Bayanin Fasaha na LED na SMD Orange AlInGaP 0603 - Girman 1.6x0.8x0.6mm - Ƙarfin Wutar Lantarki 1.8-2.4V - Ƙarfin Wuta 72mW - Takardun Fasaha na Hausa

1. Bayyani Game da Samfur Wannan takarda ta ba da cikakkun bayanai game da ƙayyadaddun bayanai na Babban Haske, ƙaramin Na'urar Haske mai Haɗawa da Ƙasa (SMD). An ƙera na'urar a cikin daidaitaccen tsarin kunshin 0603 na masana'antu, wanda ya sa ya dace da tsarin haɗa allon da'ira (PCB) ta atomatik. Girman sa mai ƙanƙanta ya dace da aikace-aikacen da ke da ƙarancin sarari inda ake buƙatar ingantaccen nuni na yanayi ko hasken baya.

1.1 Fa'idodi na Asali da Kasuwar Da Ake Nufi Babban fa'idodin wannan LED sun haɗa da dacewa da kayan aikin ɗauka da sanyawa na atomatik masu yawan gaske da kuma hanyoyin solder na reflow na infrared (IR), waɗanda suke daidaitattun a cikin masana'antar kera na'urori na zamani. An gina shi ta amfani da fasahar semiconductor na Aluminum Indium Gallium Phosphide (AlInGaP), wanda aka sani da samar da haske mai inganci da haske na orange. Na'urar ta yi daidai da ƙa'idodin muhalli masu dacewa.

Kasuwar da ake nufi ta shafi nau'ikan kayan lantarki na mabukaci da na masana'antu, gami da amma ba'a iyakance ga kayan aikin sadarwa (misali, wayoyin salula), na'urorin kwamfuta masu ɗaukuwa, kayan aikin sadarwa, kayan aikin gida, da alamun gida ko hasken baya na nuni. Babban aikinsa shine a matsayin mai nuni na yanayi ko ƙaramin mai haskakawa.

2. Ma'auni na Fasaha: Cikakken Bayani Mai Ma'ana Wannan sashe yana ba da cikakken bayani game da iyakokin na'urar da halayen aiki. Fahimtar waɗannan ma'auni yana da mahimmanci don ingantaccen ƙira na da'ira da tabbatar da aiki na dogon lokaci.

2.1 Matsakaicin Ƙimar Ƙarfafawa Matsakaicin Ƙimar Ƙarfafawa yana bayyana iyakokin damuwa waɗanda za su iya haifar da lalacewa na dindindin ga na'urar. Waɗannan ba yanayi ba ne don aiki na al'ada.

Rushewar Wuta (Pd): 72 mW. Wannan shine matsakaicin adadin wutar da na'urar za ta iya watsawa azaman zafi ba tare da wuce iyakokin zafinta ba.

Matsakaicin Ƙarfin Wutar Lantarki na Gaba (I F(PEAK) ): 80 mA. Wannan ƙarfin wutar lantarki yana halatta ne kawai a ƙarƙashin yanayin bugun jini (1/10 aikin aiki, 0.1ms faɗin bugun jini) na gajeren lokaci, kamar yayin gwaji.

Matsakaicin Ƙarfin Wutar Lantarki na Gaba (I ): 30 mA DC. Wannan shine matsakaicin ƙarfin wutar lantarki da ake ba da shawarar don aiki na ci gaba.

Ƙarfin Wutar Lantarki na Baya (V ): 5 V. Yin amfani da ƙarfin wutar lantarki na baya wanda ya wuce wannan iyaka zai iya haifar da rushewa nan take. Ba a nufin na'urar don aikin karkatar da baya ba.

