LTSN-N213EGBW SMD LED Datasheet - Tri-Color (Red/Green/Blue) - Package Dimensions - Voltage 1.8-3.8V - Power 75-76mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the LTSN-N213EGBW, a surface-mount device (SMD) Light Emitting Diode (LED). This component integrates three individual LED chips (Red, Green, and Blue) within a single package, making it suitable for applications requiring multi-color indication or color mixing. The device is designed for automated assembly processes and space-constrained applications common in modern electronics.

1.1 Siffofi

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 8mm tape for compatibility with 7-inch diameter reels, facilitating automated pick-and-place assembly.
• Standard EIA (Electronic Industries Alliance) package footprint.
• Input compatible with standard integrated circuit (IC) logic levels.
• Designed for compatibility with automated placement and infrared (IR) reflow soldering equipment.
• Preconditioned to JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Aikace-aikace

This LED is intended for a broad range of electronic equipment where reliable, multi-color status indication is required. Typical application areas include:

• Kayan sadarwa na wayar tarho (misali, na'urorin hanyoyin sadarwa, masu sauya hanyoyin sadarwa, tashoshin tushe).
• Na'urorin sarrafa ofis ta atomatik (misali, firintoci, na'urorin daukar hoto, na'urori masu ayyuka daban-daban).
• Kayan aikin gida masu nuna matsayi.
• Kwandon sarrafa masana'antu da allunan kayan aikin auna.
• Alamun cikin gida da tsarin nuna bayanai.

2. Sigogi na Fasaha: Cikakken Fassarar Manufa

The following sections provide a detailed breakdown of the device's operational limits and performance characteristics. All data is specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Matsakaicin Matsakaici na Cikakke

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided in circuit design.

• Power Dissipation (Pd): 75 mW for the Red chip, 76 mW for the Green and Blue chips. This is the maximum amount of power the device can dissipate as heat.
• Peak Forward Current (I_FP): 80 mA don kowane launuka. Wannan shine matsakaicin halalaccen halin yanzu na lokaci-lokaci, yawanci ana ƙayyadad da shi don aikin bugun jini (1/10 aikin aiki, 0.1ms faɗin bugun jini).
• DC Forward Current (I_F): 30 mA don Ja, 20 mA don Kore da Blue. Wannan shine matsakaicin ci gaba na ci gaba na DC da aka ba da shawarar don dogon lokaci mai aminci.
• Operating Temperature Range: -40°C zuwa +85°C. An tabbatar da cewa na'urar tana aiki a cikin wannan kewayon zafin yanayi.
• Storage Temperature Range: -40°C zuwa +100°C. Ana iya adana na'urar ba tare da amfani da wutar lantarki ba a cikin wannan kewayon.

2.2 Electrical and Optical Characteristics

Waɗannan su ne na'urorin aiki na yau da kullun da aka auna a ƙarƙashin daidaitattun yanayin gwaji (I_F = 20mA, Ta=25°C).

