SMD LED 16-213/GHC-YR1S1/3T Datasheet - Bright Green - 2.7-3.7V - 25mA - Simplified Chinese Technical Documentation

1. Product Overview

16-213/GHC-YR1S1/3T wani na'urar LED ne mai haɗawa ta saman (SMD), wanda aka ƙera don aikace-aikacen lantarki na zamani waɗanda ke buƙatar ƙaramin girma, ingantaccen aminci da kyakkyawan aikin gani. Wannan ɓangaren yana amfani da guntu na semiconductor na InGaN (Indium Gallium Nitride) don samar da fitowar haske mai haske mai kore. Babban fa'idodinsa sun haɗa da: rage girman filin allon da ya fi na LED na tsarin igiya na al'ada, wanda hakan ke haɓaka yawan ɓangarorin akan allon da'ira (PCB), rage buƙatun ajiya, kuma a ƙarshe yana taimakawa wajen rage girman na'urar ƙarshe. Na'urar tana da nauyi mai sauƙi, musamman ma don aikace-aikacen da ke da ƙarancin sarari da na ɗauka.

Key product positioning includes use as high-efficiency indicator lights and backlight sources. It is packaged in 8mm carrier tape, wound onto reels with a 7-inch diameter, ensuring compatibility with standard automated surface-mount assembly equipment. The LED is encapsulated in transparent resin to maximize light output and provide a clean, bright appearance.

2. Detailed Technical Specifications

2.1 Absolute Maximum Ratings

The operating limits of the device are defined under the condition of Ta=25°C. Exceeding these ratings may cause permanent damage.

• Reverse Voltage (V_R):5V. Applying a reverse voltage higher than this value may break down the PN junction of the LED.
• Continuous forward current (I_F):25mA. This is the maximum DC current recommended for continuous operation.
• Peak forward current (I_FP):100mA. This rating applies under pulse conditions with a duty cycle of 1/10 and a frequency of 1kHz, allowing for short periods of high-brightness operation.
• Power Dissipation (P_d):110mW. This is the maximum power the package can dissipate without exceeding its thermal limits.
• Electrostatic Discharge (ESD):Withstand 150V (Human Body Model). Proper ESD handling procedures must be followed during assembly.
• Operating Temperature (T_opr):-40°C to +85°C. This LED is rated to operate under a wide range of environmental conditions.
• Storage temperature (T_stg):-40°C to +90°C.
• Welding Temperature (T_sol):This device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per pin.

2.2 Electro-Optical Characteristics

Typical performance measured under conditions of Ta=25°C, I_F=20mA, unless otherwise specified.

• Luminous intensity (I_v):ranges from a minimum of 112 mcd to a maximum of 225 mcd, with typical values falling within this grading range. The applicable tolerance is ±11%.
• Perspective (2θ_1/2):120 degrees. This wide viewing angle ensures good visibility from different angles.
• Peak wavelength (λ_p):Typical value 518 nm, indicating the wavelength at which the emission light intensity is highest.
• Dominant Wavelength (λ_d):Ranging from 520 nm to 535 nm, defining the perceived color (green). Applicable tolerance is ±1 nm.
• Spectral Bandwidth (Δλ):Typical value 35 nm, measured at full width at half maximum (FWHM).
• Forward voltage (V_F):Ranges from 2.7V (min) to 3.7V (max), with a typical value of 3.3V at 20mA. Applicable tolerance is ±0.05V.
• Reverse current (I_R):Maximum 50 μA when a 5V reverse voltage is applied.

3. Grading System Description

Products are classified based on key optical and electrical parameters to ensure consistency in application design.

3.1 Luminous Intensity Binning

Under the condition of I_v=20mA, grade the I_F:

• R1:112 mcd to 140 mcd
• R2:140 mcd to 180 mcd
• S1:180 mcd to 225 mcd

Specific bin codes (e.g., part of GHC-YR1S1) indicate the guaranteed intensity range for that particular unit.

3.2 Dominant Wavelength Binning

Under the condition of I_dUnder the condition of =20mA, for λ_F:

• X:520 nm to 525 nm
• Y:525 nm to 530 nm
• Z:530 nm to 535 nm

This allows designers to select LEDs with a very specific green hue for color matching applications.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are crucial for design.

4.1 Relationship Between Relative Luminous Intensity and Ambient Temperature

The curve shows that the luminous intensity is relatively stable from -40°C to approximately 25°C. Beyond 25°C, the intensity gradually decreases as temperature increases, which is a common characteristic of LEDs, stemming from increased non-radiative recombination and other thermal effects. At the maximum operating temperature of 85°C, the output may be significantly lower than at room temperature. This must be considered in designs where high ambient temperatures are expected.

4.2 Forward Current Derating Curve

This graph defines the maximum allowable forward current as a function of ambient temperature. At 25°C, the full rating of 25mA is permitted. As the ambient temperature increases, the maximum allowable current must be reduced linearly to prevent exceeding the device's 110mW power dissipation limit and to ensure long-term reliability. This is crucial for preventing thermal runaway and premature failure.

