1. Product Overview
LTST-G353CEGB7W shine ne wani na'ura mai haɗawa da saman (SMD) LED wanda aka tsara don haɗin kai na'urar buga kewaye (PCB) da aikace-aikacen da sarari ya zama ƙayyadaddun ƙuntatawa. Wannan ɓangaren ya haɗa jajayen, kore, da shuɗi (RGB) guntuwar semiconductor tare da keɓaɓɓen da'irar sarrafawa a cikin fakit ɗaya, yana samar da cikakken pixel mai iya magana da kansa. An ƙera shi don faɗin kewayon kayan lantarki, gami da amma ba'a iyakance ga na'urorin sadarwa, kwamfutocin hannu, abubuwan more rayuwa na cibiyar sadarwa, na'urorin masu amfani, da alamun cikin gida ko tsarin haske na ado.
1.1 Core Features and Advantages
Na'urar ta bambanta kanta ta hanyar wasu mahimman fasahohin fasaha da fakitin da ke haɓaka amfani da aikin ta a cikin kera lantarki na zamani.
- Integrated Control: A significant advantage is the integration of the RGB LED chips with a 14-bit driver IC. This eliminates the need for external driver components for basic control, simplifying circuit design and reducing the overall bill of materials (BOM).
- High-Resolution Color Control: Each primary color (Red, Green, Blue) can be controlled across 1024 distinct brightness levels (10-bit PWM). This allows for the generation of over 1.07 billion (2^30) color combinations, enabling smooth color gradients and precise color mixing.
- Advanced Driver IC: The embedded driver utilizes constant current Pulse Width Modulation (PWM) control. The 14-bit control is split, with 10 bits dedicated to PWM duty cycle for brightness and 4 bits for fine-tuning the current level, offering granular control over light output and efficiency.
- Simplified Data Interface: Communication with the LED and daisy-chaining of multiple units is achieved through a single-wire serial protocol (SPI-compatible). This minimizes the number of control lines required from the host microcontroller.
- Data Integrity Feature: The device supports breakpoint continuous transmission (Bypass function). If one LED in a chain fails, the data signal can bypass it, ensuring the remaining LEDs in the sequence continue to function correctly, enhancing system reliability.
- Manufacturing Readiness: The component is supplied on 12mm tape mounted on 7-inch diameter reels, compatible with standard automated pick-and-place equipment. It is also qualified for lead-free infrared (IR) reflow soldering processes, including preconditioning to JEDEC Moisture Sensitivity Level 4.
- Environmental Compliance: The product is compliant with relevant environmental regulations.
1.2 Target Applications and Markets
The combination of small form factor, integrated intelligence, and full-color capability makes this LED suitable for diverse applications:
- Status and Indicator Lighting: Providing multi-color status feedback in telecommunications gear, office automation equipment, home appliances, and industrial control panels.
- Front Panel and Backlighting: Illuminating buttons, logos, or displays with dynamic, customizable colors.
- Decorative and Architectural Lighting: Used in LED strips, modules, soft lights, and lamps for ambient or accent lighting.
- Indoor Display Elements: Building blocks for full-color modules or irregular video displays where individual pixel control is required.
2. Technical Parameters: In-Depth Objective Interpretation
This section provides a detailed analysis of the key performance parameters specified in the datasheet.
2.1 Optical Characteristics
Optical performance is measured under standard conditions (Ta=25°C, VDD=5V). The device uses a white diffused lens to mix the light from the individual color chips, producing a uniform appearance.
- Luminous Intensity (IV): The typical axial luminous intensity varies by color chip. The Green chip is the brightest (330-700 mcd), followed by Red (130-300 mcd), and then Blue (50-180 mcd). These values represent the light output measured through a filter simulating the photopic (human eye) response.
- Viewing Angle (2θ1/2): The device features a wide viewing angle of 120 degrees. This is defined as the full angle at which the luminous intensity drops to half of its on-axis value, indicating good off-axis visibility.
- Dominant Wavelength (λd): This parameter defines the perceived color of each chip. The specified ranges are: Red: 618-630 nm, Green: 520-535 nm, Blue: 463-475 nm. The peak emission wavelength tolerance is ±1 nm, ensuring consistent color production from device to device.
2.2 Electrical and Absolute Maximum Ratings
Adherence to these ratings is critical for reliable operation and preventing permanent damage.
- Absolute Maximum Ratings:
- Power Dissipation (PD): 94 mW. Exceeding this can lead to overheating.
- Supply Voltage (VDD): +4.2V mpaka +5.5V. IC ya ndani imeundwa kwa usambazaji wa kawaida wa 5V.
- Jumla ya Sasa ya Mbele (IF): 17 mA. Hii ndiyo jumla ya sasa ya juu kwa chips zote tatu pamoja.
- Joto la Uendeshaji: 0°C mpaka +85°C.
