SMD LED 16-213/R6C-AQ2R2B/3T Datasheet - Bright Red - 20mA - 1.75-2.35V - Simplified Chinese Technical Documentation

1. Product Overview

16-213 is a surface-mount device (SMD) LED designed for high-density, miniaturized applications. It utilizes AlGaInP semiconductor technology to produce bright red light output. Its compact form factor significantly saves space on printed circuit boards (PCBs) compared to traditional lead frame components, contributing to smaller end-product designs and reduced storage requirements.

1.1 Core Advantages

• Miniaturization:The small package size allows for higher packaging density and makes it possible to design more compact electronic devices.
• Lightweighting:Suitable for applications where weight is a critical factor.
• Compatibility:Packaged in 8mm tape on 7-inch reels, making it fully compatible with standard automatic surface-mount assembly equipment.
• Environmental Compliance:产品为无铅设计，符合 RoHS、欧盟 REACH 及无卤素标准 (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm)。
• Process Compatibility:Suitable for infrared (IR) and vapor phase reflow soldering processes.

1.2 Target Applications

This LED is ideal for various indicator and backlight functions, including:

• Dashboard and switch backlighting in automotive and industrial control equipment.
• Status indicators and keyboard backlighting in communication devices such as telephones and fax machines.
• Flat backlight for LCD panels, switches, and symbols.
• General indicator light applications.

2. Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under or beyond these conditions is not guaranteed.

3. Electro-Optical Characteristics

These parameters are measured under the condition of an ambient temperature (T_a) of 25°C and a forward current (I_F) of 20mA (unless otherwise specified). They represent the typical performance of the device._aT_a_FI_F

I_R

1. μA
2. V_R=5V
3. Note:

Luminous intensity tolerance: ±11%

Dominant wavelength tolerance: ±1nm

Forward Voltage Tolerance: ±0.05V

4. Explanation of the Grading System_FTo ensure consistency in application performance, LEDs are classified (binned) according to key parameters. 16-213 employs a three-code binning system.

R1

R2

E6

E7_F4.3 Forward Voltage Binning (REF)

Maximum (V)

5. Performance Curve Analysis_aThe following typical curves reveal the device's behavior under different conditions. Unless noted, all curves are measured at T_a=25°C.

5.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve illustrates the exponential relationship between applied voltage and resulting current. At the standard operating current of 20mA, the forward voltage (V_F) typically ranges from 1.75V to 2.35V. Designers must use a series current-limiting resistor to prevent thermal runaway, as a slight increase in voltage beyond the knee point can lead to a large and potentially destructive surge in current._FV_F

5.2 Luminous Intensity vs. Forward Current

Luminous intensity increases approximately linearly with forward current until the maximum rated current is reached. Operation above the absolute maximum rating (25mA continuous current) will shorten lifetime and reduce reliability.

5.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as the junction temperature rises. This curve shows the relative luminous intensity declining as the ambient temperature increases from -40°C to +85°C. This derating must be considered in designs where LEDs operate in high-temperature environments or at high drive currents.

5.4 Forward Current Derating Curve

This critical curve defines the maximum allowable continuous forward current as a function of ambient temperature. To ensure reliable operation and prevent overheating, the forward current must be reduced when operating at high ambient temperatures.

5.5 Spectral Distribution

The spectrum is centered around a typical peak wavelength (λ_p) of 632nm with a full width at half maximum (FWHM) of approximately 20nm, which is characteristic of AlGaInP-based red LEDs. The dominant wavelength (λ_d) defines the perceived color._pλ_d_d5.6 Radiation Pattern

This LED features a wide viewing angle of 120 degrees (2θ_1/2), providing a broad and uniform emission pattern, suitable for area lighting and indicator applications that require a wide viewing angle.

6. Mechanical and Packaging Information_{6.1 Package Dimensions}The datasheet provides the physical outline and key dimensions of the LED package. Unless otherwise specified, the tolerance is typically ±0.1mm. Designers should refer to the exact drawing to create the footprint.

6.2 Recommended Land Pattern

Contains the recommended pad pattern (footprint) for PCB design. This pattern is for reference only and should be optimized based on specific manufacturing processes, solder paste volume, and thermal management requirements.

6.3 Polarity Marking

The cathode is usually marked on the device. Correct polarity orientation during assembly is crucial to prevent damage from reverse bias.