• Ƙarfin Hasken (I_V): Fitowar hasken da aka auna a cikin millicandelas (mcd).
  • Ja: Mafi ƙarancin 345 mcd, Mafi girma 720 mcd.
  • Kore: Mafi ƙarancin 750 mcd, Mafi girma 1300 mcd.
  • Blue: Mafi ƙarancin 140 mcd, Mafi girma 280 mcd.
• Kallon Angle (2θ_1/2): Kusan da kusan digiri 120 (na al'ada). Wannan shine cikakken kusurwar da ƙarfin haske ya kasance rabin ƙimar axial ta kololuwa, yana nuna tsarin kallo mai faɗi.
• Peak Emission Wavelength (λ_P): Tsayin raƙuman ruwa wanda rarraba ƙarfin bakan ya fi girma.
  • Ja: 630 nm (na al'ada).
  • Kore: 518 nm (na al'ada).
  • Shudi: 467 nm (na al'ada).
• Dominant Wavelength (λ_d): Tsayin raƙuman ruwa guda ɗaya wanda idon ɗan adam ya fahimta wanda ke ayyana launi.
  • Red: 617-627 nm (typical range).
  • Green: 517-527 nm (typical range).
  • Blue: 462-472 nm (typical range).
• Spectral Line Half-Width (Δλ): The bandwidth of the emitted spectrum at half its maximum intensity.
  • Red: 25 nm (typical).
  • Green: 35 nm (typical).
  • Shudi: 20 nm (na al'ada).
• Forward Voltage (V_F): Faɗin wutar lantarki a kan LED lokacin da ake tuka shi da ƙwararren gwajin na yanzu.
  • Ja: 1.8V (Mafi ƙanƙanta), 2.5V (Mafi girma).
  • Kore: 2.8V (Mafi ƙanƙanta), 3.8V (Mafi girma).
  • Shudi: 2.8V (Mafi ƙanƙanta), 3.8V (Mafi girma).
• Reverse Current (I_R): Maximum 10 μA for all colors at a reverse voltage (V_R) of 5V. Note: This device is not designed for operation under reverse bias; this parameter is for test purposes only.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. The LTSN-N213EGBW uses a two-dimensional binning system.

3.1 Luminous Intensity (I_V) Bins

LEDs are categorized based on their light output at 20mA.

• Red:
  • Bin U1: 345.0 - 500.0 mcd
  • Bin U2: 500.0 - 720.0 mcd
• Green:
  • Bin V1: 750.0 - 1000.0 mcd
  • Bin V2: 1000.0 - 1300.0 mcd
• Blue:
  • Bin R2: 140.0 - 200.0 mcd
  • Bin S1: 200.0 - 280.0 mcd

Tolerance on each intensity bin is +/-11%.

3.2 Dominant Wavelength (λ_d) Bins

LEDs are categorized based on their perceived color (dominant wavelength).

• Red:
  • Bin V: 617.0 - 622.0 nm
  • Bin W: 622.0 - 627.0 nm
• Green:
  • Bin AP: 517.0 - 522.0 nm
  • Bin AQ: 522.0 - 527.0 nm
• Blue:
  • Bin AC: 462.0 - 467.0 nm
  • Bin AD: 467.0 - 472.0 nm

Tolerance for each dominant wavelength bin is +/- 1 nm.

3.3 Combined Bin Code

The final product tag uses a combined code (e.g., A1, C2, D3) that references a specific combination of intensity and wavelength bins for all three colors, as defined in the cross-tables provided in the datasheet. This ensures a matched set of characteristics for the Red, Green, and Blue chips within a single unit.

4. Performance Curve Analysis

The datasheet includes typical characteristic curves which are essential for understanding device behavior under varying conditions. While specific graphs are not reproduced here, they typically include:

• Relative Luminous Intensity vs. Forward Current (I-V Curve): Yana nuna yadda haske ke ƙaruwa tare da halin yanzu, yawanci a cikin alaƙar da ba ta layi ba. Yin aiki kusa da matsakaicin halin yanzu na DC na iya ba da raguwar dawowa cikin haske yayin ƙara zafi da damuwa.
• Ƙarfafan Wutar Lantarki Gaba vs. Halin Yanzu Gaba: Yana nuna halayen I-V na diode mai ma'ana. Ƙarfafan wutar lantarki gaba yana da ƙimar zafin jiki mara kyau, ma'ana yana raguwa kaɗan yayin da zafin haɗin ya tashi.
• Ƙarfin Hasken Hasken Dangi vs. Yanayin Yanayi: Yana kwatanta tasirin kashe zafi, inda fitowar haske ke raguwa yayin da yanayin yanayi (don haka haɗin) ya ƙaru. Wannan yana da mahimmanci musamman ga aikace-aikacen babban ƙarfi ko babban zafin jiki.
• Rarraba Spectral: Hotunan da ke nuna ƙarfin wutar lantaki da aka fitar a tsawon tsayin kowane launi, suna nuna kololuwa da manyan tsayin raƙuman ruwa da faɗin bakan.

