SMD LED LTST-008UWQEET Datasheet - White and Red Light - 30mA Forward Current - 102mW Power Consumption - Simplified Chinese Technical Documentation

1. Product Overview

This document details the specifications of a Surface-Mount Device (SMD) LED component. This LED is specifically designed for automated Printed Circuit Board (PCB) assembly and is suitable for critical applications with space constraints. The component integrates two independent light sources within a single package.

1.1 Product Features

• Compliant with RoHS environmental standards.
• Packaged in 12mm tape and reel, wound on a 7-inch diameter reel for automated handling.
• Standard EIA package size ensures compatibility.
• Input levels are compatible with integrated circuit (IC) logic levels.
• Design is compatible with automated surface-mount assembly equipment.
• Can withstand standard infrared (IR) reflow soldering processes.
• Preconditioned according to JEDEC Moisture Sensitivity Level 3.

1.2 Application Fields

This LED is suitable for a wide range of electronic devices and systems, including but not limited to:

• Kayan sadarwa (misali, wayoyin mara igiya da wayoyin hannu).
• Kayan sarrafa aikin ofis da kwamfutocin hannu.
• Home appliances and consumer electronics.
• Network systems and industrial control equipment.
• Indoor signage and display applications.

2. Technical Parameters: An In-depth Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limiting conditions that may cause permanent damage to the device. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd):102 mW (white light), 72 mW (red light). This is the maximum thermal power the LED can dissipate at an ambient temperature (Ta) of 25°C.
• Peak Forward Current (I_F(PEAK)):100 mA (white light), 80 mA (red light). This is the maximum instantaneous current allowed under pulse conditions (1/10 duty cycle, 0.1ms pulse width).
• Direct forward current (I_FF):
• Both colors are 30 mA. This is the maximum continuous forward current recommended for reliable operation.Operating temperature range:
• -40°C to +85°C. The device is designed to operate within this ambient temperature range.Storage temperature range:

-40°C to +100°C. The device can be stored within this range without power applied.

2.2 Electrical and Optical Characteristics_FThese parameters are measured under the conditions of Ta=25°C and I

• F_v=20mA, representing typical operating conditions.Luminous Flux (Φ
• v_v):White light: 4.15-11.4 lm (min-max). Red light: 1.07-2.71 lm (min-max). This is the total visible light output emitted by the LED.
• Luminous Intensity (I_v):White light: 1500-4100 mcd (min-max). Red light: 355-900 mcd (min-max). This is the light output in a specific direction, measured in millicandelas.
• Viewing Angle (2θ_d1/2):
• The typical value is 120 degrees. This is the full angle at which the luminous intensity drops to half of its axial peak value.Dominant Wavelength (λ
• D_F):For red LEDs: 617-630 nm (typical range). For white LEDs, chromaticity coordinates are provided.
• Chromaticity Coordinates (x, y):_RFor white LEDs: x=0.31, y=0.31 (typical values). This places the white point near the Planckian locus.Forward Voltage (V_RF

):

White: 2.8-3.4V (Min-Max). Red: 1.8-2.4V (Min-Max). Tolerance is +/- 0.1V. This is the voltage drop across the LED when operating at the specified current.

Reverse current (I_vR

):

At V

• R=5V, the maximum value for both colors is 10 μA. This device is not designed for reverse bias operation; this parameter is for test purposes only.
• 3. Bin System DescriptionLEDs are classified into different bins based on performance to ensure consistency. The bin code is marked on the product packaging.
• 3.1 Luminous Intensity (Iv

) Binning

• LEDs are grouped based on their light output measured at 20mA.White LED Binning:
• W1:Luminous flux: 4.15-5.80 lm, intensity: 1500-2100 mcd.

W2:

Luminous flux: 5.80-8.10 lm, intensity: 2100-2900 mcd.

W3:

• Luminous flux: 8.10-11.40 lm, intensity: 2900-4100 mcd.
• Red LED Binning:
• R1:

Luminous Flux: 1.07-1.68 lm, Intensity: 355-600 mcd.

R2:

Luminous flux: 1.68-2.71 lm, intensity: 600-900 mcd.

The tolerance for each luminous flux bin is +/- 11%.

