SMD LED 19-213 Datasheet - Bright Green - 120° Viewing Angle - 2.7-3.2V - 25mA - Transparent Epoxy - Simplified Chinese Technical Document

1. Product Overview

19-213 is a surface-mount device (SMD) LED designed specifically for modern compact electronic applications. It utilizes indium gallium nitride (InGaN) chip technology to produce a bright green light output. The core advantage of this component lies in its miniature size, which significantly reduces the footprint on the PCB (Printed Circuit Board), increases component assembly density, and contributes to the overall miniaturization of end-user equipment. Its lightweight structure makes it an ideal choice for applications where space and weight are constrained.

This LED is packaged on an 8mm carrier tape, wound onto a reel with a diameter of 7 inches, and is fully compatible with high-speed automated pick-and-place assembly equipment. This compatibility simplifies the manufacturing process for mass production.

1.1 Core Advantages and Target Market

The core advantages of the 19-213 SMD LED stem from its SMD package form and material compliance. It abandons the traditional lead frame, thereby achieving a more robust connection to the PCB and offering better performance in high-vibration environments. This product is classified as lead-free, complying with the EU's RoHS (Restriction of Hazardous Substances) directive and adhering to REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations. Simultaneously, it is also halogen-free, with bromine (Br) and chlorine (Cl) content each below 900 ppm, and their sum below 1500 ppm, making it suitable for environmentally conscious designs.

Its target applications are diverse, primarily focusing on indicator lights and backlighting functions. Key markets include automotive interiors (e.g., dashboard and switch backlighting), communication equipment (e.g., indicator lights on telephones and fax machines), and consumer electronics (e.g., flat backlighting for LCDs, switches, and symbols). Its versatility also makes it suitable for a wide range of other indicator applications.

2. In-depth Technical Parameter Analysis

This section provides a detailed and objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet. Understanding these limit and typical values is crucial for reliable circuit design.

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not normal operating conditions.

• Reverse Voltage (VR): 5V- Applying a reverse bias voltage exceeding 5V may cause immediate junction breakdown. The datasheet clearly states that this device is not designed for reverse operation; this rating is primarily for IR test conditions.
• Forward Current (IF): 25mA- The maximum DC current that can flow continuously through the LED. Exceeding this value will generate excessive heat, leading to accelerated luminous flux degradation or catastrophic failure.
• Peak Forward Current (IFP): 100mA- This is the maximum allowable pulse current, specified with a duty cycle of 1/10 and a frequency of 1kHz. It allows for higher brightness in a short period but must be used with precise timing control.
• Power Dissipation (Pd): 95mW- Maximum power that can be dissipated as heat, calculated as VF * IF. Careful thermal management of the PCB is required when operating near this limit.
• Electrostatic Discharge (ESD): 150V (Human Body Model)- This Human Body Model rating indicates the device has a moderate level of ESD sensitivity. Proper ESD handling procedures must be followed during assembly and operation to prevent latent or immediate failures.
• Operating Temperature (Topr): -40°C to +85°C- The ambient temperature range within which the device is guaranteed to operate according to its published specifications.
• Storage Temperature (Tstg): -40°C to +90°C- The temperature range for storage when the device is in a non-operating state.
• Tsol (Soldering Temperature)Two soldering profiles are specified: reflow soldering (peak temperature 260°C, duration not exceeding 10 seconds) and hand soldering (soldering iron tip temperature 350°C, contact time per termination not exceeding 3 seconds).

2.2 Electro-Optical Characteristics

Unless otherwise specified, these parameters are measured under standard test conditions of Ta=25°C and IF=5mA. They define the optical performance of the LED.