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to a standard SMD footprint. Key dimensional notes include:

• All dimensions are in millimeters.
• Standard tolerance is ±0.2 mm unless otherwise specified on the detailed dimension drawing.
• The package incorporates a diffused lens for each color chip to widen the viewing angle.

5.2 Pin Assignment

The tri-color LED has a common-cathode or common-anode configuration (specific configuration should be verified from the package diagram). The datasheet indicates pin assignments for the Red (Pin 2), Green (Pin 3), and Blue (Pin 4) anodes, with a common cathode likely on Pin 1. Correct polarity identification is crucial during PCB layout and assembly.

5.3 Recommended PCB Attachment Pad

A land pattern diagram is provided to ensure proper solder joint formation and mechanical stability. Adherence to this recommended footprint is critical for successful reflow soldering and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

The device is compatible with infrared (IR) reflow soldering processes using lead-free (Pb-free) solder. The recommended profile conforms to J-STD-020B. Key parameters typically include:

• Yayyafa rampi rate.
• Soak (yayyafa) zazzabi da lokaci don kunna flux da rage girgizar zafi.
• Liquidus zazzabi da lokaci sama da liquidus (TAL).
• Peak reflow zazzabi (bai kamata ya wuce matsakaicin juriyar na'urar ba, yawanci kusan 260°C na ɗan gajeren lokaci).
• Sanyaya rampi rate.

6.2 Cleaning

Idan ana buƙatar tsaftacewa bayan siyar da guduro, kawai ya kamata a yi amfani da sinadarai da aka ƙayyade. Takardar bayanan ta ba da shawarar nutsar da cikin barasa na ethyl ko isopropyl a yanayin zafi na yau da kullun na ƙasa da minti ɗaya. Sinadarai da ba a ƙayyade ba na iya lalata kunshin LED ko ruwan tabarau.

6.3 Storage and Handling

• Kunshin da aka Rufe: Ana jigilar na'urori a cikin jakar shinge na danshi tare da busasshiyar abu. Ya kamata a adana su a ≤30°C da ≤70% Danshin Dangi (RH) kuma a yi amfani da su cikin shekara guda bayan ranar rufe jakar.
• Kunshin da aka Buɗe: Da zarar an buɗe jakar shinge na danshi, abubuwan haɗin suna fuskantar danshin yanayi. Ya kamata a adana su a ≤30°C da ≤60% RH.
• Rayuwar Bene: Ana ba'a shawarar cewa na'urorin da aka cire daga marufinsu na asali su yi IR reflow soldering a cikin sa'o'i 168 (kwanaki 7). Don ajiyar da ya fi tsayi a waje da jakar asali, ya kamata a sanya su a cikin akwati mai rufaffiyar tare da busassun abubuwan da suka dace ko a gasa bisa ga matakan da suka dace na damuwa na danshi (MSL) kafin amfani.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

Ana samar da na'urar a cikin tef ɗin ɗaukar hoto don haɗawa ta atomatik.

• Faɗin tef: 8 mm.
• Diamita na reel: inci 7.
• An ƙayyade filin aljihu da girma don tabbatar da dacewa da daidaitattun kayan ajiya.
• Packing quantity: 3000 pieces per full reel.
• Minimum order quantity for remnants: 500 pieces.
• The packaging conforms to ANSI/EIA-481 specifications.

8. Application Suggestions and Design Considerations

8.1 Current Limiting

LEDs are current-driven devices. A series current-limiting resistor is mandatory for each color channel when driving from a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the forward voltage of the specific color chip at the desired current I_F. Always use the maximum V_F from the datasheet for a conservative design to prevent overcurrent.

8.2 Thermal Management

While this is a low-power device, proper thermal design extends lifetime and maintains stable light output. Ensure the PCB has adequate copper area connected to the LED's thermal pad (if present) or pads to dissipate heat. Avoid operating at absolute maximum ratings for extended periods in high ambient temperatures.