• 3.2 White LED Color (Chromaticity) Binning_FWhite LEDs are further classified based on their chromaticity coordinates (x, y) on the CIE 1931 chromaticity diagram to control color variation._FThe binning codes include Z1, Y1, Y2, X1, W1, W2.Kowane matsayi yana da ma'anar yanki mai siffar huɗu a kan taswirar launi, wanda ke da takamaiman maki huɗu na (x,y) masu daidaito.
• Kowane matsayin launi yana da ƙimar sallamar +/- 0.01 akan daidaitattun x da y._v3.3 Combined Binning Code on Label_FLambar harafi-da-lamba guda ɗaya (A1 zuwa A6) akan lakabin marufi tana haɗa matakan ƙarfin LED na farin haske da ja a cikin kullun ɗaya, kamar yadda aka nuna a teburin tsallake-tsallake.4. Performance Curve Analysis
• Takaddar ƙayyadaddun bayanai ta ƙunshi madaidaitan madaidaitan sifofi da aka auna a yanayin zafin yanayi na 25°C (sai dai idan an faɗi daban). Waɗannan lanƙwasai suna da mahimmanci ga nazarin ƙira.Forward Current vs. Forward Voltage (I
• F-V_PF
• Curve):It demonstrates the exponential relationship between current and voltage for white and red LEDs. This is crucial for designing current-limiting drive circuits.

Luminous Intensity vs. Forward Current (I

v

-I

F

Curve):

• It illustrates how the light output increases with the driving current, typically growing in a sublinear manner at higher currents due to efficiency droop and heating.
• Relative Luminous Intensity vs. Ambient Temperature:
• It demonstrates the thermal dependence of light output. Luminous intensity typically decreases as junction temperature increases.

Spectral Distribution:

For red LEDs, this curve shows the variation of relative radiant power with wavelength, indicating the peak emission wavelength (λ

D

) and spectral half-width (Δλ).

Viewing angle distribution diagram:

A polar plot showing the angular distribution of luminous intensity, confirming a viewing angle of 120 degrees.

• 5. Mechanical and Packaging Information5.1 Package Dimensions
• This LED uses a standard surface-mount package. All dimensions are in millimeters, with a general tolerance of ±0.2 mm unless otherwise specified. The drawing shows the top view, side view, and pad layout.5.2 Pin Assignment and Polarity Identification
• This component has multiple pins. The assignment is as follows:Pins (0,1) and 2: Connected to the blue/white LED chip (InGaN).
• Pins 3 and 4: Connected to the red LED chip (AlInGaP).Pins 5 and (6,7): Not connected (NC).

The lens color is yellow. Correct polarity must be observed when connecting the drive circuit; applying reverse voltage may damage the device.

5.3 Recommended PCB Pad Layout

It provides recommended pad patterns (copper pad layout) to ensure reliable soldering, proper thermal management, and mechanical stability. Following this recommendation helps prevent tombstoning and ensures good solder joint formation.

• 6. Welding and Assembly Guide
• 6.1 Infrared Reflow Soldering Temperature Profile
• A detailed lead-free (Pb-free) reflow soldering temperature profile is specified for lead-free soldering processes, complying with the J-STD-020B standard. The graph shows:
• Preheating/Warming Zone:

Control the temperature rise to activate the flux.

• Soaking Zone:A plateau stage to uniformly heat the circuit board and components.
• Reflow Zone:The peak temperature must not exceed the component's maximum allowable value (related to storage temperature).
• Cooling rate:Control the cooling to allow the solder joints to solidify properly.

Following this temperature profile is crucial to prevent thermal shock and ensure reliable solder connections without damaging the LED package or internal chip.

6.2 Cleaning

If cleaning is required after welding:

• Use only ethanol or isopropanol.Soak the LED at room temperature.
• Limit the soaking time to less than one minute.Avoid using unspecified chemical cleaners as they may damage the packaging material (e.g., causing discoloration or cracking).
• 6.3 Storage and Handling ConditionsSealed packaging:
• Store at ≤30°C and ≤70% relative humidity (RH). When stored in the original moisture barrier bag with desiccant, the shelf life is one year.Opened packaging:
• The storage environment shall not exceed 30°C and 60% RH. Components removed from the original packaging should be infrared reflow soldered within 168 hours (7 days).
• Long-term storage (out of bag):
• For storage exceeding 168 hours, LEDs should be stored in a sealed container with desiccant or in a nitrogen-purged desiccator to prevent moisture absorption, which can lead to the "popcorn" effect during reflow soldering.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

LEDs are supplied in embossed carrier tape for automated assembly.

Carrier tape width:_s12 mm._sReel diameter:_{7 inches.}Quantity per reel:_F4000 pieces._FMinimum packaging quantity:_FRemaining quantity starts from 500 pieces.

Empty positions in the carrier tape are sealed with cover tape.

A maximum of two consecutive missing components is allowed.

