SMD Tsakiyar Ƙarfin LED Mai Rawa 67-21S - PLCC-2 - 150mA - 2.8V - 590-600nm - Takardun Fasaha na Hausa

1. Bayanin Samfur

Wannan takarda ta yi cikakken bayani game da ƙayyadaddun ƙayyadaddun na'urar da ake hawa a saman (SMD) mai tsakiyar ƙarfi mai fitar da haske (LED) a cikin tsarin kayan PLCC-2. Ana siffanta na'urar da fitar da hasken rawaya, wanda aka samu ta hanyar kayan guntu na AlGaInP da aka rufe a cikin resin mai tsabta. An tsara shi don aikace-aikacen haske na gaba ɗaya waɗanda ke buƙatar daidaiton aiki, inganci, da tsari mai ƙarami.

Babban fa'idodin wannan LED sun haɗa da ingantaccen haske, matsakaicin amfani da wutar lantarki wanda ya dace da aikace-aikacen tsakiyar ƙarfi, da faɗin kusurwar kallo na digiri 120, yana tabbatar da rarraba haske daidai. Samfurin ya bi ka'idojin muhalli da aminci na zamani, ba shi da gubar (Pb-free), ya bi ka'idar ƙuntata abubuwa masu haɗari (RoHS), ƙa'idodin EU REACH, da buƙatun marasa halogen (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm). Ƙirar sa mai ƙarami ya sa ya zama kayan da ya dace don maganin haske masu ƙarancin sarari.

1.1 Aikace-aikacen Da Ake Nufi

Babban fagagen aikace-aikacen wannan LED sun bambanta, suna amfani da halayen sa na launi da aiki. Manyan kasuwanni sun haɗa da Hasken Kayan Ado da Nishaɗi, inda ake son fitar da rawaya mai daidaito don tasirin kyan gani. Hakanan ya dace don aikace-aikacen Hasken Noma, mai yuwuwa don takamaiman matakan girma ko ƙarin haske. A ƙarshe, daidaitaccen bayanin aikin sa ya sa ya dace don Hasken Amfani Gabaɗaya a cikin samfuran mabukaci da na kasuwanci daban-daban.

2. Bincike na Ma'auni na Fasaha

2.1 Iyakar Ƙididdiga Mafi Girma

Ana ayyana iyakokin aikin na'urar a ƙarƙashin yanayin da zafin wurin soldering (T_Soldering) ya kasance 25°C. Wucewa waɗannan ƙididdiga na iya haifar da lalacewa ta dindindin.

• Ƙarfin Gaba (I_F):150 mA (Ci gaba).
• Kololuwar Ƙarfin Gaba (I_FP):300 mA, wanda aka halatta a ƙarƙashin yanayin bugun jini tare da aikin aiki na 1/10 da faɗin bugun jini na 10ms.
• Rushewar Wutar Lantarki (P_d):420 mW.
• Zubar da Lantarki Mai Tsauri (ESD) Tsarin Jikin Mutum (HBM):2000 V. Abun yana da hankali ga lantarki mai tsauri, kuma dole ne a bi matakan kula da ESD da suka dace. Wannan ƙididdiga don tunani ne.
• Zafin Aiki (T_opr):-40°C zuwa +85°C.
• Zafin Ajiya (T_stg):-40°C zuwa +100°C.
• Juriya na Zafi, Junction zuwa Wurin Soldering (R_{th J-S}):50 °C/W. Wannan ma'auni yana da mahimmanci don ƙirar sarrafa zafi.
• Matsakaicin Zafin Junction (T_j):115 °C.
• Zafin Soldering:Na'urar na iya jure soldering na sake kunnawa a 260°C na dakika 10 ko soldering na hannu a 350°C na dakika 3.

2.2 Halayen Lantarki da Hasken Lantarki

Ana auna aikin na yau da kullun a T_Soldering= 25°C da I_F= 150 mA.

• Ƙarfin Hasken Hasken (Φ):Ya bambanta daga mafi ƙarancin 11 lm zuwa matsakaicin 27 lm, tare da matsakaicin jurewar ±11%.
• Ƙarfin Gaba (V_F):Ya bambanta daga 1.8 V zuwa 2.8 V a ƙayyadadden ƙarfin, tare da matsakaicin jurewar ±0.1V.
• Kusurwar Dubawa (2θ_1/2):digiri 120, na yau da kullun.
• Ƙarfin Baya (I_R):Matsakaicin 50 µA lokacin da aka yi amfani da ƙarfin baya (V_R) na 5V.

3. Bayanin Tsarin Binning

Don tabbatar da daidaito a cikin samarwa, ana rarraba LED zuwa kwandon shara dangane da manyan ma'auni na aiki. Wannan yana ba masu ƙira damar zaɓar abubuwan da suka dace da takamaiman buƙatun aikace-aikace don haske da halayen lantarki.