- Storage Temperature: -40°C to +100°C.
- Electrical Characteristics (Typical @ VDD=5V):
- IC Output Current per Color: Typically 5 mA per individual R, G, or B channel. This constant current drive ensures stable color output regardless of minor voltage fluctuations.
- Logic Input Levels: High-level input voltage (VIH) is 0.7*VDD (typically 3.3V at 5V supply). Low-level input voltage (VIL) is 0.3*VDD. This makes it compatible with both 5V and 3.3V microcontroller logic.
- IC Quiescent Current: Approximately 0.2 mA when all LED outputs are off, indicating low power consumption in standby.
2.3 Thermal Considerations
While not explicitly detailing thermal resistance, the datasheet provides crucial thermal management guidelines through the soldering profile and storage conditions. The maximum power dissipation of 94 mW and the operating temperature range define the thermal operating window. Proper PCB layout with adequate thermal relief is necessary to maintain the junction temperature within safe limits during continuous operation, especially at maximum brightness and current.
3. Binning System Explanation
Datasheet ya ha ƙunshi teburin rarrabawar launi na CIE (Commission Internationale de l'Eclairage) don tabbatar da daidaiton launi.
- Rarrabawar Launi: Ana rarraba LEDs zuwa rukunoni (A, B, C, D) bisa ga ma'aunin ma'aunin launi (x, y) da aka auna akan zanen sararin launi na CIE 1931. Kowace rukuni an bayyana ta ta hanyar siffar huɗu a kan ginshiƙi. Rangwamen sanya a cikin rukuni shine ±0.01 a cikin ma'aunin x da y. Wannan tsarin rarrabawar yana haɗa LEDs masu kusan irin launin da ake gani, wanda yake da mahimmanci ga aikace-aikacen da ake amfani da LEDs da yaya a gefe da juna don guje wa rashin daidaiton launi da ake iya gani.
- Interpretation: Bins A and B cover a specific region of the color space for the mixed white light (through the diffused lens), while bins C and D cover an adjacent region. Designers can specify a bin code to guarantee a tighter color match for their production run.
4. Performance Curve Analysis
Datasheet ina nuna daidaitattun ayyukan lanƙwasa waɗanda ke wakiltar mahimman alaƙa ta hanyar zane. Duk da cewa ba a sake yin takamaiman zane-zanen a cikin rubutun da aka bayar ba, ana nazarin daidaitattun abubuwan da ke ciki a ƙasa.
- Dangantakar Haske mai Dangantaka da Ƙarfin Gaba (I-V Curve): Wannan lanƙwasa zai nuna yadda fitowar haske ke ƙaruwa tare da ƙarfin gaba da ake bayarwa ga kowane guntu LED. Saboda haɗaɗɗen direban ƙarfin yau da kullun, ana sarrafa wannan alaƙar da farko a ciki, amma lanƙwasa zai kwatanta ingancin haɗin guntu/direba.
- Relative Luminous Intensity vs. Ambient Temperature: This is a critical curve showing the derating of light output as the ambient (or junction) temperature rises. LED efficiency decreases with temperature, so this graph helps designers understand the thermal performance and potential light loss in warm environments.
- Spectral Power Distribution: This graph would display the intensity of light emitted across the wavelength spectrum for each color chip, showing the narrow emission peaks characteristic of LEDs and the specific dominant wavelengths.
5. Mechanical and Package Information
5.1 Package Dimensions and Configuration
The device conforms to an industry-standard SMD footprint. Key dimensions are approximately 5.0mm in length, 5.0mm in width, and 1.6mm in height (tolerance ±0.2mm). A detailed dimensional drawing is provided in the original datasheet for precise PCB land pattern design.
5.2 Pin Configuration and Function
The 6-pin device has the following pinout:
- VCC: Power supply input for the internal IC. Can be connected to VDD.
- VDD: Main DC power input (4.2-5.5V).
- DOUT: Control data signal output for daisy-chaining to the next LED's DIN.
- DIN: Control data signal input from a microcontroller or previous LED.
- VSS: Ground connection.
- FDIN: Auxiliary data signal input (functionality may be specific to certain control modes).
5.3 Recommended PCB Attachment Pad
A suggested solder pad layout is provided to ensure reliable soldering and mechanical stability. This layout typically includes thermal relief connections to manage heat during soldering and operation, and correctly sized pads for the gull-wing or similar leads.
6. Soldering, Assembly, and Handling Guidelines
6.1 IR Reflow Soldering Profile
A detailed reflow profile for lead-free soldering is provided, conforming to J-STD-020B. This profile specifies critical parameters:
- Preheat: A gradual ramp to activate flux and minimize thermal shock.
- Soak Zone: A temperature plateau to ensure uniform heating of the component and board.