• Kewayon Zafin Jiki na Aiki (T opr ): -40°C zuwa +85°C. An tabbatar da cewa na'urar za ta yi aiki a cikin wannan kewayon zafin yanayi.Kewayon Zafin Jiki na Ajiya (T stg ): -40°C zuwa +100°C. Ana iya adana na'urar ba tare da lalacewa ba a cikin waɗannan iyakoki.
• 2.2 Halayen Lantarki da Haske Ana auna waɗannan ma'auni a ƙarƙashin daidaitattun yanayin gwaji (Ta=25°C, I =20mA) kuma suna bayyana aikin na'urar._{Ƙarfin Haske (I ): 90.0 - 280.0 mcd (millicandela). Wannan ma'auni ne na hasken da ido na ɗan adam ke gani. Ana sarrafa babban kewayon ta hanyar tsarin binning.}Kusurwar Dubawa (2θ 1/2 ): Digiri 110. Wannan shine cikakken kusurwar da ƙarfin haske ke faɗuwa zuwa rabin ƙimarsa da aka auna akan-axis (kai tsaye a gaban LED). Kusurwar 110° tana nuna tsarin dubawa mai faɗi.Matsakaicin Tsawon Zangon Haske (λ ): 611 nm (na al'ada). Wannan shine tsawon zangon da fitowar ƙarfin haske ya fi girma.
• Babban Tsawon Zangon Haske (λ ): 600 - 612 nm. Wannan shine tsawon zango guda ɗaya wanda ya fi wakiltar launin hasken da ake gani, wanda aka samo daga madaidaitan launi. Shi ne babban ma'auni don rarrabe launi._FRabin Faɗin Layin Haske (Δλ): 17 nm (na al'ada). Wannan yana nuna tsaftar haske, yana auna faɗin bakan haske a rabin matsakaicin ƙarfinsa. Ƙananan ƙima yana nuna tushen haske mai launi ɗaya.Ƙarfin Wutar Lantarki na Gaba (V ): 1.8 - 2.4 V. Wannan shine faɗuwar ƙarfin wutar lantarki a kan LED lokacin da ake tuka shi da ƙarfin gwaji na 20mA. Yana bambanta da ƙarfin wutar lantarki da zafin jiki.
• Ƙarfin Wutar Lantarki na Baya (I ): 10 μA (max) a V =5V. Wannan shine ƙaramin ƙarfin wutar lantarki mai ɓarna wanda ke gudana lokacin da na'urar ta kasance cikin karkatar da baya a cikin matsakaicin ƙimarta._R3. Bayanin Tsarin Binning Don tabbatar da daidaito a cikin samarwa mai yawa, ana rarraba LED ta hanyar ma'auni masu mahimmanci. Wannan yana ba masu ƙira damar zaɓar sassa waɗanda suka cika takamaiman buƙatu don haske, launi, da ƙarfin wutar lantarki.3.1 Binning na Ƙarfin Wutar Lantarki na Gaba Ana auna raka'a a I = 20mA. Haƙuri ga kowane kwandon shine ±0.1V.
• Bin D2: 1.8V (Min) zuwa 2.0V (Max)_{Bin D3: 2.0V (Min) zuwa 2.2V (Max)}Bin D4: 2.2V (Min) zuwa 2.4V (Max)3.2 Binning na Ƙarfin Haske Raka'a sune mcd (millicandela) a I = 20mA. Haƙuri akan kowane kwandon shine ±11%.
• Bin Q2: 90 mcd (Min) zuwa 112 mcd (Max)_{Bin R1: 112 mcd (Min) zuwa 140 mcd (Max)}Bin R2: 140 mcd (Min) zuwa 180 mcd (Max)Bin S1: 180 mcd (Min) zuwa 220 mcd (Max)

Bin S2: 220 mcd (Min) zuwa 280 mcd (Max)

3.3 Binning na Tsawon Zangon Haske Raka'a sune nanometers (nm) a I = 20mA. Haƙuri ga kowane kwandon shine ±1 nm._FBin P: 600 nm (Min) zuwa 603 nm (Max)