7. Welding and Assembly Guide

7.1 Reflow Soldering Temperature Profile (Lead-Free)

This LED is compatible with standard infrared or vapor phase reflow processes using lead-free solder. The recommended temperature profile includes:

Dumama kafin aiki:

150-200°C, na tsawon dakika 60-120.

Time Above Liquidus (TAL):

• 60-150 seconds above 217°C.Peak Temperature:
• Maximum 260°C, hold time not exceeding 10 seconds.Ramp rate:
• Up to 255°C maximum 3°C/sec, then to peak maximum 6°C/sec.Cooling rate:
• Maximum 6°C/s.Key point:
• No more than two reflow soldering cycles should be performed on the same device.7.2 Manual Soldering

Idan dole ne a yi waldar hannu, dole ne a yi taka tsantsan sosai:Yi amfani da irin wuta wanda zafin ƙarfe bai wuce 350°C ba.

Ƙayyade lokacin haɗin kowane ƙarshen waldar zuwa aƙalla daƙiƙa 3.

Yi amfani da ƙarfe mai ƙarfin wutar lantarki na 25W ko ƙasa da haka.

• Tsakanin kowane tashar haɗin gwiwa, a bar aƙalla dakika 2 don sanyaya.
• Avoid applying mechanical stress to the LED body during heating.
• 7.3 Rework and Repair
• Repair after LED soldering is strongly not recommended. If unavoidable, a dedicated dual-tip soldering iron must be used to heat both solder terminals simultaneously to minimize thermal stress. The impact on LED characteristics must be verified after rework.
• 8. Storage and Moisture Sensitivity

LEDs are packaged in moisture barrier bags with desiccant.

Gbẹtọ nọ yin nukọntọ de mẹ to osẹn de mẹ.

Nọ yin nukọntọ de mẹ to osẹn de mẹ.

After Opening (Floor Life):

• Unused devices must be soldered within 1 year when stored at ≤30°C and ≤60% RH. If not used within this period, they must be rebaked and repacked.Baking Procedure:
• If the desiccant indicator changes color or exceeds the shop life, it must be baked at 60 ±5°C for 24 hours before use.9. Packaging and Ordering Information
• 9.1 Tape and Reel SpecificationsDevices are supplied in 8mm wide embossed carrier tape, wound on 7-inch diameter reels. Each reel contains 3000 pieces.

9.2 Label Description

The reel label contains several key codes:

CPN:

Customer Part Number.

P/N:

• Manufacturer Part Number (e.g., 16-213/R6C-AQ2R2B/3T).QTY:
• Quantity per reel.CAT:
• Luminous intensity grade (e.g., Q2, R1, R2).HUE:
• Dominant wavelength grade (e.g., E4, E5, E6, E7).REF:
• Forward voltage level (e.g., 0, 1, 2).LOT No:
• Traceable production lot number.10. Application Design Considerations
• 10.1 Current Limiting Resistor CalculationA series resistor must be used to set the forward current. The resistor value (R_S) can be calculated using Ohm's law: R_S = (V_Supply - V_F) / I_F. For conservative design, use the maximum V_F value from the binning table to ensure I_F does not exceed the desired value. The resistor's power rating must also be calculated: P_R = (I_F)² * R_S.

V_Supply

V_F

I_FV_FI_F_SI_F_SR_S_{10.2 Thermal Management}Despite the compact package, the power dissipation (up to 60mW) can lead to a significant junction temperature rise, especially in high ambient temperatures or enclosed spaces. This reduces light output and lifetime. If operating near maximum ratings, ensure sufficient PCB copper area or thermal vias are used for heat dissipation._F10.3 ESD Protection_FAlthough rated for 2000V HBM, standard ESD precautions should always be followed during assembly and handling to prevent potential damage._F11. Technical Comparison and Differentiation_FThe 16-213 LED based on AlGaInP technology offers distinct advantages in red indicator applications:_RCompared to older technologies (e.g., GaAsP):_FAlGaInP provides higher luminous efficacy, producing brighter output at the same current, and better color purity (more saturated red)._S.

Compared to broad-spectrum white LEDs with filters:

For generating pure red light, monochromatic red LEDs are far more efficient than filtering white light, resulting in lower power consumption.

Compared to larger leaded LEDs:

The SMD form factor enables automated assembly, saves board space, and improves mechanical reliability by eliminating the flexible and breakable leads.

12. Frequently Asked Questions (FAQ)

Q1: What is the difference between Peak Wavelength (λp) and Dominant Wavelength (λd)?