3.3 Relationship between Luminous Intensity and Forward Current

At lower currents, the relationship is typically linear, but at higher currents (approaching the maximum rating), it may show signs of saturation or a decrease in efficiency. This curve allows designers to predict the brightness at a given drive current.

4.4 Spectral Distribution

The spectrum shows a single dominant peak centered at approximately 518 nm (green), with a characteristic FWHM of 35 nm. Minimal emission in other parts of the visible spectrum confirms pure green color.

4.5 Forward Current vs. Forward Voltage Relationship

This IV curve demonstrates the typical exponential relationship of a diode. The forward voltage increases with increasing current. The specified V_FThe range (2.7V-3.7V at 20mA) is visible on this curve. Designers use this curve to calculate the required current-limiting resistor value for a given supply voltage.

4.6 Radiation Pattern Diagram

The polar plot illustrates a 120° viewing angle. The intensity is nearly uniform within the central conical region and attenuates towards the edges. This pattern is crucial for applications requiring specific illumination angles.

5. Mechanical and Packaging Information

5.1 Package Size

This LED features a compact SMD footprint. Key dimensions include body size, lead pitch, and overall height. The datasheet provides a detailed dimensional drawing, with standard tolerances of ±0.1mm unless otherwise noted. The recommended pad layout on the PCB is also shown, which is designed for reliable soldering and mechanical stability. Designers are advised to modify the pad dimensions based on their specific PCB fabrication process and thermal requirements.

5.2 Polarity Marking

This component has an anode and a cathode. The datasheet drawing indicates the polarity, typically marked by a notch, a dot, or different lead shapes. Correct polarity must be observed during PCB layout and assembly to ensure proper functionality.

6. Welding and Assembly Guide

6.1 Reflow Soldering Temperature Profile

Provides a detailed temperature profile for lead-free reflow soldering:

• Preheating:150-200°C, for 60-120 seconds.
• Time above liquidus (217°C):60-150 segundos.
• No se recomienda realizar reparaciones después de la soldadura. Si es inevitable, se debe utilizar un soldador de doble punta para calentar simultáneamente los dos pines, con el fin de minimizar la tensión sobre el LED. Es necesario evaluar de antemano el impacto potencial de la reparación en las características del LED.Máximo 260°C, mantener durante no más de 10 segundos.
• Tasa de calentamiento:Maximum 6°C/s.
• Cooling rate:Maximum 3°C/s.

It is recommended that the LED should not undergo more than two reflow soldering cycles. Stress should not be applied to the LED body during heating, and PCB warpage after soldering should be avoided.

6.2 Manual Soldering

If manual soldering is necessary, the soldering iron tip temperature should be below 350°C, and the contact time per pin should not exceed 3 seconds. It is recommended to use a low-power soldering iron (≤25W). A cooling interval of at least 2 seconds should be allowed between soldering two pins to prevent thermal shock.

6.3 Rework and Repair

Repair after soldering is discouraged. If unavoidable, a dual-head soldering iron should be used to simultaneously heat both terminals, minimizing stress on the LED. The potential impact on LED characteristics from rework must be evaluated beforehand.

7. Packaging and Ordering Information

7.1 Reel Specification

LEDs are supplied in carrier tape packaging, with dimensions specified in the datasheet. Each reel contains 3000 pieces. Reel dimensions (7-inch diameter) are provided for automated handling equipment setup.

7.2 Moisture Sensitivity and Storage

The product is packaged in a moisture-proof aluminum foil bag with desiccant and humidity indicator card included. To prevent damage during the reflow soldering process due to moisture ("popcorn" effect):

• Before opening:Store under conditions of ≤30°C and ≤90% RH.
• After opening:Under conditions of ≤30°C and ≤60% RH, the "shop life" is 1 year. Unused components should be resealed.
• Baking:If the desiccant indicator shows saturation or the storage time is exceeded, it should be baked at 60±5°C for 24 hours before use.

7.3 Label Description

The reel label contains the following codes:

• Customer Part Number (CPN)
• Product Number (P/N)
• Packaging Quantity (QTY)
• CAT
• HUE
• Forward Voltage Grade (REF)
• Lot Number (LOT No.)

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlight:For flat backlighting of dashboard indicators, switch illumination, and LCD panels and symbols.
• Telecommunications equipment:Status indicators and keyboard backlighting in telephones and fax machines.
• General indication:Widely used in consumer electronics, industrial electronics, and automotive electronics for power status, mode selection, and other user interface indicators.

8.2 Key Design Considerations

• Current Limiting:An external series resistor isabsolutely essentialto limit the forward current. The exponential V-I characteristic of an LED means that a small voltage increase can cause a large, destructive current surge.
• Thermal Management:Observe the forward current derating curve. Ensure sufficient PCB copper area or other heat dissipation measures if operating at high ambient temperatures or near maximum current.
• ESD Protection:Implement ESD protection circuits on sensitive lines and follow proper handling procedures during assembly.
• Optical Design:When designing light guides, lenses, or diffusers, consider a 120° viewing angle and radiation pattern to achieve the desired lighting effect.