• Bin Q: 603 nm (Min) zuwa 606 nm (Max)_VBin R: 606 nm (Min) zuwa 609 nm (Max)Bin S: 609 nm (Min) zuwa 612 nm (Max)
• 4. Bincike na Lankwasa Ayyuka Yayin da aka ambaci takamaiman bayanan hoto a cikin takardar tushe, lankwasan ayyuka na al'ada na irin waɗannan na'urori suna nuna mahimman alaƙa masu mahimmanci don ƙira._{4.1 Ƙarfin Wutar Lantarki na Gaba vs. Ƙarfin Wutar Lantarki na Gaba (Lankwasa I-V) Lankwasa I-V ba ta da layi. Ƙarfin wutar lantarki na gaba (V ) yana ƙaruwa tare da ƙarfin wutar lantarki amma yana da ma'aunin zafin jiki—V yawanci yana raguwa yayin da zafin haɗin gwiwa ya tashi. Dole ne a yi la'akari da wannan a cikin ƙirar tuƙi na ƙarfin wutar lantarki na ci gaba.}4.2 Ƙarfin Haske vs. Ƙarfin Wutar Lantarki na Gaba Fitowar haske (ƙarfin haske) yana kusan daidai da ƙarfin wutar lantarki na gaba a cikin babban kewayon. Duk da haka, inganci na iya raguwa a ƙarfin wutar lantarki mai yawa saboda ƙaruwar samar da zafi. Yin aiki a ko ƙasa da shawarar 20mA yana tabbatar da ingantaccen inganci da tsawon rai.4.3 Halayen Zafin Jiki Aikin LED ya dogara da zafin jiki. Ƙarfin haske gabaɗaya yana raguwa yayin da zafin haɗin gwiwa ya ƙaru. Babban tsawon zangon haske kuma na iya canzawa kaɗan tare da zafin jiki, yana shafar launin da ake gani, musamman a aikace-aikacen daidaito.
• 5. Bayanin Injiniya da Kunshin 5.1 Girman Kunshin Na'urar ta yi daidai da daidaitaccen girman kunshin EIA 0603. Manyan girma (a cikin millimeters) sun kusan 1.6mm tsawon, 0.8mm faɗi, da 0.6mm tsayi. Haƙuri yawanci ±0.1mm. Ruwan tabarau yana da tsabta, tare da launin orange da aka samar ta hanyar guntuwar semiconductor na AlInGaP a ciki._P5.2 Tsarin Ƙasa na PCB da Ake Ba da Shawara An ba da tsarin ƙasa don solder na reflow na infrared ko matakin tururi. An ƙera wannan tsari don tabbatar da ingantaccen samuwar haɗin gwiwa, daidaita kai yayin reflow, da ingantaccen haɗin injiniya. Bin tsarin pad ɗin da aka ba da shawara yana da mahimmanci don hana kabari ko rashin ingantaccen haɗin gwiwa.5.3 Gano Polarity Ana yiwa cathode alama a kan na'urar, sau da yawa ta hanyar launin kore a gefen da ya dace na kunshin ko ƙaramin tsaga. Silkscreen na PCB da sawun ƙafa yakamata su nuna polarity a fili don hana sanya ba daidai ba.
• 6. Jagororin Solder da Haɗawa 6.1 Ma'auni na Solder na Reflow Na'urar ta dace da hanyoyin solder na reflow na infrared (marasa gubar). An ambaci shawarar bayanin martaba mai bin J-STD-020B. Manyan ma'auni sun haɗa da:_dPre-heat: 150-200°CLokacin Pre-heat: Matsakaicin 120 seconds.
• Matsakaicin Zafin Jiki: Matsakaicin 260°C.Lokaci Sama da Liquidus: Ana ba da shawarar bin ƙayyadaddun masana'anta na man solder.
• Matsakaicin Zangon Solder: Sau biyu._FDole ne a siffanta bayanan martaba don takamaiman haɗin PCB, la'akari da kauri na allon, yawan abubuwan da aka haɗa, da nau'in man solder.6.2 Solder na Hannu (Idan Ya Kamata) Idan ana buƙatar solder na hannu, dole ne a yi taka tsantsan:
• Zafin Ƙarfe: Matsakaicin 300°C._RLokacin Solder: Matsakaicin 3 seconds kowane pad.Iyaka: Zangon solder ɗaya kawai. Yawan zafi zai iya lalata ciki na ciki ko kunshin filastik._R6.3 Yanayin Ajiya LEDs na'urori ne masu kula da danshi (MSD).

