SMD LED LTST-C216TGKT Datasheet - 3.2x1.6x1.2mm - Typical 3.2V - 76mW - Water Clear Lens Green Light - Simplified Chinese Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the LTST-C216TGKT, a Surface-Mount Device (SMD) LED lamp. This component is designed for automated printed circuit board (PCB) assembly and is suitable for critical applications with space constraints. The LED utilizes an ultra-bright Indium Gallium Nitride (InGaN) semiconductor chip to produce green light, encapsulated within a water-clear lens.

1.1 Core Advantages and Target Market

The primary advantages of this LED include compliance with the Restriction of Hazardous Substances (RoHS) directive, high luminous intensity, and a design compatible with standard industrial assembly processes. It is supplied in packaging with 8mm carrier tape wound on 7-inch diameter reels, conforming to Electronic Industries Alliance (EIA) standards, making it highly suitable for high-volume, automated pick-and-place manufacturing.

Target applications cover a wide range of consumer and industrial electronics. Key markets include telecommunications equipment (e.g., cordless phones and cellular phones), portable computing devices (e.g., notebook computers), network infrastructure systems, various household appliances, and indoor signage or display applications. Its primary functions within a system are status indication, keyboard backlighting, integration into micro-displays, and general signal or symbol illumination.

2. In-depth Technical Parameter Analysis

The performance of the LTST-C216TGKT is defined under specific environmental and electrical conditions, primarily at an ambient temperature (Ta) of 25°C.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed and should be avoided.

• Power Dissipation (Pd):76 mW. This is the maximum power the device dissipates as heat.
• Peak Forward Current (I_F(PEAK)):100 mA. This current is only permitted under pulse conditions with a duty cycle of 1/10 and a pulse width of 0.1ms.
• Continuous Forward Current (I_F):20 mA. This is the recommended maximum current for continuous DC operation.
• Operating Temperature Range:-20°C to +80°C. The device is designed to operate within this ambient temperature range.
• Temperature Range for Storage:-30°C to +100°C.
• Infrared Reflow Soldering Conditions:Capable of withstanding a peak temperature of up to 260°C for a maximum of 10 seconds, which is crucial for lead-free (Pb-free) assembly processes.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured under standard test conditions (unless otherwise specified, I_F= 20mA, Ta=25°C).

• Luminous Intensity (I_V):ranges from a minimum of 71.0 millicandelas (mcd) to a maximum of 450.0 mcd. The intensity is measured using a sensor and filter combination that approximates the CIE standard photopic (human eye) response curve.
• Viewing Angle (2θ_1/2):130 degrees. This is the full angle at which the luminous intensity drops to half of the measurement on the central axis (0 degrees). This indicates it has a wide viewing pattern.
• Peak Emission Wavelength (λ_P):530 nanometers (nm). This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d):525 nm. Derived from the CIE chromaticity diagram, this single wavelength best represents the LED color (green) as perceived by the human eye.
• Spectral Line Half-Width (Δλ):35 nm. This parameter indicates the spectral purity or bandwidth of the emitted light, measured as the width at half of the maximum intensity.
• Forward Voltage (V_F):Typical value 3.2V, ranging from 2.80V to 3.60V at 20mA drive. This is the voltage drop across the LED when it is conducting.
• Reverse current (I_R):When a 5V reverse voltage (V_R) is applied, the maximum is 10 microamperes (μA). This device is not designed for reverse bias operation.

3. Bin System Description

To ensure consistency in high-volume production, LEDs are sorted into performance categories or "bins" based on key parameters. The LTST-C216TGKT employs a three-dimensional binning system.

3.1 Forward Voltage (V_F) Binning

LEDs are classified based on their forward voltage drop at 20mA. This is crucial for designing current-limiting circuits and ensuring brightness uniformity in parallel arrays.

• Gear code D7: V_F= 2.80V to 3.00V
• Gear code D8: V_F= 3.00V to 3.20V
• Gear code D9: V_F= 3.20V to 3.40V
• Gear code D10: V_F= 3.40V to 3.60V

Tolerance within each bin is ±0.1V.

3.2 Luminous Intensity (I_V) Binning

This binning is sorted according to the LED's light output power in millicandelas.

