SMD LED 48-213/T2D-AQ2R2QY/3C Datasheet - 2.25x1.85x1.45mm - 3.2V - 95mW - Pure White - English Technical Document

1. Product Overview

The 48-213/T2D-AQ2R2QY/3C is a surface-mount device (SMD) LED in a compact 1206 package format. This mono-color, pure white LED is designed for modern electronic applications requiring high-density component placement and reliable performance. Its primary advantages include a significantly reduced footprint compared to leaded LEDs, enabling smaller printed circuit board (PCB) designs and higher packing density. The component is lightweight, making it suitable for miniature and portable applications. It is compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), ensuring environmental and safety compliance for global markets.

1.1 Core Features and Applications

The LED is supplied on 8mm tape mounted on a 7-inch diameter reel, making it fully compatible with high-speed automatic pick-and-place assembly equipment. It is designed to withstand standard infrared (IR) and vapor phase reflow soldering processes, which are common in volume manufacturing.

Typical Applications:

• Telecommunication Equipment: Status indicators and backlighting for keys or displays in telephones and fax machines.
• Consumer Electronics: Flat backlighting for liquid crystal displays (LCDs), backlighting for switches and symbols on control panels.
• General Purpose Indication: Any application requiring a compact, reliable, and bright white indicator light.

2. Technical Specifications and In-Depth Interpretation

This section provides a detailed analysis of the absolute maximum ratings and electro-optical characteristics defined in the datasheet. Understanding these parameters is critical for reliable circuit design and ensuring the LED's longevity.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause immediate junction breakdown.
• Continuous Forward Current (I_F): 25mA. The DC current that can be continuously passed through the LED.
• Peak Forward Current (I_FP): 100mA. This is the maximum pulsed current, permissible only under specific conditions (duty cycle of 1/10 at 1kHz). It is useful for brief, high-brightness pulses but must not be used for continuous operation.
• Power Dissipation (P_d): 95mW. This is the maximum amount of power the package can dissipate as heat, calculated as V_F * I_F. Exceeding this limit risks overheating and accelerated degradation.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage). These wide ranges make the LED suitable for industrial and automotive environments.
• Electrostatic Discharge (ESD): 150V (Human Body Model). This is a relatively low ESD tolerance, indicating the device is sensitive to static electricity. Proper ESD handling procedures are mandatory.
• Soldering Temperature: The LED can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters under standard test conditions. Designers should use the typical (Typ.) or maximum/minimum values as the basis for their designs.

• Luminous Intensity (I_v): 90 to 180 millicandela (mcd) at a forward current (I_F) of 5mA. The wide range is managed through a binning system (detailed in Section 3). The viewing angle (2θ_1/2) is typically 130 degrees, providing a wide, diffuse light pattern.
• Forward Voltage (V_F): 2.7V to 3.2V at I_F=5mA. This parameter has a tolerance of ±0.05V. The forward voltage is crucial for calculating the current-limiting resistor value: R = (V_supply - V_F) / I_F.
• Reverse Current (I_R): Maximum 50µA at V_R=5V. The datasheet explicitly notes that the reverse voltage condition is for test purposes only, and the LED should not be operated in reverse bias in an actual circuit.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into "bins" based on key performance parameters. This allows designers to select parts that meet specific brightness and voltage requirements for their application.

3.1 Luminous Intensity Binning

The luminous intensity is sorted into three primary bins at I_F=5mA:

• Bin Q2: 90 mcd (Min) to 112 mcd (Max)
• Bin R1: 112 mcd (Min) to 140 mcd (Max)
• Bin R2: 140 mcd (Min) to 180 mcd (Max)

The product code "AQ2R2QY" indicates this specific part is from intensity bin Q2 and R2. A tolerance of ±11% applies within each bin.

3.2 Forward Voltage Binning

The forward voltage is grouped and binned to help with power supply design and current regulation. The bins (Group Q) are defined in 0.1V steps:

• Bin 29: 2.7V to 2.8V
• Bin 30: 2.8V to 2.9V
• Bin 31: 2.9V to 3.0V
• Bin 32: 3.0V to 3.1V
• Bin 33: 3.1V to 3.2V

The tolerance for forward voltage within a bin is ±0.05V.

3.3 Chromaticity Coordinate Binning

For white LEDs, color consistency is critical. The chromaticity coordinates (CIE x, y) define the precise color point on the CIE 1931 diagram. The datasheet defines six bins (A1 through A6), each representing a small quadrilateral area on the color chart. The product's color is guaranteed to fall within the specified polygon with a tolerance of ±0.01 in both x and y coordinates. This tight control ensures minimal visible color variation between different LEDs in an array or backlight.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the LED's behavior under varying conditions. These are essential for advanced design considerations.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the non-linear relationship between current and voltage. The forward voltage increases logarithmically with current. For stable operation, a constant current driver or a current-limiting resistor is mandatory, as a small increase in voltage beyond the nominal V_F can cause a large, potentially destructive increase in current.

