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67-21ST SMD Mid-Power LED Datasheet - PLCC-2 Package - 3.3V Max Voltage - 60mA - White Light - Technical Documentation

67-21ST SMD Mid-Power LED Technical Datasheet. Product features include PLCC-2 package, high luminous intensity, wide viewing angle, ANSI binning, and compliance with RoHS, REACH, and halogen-free standards.
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PDF Document Cover - 67-21ST SMD Mid-Power LED Datasheet - PLCC-2 Package - 3.3V Maximum Voltage - 60mA - White Light - Technical Documentation

1. Product Overview

67-21ST is a surface-mount mid-power LED in a PLCC-2 package. It is a white LED designed to provide a balance of performance, efficiency, and reliability for general lighting applications. Its compact form factor and standardized package make it suitable for automated assembly processes.

1.1 Core Advantages

The main advantages of this LED package include:

1.2 Target Market and Applications

This LED is an ideal solution for numerous lighting applications requiring reliable, efficient, and compact light sources. The main application areas include:

2. In-depth Technical Parameter Analysis

This section provides a detailed and objective interpretation of the key performance parameters of the LED, based on the definitions in the datasheet under standard test conditions.

2.1 Photoelectric Characteristics

The main performance indicators are summarized as follows. All values are specified at a forward current of 60mA.F) of 60mA.

2.2 Absolute Maximum Ratings and Electrical Parameters

These ratings define the limits that may cause permanent damage. Operating conditions should always remain within these limits.

2.3 Thermal Characteristics

Thermal management is crucial for the lifespan and performance stability of LEDs.

3. Grading System Description

The product employs a comprehensive binning system to ensure consistency in luminous flux, forward voltage, and chromaticity.

3.1 Luminous Flux Grading

Luminous flux is binned using specific codes. For example:

All grades are measured at If=60mA with a tolerance of ±11%.F=60mA with a ±11% tolerance.

3.2 Bincike na ƙarfin lantarki mai gaba

Forward voltage is grouped under code "2833" and further binned with a 0.1V step:

Tolerance is ±0.1V. Selecting a lower Vf bin can reduce driver losses.Fbin can reduce driver losses.

3.3 Chromaticity and Correlated Color Temperature Grading

LED yana amfani da tsarin rarrabawar launi na ANSI wanda aka ayyana bisa ga zane na launi na CIE 1931. Takardar ƙayyadaddun bayanai tana ba da cikakkun akwatunan ma'auni na kowane CCT da ƙananan rarrabuwa. Wannan yana tabbatar da cewa hasken fari da ake fitarwa yana faɗowa cikin yankin launi da aka ayyana. Kewayon CCT na samarwa yana daga 2400K zuwa 6500K.

3.4 Color Rendering Index Grading

Ana nuna CRI a cikin nau'in samfur tare da lambar harafi ɗaya:

The standard mass-produced model is graded as "K". The tolerance is ±2.

4. Performance Curve Analysis and Design Considerations

Although specific performance curves are not provided in the abstract, key relationships can be inferred from the parameters.

4.1 Relationship Between Current and Luminous Flux/Voltage

All main characteristics are specified at 60mA. Operating at lower currents reduces light output and forward voltage, while increasing the current up to a maximum of 75mA increases both. The relationship is typically linear within this range, but luminous efficacy may decrease at higher currents due to increased thermal load.

4.2 Temperature Dependence

LED performance is sensitive to temperature. As the junction temperature increases:

Kufa kwa joto kwa kiasi kinachofaa ni muhimu kwa kudumisha utendaji na maisha ya kifaa.

4.3 Spectral Distribution

Kama LED ya mwanga mweupe, inatumia chip ya InGaN ya bluu iliyochanganywa na safu ya fosforesensi kutoa mwanga mweupe. CCT inafafanua "joto" au "baridi" ya mwanga mweupe. CRI 80 inaonyesha uokoaji mzuri wa rangi katika anuwai nzima ya wigo unaoonekana, lakini kuna ukomo unaojulikana kuhusu thamani ya R9.

5. Mechanical Structure, Packaging and Assembly Information

5.1 Packaging and Dimensions

The LED uses a standard PLCC-2 surface mount package. Although the provided text does not detail the exact dimensions, this type of package typically has a low profile and is designed for SMT assembly. The top view shows the light-emitting surface.

5.2 Soldering Guidelines

Na'urar tana da hankali ga zubar da wutar lantarki, dole ne a ɗauki matakan rigakafi masu dacewa. Ƙa'idodin walda kamar haka:

Adhering to these specifications is crucial to prevent damage to the plastic encapsulation and internal chip connections.

5.3 Polarity Identification

The PLCC-2 package has two pins. The cathode is typically identified by markings on the package, such as a notch, a green dot, or a cut corner. Correct polarity must be observed during assembly.

6. Ordering Information and Model Decoding

The model number follows a specific structure:67-21ST/KKE-HXXXX33Z6/2T

Example: Translation:67-21ST/KKE-H302633Z6/2T is decoded as: CRI 80, CCT 3000K, minimum luminous flux 26 lumens, maximum Vf 3.3V, If 60mA.F.3V max, IF 60mA.

. Application Suggestions & Design Notes

7. Application Suggestions and Design Considerations

7.1 Drive Circuit Design

For stable operation, please use a constant current driver set to 60mA. The driver must be capable of providing a voltage higher than the maximum forward voltage of the selected bin. Consider inrush current protection.

7.2 Thermal Management DesignjCalculate the expected junction temperature: Tj = Ts + (Rth J-S * Pd), where Ts is the solder point temperature, Pd = Vf * If. Ensure Tj is well below 125°C, ideally below 85°C for optimal lifespan. Use sufficient copper area on the PCB for heat dissipation.s+ (Rth J-S* Pd), where Tsis the soldering point temperature and Pd= VF* IF. Ensure Tjremains well below 125°C, ideally below 85°C for optimal lifetime. Use adequate copper area on the PCB for heat spreading.