• Bin Code Q: I_V= 71.0 mcd to 112.0 mcd
• Bin Code R: I_V= 112.0 mcd to 180.0 mcd
• Bin Code S: I_V= 180.0 mcd to 280.0 mcd
• Gear Code T: I_V= 280.0 mcd to 450.0 mcd

Tolerance within each gear is ±15%.

3.3 Chromaticity (Dominant Wavelength) Binning

This classification ensures color consistency by grouping LEDs with similar dominant wavelengths.

• Gear Code AP: λ_d= 520.0 nm to 525.0 nm
• Gear code AQ: λ_d= 525.0 nm to 530.0 nm
• Gear code AR: λ_d= 530.0 nm to 535.0 nm

The tolerance within each gear is ±1 nm.

4. Bincike akan Lankwalin Aiki

Although specific graphical data are referenced in the datasheet, the typical performance curves for this type of LED provide key insights for design engineers.

4.1 Halayen I-V (Ƙarfin Lantarki vs. Ƙarfafawa)

The I-V curve is nonlinear, similar to a standard diode. The forward voltage (V_F) has a positive temperature coefficient, meaning it decreases slightly with increasing junction temperature at a given current. The curve shows a sharp turn-on characteristic above the threshold voltage.

4.2 Ƙarfin Hasken da ya dace vs. Ƙarfin Lantarki na Gaba

This curve typically shows a nearly linear relationship between forward current (I_F) and light output (I_V) within the recommended operating range (up to 20mA). Driving the LED beyond its absolute maximum ratings can lead to superlinear efficiency roll-off and accelerated performance degradation.

4.3 Ƙarfin Hasken da ya dace vs. Yanayin Zafi na Muhalli

The light output of an InGaN LED typically decreases as the ambient temperature (and consequently the junction temperature) increases. For applications operating in high-temperature environments, this derating curve is crucial to ensure that sufficient brightness is maintained.

4.4 Spectral Distribution

The spectral output curve is centered at a peak wavelength of 530 nm with a characteristic full width at half maximum of 35 nm, defining the green emission. Its shape is typically Gaussian.

5. Mechanical and Packaging Information

5.1 Package Dimensions

This LED conforms to a standard SMD package outline. Unless otherwise specified, all dimensions are in millimeters with a general tolerance of ±0.1 mm. The package features a water-clear lens. The cathode is typically identified by a visual marker (such as a notch, green dot, or cut corner on the package) and must be cross-referenced with the recommended PCB pad pattern.

5.2 Recommended PCB Pad Layout

An ba da zanen shafin don tabbatar da samar da ingantaccen haɗin gwiwa da kuma kiyaye kwanciyar hankali na inji. Bin wannan shafin da aka ba da shawarar yana da mahimmanci don nasarar sake yin haɗawa da hana tashin dutse (ɗayan kayan yana tasowa). Ƙirar yawanci ta haɗa da haɗin gwiwar sanyaya, don sarrafa zafin da ke ɓarna yayin haɗawa.

6. Soldering and Assembly Guide

6.1 Infrared Reflow Soldering Temperature Profile

Wannan na'urar ta dace gaba ɗaya da tsarin sake haɗawa ta infrared (IR), wanda shine daidaitaccen tsarin haɗawa na saman. An ba da shawarar takamaiman tsarin zafin jiki don man haɗin gwiwa maras gubar:

• Yankin dumama:Dumama zuwa 150-200°C.
• Lokacin jikewa/dumama:Mafi tsawon dakika 120, don kunna kayan taimako da daidaita zafin allon kewaye.
• Matsakaicin zafin jiki:Mafi girma 260°C.
• Lokacin sama da layin ruwa (TAL):Jikin kayan aiki bai wuce dakika 10 a matsakaicin zafin jiki ba. Wannan LED na iya jure wa wannan zagayowar walƙiya sau biyu kawai.

Waɗannan sigogi sun yi daidai da ka'idodin masana'antu na gama gari na JEDEC na na'urorin haɗawa ta saman.

6.2 Hand Soldering

If manual soldering is necessary, extreme caution must be exercised:

• Soldering iron temperature:Maximum 300°C.
• Soldering time:Maximum 3 seconds per solder joint.
• Limitations:Manual soldering should be performed only once to avoid thermal damage to the epoxy package and semiconductor chip.

6.3 Cleaning

Post-soldering cleaning must be performed with care. Only specified alcohol-based solvents, such as ethanol or isopropyl alcohol (IPA), may be used. The LED should be immersed at room temperature for less than one minute. The use of harsh or unspecified chemical cleaners may damage the plastic lens and packaging material.

