17-215/G6C-FN2P2B/3T SMD LED Datasheet - Bright Yellow Green - 2.0x1.25x0.8mm - Max 2.35V - 60mW - Simplified Chinese Technical Documentation

1. Product Overview

17-215/G6C-FN2P2B/3T, yüksek yoğunluklu elektronik montaj için tasarlanmış bir yüzey montaj cihazı (SMD) LED'dir. Bu bileşen, parlak sarı-yeşil ışık yayan bir AIGaInP (alüminyum galyum indiyum fosfor) yarı iletken çip kullanır. Ana avantajı, baskılı devre kartının (PCB) boyutunu önemli ölçüde küçültmeye, bileşen montaj yoğunluğunu artırmaya ve sonuçta daha küçük, daha hafif son kullanıcı cihazlarının geliştirilmesini teşvik etmeye yardımcı olan minyatür paket boyutudur. Cihaz, endüstri standardı 8mm taşıma bandı formatında, 7 inç çapında bir makaraya sarılı olarak sunulur ve otomatik yüzey montaj ekipmanlarıyla tam uyumludur, böylece yüksek hacimli üretim süreçlerini basitleştirir.

该 LED 属于单色类型，采用无铅 (Pb-free) 材料制造。它符合主要的国际环境与安全法规，包括欧盟的《有害物质限制指令》(RoHS)、《化学品注册、评估、授权和限制法规》(REACH) 以及无卤标准（溴含量 <900 ppm，氯含量 <900 ppm，总和 <1500 ppm）。这种合规性确保了其适用于全球范围内对材料有严格要求的广泛市场和各类应用。

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These values are not intended for normal operating conditions. For the 17-215 LED, the maximum continuous forward current (I_F) rating is 25 mA. Under pulsed conditions with a duty cycle of 1/10 and a frequency of 1 kHz, the peak forward current (I_FP) Can reach 60 mA. Maximum allowable reverse voltage (V_R) is 5 V; it must be noted that this device is not designed for reverse bias operation, this rating primarily applies to reverse current (I_R) test conditions. Total power dissipation (P_d) must not exceed 60 mW, this value is calculated from the product of forward voltage and forward current. According to the Human Body Model (HBM), this device can withstand 2000 V of Electrostatic Discharge (ESD). Operating temperature range (T_opr) is -40°C to +85°C, while the storage temperature (T_stg) is slightly wider, up to +90°C.

2.2 Electro-Optical Characteristics

Photoelectric performance is specified under standard test conditions with an ambient temperature (T_a) of 25°C and a forward current of 20 mA. The typical range of luminous intensity (I_v) is from 36.00 mcd to 72.00 mcd, with a specified tolerance of ±11%. The spatial distribution of light features a wide viewing angle (2θ_1/2) as a feature, providing broad illumination. The spectral characteristics are defined by the peak wavelength (λ_p) 575 nm and the dominant wavelength (λ_d) range 570.00 nm to 574.50 nm (tolerance ±1nm). The spectral bandwidth (Δλ) is approximately 20 nm. At a current of 20 mA, the forward voltage (V_FThe typical range of ) is from 1.75 V to 2.35 V, with a tolerance of ±0.1 V. When a 5 V reverse voltage is applied, the reverse current (I_R) is guaranteed to be less than or equal to 10 μA.

3. Grading System Description

To ensure consistency in mass production, LEDs are sorted into different bins based on key performance parameters. This allows designers to select components that meet the requirements of specific applications in terms of brightness, color, and electrical behavior.

3.1 Luminous Intensity Binning

Luminous intensity is divided into three main bins under the condition of I_F= 20 mA:

• Gear N2:36.00 mcd (min) to 45.00 mcd (max)
• Gear P1:45.00 mcd (minimum) to 57.00 mcd (maximum)
• Gear P2:57.00 mcd (minimum) to 72.00 mcd (maximum)

The tolerance of luminous intensity within the gear is ±11%.