- Reflow Zone: A peak temperature typically between 240°C and 260°C, with time above liquidus (TAL) carefully controlled to form reliable solder joints without damaging the LED package or internal components.
- Cooling Rate: A controlled cool-down to solidify the solder and minimize stress.
6.2 Storage and Moisture Sensitivity
Na'urar tana da hanzarin danshi. Lokacin da aka rufe ta a cikin jakar kariyar danshi ta asali tare da busasshiyar abu, tana da tsawon rayuwa na shekara guda idan aka adana a ≤30°C da ≤70% RH. Da zarar an buɗe, ya kamata a adana sassan a ≤30°C da ≤60% RH. Don tsawaita ajiya a wajen jakar asali, yi amfani da akwati mai rufi tare da busasshiyar abu. Sassan da aka fallasa ga iskar yanayi fiye da sa'o'i 96 suna buƙatar tsarin gasa (kimanin 60°C na sa'o'i 48) kafin sake kwarara don hana "popcorning" ko rabuwa yayin gudanar da soldering.
6.3 Tsaftacewa
If cleaning after soldering is necessary, only use specified solvents. Immersion in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is recommended. Harsh or unspecified chemicals can damage the plastic lens and package.
7. Packaging and Ordering Information
- Standard Packaging: The components are supplied on 12mm wide embossed carrier tape, wound onto 7-inch (178mm) diameter reels.
- Quantity per Reel: 1500 pieces per full reel.
- Minimum Order Quantity (MOQ): For partial quantities, a minimum of 500 pieces is available.
- Packaging Standards: Complies with ANSI/EIA-481 specifications. Empty pockets in the tape are covered with a protective top cover tape.
8. Application Design Considerations
8.1 Typical Application Circuits
Babban aikace-aikacen ya ƙunshi daisy-chaining LEDs da yawa. Layin bayanai guda ɗaya daga microcontroller yana haɗawa zuwa DIN na LED na farko. DOUT dinsa yana haɗawa zuwa DIN na na gaba, da sauransu. Dole ne a samar da wutar lantarki na 5V (tare da madaidaicin capacitors na decoupling na gida, misali, 100nF) ga duk LEDs, yana tabbatar da cewa ƙarfin lantarki ya kasance a cikin kewayon 4.2-5.5V, musamman a ƙarshen dogayen sarkoki inda faɗuwar IR zai iya faruwa. Ana iya buƙatar resistor na jerin akan layin bayanai don daidaita impedance a cikin dogayen sarkoki ko yanayi mai hayaniya.
8.2 Data Transmission Protocol
Sadarwa tana amfani da babban gudun, waya guda ɗaya, ka'idar tushen sake saiti. Kowane bit ana watsa shi azaman babban bugun jini a cikin lokacin 1.2µs (±160ns).
- Logic '0': T0H (high time) = 300ns ±80ns, T0L (low time) = 900ns.
- Logic '1': T1H = 900ns ±80ns, T1L = 300ns.
- Data Frame: 42 bits per LED (presumably 14 bits for each R, G, and B channel).
- Reset: A low signal on the data line for longer than 50µs (RES) latches the received data into the output registers and prepares the IC to receive a new frame for the first LED in the chain.
8.3 Thermal and Power Management
Masu ƙira dole su lissafta jimillar ɓarnawar wutar lantarki. A cikin na'urar 5mA na yau da kullun kowace launi da wadata 5V, LED ɗaya tare da duk launuka uku a cikin cikakkiyar fari na iya ɓata har zuwa 75mW (5V * 15mA), wanda ke ƙasa da iyakar 94mW. Duk da haka, a cikin tsararrun da suka yi yawa, jimillar zafi na iya zama mai mahimmanci. Isasshen yanki na tagulla na PCB don nutsewar zafi, yuwuwar iska, da rage haske a yanayin zafi mai girma sune muhimman abubuwan da ake la'akari don dogon lokaci na dogaro.
9. Technical Comparison and Differentiation
Compared to discrete RGB LEDs requiring external constant current drivers and multiplexing circuits, this device offers significant integration, reducing design complexity, component count, and board space. Versus other addressable LEDs (e.g., those using a different protocol like APA102 or older WS2812), the LTST-G353CEGB7W's 14-bit control (10-bit PWM + 4-bit current) provides finer color resolution and grayscale control than typical 8-bit (256 levels) alternatives. The integrated bypass function for fault tolerance is also a distinguishing reliability feature not found in all addressable LEDs.
10. Frequently Asked Questions (Based on Technical Parameters)
Q1: What is the difference between VCC and VDD pins?
A1: Dukansu shigarwar wutar lantarki ne na cikin IC. Ana iya haɗa su tare. Datasheet yana ba da shawarar cewa suna kama da juna a ciki, suna ba da sassauci na ƙira, mai yiwuwa don keɓance hayaniya a aikace-aikace masu mahimmanci.