6.4 Ajiyewa da Yanayin Aiki

Electrostatic Discharge (ESD) Sensitivity:This LED is sensitive to ESD and surge currents. Appropriate ESD precautions must be taken during handling. This includes the use of grounded wrist straps, anti-static gloves, and ensuring all workstations and equipment are properly grounded.

Moisture Sensitivity:This package has a Moisture Sensitivity Level (MSL) rating. As indicated, if the original sealed moisture barrier bag is opened, the components should undergo infrared reflow soldering within one week (MSL 3). For storage outside the original packaging for more than one week, the components must be stored in a sealed container with desiccant or in a nitrogen environment. Components stored under such conditions for more than one week require baking at approximately 60°C for at least 20 hours before assembly to remove absorbed moisture and prevent "popcorn" effect (package cracking) during reflow soldering.

General Storage:For unopened packages, the storage conditions are ≤30°C and relative humidity (RH) ≤90%, with a recommended shelf life of one year from the date code. For opened packages, the ambient temperature should not exceed 30°C, and the relative humidity should not exceed 60%.

7. Marufi da Bayanin Oda

7.1 Madaidaicin Teyi da Reel

LEDs are supplied on industry-standard embossed carrier tape for automated assembly.

• Carrier Tape Width:8 mm.
• Reel diameter:7 inches (178 mm).
• Quantity per reel:3000 pieces.
• Minimum Order Quantity (MOQ):Minimum order of 500 pieces for remaining quantity.
• Bag sealing:Empty material bags are sealed with top cover tape.
• Missing Components:According to the carrier tape specifications, a maximum of two consecutive missing LEDs is allowed.

These specifications comply with the ANSI/EIA-481 standard.

8. Bayanin Aikace-aikace da La'akari da Zane

8.1 Typical Application Circuit

LEDs must be driven by a constant current source or, more commonly, by a current-limiting resistor in series with a voltage source. The series resistor value (R_S) Can be calculated using Ohm's law: R_S= (V_{power supply}- V_F) / I_F. Using a typical V_Fvalue of 3.2V, a desired I_Fvalue of 20mA, and a power supply voltage of 5V, then R_S= (5V - 3.2V) / 0.02A = 90 ohms. A standard 91-ohm or 100-ohm resistor is suitable, with a power dissipation of (5V-3.2V)*0.02A = 36mW.

8.2 Thermal Management

Although power consumption is low (maximum 76mW), effective thermal management through the PCB remains important for long-term reliability and maintaining stable light output. The recommended PCB pad design helps conduct heat away from the LED junction area. In applications with high ambient temperatures or densely packed multiple LEDs, additional thermal design considerations for the PCB may be necessary.

8.3 Optical Design Considerations

The wide 130-degree viewing angle makes this LED suitable for applications requiring large-area illumination or wide-angle visibility, such as status indicators. For applications requiring a more focused beam, secondary optical elements (e.g., lenses, light guides) need to be designed and placed above the LED.

8.4 Application Limitations and Warnings

This component is intended for use in standard commercial and industrial electronic equipment. It is not designed or certified for safety-critical applications where failure could directly endanger life or health. Such applications include, but are not limited to, aviation systems, traffic control, medical life-support equipment, and critical safety equipment. For these applications, components with appropriate safety certifications must be selected.

9. Kwatancin Fasaha da Bambance-bambance

LTST-C216TGKT is positioned for the standard SMD green LED market. Its key differentiators are the combination of its high typical luminous intensity (up to 450 mcd) with a standard package size, RoHS compliance for global market access, and proven compatibility with high-temperature lead-free reflow soldering processes. Three-dimensional binning (V_F, I_V, λ_d) provides designers with the ability to select components to meet applications requiring tight parameter matching, such as in multi-LED arrays or displays with extremely high demands for color and brightness uniformity.

10. Tambayoyin da ake yawan yi (FAQ)

10.1 Menene bambanci tsakanin Peak Wavelength da Dominant Wavelength?

Peak Wavelength (λ_P) is the physical wavelength at which the LED emits its maximum optical power. Dominant Wavelength (λ_d) is a value calculated based on colorimetry, representing the wavelength of monochromatic light that appears to the human eye to be the same color as the LED's output. For green LEDs, λ_dis typically shorter than λ_PA bit shorter ("blue-shifted").