Jakarta Mai Rufi: Ajiye a ≤30°C da ≤70% Danshi na Dangi (RH). Yi amfani da shi cikin shekara guda bayan ranar rufewar jakar.

Jakarta da aka Buɗe/Buɗe: Ajiye a ≤30°C da ≤60% RH. Ana ba da shawarar sosai don kammala reflow na IR cikin sa'o'i 168 (7 kwanaki) na fallasa iska na yanayi.

Tsawaita Fallasa: Idan an fallasa fiye da sa'o'i 168, ana buƙatar gasa a kusan 60°C na aƙalla sa'o'i 48 kafin solder don cire danshin da aka sha da kuma hana "popcorning" yayin reflow.

6.4 Tsaftacewa Idan tsaftacewa bayan solder ya zama dole, yi amfani da kawai yarda da kaushi na barasa kamar isopropyl alcohol (IPA) ko ethyl alcohol. Tsoma yakamata ya kasance a zafin jiki na al'ada kuma ƙasa da minti ɗaya. Mugun ko ba a bayyana sinadarai ba na iya lalata kayan kunshin ko ruwan tabarau._F7. Bayanin Kunshin da Oda 7.1 Ƙayyadaddun Kaset da Reel Ana ba da na'urar da aka kunshin cikin kaset mai ɗaukar kaya mai faɗin 8mm akan reels mai diamita 7-inch (178mm). Wannan kunshin ya dace da daidaitattun kayan aikin haɗa SMD na atomatik.

• Adadin kowane Reel: 4000 guda.Matsakaicin Adadin Oda (MOQ) don Sauran: 500 guda.
• Kaset Mai Rufi: An rufe buɗaɗɗen aljihu na abubuwan da ba kowa tare da babban kaset ɗin rufi.Abubuwan da suka ɓace: Ana ba da izinin mafi girman abubuwan da suka ɓace guda biyu a jere bisa ga ƙayyadaddun bayanai.
• Kunshin ya yi daidai da ƙayyadaddun ANSI/EIA-481.8. Shawarwari na Aikace-aikace 8.1 Da'irori na Aikace-aikace na Al'ada LED na'urar ce da aka tuƙa. Don ingantaccen aiki da daidaiton haske, musamman lokacin da ake amfani da LED da yawa, dole ne a yi amfani da resistor mai iyakancewa na ƙarfin wutar lantarki a jere tare da kowane LED ko kowane layin LED a layi daya. Tuƙi LED kai tsaye daga tushen ƙarfin wutar lantarki ba tare da sarrafa ƙarfin wutar lantarki ba ba a ba da shawarar ba kuma zai haifar da rashin daidaiton aiki da yuwuwar gazawar na'urar. Ana ƙididdige ƙimar resistor na jere ta amfani da Dokar Ohm: R = (V supply - V ) / I , inda V shine ƙarfin wutar lantarki na gaba na LED a ƙarfin wutar lantarki da ake so I .

8.2 Abubuwan Tunani na Ƙira Gudanar da Zafi: Ko da yake rushewar wuta yana da ƙasa, tabbatar da isasshen yanki na tagulla na PCB ko taimakon zafi na iya taimakawa wajen kiyaye ƙananan zafin haɗin gwiwa, kiyaye fitowar haske da tsawon rai.