• A1: Peak wavelength is the wavelength at which the spectral power distribution reaches its maximum. Dominant wavelength is the wavelength of monochromatic light that matches the perceived color of the LED. In indicator applications, λd is more relevant for color specification.Q2: If my power supply is exactly 2.0V, can I drive this LED without a current-limiting resistor?
• A2: Forward voltage has tolerances and varies with temperature. A supply voltage equal to the nominal V_F can lead to excessive current due to device-to-device variation or a drop in temperature. A series resistor is always required for reliable operation.V_F
• Q3: Why is the storage temperature range wider than the operating temperature range?A3: Storage ratings apply when the device is in a non-operating, unpowered state. The operating range is narrower because operation generates heat at the semiconductor junction, and the combined effect of ambient temperature and self-heating must be limited to ensure performance and longevity.

Q4: How to interpret the part number 16-213/R6C-AQ2R2B/3T?

A4: Although the exact decoding rules may be proprietary, it typically contains a base product code (16-213), followed by codes specifying performance bins (e.g., luminous intensity 'R2', dominant wavelength likely in the 'E6/E7' range, forward voltage 'B2'), and possibly the package type ('3T' may refer to tape and reel).
13. Design Case Study: Dashboard Switch Backlight

Scenario:
Design backlighting for automotive dashboard switches, requiring uniform and reliable red illumination in environments with ambient temperatures up to 70°C.No.Design Steps:_FCurrent Selection:

To ensure long life at high temperatures, current derating is required. According to the derating curve, at an ambient temperature of 70°C, the maximum allowable I_F is significantly lower than 25mA. Selecting I_F = 15mA provides a good safety margin.
I_F

I_F
Resistor Calculation:

Using a 12V automotive power supply and the maximum V_F (2.35V) of the B2 bin. R_S = (12V - 2.35V) / 0.015A ≈ 643Ω. Use a standard 620Ω or 680Ω resistor. Power: P = (0.015)² * 643 ≈ 0.145W. A 1/4W resistor is sufficient.

V_FR_S

Bin selection:

1. To ensure a consistent appearance among multiple switches, strict HUE (dominant wavelength, e.g., only E6) and CAT (luminous intensity, e.g., only R1) binning must be specified. This ensures uniformity in color and brightness.Layout:_FPlace the LED and its current-limiting resistor close together. Use the recommended pad layout from the datasheet. Small thermal relief connections can be added to aid soldering._F14. Technical Principles
2. This LED is based on an aluminum gallium indium phosphide (AlGaInP) semiconductor heterostructure. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. The energy released during recombination is emitted as photons (light). The specific bandgap energy of the AlGaInP alloy determines the wavelength of the emitted light, which in this case is in the red spectrum (approximately 632nm). The water-clear resin lens allows the light to escape with minimal absorption, and its shape provides a wide viewing angle of 120 degrees.15. Industry Trends_FKasuwar LED masu nuna alama na SMD kamar 16-213 na ci gaba da haɓakawa. Manyan abubuwan da ke faruwa sun haɗa da:_SHaɓaka inganci:
3. Ci gaba da ingantattun kimiyyar kayan aiki da nufin samar da mafi girman ingancin haske (ƙarin fitowar haske a kowace ƙarfin lantarki), wanda ke haifar da ƙarancin amfani da wutar lantarki ko fitilu masu haske.Miniaturization:
4. The demand for smaller end products drives the continuous reduction in LED package sizes (e.g., 0402, 0201 metric sizes) while maintaining or improving optical performance.Reliability Enhancement:

Improvements in packaging materials and die-attach technologies focus on extending operational lifespan and enhancing robustness against thermal cycling and humidity.

Integration:

The trend of integrating multiple LEDs (e.g., RGB clusters) or combining LEDs with control ICs (such as driver chips) into a single package to simplify circuit design and save board space.

The market for SMD indicator LEDs like the 16-213 continues to evolve. Key trends include:

• Increased Efficiency:Ongoing material science improvements aim to deliver higher luminous efficacy (more light output per unit of electrical input), allowing for lower power consumption or brighter indicators.
• Miniaturization:The drive for smaller end products pushes for ever-smaller LED packages (e.g., 0402, 0201 metric sizes) while maintaining or improving optical performance.
• Enhanced Reliability:Improvements in packaging materials and die-attach technologies focus on extending operational lifetime and robustness against thermal cycling and humidity.
• Integration:A trend towards integrating multiple LEDs (e.g., RGB clusters) or combining LEDs with control ICs (like driver chips) into single packages to simplify circuit design and save board space.