10.2 Zan iya amfani da Constant Voltage Source don kunna wannan LED?

No, it is not recommended. LEDs are current-driven devices. Their forward voltage has tolerances and varies with temperature. Even connecting it directly to a voltage source at its typical V_Fcan lead to uncontrolled current, easily exceeding the maximum rating and damaging the device. Always use a series current-limiting resistor or a dedicated constant-current drive circuit.

10.3 Me ya sa damuwa da ɗanɗano da aiki ke da mahimmanci?

SMD plastic packages absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture rapidly turns to steam, creating high internal pressure. This can lead to internal package delamination or catastrophic failure, such as cracking ("popcorn" effect), resulting in immediate or latent reliability issues. Following MSL guidelines prevents this.

10.4 Yaya ake fassara lambar rarrabawa lokacin yin oda?

When specifying the purchase of this LED, you can request a specific V_F, I_Vand λ_dGrading codes to ensure performance characteristics meet your design requirements. For example, requiring D8 grade (V_F), T gear (I_V) e AQ file (λ_d) Select an LED with a forward voltage of approximately 3.1V, very high brightness, and a dominant wavelength centered at 527.5 nm.

11. Nazarin Ƙira da Amfani

11.1 Nazarin Lamari: Panel Nuna Matsayin LED da yawa

Consider designing a panel with 20 green LEDs to indicate the operational status of various subsystems in a network router. Uniform brightness and color are crucial for user experience.

Design steps:

1. Saita na Ƙarfin Lantarki:Zaɓi I_F= 15 mA (ƙasa da matsakaicin 20mA) don tabbatar da tsawon rayuwa da samar da amintaccen gado. Wannan kuma yana rage yawan amfani da wutar lantarki da zafi.
2. Da'irar Turawa:Yi amfani da layin wutar lantarki na kowa 3.3V. Lissafa resistor na jere: R_S= (3.3V - 3.2V) / 0.015A ≈ 6.7 ohms. Yi amfani da madaidaicin resistor na 6.8 ohms. Tabbatar da ƙarfin resistor: P = I²R = (0.015)²*6.8 ≈ 1.5 mW.
3. Ensure uniformity:To achieve uniform appearance, specify strict binning when ordering. Require all LEDs to be from a single luminous intensity bin (e.g., S bin) and a single tint bin (e.g., AQ bin). When using individual series resistors, the forward voltage bin is less critical for visual uniformity.
4. PCB layout:Follow the recommended pad pattern. Routing should provide equal current paths for each LED. Include sufficient ground plane for heat dissipation.
5. Assembly:Precisely follow the infrared reflow soldering temperature profile. If panels are assembled in batches, ensure components from opened reels are used within a one-week window or are properly baked.

This method can produce a reliable, professionally appearing indicator panel with consistent performance across all units.

12. Introduction to Working Principles

LTST-C216TGKT is a semiconductor light source based on the principle of electroluminescence in direct bandgap materials. The active region uses indium gallium nitride (InGaN) compound semiconductor. When a forward bias voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. Here, they recombine, releasing energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the InGaN material, which is designed to be approximately 2.34 eV, corresponding to green light at about 530 nm. A water-clear epoxy resin lens encapsulates the semiconductor chip, providing mechanical protection and shaping the light output pattern.

13. Technology Trends and Background

This component represents a mature and widely adopted technology within the broader field of solid-state lighting. InGaN-based LEDs are the standard for generating blue and green light. Key ongoing industry trends providing context for this device include:

• Efficiency Improvement:Ongoing R&D aims to increase the internal quantum efficiency (IQE) and light extraction efficiency (LEE) of InGaN LEDs, thereby achieving higher luminous efficacy (more light output per watt of electrical input).
• Miniaturization:The drive for smaller, denser electronics demands LEDs in smaller package sizes while maintaining or increasing optical power.
• Reliability Enhancement:Improvements in packaging materials, die-attach techniques, and phosphor technology (for white LEDs) focus on extending operational lifetime and stability under harsh conditions.
• Smart Integration:A growing trend is the direct integration of control circuitry, sensors, or communication interfaces into the LED package, moving beyond simple discrete components.

With its RoHS compliance, reflow solder compatibility, and detailed binning, the LTST-C216TGKT is a product designed to meet the current demands of efficient, reliable, and high-volume electronics manufacturing.