8.3 Color Mixing and Control

For applications requiring specific colors (e.g., white, amber, purple) through additive mixing of the Red, Green, and Blue chips, independent pulse-width modulation (PWM) control of each channel is the most effective method. This allows for precise color and intensity control without the color shift associated with analog dimming (current reduction).

9. Kwatancen Fasaha da Bambance-bambance

The LTSN-N213EGBW offers specific advantages in its class:

• Integrated Tri-Color Solution: Combines three discrete colors in one 4-pin package, saving PCB space and simplifying assembly compared to using three separate SMD LEDs.
• Wide Viewing Angle (120°): The diffused lens provides a broad, even illumination pattern suitable for front-panel indicators that need to be visible from various angles.
• Standardized Packaging: Compatibility with 8mm tape and reels, and a standard EIA footprint, ensures seamless integration into high-volume automated manufacturing lines.
• Comprehensive Binning: The detailed intensity and wavelength binning allows designers to select consistency levels appropriate for their application, from general indication to color-critical displays.

10. Tambayoyin da ake yawan yi (Dangane da Ma'auni na Fasaha)

Q: Can I drive the Red, Green, and Blue LEDs simultaneously at their maximum DC current (30mA, 20mA, 20mA)?
A: A'a. Dole ne a lili'i i ka mana holo'oko'a Absolute Maximum Rating (75-76 mW no kēlā me kēia chip). Inā ho'oholo like 'ia nā mea 'ekolu i ka lilo nui loa, e 'oi paha ia i ka hiki wela o ka pū'olo, e ho'ēmi i ke ola, a e hiki ke hā'ule. E ho'ēmi i nā au ma muli o ka nānā wela o kāu noi kiko'ī.

Q: He aha ka 'oko'a ma waena o ka Peak Wavelength a me ka Dominant Wavelength?
A> Peak Wavelength (λ_P) ka lō'ihi nalu kino kahi e ho'olewa nui ai ka LED i ka mana māmā. 'O ka Dominant Wavelength (λ_d) he helu i helu 'ia ma muli o ka na'au o ka maka kanaka (CIE chromaticity) e hō'ike ana i ke kala i 'ike 'ia. No nā LED me kahi ākea haiki (e like me kēia), kokoke pinepine lākou, akā 'o λ_d ke kumu kiko'ī no ka wehewehe kala.

Q: Ua wehewehe 'ia ka Reverse Current ma 10μA ka nui ma 5V. Hiki ia'u ke ho'ohana i kēia LED i kahi ka'apuni multiplexing i ho'ohuli 'ia?
A: Mana'o 'ino loa. Datasheet din ya bayyana cewa na'urar ba a tsara ta don aiki na baya ba. I_R parameter ne kawai don dalilai na gwaji. Yin amfani da bias na baya a cikin aikin kewayawa na iya haifar da halayen da ba a iya tsinkaya ba da lalacewa da wuri.

Q: Yaya mahimmanci ne a bi rayuwar bene na sa'o'i 168 bayan buɗe jakar shinge na danshi?
A> It is a critical reliability guideline. SMD components absorb moisture from the air. During reflow, this moisture can turn to steam rapidly, causing internal delamination or \"popcorning,\" which cracks the package. If the exposure time is exceeded, the components must be baked according to the MSL3 profile before soldering to drive out the moisture.

11. Nazarin Aikace-aikace na Aiki

Scenario: Zana alamar matsayi don sauya hanyar sadarwa.
Na'urar tana buƙatar alamar launi guda ɗaya don nuna matsayin haɗin gwiwa (Kore = 1Gbps, Amber = 100Mbps, Ja = Babu Haɗin/Kuskure) da aiki (kyalkyali).