3.1 Binning na Ƙarfin Hasken Hasken

Ana rarraba LED ta hanyar fitar da hasken da aka auna a I_F=150mA. Lambobin kwandon shara (misali, L2, L3, M3, N3) suna ayyana mafi ƙarancin da matsakaicin kewayon ƙarfin haske. Misali, kwandon shara L2 ya ƙunshi 11-12 lm, yayin da kwandon shara N3 ya ƙunshi 24-27 lm. Jurewar a cikin kowane kwandon shara shine ±11%.

3.2 Binning na Ƙarfin Gaba

Hakanan ana rarraba na'urori bisa ga faɗuwar ƙarfin gaba a I_F=150mA. Lambobin kwandon shara daga 25 zuwa 34 suna wakiltar kewayon ƙarfin lantarki a matakan 0.1V, farawa daga 1.8-1.9V (Kwandon shara 25) har zuwa 2.7-2.8V (Kwandon shara 34). Jurewar shine ±0.1V.

3.3 Binning na Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon Tsawon 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Wannan yana ayyana launin da ake gani na hasken rawaya. An ƙayyade kwandon shara biyu: Y53 (590-595 nm) da Y54 (595-600 nm). Matsakaicin auna don tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin tsayin

. Performance Curve Analysis

The datasheet provides several graphs illustrating the device's behavior under varying conditions.

.1 Spectral Distribution

A graph shows the relative luminous intensity across wavelengths from approximately 520 nm to 680 nm. The curve peaks in the yellow region (around 590-600 nm), confirming the dominant wavelength bins, with minimal emission in other parts of the visible spectrum.

.2 Thermal and Electrical Characteristics

• Forward Voltage vs. Junction Temperature (Fig.1):Shows how V_Fdecreases linearly with increasing junction temperature (T_j), a common characteristic of LEDs. This is important for constant-current drive design.
• Relative Radiometric Power vs. Forward Current (Fig.2):Illustrates the sub-linear relationship between light output and drive current. Efficiency typically decreases at very high currents.
• Relative Luminous Flux vs. Junction Temperature (Fig.3):Demonstrates the reduction in light output as T_jincreases, highlighting the importance of thermal management to maintain brightness.
• Forward Current vs. Forward Voltage (Fig.4):The standard I-V curve for a diode, showing the exponential relationship.
• Max. Driving Forward Current vs. Soldering Temperature (Fig.5):A derating curve indicating that the maximum allowable continuous forward current must be reduced as the ambient/soldering point temperature increases to prevent exceeding T_j(max).
• Radiation Diagram (Fig.6):A polar plot depicting the spatial distribution of light intensity, confirming the wide 120-degree viewing angle with a near-Lambertian pattern.

. Mechanical and Package Information

.1 Package Dimensions

The LED is housed in a standard PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. The dimensional drawing specifies the length, width, height, lead spacing, and other critical mechanical features. Unless otherwise noted, the dimensional tolerance is ±0.15 mm. The package is designed for compatibility with automated pick-and-place and reflow soldering processes.

. Soldering and Assembly Guidelines

.1 Soldering Parameters

The device is rated for standard soldering processes: Reflow soldering at a peak temperature of 260°C for a duration of 10 seconds, or hand soldering at 350°C for 3 seconds. Adherence to these profiles is necessary to prevent package damage or degradation of internal materials.

.2 Storage and Handling Precautions

• ESD Sensitivity:The product is sensitive to electrostatic discharge. Proper ESD-safe handling procedures must be followed during all stages of assembly and testing.
• Moisture Sensitivity:The components are packaged in moisture-resistant materials (aluminum moisture-proof bags with desiccant). The bag should not be opened until the products are ready for use in a production environment. If exposed, baking may be required per industry standards (though specific conditions are not detailed here).
• Current Protection:An external current-limiting resistor or constant-current driver is mandatory. LEDs exhibit a sharp rise in current with a small increase in voltage beyond their forward voltage, which can lead to thermal runaway and failure if not properly controlled.

. Packaging and Ordering Information

.1 Reel and Tape Specifications

The LEDs are supplied on embossed carrier tape wound onto reels for automated assembly. Key specifications include reel dimensions, tape width, pocket spacing, and the progressive direction. A standard reel contains 4000 pieces. Detailed drawings for the reel, carrier tape, and cover tape dimensions are provided, with tolerances typically ±0.1 mm.

.2 Label Explanation

The packaging label includes several codes: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank, corresponding to flux bin), HUE (Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No (Lot Number for traceability).

. Application Suggestions and Design Considerations

.1 Design Considerations

• Thermal Management:With a thermal resistance (R_{th J-S}) of 50 °C/W, effective heat sinking from the soldering pads is crucial, especially when operating at or near the maximum current of 150 mA. The derating curve (Fig.5) must be consulted for high ambient temperature applications.
• Drive Circuitry:Always use a constant-current source or a voltage source with a series resistor to set the current. The forward voltage has both a range (1.8-2.8V) and a negative temperature coefficient, making voltage-driven designs unstable.
• Optical Design:The wide 120-degree viewing angle is beneficial for applications requiring broad illumination without secondary optics. For focused beams, appropriate primary optics (lenses) must be selected.