Rage Ƙimar Ƙarfin Wutar Lantarki: Don aiki a babban zafin yanayi (kusa da +85°C), yi la'akari da rage ƙarfin wutar lantarki na gaba don rage zafi na ciki._FKariya ta ESD: Yayin da ba a bayyana a fili a matsayin mai hankali sosai ba, yakamata a kiyaye matakan kula da ESD na al'ada yayin haɗawa da sarrafawa.

• 9. Kwatancen Fasaha da Bambanci Idan aka kwatanta da tsofaffin fasahohi kamar Gallium Phosphide (GaP), LED na AlInGaP suna ba da inganci mai haske da haske sosai don launin orange da ja. Kunshin 0603 yana wakiltar daidaito tsakanin ƙananan ƙira da sauƙin sarrafawa/samarwa. Ƙananan kayan aiki (misali, 0402) sun wanzu amma suna iya zama ƙalubale ga wasu layukan haɗawa kuma suna da ɗan bambancin halayen zafi. Faɗin kusurwar dubawa na digiri 110 ya dace da aikace-aikacen da ke buƙatar faɗin gani, sabanin LED masu ƙunƙuntaccen kusurwa da ake amfani da su don haske mai mai da hankali.10. Tambayoyin da Ake Yi Akai-akai (Dangane da Ma'auni na Fasaha) 10.1 Shin Zan iya tuka wannan LED a 30mA akai-akai? Ee, 30mA shine matsakaicin ƙimar ƙarfin wutar lantarki na DC na ci gaba. Duk da haka, don mafi kyawun tsawon rai da kuma la'akari da yuwuwar hawan zafi a cikin aikace-aikacen, ƙira don ƙaramin ƙarfin wutar lantarki kamar 20mA al'ada ce kuma tana ba da gefen aminci.
• 10.2 Me yasa akwai babban bambanci a cikin ƙarfin haske (90-280 mcd)? Wannan kewayon yana wakiltar jimlar yaduwa a duk samarwa. Ana rarraba na'urori zuwa takamaiman kwandon ƙarfi (Q2, R1, R2, S1, S2). Masu ƙira na iya ƙayyadad da lambar kwandon da ake buƙata don tabbatar da daidaiton haske a cikin samfurinsu. Idan takamaiman haske yana da mahimmanci, yakamata a ƙayyade kwandon S1 ko S2.10.3 Me zai faru idan na yi solder wannan LED fiye da sau biyu? Wucewa matsakaicin zangon solder da aka ba da shawarar (biyu don reflow, ɗaya don solder na hannu) yana fallasa na'urar ga damuwa na zafi mai tarawa. Wannan na iya lalata haɗin gwiwar waya na ciki, lalata guntuwar semiconductor, ko haifar da rabuwar kunshin filastik, wanda zai haifar da gazawar da ba a kai ba ko rage aminci.
• 10.4 Shin gasa koyaushe ya zama dole idan jakar ta buɗe tsawon mako guda? Ee. Rayuwar bene na sa'o'i 168 (7 kwanaki) muhimmiyar jagora ce ga na'urori masu kula da danshi. Idan abubuwan an fallasa su zuwa yanayin yanayi fiye da wannan lokacin ba tare da ingantaccen ajiyar bushewa ba (misali, a cikin desiccator), dole ne a yi gasa (60°C na sa'o'i 48) don fitar da danshin da aka sha da kuma hana lalacewar matsa lamba na tururi yayin babban zafin jiki. tsarin solder na reflow.11. Nazarin Aikace-aikace na Aiki Yanayi: Ƙirar allon nuni na yanayi don mai sarrafa hanyar sadarwa tare da alamun LED orange iri ɗaya guda biyar.
• Matakan Ƙira: Zaɓin Ma'auni: Zaɓi lambobin kwandon don daidaito. Misali, ƙayyade Babban Tsawon Zangon Haske Bin R (606-609nm) da Ƙarfin Haske Bin S1 (180-220 mcd) don tabbatar da daidaiton launi da haske.Ƙirar Da'ira: Samar da dabaru na ciki na mai sarrafa hanyar sadarwa shine 3.3V. Yin amfani da na al'ada V na 2.1V (daga Bin D3) da manufa I na 20mA, lissafta resistor na jere: R = (3.3V - 2.1V) / 0.020A = 60 Ohms. Za a yi amfani da resistor na al'ada na 62-ohm.
• Shimfidar PCB: Yi amfani da tsarin ƙasa da aka ba da shawara. Sanya LED guda biyar tare da daidaitaccen yanayi. Haɗa alamun polarity a fili akan silkscreen.Haɗawa: Tabbatar cewa ana amfani da LED cikin sa'o'i 168 na buɗe jakar shinge na danshi ko an gasa su yadda ya kamata. Bi bayanin martaba na IR reflow da aka ba da shawara.