Q2: Shin zan iya tuƙa wannan LED tare da microcontroller na 3.3V?
A2: Ee, don shigarwar bayanai (DIN). VIH minimum is 0.7*VDD. With VDD=5V, VIH min is 3.5V. A 3.3V output might be at the lower edge. It may work, but for reliability, a level shifter to 5V for the data line is recommended. The power supply VDD must still be 4.2-5.5V.
Q3: How many LEDs can I daisy-chain?
A3: The limit is primarily determined by the data refresh rate and power supply. Each LED requires 42 bits of data. For a long chain, the time to transmit data for all LEDs before the desired refresh rate (e.g., 60Hz) may limit the number. Electrically, the DOUT can drive the DIN of the next LED directly. Power must be distributed robustly to avoid voltage drop along the chain.
Q4: FDIN pin yana da nufin me?
A4: Takardar bayanan ta lissafa shi azaman shigar da bayanan taimako. Aikinsa na ainihi na iya zama don ƙirar sarrafawa na ci-gaba, gwajin masana'anta, ko dacewa da sifofin sarrafawa na musamman. Don daidaitaccen sarkar daisy ta waya ɗaya, yawanci ba a haɗa shi ba ko kuma a ɗaura shi da VDD ko VSS kamar yadda aka ƙayyade a cikin bayanan aikace-aikace.
11. Misalai na Ƙira da Amfani na Aiki
Example 1: Status Indicator Panel: A cluster of 10 LEDs can be used on a network router. Each can be assigned a unique color to indicate link status, traffic activity, or system alerts. The single data line control simplifies wiring compared to multiplexing 30 discrete LEDs (10 RGB).
Example 2: Decorative LED Strip Prototype: For a custom lighting project, 50 LEDs can be soldered onto a flexible PCB strip. A small microcontroller (e.g., ESP32) can generate the data stream, allowing animations, color washes, and music visualization. The wide viewing angle ensures even illumination.
Example 3: Instrument Cluster Backlighting: In a low-volume industrial device, these LEDs can provide customizable backlighting for gauges or buttons, allowing the end-user to select color themes. The constant current drive ensures consistent brightness regardless of the selected color.
12. Operational Principle Introduction
The device operates on a straightforward principle. An external microcontroller sends a serial data stream containing brightness information for the red, green, and blue channels. The integrated driver IC receives this data, stores it in internal registers, and then uses constant current sources to drive each LED chip. The brightness of each chip is controlled by rapidly switching its current on and off (PWM) at a frequency high enough to be imperceptible to the human eye (>200Hz). The duty cycle of this PWM (the proportion of 'on' time) determines the perceived brightness. The 4-bit current adjustment allows scaling the maximum current for each color, enabling white point calibration. The light from the three monochromatic chips mixes within the white diffused lens, producing the final composite color.
13. Technology Trends and Context
LTST-G353CEGB7W yana wakiltar mataki na girma a cikin juyin halittar SMD LEDs, musamman a cikin rukunin "mai hankali" ko "mai adireshi" LEDs. Hanyar da ake bi a wannan fanni ita ce zuwa ga haɗakar da juna, mafi girman ƙudurin sarrafawa (motsawa daga 8-bit zuwa 16-bit ko mafi girma a kowane tashar), ingantaccen ingancin wutar lantarki (ƙananan ƙarfin lantarki na gaba, mafi girman ingancin haske), da ingantattun ka'idojin sadarwa waɗanda suke da sauri kuma suna da ƙarfi ga hayaniya. Hakanan akwai yunƙurin zuwa ga ƙananan ƙirar yayin da ake kiyayewa ko ƙara fitowar haske, da haɓaka LEDs tare da mafi faɗin launuka don ƙarin nunin haske mai haske. Wannan na'urar, tare da haɗakar direba 14-bit da ingantacciyar hanyar sadarwa ta waya guda, ta dace da yunƙurin masana'antu don mafi sauƙi, mafi inganci, da mafi amintaccen hanyoyin haske don na'urori masu hankali da haɗin kai.
Kalmomin Ƙayyadaddun LED
Cikakken bayanin kalmomin fasahar LED
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Metric ya kwaida ya rangi, hatua ndogo zina maana rangi inayolingana zaidi. | Inahakikisha rangi sawa kwenye kundi moja la LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: kona mafuta bora, ufanisi wa juu, kwa nguvu kubwa. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | E kia whakarite i te marama ōrite i roto i te pāhi kotahi. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Yana tabbatar da babu abubuwa masu cutarwa (gubar, mercury). | Bukatar shiga kasuwa a duniya. |
| ENERGY STAR / DLC | Ilimin ingancin makamashi | Ilimin ingancin makamashi da aiki don hasken wuta. | Used in government procurement, subsidy programs, enhances competitiveness. |