.2 Binning for Application Consistency

For applications where color or brightness uniformity is critical (e.g., multi-LED arrays in decorative lighting), specifying tight bins for luminous flux (Φ), forward voltage (V_F), and dominant wavelength is essential. Using LEDs from the same manufacturing lot can further enhance consistency.

. Reliability and Quality Assurance

A comprehensive set of reliability tests is performed to ensure product longevity and robustness under various environmental stresses. The tests are conducted with a confidence level of 90% and a Lot Tolerance Percent Defective (LTPD) of 10%. Sample size for each test is 22 pieces, with an Accept/Reject criterion of 0/1.

.1 Reliability Test Items

The test regimen includes: Reflow Soldering Resistance, Thermal Shock, Temperature Cycling, High Temperature/Humidity Storage, High Temperature/Humidity Operation, Low Temperature Storage, High Temperature Storage, and multiple High/Low Temperature Operation Life tests under different current and temperature conditions (e.g., 150mA at 25°C, 55°C, and 90mA at 85°C). These tests simulate real-world operating conditions and accelerated aging.

. Technical Comparison and Positioning

As a middle power LED in a PLCC-2 package, this device occupies a specific niche. Compared to low-power LEDs (e.g., 0603, 0805 packages), it offers significantly higher light output, making it suitable for primary illumination rather than just indicators. Compared to high-power LEDs (e.g., 1W, 3W packages on metal-core PCBs), it operates at lower currents and has a simpler thermal management requirement, often dissipating heat through the PCB traces alone. Its key differentiators are the combination of good efficacy, a compact and standardized package, wide viewing angle, and compliance with stringent environmental regulations.

. Frequently Asked Questions (Based on Technical Parameters)

.1 What is the typical operating current?

The electro-optical characteristics are specified at 150 mA, which is also the maximum continuous forward current. This is the standard test and recommended operating point for achieving the rated luminous flux.

.2 Why is a constant current driver necessary?

The forward voltage (V_F) has a production spread (1.8-2.8V) and decreases with temperature. Driving with a fixed voltage would cause large variations in current and thus light output, potentially exceeding the absolute maximum rating and causing failure. A constant current source ensures stable brightness and protects the LED.

.3 How do I interpret the bin codes in an order?

The full part number includes codes for luminous flux (e.g., L8), forward voltage (e.g., 28), and dominant wavelength (e.g., Y54). This specifies a device with flux between 17-18 lm, V_Fbetween 2.1-2.2V, and a wavelength between 595-600 nm. Designers should select bins that match their circuit design (for voltage) and application requirements (for brightness and color).

.4 What are the storage conditions before use?

The components are moisture-sensitive. They must be stored in their original, unopened moisture-proof bags. Once opened, they should be used within a specified time frame or baked according to relevant industry standards (e.g., IPC/JEDEC standards) to remove absorbed moisture before reflow soldering, to prevent \"popcorning\" or delamination.

. Practical Design and Usage Case

Scenario: Designing a decorative yellow LED string light.A designer needs 50 LEDs per string. To ensure uniform appearance, they specify a tight luminous flux bin (e.g., L7: 16-17 lm) and a single dominant wavelength bin (Y54). They design a driver circuit providing a constant 150 mA. Considering the 50 °C/W thermal resistance, they ensure the PCB has sufficient copper area under the LED pads to act as a heat spreader, especially if the lights will be used in enclosed fixtures. They calculate the total voltage drop for the series string based on the maximum V_Fbin (e.g., Bin 34: 2.8V) to size the power supply appropriately. The wide 120-degree viewing angle is perfect for creating a diffuse, glowing effect without hotspots.

. Operational Principle

Light is generated through electroluminescence. When a forward voltage exceeding the diode's built-in potential is applied, electrons and holes are injected into the active region of the semiconductor chip (composed of AlGaInP). These charge carriers recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, yellow (590-600 nm). The water-clear resin encapsulation protects the chip, provides mechanical stability, and shapes the light output pattern.

. Industry Trends and Context

Mid-power LEDs in packages like PLCC-2 have become the workhorse for general lighting applications due to their excellent balance of cost, efficacy (lumens per watt), and reliability. The trend in this segment is towards ever-higher efficacy, allowing for lower energy consumption or higher light output from the same form factor. There is also a continuous drive for improved color consistency (tighter binning) and higher maximum operating temperature ratings. Furthermore, compliance with evolving environmental regulations (RoHS, REACH, halogen-free) is now a standard requirement, not a differentiator. The technology is mature, with focus on manufacturing optimization and integration into smarter, connected lighting systems.