Sakamako: Alamomi biyar tare da launi da haske da suka dace da gani, suna ba da cikakkun bayanai na yanayi ga mai amfani na ƙarshe.

12. Gabatarwa da Ka'idar Aiki LED na Haske diodes ne na semiconductor p-n junction. Lokacin da aka yi amfani da ƙarfin wutar lantarki na gaba, electrons daga yankin n-type da ramuka daga yankin p-type ana shigar da su cikin yankin haɗin gwiwa (Layer mai aiki). Lokacin da waɗannan masu ɗaukar caji (electrons da ramuka) suka sake haɗuwa, ana sakin makamashi. A cikin LED, ana sakin wannan makamashi a cikin nau'in photons (haske). Takamaiman tsawon zangon (launi) na hasken da aka fitar yana ƙaddara ta hanyar ƙarfin bandgap na kayan semiconductor da aka yi amfani da su a cikin Layer mai aiki. Ga wannan LED orange, kayan shine Aluminum Indium Gallium Phosphide (AlInGaP), wanda ke da bandgap daidai da haske a cikin sashi na orange/ja na bakan gani. Ruwan tabarau na epoxy mai tsabta yana aiki don kare guntuwar semiconductor da kuma siffata fitowar hasken._F13. Trends na Fasaha Gabaɗayan yanayin a LED na nuni yana ci gaba zuwa mafi inganci (ƙarin fitowar haske a kowace raka'a na wutar lantarki), wanda ke ba da damar haske iri ɗaya a ƙananan ƙarfin tuƙi, rage amfani da wutar lantarki na tsarin da samar da zafi. Ƙananan kunshin kuma yana ci gaba, tare da kunshin 0402 har ma da 0402 suna zama ruwan dare gama gari don ƙirar da ke da ƙarancin sarari. Bugu da ƙari, an mayar da hankali kan inganta daidaiton launi da faɗaɗa kewayon launuka masu jikewa ta hanyar ci gaba a cikin kayan semiconductor da fasahar phosphor. Tuƙin atomatik da aminci a cikin masana'antu yana ƙarfafa mahimmancin abubuwan da suka dace da daidaitattun hanyoyin ɗauka da sanyawa da reflow, kamar yadda wannan na'urar ta misalta.

• Bin P: nm (Min) to 603 nm (Max)
• Bin Q: nm (Min) to 606 nm (Max)
• Bin R: nm (Min) to 609 nm (Max)
• Bin S: nm (Min) to 612 nm (Max)

. Performance Curve Analysis

While specific graphical data is referenced in the source document, typical performance curves for such devices illustrate key relationships essential for design.

.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is non-linear. The forward voltage (V_F) increases with current but has a temperature coefficient—V_Ftypically decreases as junction temperature rises. This must be considered in constant-current drive designs.

.2 Luminous Intensity vs. Forward Current

The light output (luminous intensity) is approximately proportional to the forward current over a significant range. However, efficiency may drop at very high currents due to increased heat generation. Operating at or below the recommended 20mA ensures optimal efficiency and longevity.

.3 Temperature Characteristics

LED performance is temperature-dependent. Luminous intensity generally decreases as the junction temperature increases. The dominant wavelength may also shift slightly with temperature, affecting perceived color, especially in precision applications.