• Zaɓin Kayan Aiki: LTSN-N213EGBW yana da kyau, yana maye gurbin fitilun LED guda uku daban-daban.
• Zane na'urar Lantarki: Fil ɗin GPIO guda uku daga mai sarrafa mai sarrafa, kowanne yana haɗe zuwa tashar launi ta hanyar resistor mai iyakancewar ƙarfin lantarki. Ana ƙididdige ƙimomin daban don Ja (V_F~2.5V), Kore (V_F~3.8V), da Blue (ba a amfani da shi don Amber; Ana ƙirƙira Amber ta hanyar tuƙi Ja da Kore lokaci guda a ma'auni na musamman).
• Sarrafa Software: Mai sarrafawa yana tuƙi fil ɗin don ƙirƙira Kore mai ƙarfi, Ja mai ƙarfi, ko cakuda PWM na Ja da Kore don Amber. Ana aiwatar da ƙyalli na aiki ta hanyar juya GPIO(s) masu dacewa.
• Tsari: Ana bin tsarin faifan PCB da aka ba da shawarar. Ƙaramin taimako na zafi akan faifan haɗin ƙasa yana taimakawa wajen yin gwaiduwa ba tare da ƙirƙirar babban mai sanyaya zafi wanda zai iya shafar sake kwarara ba.
• Sakamako: Alamar yanayi mai ƙarfi, amintacce, da bayyananne ta gani wanda ke sauƙaƙa haɗawa (sashi ɗaya maimakon uku) kuma yana rage rikitaccen Lissafin Kayan (BOM).

12. Gabatarwar Ka'idar Aiki

Diodes Masu Fitadar Haske (LEDs) na'urorin semiconductor ne waɗanda ke fitar da haske ta hanyar electroluminescence. Lokacin da ake amfani da ƙarfin lantarki na gaba a kan mahaɗin p-n, electrons daga kayan n-type suna haɗuwa da ramuka daga kayan p-type a yankin aiki. Wannan haɗuwa yana sakin makamashi a cikin nau'in photons (haske). Takamaiman tsayin raƙuman ruwa (launi) na hasken da aka fitar an ƙaddara shi ta hanyar bandgap na makamashi na kayan semiconductor da aka yi amfani da su:

• LED Ja: Yawanci yana amfani da kayan Aluminum Indium Gallium Phosphide (AlInGaP), wanda ke da ƙaramin bandgap wanda yake dace da tsayin raƙuman ruwa (ja/lemu).
• LEDs Kore da Shudi: Yawanci ana amfani da kayan Indium Gallium Nitride (InGaN). Ta hanyar bambanta rabon indium/gallium, za a iya daidaita bandgap don fitar da haske kore ko shuɗi (shuɗi yana buƙatar bandgap mafi faɗi).

Ruwan tabarau da aka yada akan guntu yana watsa hasken, yana haifar da kusurwar kallo mafi faɗi, mafi daidaito idan aka kwatanta da ruwan tabarau mai tsabta wanda ke samar da katako mai mai da hankali.

13. Trends na Fasaha

Fagen SMD LEDs yana ci gaba da haɓakawa tare da wasu trends masu iya gani:

• Ƙara Ingantacciyar Aiki: Ci gaban kimiyyar kayan aiki da haɓakar epitaxial suna haifar da ingantaccen haske mafi girma (ƙarin fitowar haske a kowace watt na lantarki), yana ba da damar nuna alamomi masu haske ko ƙarancin amfani da wutar lantarki.
• Ƙananan Girma: Packages continue to shrink (e.g., from 0603 to 0402 metric sizes) to fit ever-smaller consumer electronics, while maintaining or improving optical performance.
• Enhanced Color Rendering and Consistency: Tighter binning tolerances and improved manufacturing processes provide better color uniformity across production batches, which is critical for display and lighting applications.
• Integrated Solutions: Beyond multi-color, there is a trend towards LEDs with integrated drivers (IC-in-package) or built-in current regulation, simplifying circuit design further.
• Reliability Focus: Improved packaging materials and designs enhance resistance to thermal cycling, humidity, and other environmental stresses, extending operational lifetime in demanding applications.