• Luminous intensity (Iv): 45 - 112 mcd (min - max)- The perceived brightness of the LED measured in millicandelas. The broad range indicates the use of a binning system (see Section 3 for details). A typical value is not explicitly given and falls somewhere within this range.
• Viewing Angle (2θ1/2): 120° (Typical)- The angular span at which the luminous intensity drops to half of its peak value. This is a very wide viewing angle, ideal for applications requiring visibility from off-axis positions.
• Peak Wavelength (λp): 518 nm (Typical)- Wavelength at which the spectral power distribution of the emitted light reaches its maximum value.
• Dominant Wavelength (λd): 520 - 535 nm- The wavelength of monochromatic light that can evoke the same perceived color as the LED's output. This is a key parameter for color specification and is also binned.
• Spectral Bandwidth (Δλ): 35 nm (Typical)- The width of the emission spectrum, measured at half the maximum power (Full Width at Half Maximum - FWHM). A value of 35nm is typical for InGaN green LEDs.
• Forward Voltage (VF): 2.70 - 3.20 V- The voltage drop across the LED when driven by a 5mA test current. This range is also subject to binning. The tolerance for this parameter is ±0.05V of the binned value.
• Reverse Current (IR): 50 μA (Max)- Maximum leakage current when the specified reverse voltage (5V) is applied.

3. Explanation of the Grading System

To ensure color and brightness consistency in production, LEDs are binned according to performance. 19-213 uses three independent binning parameters.

3.1 Luminous Intensity Grading

LEDs are divided into four bins (P1, P2, Q1, Q2) based on their luminous intensity measured at IF=5mA. The bin ranges are as follows: P1 (45.0-57.0 mcd), P2 (57.0-72.0 mcd), Q1 (72.0-90.0 mcd), and Q2 (90.0-112.0 mcd). The tolerance for the binning value is ±11%. Designers must select the appropriate bin to meet the brightness level required for their application.

3.2 Dominant Wavelength Binning

Color consistency is managed by dividing the dominant wavelength into three groups: X (520-525 nm), Y (525-530 nm), and Z (530-535 nm). The tolerance is ±1nm. This ensures all LEDs from the same batch produce a very similar green hue.

3.3 Forward Voltage Binning

The forward voltage is divided into five groups with a step of 0.1V: 29 (2.70-2.80V), 30 (2.80-2.90V), 31 (2.90-3.00V), 32 (3.00-3.10V), and 33 (3.10-3.20V). The tolerance is ±0.05V. Understanding the VF bin helps in designing more precise current-limiting circuits, especially when driving multiple LEDs in series.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves, which are crucial for understanding the behavior of LEDs under non-standard conditions.

4.1 Relationship between Relative Luminous Intensity and Ambient Temperature

The curve shows how light output decreases as ambient temperature (Ta) increases. Like all LEDs, the 19-213 experiences luminous flux depreciation with rising temperature. In applications where the LED or its environment may become hot, designers must account for this thermal derating to ensure sufficient brightness is maintained at the maximum operating temperature.

4.2 Relationship between Relative Luminous Intensity and Forward Current

This graph illustrates the nonlinear relationship between drive current and light output. While increasing the current boosts brightness, efficiency (lumens per watt) typically decreases at higher currents due to increased heat generation. It also shows that light output tends to saturate as the current approaches the maximum rated value.

4.3 Relationship between Forward Voltage and Forward Current (IV Curve)

IV curve shine tushen ƙirar da'ira. Yana nuna alaƙar ƙarfin lantarki da ƙarfin kunnawa a cikin diode. A wurin "karkatacciyar hanya" kusa da matsakaicin ƙarfin lantarki mai gaba, LED ta fara haskakawa sosai. Wannan lanƙwasa yana da mahimmanci don zaɓar hanyar da ta dace don iyakance ƙarfin kunnawa (misali, ƙimar juriya ko saitin mai tuƙi na ƙarfin kunnawa mai dorewa).

4.4 Radiation Pattern

The polar plot depicts the spatial distribution of light intensity. The 120° viewing angle of the 19-213 forms a broad, Lambertian-like emission pattern. This confirms its suitability for wide-area lighting and indicator applications requiring visibility from all angles.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The datasheet provides a detailed two-dimensional drawing of the LED package, including key dimensions. Key measurements include overall length, width, height, pad size and location, and the position of the cathode identifier (typically a notch or green marking at one corner). All unspecified tolerances are ±0.1mm. This drawing is essential for creating the PCB pad pattern (footprint) in CAD software.