4.2 Luminous Intensity vs. Forward Current

The light output is approximately proportional to the forward current. However, efficiency (lumens per watt) may drop at very high currents due to increased heat generation within the chip. Operating near the maximum continuous current (25mA) may reduce long-term reliability.

4.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as the junction temperature rises. This curve quantifies that derating. For applications operating in high ambient temperatures, the drive current may need to be reduced to maintain brightness or to prevent overheating.

4.4 Forward Current Derating Curve

This is a critical curve for thermal management. It defines the maximum allowable continuous forward current as a function of the ambient temperature. As temperature increases, the maximum safe current decreases to keep the junction temperature within safe limits and prevent thermal runaway.

4.5 Spectral Distribution

The spectrum curve shows the relative power emitted across different wavelengths. A pure white LED typically uses a blue InGaN chip combined with a yellow phosphor. The spectrum will show a peak in the blue region (around 450nm) and a broad emission in the yellow/green region from the phosphor, combining to produce white light.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED conforms to the standard 1206 (inch) or 3216 (metric) package size. Key dimensions (in mm) are:

• Overall Length: 2.25 ±0.20
• Overall Width: 1.85 ±0.20
• Overall Height: 1.45 ±0.10
• Terminal Dimensions: 0.72 ±0.10 (height), 1.20 x 0.60 (footprint)

Tolerances are ±0.1mm unless otherwise specified. A cathode mark is clearly indicated on the package for correct polarity orientation during assembly.

5.2 Recommended Pad Layout

The datasheet includes a suggested land pattern (pad design) for PCB layout. The recommended pad size is 1.40mm x 1.10mm. It is emphasized that this is for reference only, and the pad dimensions should be optimized based on the specific solder paste, stencil, and assembly process used by the manufacturer.

6. Soldering and Assembly Guidelines

Proper handling and soldering are vital for yield and reliability.

6.1 Current Limiting Requirement

Mandatory: An external current-limiting resistor must always be used in series with the LED. The LED is a current-driven device, and its forward voltage has a negative temperature coefficient. Without a resistor, even a small increase in supply voltage or a drop in V_F due to heating can cause an uncontrolled rise in current, leading to immediate failure.

6.2 Storage and Moisture Sensitivity

The components are packaged in a moisture-resistant bag with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
• After Opening: The "floor life" is 1 year at ≤30°C and ≤60% RH. Unused parts should be resealed in a moisture-proof bag.
• Baking: If the desiccant indicator changes color or the storage time is exceeded, the LEDs must be baked at 60 ±5°C for 24 hours before reflow soldering to remove absorbed moisture and prevent "popcorning" damage during reflow.

6.3 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (TAL): 60-150 seconds above 217°C.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Ramp Rates: Maximum 6°C/sec heating, 3°C/sec cooling.

Critical Notes:

• Reflow soldering should not be performed more than two times.
• Avoid mechanical stress on the LED body during heating and cooling.
• Do not warp the PCB after soldering, as this can crack the LED or its solder joints.

6.4 Hand Soldering

If hand soldering is necessary, use a soldering iron with a tip temperature below 350°C. Contact time per terminal should be less than 3 seconds. Use an iron with a power rating of 25W or less. Allow a minimum interval of 2 seconds between soldering each terminal to prevent excessive heat buildup.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The LEDs are supplied in embossed carrier tape on 7-inch reels.

• Carrier Tape Width: 8mm.
• Pocket Pitch: 4mm.
• Quantity per Reel: 3000 pieces.
• Reel Dimensions: Standard 7-inch diameter with specific hub and flange dimensions as per EIA-481.

7.2 Label Explanation

The reel label contains critical information for traceability and verification:

• P/N: Full product number (48-213/T2D-AQ2R2QY/3C).
• CAT: Luminous Intensity Rank (e.g., Q2, R2).
• HUE: Chromaticity Coordinates and Dominant Wavelength Rank.
• REF: Forward Voltage Rank (e.g., from Group Q bins).
• LOT No: Manufacturing lot number for traceability.

8. Application Design Considerations

8.1 Circuit Design

Always calculate the series resistor using the maximum forward voltage from the datasheet (3.2V) to ensure sufficient current limiting under all conditions. For a 5V supply and a target current of 5mA: R = (5V - 3.2V) / 0.005A = 360Ω. The nearest standard value (360Ω or 390Ω) would be chosen. The resistor power rating should be I²R = (0.005)² * 360 = 0.009W, so a standard 1/10W or 1/8W resistor is more than adequate.