3.2 Dominant Wavelength Binning

Dominant wavelength is closely related to perceived color and is divided into three grades:

• Grade CC2:570.00 nm (minimum) to 571.50 nm (maximum)
• Gear CC3:571.50 nm (minimum) to 573.00 nm (maximum)
• Gear CC4:573.00 nm (minimum) to 574.50 nm (maximum)

The tolerance of the dominant wavelength is ±1 nm.

3.3 Forward Voltage Binning

Forward voltage is divided into three levels to assist circuit design, particularly for current-limiting resistor calculation and power supply design:

• Level 0:1.75 V (minimum) to 1.95 V (maximum)
• Level 1:1.95 V (minimum) to 2.15 V (maximum)
• Gear 2:2.15 V (minimum) to 2.35 V (maximum)

The tolerance of forward voltage is ±0.1 V.

4. Performance Curve Analysis

Although the PDF file indicates that page 5 contains typical photoelectric characteristic curves, no specific charts are provided in the textual content. Typically, such datasheets include curves illustrating the relationship between forward current and luminous intensity, forward voltage versus forward current, and relative luminous intensity versus ambient temperature. These curves are crucial for designers to understand the device's behavior under non-standard conditions. For example, luminous intensity generally decreases as the ambient temperature rises. Forward voltage also has a negative temperature coefficient, meaning it slightly decreases with increasing temperature. Designers should refer to the graphical data to appropriately derate performance for their specific operating environment and ensure stable current drive within the target temperature range.

5. Mechanical and Packaging Information

5.1 Package Size

17-215 SMD LED uses a compact package. Key dimensions (unit: mm) are as follows, with a general tolerance of ±0.1 mm unless otherwise specified: overall package length is 2.0 mm, width is 1.25 mm, and height is 0.8 mm. The device includes two anode/cathode terminals for electrical connection. The datasheet provides detailed dimension drawings, including pad pitch, terminal dimensions, and lens geometry, to guide PCB pad pattern design for optimal soldering and mechanical stability.

5.2 Polarity Identification

Daidaitaccen halayen lantarki yana da mahimmanci ga aikin LED. Zanen kayan aiki a cikin takaddar bayanin yana nuna tashoshin anode da cathode a sarari. Yawancin lokaci, wani tashoshi na iya samun alama ko yana da siffa daban (misali, rami ko gefen da aka yanke) don sauƙaƙe ganewa ta gani yayin haɗawa da hannu ko dubawa. Dole ne masu ƙira su tabbatar da cewa ƙirar filayen PCB ta yi daidai da wannan halayen lantarki, don hana kuskuren sanyawa.

6. Welding and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This LED is compatible with infrared and vapor phase reflow soldering processes. For lead-free soldering, a specific temperature profile must be followed:

• Preheating:Heat from ambient temperature to 150-200°C within 60-120 seconds.
• Soak/Reflow:Maintain at temperatures above 217°C (liquidus temperature) for 60-150 seconds. The peak temperature must not exceed 260°C, and the time above 255°C must be limited to a maximum of 30 seconds.
• Cooling:The maximum cooling rate should not exceed 6°C per second.

It is strongly recommended that the number of reflow soldering cycles does not exceed two to prevent thermal stress damage to the LED package and internal wire bonds.

6.2 Manual Soldering

If manual soldering cannot be avoided, extra care must be taken. The soldering iron tip temperature should be below 350°C, and the contact time with each terminal must not exceed 3 seconds. The soldering iron power should be 25W or lower. At least 2 seconds should elapse between soldering each terminal. Using a dual-tip soldering iron for rework is recommended to minimize thermal stress, but rework after initial soldering is generally discouraged.

6.3 Storage and Humidity Sensitivity

LEDs are packaged in moisture barrier bags with desiccant. Do not open the bag until ready to use the components. After opening:

• Unused LEDs should be stored at 30°C or lower, with a relative humidity (RH) of 60% or lower.
• The "floor life" after opening the bag is 168 hours (7 days).
• If not used within this period, the remaining LEDs must be repacked into a bag with desiccant.
• If the desiccant indicator changes color or the exposure time exceeds the specified limit, baking at 60°C ±5°C for 24 hours is required before use.