5.2 Polarity Identification

Correct polarity is crucial for operation. The package includes a visual marker to identify the cathode (-) terminal. Designers and assembly technicians must refer to the dimension drawing to correctly orient the component on the PCB.

6. Welding and Assembly Guide

Adhering to these guidelines is crucial for achieving reliable solder joints without damaging the LED.

6.1 Reflow Soldering Temperature Profile

Recommended lead-free reflow soldering temperature profile is provided. Key parameters include: preheat zone between 150-200°C, lasting 60-120 seconds; time above liquidus (217°C) 60-150 seconds; peak temperature not exceeding 260°C; maximum duration at peak temperature 10 seconds. Maximum heating rate 6°C/second, maximum cooling rate 3°C/second. Reflow soldering cycles should not exceed two.

6.2 Manual Soldering Precautions

If manual soldering is necessary, extra caution is required. The soldering iron tip temperature must be below 350°C, and contact time with each solder joint must not exceed 3 seconds. Use of a low-power soldering iron (≤25W) is recommended. Allow at least 2 seconds between soldering each joint for heat dissipation.

6.3 Storage and Moisture-proof Requirements

LEDs are packaged in moisture barrier bags with desiccant. The bag must not be opened until the components are ready for use. After opening, unused LEDs should be stored at ≤30°C and ≤60% relative humidity and used within 168 hours (7 days). If the storage time exceeds the specified limit or the desiccant indicates moisture absorption, baking at 60±5°C for 24 hours is required before use to prevent "popcorn" phenomenon during reflow soldering.

7. Packaging and Ordering Information

7.1 Reel Specifications

Components are supplied in embossed carrier tape, with dimensions specified in the datasheet. The tape is wound on standard 7-inch (178mm) diameter reels. Each reel contains 3000 pieces. Reel dimensions (hub diameter, flange diameter, width) are provided to ensure compatibility with automated assembly equipment.

7.2 Label Description

The reel label contains several key codes: P/N (Product Number), QTY (Quantity), CAT (Luminous Intensity Grade/Bin), HUE (Chromaticity/Dominant Wavelength Grade), REF (Forward Voltage Grade), and LOT No (Traceable Lot Number). Understanding this label is crucial for inventory control and ensuring the correct performance bin is used in production.

8. Application Design Considerations

8.1 Must use current limiting measures

The datasheet emphasizes that an external current-limiting resistor (or constant current driver) must be used. When the voltage slightly exceeds its forward voltage, the current through an LED increases exponentially and sharply. Without current limiting, even minor power supply voltage fluctuations can cause the current to exceed the maximum rating, leading to immediate failure.MustUse. When the voltage slightly exceeds its forward voltage, the current of an LED increases exponentially and sharply. Without current limiting, even minor power supply voltage fluctuations can cause the current to exceed the maximum rated value, leading to immediate failure.

8.2 Thermal management

Although the package itself dissipates heat, the primary thermal path is through the pads into the PCB copper layers. For applications operating in high ambient temperatures or near maximum current, PCBs with adequate thermal design, wider copper traces, or even dedicated thermal pads connected to a ground plane should be considered to aid heat dissipation.

8.3 Electrostatic Discharge (ESD) Protection

Given the 150V HBM ESD rating, incorporating basic ESD protection (e.g., using transient voltage suppression diodes or series resistors) on lines connected to the LED may be advisable, especially in environments prone to electrostatic discharge, particularly when the LED is user-accessible.

9. Technical Comparison and Differentiation

The 19-213 differentiates itself primarily through the combination of its 120° ultra-wide viewing angle and transparent resin. Many indicator LEDs use diffused resin to widen the viewing angle, but this reduces the axial peak intensity. The 19-213 achieves a wide viewing angle using transparent resin, which can provide higher perceived brightness directly on-axis while maintaining good off-axis visibility. Its full compliance with modern environmental regulations (RoHS, REACH, Halogen-Free) is also a standard yet essential requirement for most new designs.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 When using a 5V power supply, what resistance value should be selected?