• The packaging conforms to the ANSI/EIA-481 specification.
• The datasheet provides detailed dimensions for the tape pockets and the reel.
• 8. Application Suggestions and Design Considerations_JA8.1 Typical Application Circuit

LED is a current-driven device. The simplest driving method is to connect a current-limiting resistor in series. The resistor value (R

• S
• ) can be calculated using Ohm's Law: R
• S

= (V

Power supply

• - VF
• ) / IF
• . Use the maximum V from the datasheet.F
• value to ensure that the current does not exceed the limit even with component variations. For more stable performance, especially under varying supply voltage or temperature conditions, it is recommended to use a constant current driver (linear or switching).8.2 Thermal Management

Although the power consumption is relatively low, proper thermal design can extend LED lifespan and maintain stable light output.

Use the recommended PCB pad layout to aid in heat dissipation.

In high-current or high-ambient-temperature applications, consider using thermal vias under the pad to transfer heat to internal or bottom copper layers.

By considering the thermal resistance from junction to ambient (θ

JA

), ensure that the maximum junction temperature is not exceeded.

8.3 Optical Design Considerations

A 120-degree viewing angle provides a wide, diffuse light pattern, suitable for backlighting and status indicators.

For a more focused beam, secondary optics (lenses) can be placed above the LED.

The yellow lens acts as a color filter/diffuser for white light, which may affect the exact Correlated Color Temperature (CCT).

9. Technical Comparison and Differentiation

The primary differentiation of this component lies in its integration of a dual-color (white and red) configuration within a single SMD package. Compared to using two separate LEDs, this saves PCB space and simplifies assembly. Key points include:

Space efficiency:

1. Integrating two functions within one package size.Ease of Assembly:
2. One placement cycle replaces two.Performance:
   • Provides independent, individually addressable white and red light sources, each with specified performance binning.
   • Compatibility:
3. Standard EIA package dimensions and infrared reflow compatibility make it a plug-and-play solution for modern SMT production lines.10. Frequently Asked Questions (Based on Technical Parameters)
4. 10.1 Can I drive this LED directly with a 5V power supply?No. Connecting a 5V power supply directly across the LED will cause excessive current and likely damage it. You must use a current-limiting mechanism, such as a series resistor or constant current driver, set to a maximum of 30mA DC.
5. 10.2 What is the difference between luminous flux (lm) and luminous intensity (mcd)?Luminous flux (lumens) measures the total amount of visible light emitted by the LED in all directions. Luminous intensity (candelas) measures the brightness of the LED as seen from a specific viewing direction. The mcd value in the datasheet is typically the axial (on-axis) intensity. A wide-viewing-angle LED may have a higher lumen number but a lower mcd value compared to a narrow-beam LED with the same lumen output.

10.3 How to interpret the binning code when ordering?

Please specify the combined bin code (e.g., A3) according to the cross-reference table to ensure the white light (e.g., W2) and red light (e.g., R1) components of the LED you receive fall within the required performance range. This is crucial for applications requiring consistent brightness and color across multiple units.

10.4 Is this LED suitable for outdoor environments?

• Its operating temperature range is as low as -40°C, but up to +85°C. While it can function in some outdoor environments, the datasheet primarily lists indoor applications (signage, displays). For outdoor use, potential UV radiation, moisture ingress, and higher ambient temperatures must be considered, which may require additional protective measures not covered in this document.11. Practical Design and Usage Cases
• Scenario: Dual-state indicator lights for network routersDesigners need to set up power (steady white light) and network activity (blinking red light) indicator lights on a compact router PCB.

Implementation Plan:_FComponent Selection:_FLTST-008UWQEET i zaɓe saboda yana ba da launuka biyu da ake buƙata a cikin kayan aikin 3.2mm x 2.8mm, yana adana sarari.

Zane na kewaye:

An ƙirƙira kewayen tuƙi masu zaman kansu guda biyu:

• Daga hanyar wutar lantarki na 3.3V ta hanyar madaidaicin resistor, ana tuƙa LED na farin haske, kusan 15mA, a matsayin madaidaicin alamar "wutar lantarki a kunne".The GPIO pin of the main processor, also in series with a resistor, drives a red LED. The firmware makes this pin blink to indicate data activity.
• PCB layout:Use the recommended pad layout. Thermal connections have been added to the pads to facilitate soldering while maintaining a thermal path to the ground plane for slight heat dissipation.
• Binning:To ensure consistency among production units, the binning code A3 (White: W2, Red: R1) is specified in the Bill of Materials (BOM), ensuring all routers have indicators with similar brightness.
• Assembly:Components are supplied in 7-inch reels, compatible with the pick-and-place machines of the assembly line. The specified infrared reflow soldering temperature profile has been programmed into the reflow oven.
• This case highlights the practicality of the component in space-constrained, multi-functional indicator applications commonly found in consumer electronics.12. Introduction to Principles

A Light Emitting Diode (LED) is a semiconductor device that emits light when an electric current passes through it. This phenomenon is called electroluminescence.