7. Packaging and Ordering Information

7.1 Reel and Carrier Tape Specifications

The product is supplied in standard "ammo pack" style carrier tape, 8 mm in width, wound on 7-inch (178 mm) diameter reels. Each reel contains 3000 devices. Detailed dimensions for the reel, tape pocket, and cover tape are provided to ensure compatibility with automatic feeders.

7.2 Label Description

The packaging label contains several key codes for traceability and specification:

• CPN:Customer Part Number (assigned by the buyer).
• P/N:Manufacturer Part Number (17-215/G6C-FN2P2B/3T).
• QTY:Packaging quantity (e.g., 3000).
• CAT:Luminous Intensity Grade (e.g., N2, P1, P2).
• HUE:Chromaticity Coordinates and Dominant Wavelength Grade (e.g., CC2, CC3, CC4).
• REF:Forward voltage level (e.g., 0, 1, 2).
• LOT No:Production lot number, used for traceability.

8. Application Suggestions

8.1 Typical Application Scenarios

The bright chartreuse color and compact size make this LED suitable for various indicator and backlight functions:

• Interior ya motokaa:Mwanga wa nyuma wa dashibodi, vifaa, swichi na paneli ya udhibiti.
• Vifaa vya mawasiliano:Status indicators and keyboard backlighting in telephones, fax machines, and other communication equipment.
• Consumer Electronics:Flat backlighting for small LCD displays, switch illumination, and symbol indicators.
• General Indication:Power status, mode selection, and alarm indicator lights in various electronic devices.

8.2 Key Design Considerations

Current limiting is required:LED is a current-driven device. An external current-limiting resistor must always be connected in series with the LED. The resistor value is determined based on the power supply voltage (V_supply) and the LED's forward voltage (V_F, taken from its gear position) and the required forward current (I_F, typically 20 mA or lower) is calculated. The formula is: R = (V_supply- V_F) / I_F. Without this resistor, even a small increase in the supply voltage can cause a large, destructive increase in current.

Thermal Management:Although power consumption is low, ensuring sufficient PCB copper foil area around the LED pad helps with heat dissipation, especially under high ambient temperatures or when driven at maximum continuous current. This helps maintain light output and lifespan.

Application Restrictions:Wannan daidaitaccen LED na kasuwanci ba a ƙera shi ko kuma a tabbatar da shi don amfani da ingantaccen aminci wanda gazawar zai iya haifar da haɗari. Wannan ya haɗa da amma ba'a iyakance ga tsarin soja/jirgin sama, tsarin amincin mota (misali, fitilun birki, fitilun airbag) da kuma na'urorin kiyaye rayuka. Don irin waɗannan aikace-aikace, ya kamata a sayi kayan da suka dace da cancanta da bayanan aminci.

9. Technical Comparison and Differentiation

Babban abin da ya bambanta LED na 17-215 shine haɗa takamaiman kayan AIGaInP na guntu don samar da haske mai haske rawaya-kore, girman fakitinsa mai ƙanƙanta 2012 (2.0x1.25mm), da kuma bin ka'idojin muhalli na zamani (babu gubar, babu halogen, RoHS, REACH). Idan aka kwatanta da tsofaffin LED na rami ko manyan SMD LED, ya sami ƙaramin girman sosai. Idan aka kwatanta da sauran LED masu launin rawaya-kore, fasahar AIGaInP takan ba da ingantaccen haske da kwanciyar hankali na launi (dangane da zafin jiki da ƙarfin lantarki) fiye da wasu kayan semiconductor da ake amfani da su don irin wannan launi. Faɗin kusurwar gani na digiri 130 shima sifa ce mahimmanci ga aikace-aikacen da ke buƙatar haske mai faɗi da daidaito maimakon hasken da aka mai da hankali.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between peak wavelength (λp) and dominant wavelength (λd)?
A1: Peak wavelength is the wavelength at which the spectral power distribution reaches its maximum. Dominant wavelength is the wavelength of monochromatic light that matches the perceived color of the LED. For LEDs with relatively narrow spectra, the two are usually close, but λd is more relevant for color specification in applications.