. Mechanical and Packaging Information

.1 Package Dimensions

The device conforms to the EIA standard 0603 package size. Key dimensions (in millimeters) are approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height. Tolerances are typically ±0.1mm. The lens is water clear, with the orange color generated by the AlInGaP semiconductor chip inside.

.2 Recommended PCB Land Pattern

A land pattern is provided for infrared or vapor phase reflow soldering. This pattern is designed to ensure proper solder joint formation, self-alignment during reflow, and reliable mechanical attachment. Following the recommended pad geometry is critical to prevent tombstoning or poor solder joints.

.3 Polarity Identification

The cathode is typically marked on the device, often by a green tint on the corresponding side of the package or a small notch. The PCB silkscreen and footprint should clearly indicate polarity to prevent incorrect placement.

. Soldering and Assembly Guidelines

.1 Reflow Soldering Parameters

The device is compatible with lead-free (Pb-free) IR reflow soldering processes. A suggested profile compliant with J-STD-020B is referenced. Key parameters include:

• Pre-heat:-200°C
• Pre-heat Time:Maximum 120 seconds.
• Peak Temperature:Maximum 260°C.
• Time Above Liquidus:Recommended to follow solder paste manufacturer specifications.
• Maximum Soldering Cycles:Two times.

Profiles must be characterized for the specific PCB assembly, considering board thickness, component density, and solder paste type.

.2 Hand Soldering (If Necessary)

If hand soldering is required, extreme care must be taken:

• Iron Temperature:Maximum 300°C.
• Soldering Time:Maximum 3 seconds per pad.
• Limit:One soldering cycle only. Excessive heat can damage the internal die or plastic package.

.3 Storage Conditions

LEDs are moisture-sensitive devices (MSD).

• Sealed Bag:Store at ≤30°C and ≤70% Relative Humidity (RH). Use within one year of bag seal date.
• Opened Bag/Exposed:Store at ≤30°C and ≤60% RH. It is strongly recommended to complete IR reflow within 168 hours (7 days) of exposure to ambient air.
• Extended Exposure:If exposed for more than 168 hours, a bake-out at approximately 60°C for at least 48 hours is required before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

.4 Cleaning

If post-solder cleaning is necessary, use only approved alcohol-based solvents such as isopropyl alcohol (IPA) or ethyl alcohol. Immersion should be at normal temperature and for less than one minute. Harsh or unspecified chemicals can damage the package material or lens.

. Packaging and Ordering Information

.1 Tape and Reel Specifications

The device is supplied packaged in 8mm wide embossed carrier tape on 7-inch (178mm) diameter reels. This packaging is compatible with standard automated SMD assembly equipment.

• Quantity per Reel: pieces.
• Minimum Order Quantity (MOQ) for Remainders: pieces.
• Cover Tape:Empty component pockets are sealed with a top cover tape.
• Missing Components:A maximum of two consecutive missing components is allowed per specification.

The packaging conforms to ANSI/EIA-481 specifications.

. Application Recommendations

.1 Typical Application Circuits

An LED is a current-driven device. For reliable operation and consistent brightness, especially when multiple LEDs are used, a current-limiting resistor must be used in series with each LED or each parallel string of LEDs. Driving LEDs directly from a voltage source without current control is not recommended and will lead to inconsistent performance and potential device failure. The series resistor value is calculated using Ohm's Law: R = (V_supply- V_F) / I_F, where V_Fis the forward voltage of the LED at the desired current I_F.

.2 Design Considerations

• Thermal Management:Although power dissipation is low, ensuring adequate PCB copper area or thermal relief can help maintain lower junction temperatures, preserving light output and lifespan.
• Current Derating:For operation at high ambient temperatures (approaching +85°C), consider derating the forward current to reduce internal heating.
• ESD Protection:While not explicitly stated as highly sensitive, standard ESD handling precautions should be observed during assembly and handling.

