g., 91Ω or 100Ω), which will provide a slightly smaller current and is safe.
   • Repeat this calculation using the respective VF(max) for other colors.
4. PCB Layout:Follow the recommended pad layout. Keep LEDs away from other heat-generating components. Ensure proper connection between the microcontroller ground and the LED circuit ground.
5. Software:Implement control logic to illuminate the corresponding chip based on the system status. If the total absolute maximum power dissipation of the package may be exceeded, ensure that only one chip is powered at a time.