Q2: If I use a constant voltage source set to the LED's forward voltage, can I drive this LED without a current-limiting resistor?
A2: No, it is not recommended and is likely to damage the LED. The forward voltage has tolerances and a negative temperature coefficient. Slight variations in the supply voltage or an increase in LED temperature can cause a significant and uncontrolled increase in current, leading to overheating and failure. Always use a series resistor or a dedicated constant current driver.

Q3: Why is there a strict "floor life" limit after opening the moisture barrier bag?
A3: SMD components absorb moisture from the atmosphere. During high-temperature reflow soldering, this trapped moisture rapidly vaporizes, creating internal pressure that can lead to package cracking (the "popcorn" effect) or delamination, resulting in failure. Floor life and baking procedures are used to manage this Moisture Sensitivity Level (MSL).

Q4: How to interpret the binning codes (CAT, HUE, REF) when ordering?
A4: You can specify the exact binning codes you require based on your application's needs for brightness (CAT), color (HUE), and forward voltage (REF). Ordering tighter bins ensures higher consistency in the final product's appearance and electrical performance. If not specified, you will receive components from the standard production bins.

11. Practical Design and Usage Examples

Example 1: Dashboard Switch Backlight
In an automotive dashboard, multiple 17-215 LEDs can be placed behind transparent switch caps. A microcontroller's GPIO pin can power them from the vehicle's 12V system via a transistor. Calculate the series resistor for each LED. For example, with a 12V supply, V_Fis 2.1V (gear 1), target I_FFor 20mA: R = (12V - 2.1V) / 0.02A = 495 ohms. A standard 510 ohm resistor will be suitable, resulting in I_F≈ 19.4 mA. The wide viewing angle ensures the switch is evenly illuminated.

Example 2: Network Equipment Status Indicator
For the "Link Activity" indicator on a router, a single LED can be driven directly by a 3.3V logic signal. Using V_F= 1.9V (gear 0) and I_F= 15 mA to reduce power consumption and extend life: R = (3.3V - 1.9V) / 0.015A ≈ 93.3 ohms. A 100 ohm resistor will be used. The bright yellow-green is very eye-catching and is often associated with network activity.

12. Introduction to Working Principles

A light-emitting diode (LED) is a semiconductor device that emits light through a process called electroluminescence. The 17-215 LED uses an AIGaInP (aluminum gallium indium phosphide) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In AIGaInP material, this energy is released primarily as photons (light particles) with a wavelength corresponding to the bandgap energy of the semiconductor material. The specific composition of Al, Ga, In, and P atoms is engineered to create a bandgap that produces yellow-green light with a peak wavelength of approximately 575 nm. An epoxy resin lens encapsulates the chip, protecting it and shaping the light output to achieve the desired 130-degree viewing angle.

13. Technology Trends and Development

The overall trend in SMD LED technology continues to develop in several key areas:Efficiency Improvement:Continuous advancements in materials science and chip design aim to achieve higher lumens per watt (lm/W), thereby reducing power consumption for a given light output.Miniaturization:Package sizes continue to shrink (e.g., from 2012 to 1608, 1005 metric sizes) to support increasingly miniaturized consumer electronics.Color Rendering and Consistency Improvement:Advances in phosphor technology (for white LEDs) and epitaxial growth processes (for color LEDs like AlGaInP) have enabled tighter color binning and more stable performance over lifetime and temperature ranges.Reliability Enhancement:Enhanced encapsulation materials and manufacturing processes are extending LED lifespan and improving resistance to thermal and environmental stress.Integrated Solutions:The market for LEDs with built-in current-limiting resistors, protection diodes, and even driver ICs is growing, simplifying circuit design. The 17-215 represents a mature and widely adopted package and technology that benefits from these ongoing industry-wide improvements in manufacturing yield and performance.