8.2 Thermal Management

While the 1206 package has no dedicated thermal pad, heat is conducted away through the two solder terminals. Ensure the PCB has adequate copper area connected to the LED pads, especially if operating near the maximum current or in high ambient temperatures. Avoid placing the LED near other heat-generating components.

8.3 Optical Design

The wide 130-degree viewing angle makes this LED suitable for applications requiring broad, diffuse illumination rather than a focused beam. For indicator applications, consider the required luminous intensity at the viewing angle; brightness falls off towards the edges of the viewing cone.

9. Technical Comparison and Differentiation

The 48-213 LED, in its 1206 package, offers a balance between size, brightness, and ease of assembly.

• vs. Larger Packages (e.g., 3528, 5050): The 1206 is significantly smaller, saving board space but typically offering lower total light output due to its smaller chip size.
• vs. Smaller Packages (e.g., 0402, 0603): The 1206 is easier to handle and solder manually if needed, and often can handle slightly higher currents, resulting in higher brightness.
• vs. Non-binned LEDs: The defined binning structure for intensity, voltage, and color provides predictable performance, which is essential for applications requiring uniform appearance in multi-LED arrays or consistent brightness across production batches.

10. Frequently Asked Questions (FAQs)

10.1 Can I drive this LED without a current-limiting resistor?

No. This is explicitly warned against in the datasheet. The LED must be driven by a constant current source or, more commonly, a voltage source in series with a current-limiting resistor. Direct connection to a voltage source will result in failure.

10.2 Why is the luminous intensity range so wide (90-180 mcd)?

This is the full possible range across production. Individual units are sorted into tighter bins (Q2, R1, R2). When ordering, you specify the bin code (e.g., AQ2R2QY) to get LEDs from specific intensity and color bins, ensuring consistency in your product.

10.3 How many times can I reflow solder this LED?

The datasheet states reflow soldering should not be done more than two times. A third reflow cycle risks damaging the internal wire bonds or the LED chip due to cumulative thermal stress.

10.4 What does "Pb-free" mean in the context of soldering?

It means the LED's external terminals are finished with a lead-free plating (typically tin). The specified reflow profile (peak 260°C) is designed for lead-free solder pastes (e.g., SAC305), which have a higher melting point than traditional tin-lead solder.

11. Practical Design and Usage Examples

11.1 Example 1: Simple Status Indicator

Scenario: A power-on indicator for a 3.3V logic board.
Design: Use a 5mA drive current for good visibility with low power consumption. R = (3.3V - 3.2V) / 0.005A = 20Ω. Since 3.2V is the max V_F, the actual current may be slightly higher if the LED's V_F is lower. A 33Ω or 47Ω resistor would provide a more conservative and stable current. Connect the LED with the cathode (marked side) to ground.

11.2 Example 2: Backlight Array for a Small LCD

Scenario: Uniform backlighting requiring 10 LEDs.
Design: To ensure uniform brightness, all LEDs should be from the same luminous intensity bin (e.g., R2). They should be connected in parallel, each with its own dedicated current-limiting resistor. Connecting multiple LEDs in parallel to a single resistor is not recommended due to variations in V_F, which can cause uneven current sharing and brightness.

12. Operating Principle

This is a semiconductor photonic device. It is based on an Indium Gallium Nitride (InGaN) chip. When a forward voltage exceeding the diode's junction potential (V_F) is applied, electrons and holes recombine within the active region of the semiconductor, releasing energy in the form of photons (light). In a "pure white" LED, the primary chip emits blue light. This blue light excites a layer of yellow phosphor coating the chip. The combination of the blue light from the chip and the yellow light from the phosphor is perceived by the human eye as white light. This method is known as phosphor-converted white light generation.

13. Technology Trends

SMD LEDs in packages like the 1206 represent a mature and widely adopted technology. The general industry trend is towards:

• Increased Efficiency: Higher luminous efficacy (more lumens per watt) through improvements in chip design and phosphor technology.
• Miniaturization: Continued reduction in package size (e.g., 0402, 0201) for ultra-compact devices, though this often trades off maximum power handling.
• Improved Color Quality: Development of phosphors to achieve higher Color Rendering Index (CRI) values and more consistent color points across production batches.
• Integrated Solutions: Growth of LEDs with built-in current regulation (constant current LED drivers) or protection features (ESD, reverse polarity) within the package, simplifying circuit design.

The 48-213 LED, with its well-defined specifications, reliable performance, and standard package, remains a fundamental and versatile component in the optoelectronics landscape, suitable for a vast array of indicator and backlighting applications.