7.3 Optical Design

The 120-degree viewing angle is inherently diffuse. For directional lighting, secondary optics are required. Transparent resin allows for good light extraction.

8. Technical Comparison and Market Background

67-21ST belongs to the popular mid-power LED category, competing with other PLCC-2 and similar package types. Its differentiation lies in the specific combination of luminous flux, CRI, and voltage binning, as well as its compliance certifications. Compared to high-power LEDs, it has a lower thermal density and is typically driven in arrays to achieve higher total light output. Compared to low-power LEDs, it offers significantly higher luminous efficacy and luminous flux.

9. Frequently Asked Questions

Q: What is the typical lifespan of this LED?
A: Although not explicitly stated in the summary, LED lifespan largely depends on operating conditions, primarily junction temperature. When operated within specifications and with good thermal management, the expected typical lifespan is 25,000 to 50,000 hours.

Q: Can I drive this LED continuously at 75mA?
A: Yes, 75mA is the absolute maximum continuous rating. However, driving at the maximum current generates more heat, reduces luminous efficacy, and may shorten lifespan. It is recommended to operate at the recommended 60mA for optimal performance and reliability.

Q: How to choose the appropriate CCT and CRI for my application?
A: For ambient lighting, models with 2700K-4000K and CRI 80+ are typically used. For retail or task lighting where color accuracy is critical, consider models with CRI 90+. For decorative lighting, the choice depends on the desired atmosphere.

Q: Is a single series resistor sufficient to drive this LED?
A: For basic, non-critical applications with stable voltage supply, a simple series resistor can be used. However, a constant current driver is strongly recommended for stable light output, higher efficiency, and protection against voltage variations and thermal runaway.

10. Practical Application Cases

Scenario: Designing a linear LED tube.

  1. Requirements:1200流明输出,4000K中性白,CRI >80,输入电压24V DC。
  2. Selection:Select model 67-21ST/KKE-H402833Z6/2T.F~3.1V typ).
  3. Array design:To achieve 1200 lumens, approximately 43 LEDs are required. Arrange them in a series-parallel configuration compatible with a 24V driver. Detailed design requires calculation.
  4. Thermal Design:Total power is about 8W. Ensure the metal core PCB or heat sink can dissipate heat to keep the LED junction temperature cool.
  5. Optical Design:A single LED point is blended into uniform light using a diffuser cover.
This example illustrates the process of scaling up from a single LED datasheet to a functional lighting product.

11. Working Principles

The 67-21ST LED operates based on the principle of semiconductor electroluminescence. When a forward current is applied to its p-n junction, the InGaN chip emits blue light. This blue light excites the yellow phosphor layer coated on or around the chip. The blue light from the chip mixes with the yellow/red light from the phosphor, creating the perception of white light. The precise ratio of blue light to phosphor-converted light determines the correlated color temperature of the emitted white light.

12. Technical Trends and Background

O LED e pei o le 67-21ST e fai ma sui o se vaega matua ma sili ona lelei ua fa'aleleia i tekinolosi LED. O fa'asologa o lo'o i ai nei i lenei matā'upu e taula'i i:

Bidhaa hii iko katika mazingira haya yanayobadilika, ikitoa suluhisho la kuaminika na la kawaida kwa matumizi mengi ya mwanga wa jumla.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W The luminous flux emitted per watt of electrical power, the higher the value, the more energy efficient. Directly determines the energy efficiency rating and electricity cost of the lighting fixture.
Luminous Flux lm (Lumen) Total light output from a light source, commonly known as "brightness". Determines if a luminaire is bright enough.
Viewing Angle ° (degrees), e.g., 120° The angle at which luminous intensity drops to half, determining the width of the light beam. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), such as 2700K/6500K The warmth or coolness of light color; lower values are more yellow/warm, higher values are more white/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
Color tolerance (SDCM) MacAdam ellipse steps, e.g., "5-step" A quantitative metric for color consistency; a smaller step number indicates better consistency. Ensure no color variation among luminaires from the same batch.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) Thamani ya urefu wa wimbi inayolingana na rangi ya LED ya rangi. Huamua ukoo wa rangi kwa LED za rangi moja kama nyekundu, njano, kijani.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to turn on an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage accumulates when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as current determines brightness and lifespan.
Maximum Pulse Current (Pulse Current) Ifp Peak current that can be withstood for a short period, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled to prevent overheating damage.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. The circuit must be protected against reverse connection or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat transfer from the chip to the solder joint; a lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), e.g., 1000V ESD strike resistance, the higher the value, the less susceptible to ESD damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) Time required for brightness to drop to 70% or 80% of its initial value. Directly define the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterization of luminance maintenance capability after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color changes, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Features and Applications
Package Types EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC has good heat resistance and low cost; ceramic has excellent heat dissipation and long lifespan.
Chip Structure Front Side, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Planar, microlens, total internal reflection Optical structure on the package surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Binning Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for products within the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning. 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely small range. Ensure color consistency to avoid color unevenness within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Group by color temperature, each group has a corresponding coordinate range. Meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Significance
LM-80 Lumen Maintenance Test Long-term operation under constant temperature conditions, recording data on luminance attenuation. Used to estimate LED lifespan (combined with TM-21).
TM-21 Life Prediction Standard Estimating lifespan under actual operating conditions based on LM-80 data. Providing scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covering optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure the product does not contain hazardous substances (e.g., lead, mercury). Conditions for entry into the international market.
ENERGY STAR / DLC Energy efficiency certification. Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.