The resistance value (R) depends on the desired forward current (IF) and the forward voltage (VF) of the specific LED bin. Use Ohm's law: R = (Power Supply Voltage - VF) / IF. For example, using a 5V supply, VF of 3.0V (Bin 31), and a target IF of 20mA: R = (5 - 3.0) / 0.020 = 100 ohms. Always calculate the resistor's power dissipation: P_resistor = (Power Supply Voltage - VF) * IF. In this example, P = 2V * 0.02A = 0.04W, so a standard 1/8W (0.125W) resistor is sufficient.

10.2 Can this LED be driven for dimming using a PWM signal?

可以，脉宽调制（PWM）是调光LED的绝佳方法。它通过快速开关LED来工作。感知亮度与占空比（LED开启时间的百分比）成正比。与模拟调光（降低电流）可能导致颜色偏移不同，PWM调光能保持LED的颜色一致性。确保PWM频率足够高（通常>100Hz）以避免可见闪烁。

10.3 Why are the storage and baking processes so important?

SMD packages absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture rapidly vaporizes, creating steam pressure inside the package. This can lead to internal delamination, resin cracking, or bond wire failure—a phenomenon known as the "popcorn" effect. Moisture barrier packaging and baking procedures are designed to prevent this failure mode.

11. Practical Design and Usage Examples

11.1 Multi-LED Array for Panel Backlighting

To provide backlighting for small LCDs or switch panels, multiple 19-213 LEDs can be arranged in an array. Due to forward voltage binning, it is generally more reliable to connect the LEDs in parallel, each with its own individual current-limiting resistor, rather than in series. This configuration ensures that variations in VF among individual LEDs do not lead to uneven current distribution and inconsistent brightness. For larger arrays, constant-current driver ICs designed for multiple parallel LED channels will provide the most uniform and efficient solution.

11.2 Status Indicator Light Connected to the Microcontroller

When driving directly from a microcontroller GPIO pin, the pin's current source/sink capability must be checked. The limit for many MCU pins is 20-25mA, which matches the maximum for this LED very well. The circuit will consist of an LED and a series resistor, connected between the MCU pin and ground (for a current sink configuration) or VCC (for a current source configuration). The resistor value is calculated using the MCU's output voltage (e.g., 3.3V) and the LED's VF.

12. Brief Introduction to the Working Principle

19-213 LED is based on a semiconductor diode structure made of indium gallium nitride (InGaN). When a forward voltage exceeding the diode junction potential (approximately 2.7-3.2V) is applied, electrons and holes are injected into the active region of the semiconductor. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the semiconductor's bandgap energy, which directly dictates the wavelength (color) of the emitted light. In this case, the alloy is tuned to produce photons in the green spectrum (520-535 nm). The transparent epoxy encapsulation protects the semiconductor chip, provides mechanical stability, and acts as a lens to shape the emitted light into a 120° viewing angle.

13. Technical Trends and Background

19-213 yana wakiltar fasaha mai cikakken kwarewa kuma ana amfani da ita sosai a kasuwar SMD LED. Hanyoyin da ake bi a wannan fanni suna ci gaba da tafiya zuwa ga wasu mahimman hanyoyi. Na farko, haɓaka ingancin haske (samar da ƙarin haske a kowace wutar lantarki) yana ci gaba da zama abin motsa jiki, wanda ke haɓaka ingancin makamashi. Na biyu, neman mafi girman tsaftar launi da cikar launi, musamman a cikin bakan kore, har yanzu yana aiki. Na uku, ƙananan ƙirar kunshe yana ci gaba, ƙananan siffofi fiye da 19-213 sun zama gama gari a cikin na'urori masu matuƙar ƙanƙanta. A ƙarshe, haɗawa wata hanya ce da ke girma, LED masu launuka daban-daban (RGB) ko LED masu haɗa da'irar sarrafawa (kamar I2C addressable LED) suna haɗa ayyuka da yawa zuwa cikin kunshe ɗaya, suna sauƙaƙe ƙira da haɗawa. 19-213, tare da amincinta, samuwa mai yawa, da bin ka'idoji, ya zama ginshiƙin ginin babban tsarin alamar nuni da aikace-aikacen haske.