. Technical Comparison and Differentiation

Compared to older technologies like Gallium Phosphide (GaP), AlInGaP LEDs offer significantly higher luminous efficiency and brightness for orange and red colors. The 0603 package represents a balance between miniaturization and ease of handling/manufacturing. Smaller packages (e.g., 0402) exist but may be more challenging for some assembly lines and have slightly different thermal characteristics. The wide 110-degree viewing angle is suitable for applications requiring broad visibility, as opposed to narrow-angle LEDs used for focused illumination.

. Frequently Asked Questions (Based on Technical Parameters)

.1 Can I drive this LED at 30mA continuously?

Yes, 30mA is the maximum rated continuous DC forward current. However, for optimal longevity and to account for potential thermal rise in the application, designing for a lower current such as 20mA is common practice and provides a safety margin.

.2 Why is there such a wide range in luminous intensity (90-280 mcd)?

This range represents the total spread across all production. Devices are sorted into specific intensity bins (Q2, R1, R2, S1, S2). Designers can specify a required bin code to ensure brightness consistency in their product. If a specific brightness is critical, the S1 or S2 bins should be specified.

.3 What happens if I solder this LED more than two times?

Exceeding the maximum recommended soldering cycles (two for reflow, one for hand soldering) exposes the device to cumulative thermal stress. This can degrade the internal wire bonds, damage the semiconductor die, or cause delamination of the plastic package, leading to premature failure or reduced reliability.

.4 Is baking always necessary if the bag has been open for a week?

Yes. The 168-hour (7-day) floor life is a critical guideline for moisture-sensitive devices. If the components have been exposed to ambient conditions beyond this period without proper dry storage (e.g., in a desiccator), the mandatory bake-out (60°C for 48 hours) is required to drive out absorbed moisture and prevent vapor pressure damage during the high-temperature reflow soldering process.

. Practical Application Case Study

Scenario:Designing a status indicator panel for a network router with five identical orange LED indicators.

Design Steps:

1. Parameter Selection:Choose bin codes for consistency. For example, specify Dominant Wavelength Bin R (606-609nm) and Luminous Intensity Bin S1 (180-220 mcd) to ensure uniform color and brightness.
2. Circuit Design:The router's internal logic supply is 3.3V. Using the typical V_Fof 2.1V (from Bin D3) and a target I_Fof 20mA, calculate the series resistor: R = (3.3V - 2.1V) / 0.020A = 60 Ohms. A standard 62-ohm resistor would be used.
3. PCB Layout:Use the recommended land pattern. Place the five LEDs with consistent orientation. Include clear polarity markings on the silkscreen.
4. Assembly:Ensure the LEDs are used within 168 hours of opening the moisture barrier bag or are properly baked. Follow the recommended IR reflow profile.
5. Result:Five indicators with visually matched color and brightness, providing clear status information to the end-user.

. Operating Principle Introduction

Light Emitting Diodes are semiconductor p-n junction devices. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region (the active layer). When these charge carriers (electrons and holes) recombine, energy is released. In an LED, this energy is released in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active layer. For this orange LED, the material is Aluminum Indium Gallium Phosphide (AlInGaP), which has a bandgap corresponding to light in the orange/red part of the visible spectrum. The clear epoxy lens serves to protect the semiconductor chip and shape the light output beam.

. Technology Trends

The general trend in indicator LEDs continues toward higher efficiency (more light output per unit of electrical power), which allows for the same brightness at lower drive currents, reducing system power consumption and heat generation. Package miniaturization is also ongoing, with 0402 and even 0201 packages becoming more common for extremely space-constrained designs. Furthermore, there is a focus on improving color consistency and broadening the range of available saturated colors through advances in semiconductor materials and phosphor technology. The drive for automation and reliability in manufacturing reinforces the importance of components that are fully compatible with standard pick-and-place and reflow soldering processes, as exemplified by this device.