9. Technical Comparison and Differentiation

Compared to older through-hole LED technology, this SMD LED offers significant advantages:

• Size and Density:The board footprint is greatly reduced, aiding in miniaturization.
• Automation:Fully compatible with high-speed SMT assembly, reducing manufacturing costs.
• Performance:InGaN technology provides higher efficiency and brighter green light output compared to old materials.
• Reliability:When properly soldered, SMD structure typically offers better thermal performance and mechanical robustness.
• Compliance:该器件无铅，符合RoHS和欧盟REACH法规，并满足无卤标准（Br <900ppm，Cl <900ppm，Br+Cl <1500ppm），使其适合注重环保的设计和全球市场。

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 When using a 5V power supply, what value of resistor should be selected?

Using Ohm's Law (R = (V_{Power supply}- V_F) / I_F), and assuming a typical V_Fof 3.3V at 20mA: R = (5V - 3.3V) / 0.02A = 85 ohms. A standard 82 or 100 ohm resistor is suitable. Always calculate based on the minimum V_F(2.7V) to ensure the current does not exceed the maximum rating.

10.2 Can I drive this LED with 30mA to achieve higher brightness?

A'a. Matsakaicin ƙimar halin yanzu na gaba shine 25mA. Wucewa wannan ƙimar zai lalata amincin, kuma yana iya haifar da gazawa nan take ko a hankali. Idan kuna buƙatar haske mai ƙarfi, zaɓi LED tare da matakin ƙarfin haske mafi girma (misali, matakin S1) ko samfurin da ke da ƙimar halin yanzu mafi girma.

10.3 How does temperature affect the light output?

Kamar yadda lanƙwan aikin ya nuna, ƙarfin haske yana raguwa yayin da zafin muhalli ya ƙaru. A 85°C, fitarwa na iya zama kawai 60-70% na na 25°C. Wannan dole ne a yi la'akari da shi a cikin ƙirar haske na tsarin.

10.4 Is a heat sink necessary?

对于在20mA连续工作且环境温度适中（<50°C）的情况，热量通常通过LED引脚传导到PCB铜箔上即可充分散发。遵循建议的焊盘布局可改善散热。对于高环境温度或驱动电流接近最大值的情况，增加连接到LED焊盘的PCB铜箔面积可作为有效的散热片。

11. Design Use Case Study

Scenario: Designing a status indicator panel for an industrial controller.

1. Requirements:Multiple bright green LEDs are used to indicate the "System Ready" status. The panel's operating environment temperature can reach up to 60°C.
2. Selection:Select the S1 grade (180-225 mcd) of 16-213/GHC-YR1S1/3T for high visibility.
3. Circuit Design:Use the 3.3V system power rail. Assuming V = 3.3V, calculate the series resistor: R = (3.3V - 3.3V) / 0.02A = 0 ohms. This value is invalid. Therefore, drive the LED with a lower current, such as 15mA. R = (3.3V - 3.0V*) / 0.015A = 20 ohms. (*V is estimated to be lower at 15mA according to the IV curve)._FThermal check:_FThermal check:
4. Thermal check:At an ambient temperature of 60°C, the derating curve requires a reduction in maximum current. Operating at 15mA provides a good safety margin below the derating limit, ensuring long-term reliability.
5. Layout:The PCB pad design follows the datasheet recommendations, with additional copper foil connected to the cathode pad to enhance heat dissipation.
6. Results:A reliable, uniform-brightness indicator light system suitable for work environments.

12. Introduction to Working Principles

This LED operates based on the principle of electroluminescence in a semiconductor PN junction. The active region is composed of InGaN. When a forward voltage exceeding the diode's threshold voltage is applied, electrons and holes are injected into the active region from the N-type and P-type layers, respectively. These carriers recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, green (~518 nm). The transparent epoxy resin encapsulation protects the semiconductor chip, provides mechanical stability, and acts as a lens to shape the output beam.

13. Technology Trends

Bu tür SMD LED'lerin gelişimi, fotonik alanındaki daha geniş bir trendin parçasıdır:

• Miniaturizasyon:Package size continues to decrease (e.g., from 0603 to 0402 to 0201 metric sizes) to enable smaller devices.
• Efficiency improvement:Continuous improvements in epitaxial growth and chip design lead to higher luminous efficacy (more light output per watt of electrical input).
• Color consistency:Stricter binning specifications and advanced manufacturing processes ensure high consistency in color and brightness across different production batches, which is crucial for multi-LED arrays and displays.
• Reliability Enhancement:Improved packaging materials and thermal management designs are extending operational lifespan and enabling use in harsher environments (higher temperature, humidity).
• Integration:Trends include integrating the control IC, current-limiting resistors, and even multi-color chips (RGB) into a single package, thereby simplifying circuit design for end-users.

These trends are driving components toward greater functionality, reliability, and ease of application.