SMD RGB LED with Embedded IC - 5.0x5.0x1.6mm - Voltage 4.2-5.5V - Power 99mW - English Technical Datasheet

1. Product Overview

This document details the specifications for a surface-mount device (SMD) LED that integrates red, green, and blue (RGB) semiconductor chips with an embedded 8-bit driver integrated circuit (IC) within a single package. This integrated solution is designed to simplify constant current applications for designers, eliminating the need for external current-limiting resistors or complex driver circuits for each color channel.

1.1 Core Advantages and Product Positioning

The primary advantage of this component is its high level of integration. By combining the control logic and RGB emitters, it forms a complete, addressable pixel point. This architecture is particularly beneficial for applications requiring multiple LEDs, such as LED strips, matrix displays, and decorative lighting, as it significantly reduces component count, board space, and system complexity. The device is packaged in a standard EIA-compliant footprint, making it compatible with automated pick-and-place and infrared reflow soldering processes, which is crucial for high-volume manufacturing.

1.2 Target Applications and Markets

This LED is engineered for a broad spectrum of electronic equipment where space, efficiency, and color control are paramount. Its key application areas include:

• Full-Color Modules and Soft Lighting: Ideal for creating dynamic color-changing effects in lamp strips, architectural accent lighting, and mood lighting systems.
• Indoor Displays and Signage: Suitable for irregular video displays, informational signs, and decorative panels where individual pixel control is required.
• Consumer Electronics: Can be used for status indicators, front panel backlighting, or aesthetic lighting in devices such as networking equipment, home appliances, and computer peripherals.
• Industrial & Office Equipment: Applicable for status signaling and operator interface illumination in various industrial and office automation contexts.

2. Technical Parameters: In-Depth Objective Analysis

The following sections provide a detailed, objective breakdown of the device's key performance characteristics as defined in the datasheet.

2.1 Absolute Maximum Ratings and Operating Limits

These parameters define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

• Power Dissipation (P_D): 99 mW. This is the maximum total power the package can dissipate as heat. Exceeding this limit risks overheating and failure.
• Supply Voltage Range (V_DD): +4.2V mpaka +5.5V. IC iliyojumuishwa inahitaji usambazaji wa umeme uliosimamiwa ndani ya safu hii kwa uendeshaji unaotegemewa. Kutumia voltage nje ya safu hii kunaweza kuharibu mzunguko wa udhibiti.
• Jumla ya Sasa ya Mbele (I_F): 18 mA. Hii ndiyo jumla ya juu zaidi ya mikondo inayopita kwenye chips nyekundu, kijani, na bluu kwa wakati mmoja.
• Safu za Joto: The device is rated for operation from -40°C to +85°C and can be stored in environments from -40°C to +100°C.

2.2 Optical Characteristics

Measured at an ambient temperature (T_a) of 25°C with a supply voltage (V_DD) of 5V and all color channels set to maximum brightness (8'b11111111).

• Luminous Intensity (I_V): This is the perceived brightness of the light output. The typical values are: Red: 100-200 mcd, Green: 250-500 mcd, Blue: 50-120 mcd. The green chip typically exhibits the highest luminous intensity.
• Viewing Angle (2θ_1/2): 120 degrees. This wide viewing angle, characteristic of a diffused lens, means the LED emits light over a broad area, making it suitable for applications where visibility from multiple angles is important.
• Dominant Wavelength (λ_d): This parameter defines the perceived color of the light. The specified ranges are: Red: 615-630 nm, Green: 520-535 nm, Blue: 460-475 nm. These ranges place the colors within standard visible spectral bands for red, green, and blue.

2.3 Electrical Characteristics

Defined for an ambient temperature range of -20°C to +70°C, V_DD from 4.2V to 5.5V, and V_SS at 0V.

• IC Output Current (I_F): 5 mA (typical). This is the constant current supplied by the embedded driver IC to each individual Red, Green, and Blue LED chip. This constant current design ensures stable color output and protects the LEDs from current spikes.
• Input Logic Levels: For the data input (DIN) pin, a logic high (V_IH) is recognized at 2.7V minimum up to V_DD. A logic low (V_IL) is recognized at 1.0V maximum. This is compatible with 3.3V and 5V microcontroller logic.
• IC Quiescent Current (I_DD): 0.8 mA (typical) when all LED data is set to '0' (off). This is the power consumed by the embedded IC itself when the LEDs are not illuminated.

3. Data Transmission Protocol and Control

The device features a single-wire, cascadable communication protocol, allowing multiple units to be daisy-chained and controlled from a single microcontroller pin.

3.1 Protocol Fundamentals

Data is transmitted as a sequence of high and low pulses on the DIN pin. Each bit ('0' or '1') is encoded by a specific timing pattern within a nominal period of 1.2 µs (±300ns).

• '0' Bit: High time (T_0H) = 300 ns ±150ns, followed by Low time (T_0L) = 900 ns ±150ns.
• '1' Bit: High time (T_1H) = 900 ns ±150ns, followed by Low time (T_1L) = 300 ns ±150ns.

The timing tolerance allows for some variation in microcontroller clock speeds but requires precise software or hardware timing for reliable communication.

3.2 Data Frame Structure

Kowane LED yana buƙatar bayanai na rago 24 don saita launinsa. Ana aika bayanan a cikin tsari: Koren (rago 8), Ja (rago 8), Shudi (rago 8). Kowane ƙimar rago 8 tana sarrafa hasken wannan tashar launi na musamman tare da matakai 256 (0-255). Wannan yana ba da damar ƙirƙirar haɗuwar launuka mai yuwuwa 16,777,216 (256^3).

3.3 Cascading and Reset

Data sent into the DIN pin of the first LED is shifted through its internal register and then output on its DOUT pin after 24 bits. This DOUT can be connected to the DIN of the next LED in the chain, allowing an unlimited number of LEDs to be controlled serially. A low signal on the DIN pin lasting longer than 250 µs (RESET time) causes all LEDs in the chain to latch the data currently in their registers and display it, then prepare to receive new data starting with the first LED in the chain.

4. Color Binning System

The datasheet provides a CIE 1931 chromaticity diagram-based binning table to categorize the color output of the white diffused LED. The bin codes (A, B, C, D) define quadrilaterals on the (x, y) color coordinate plane, each with a tolerance of ±0.01. This system allows manufacturers and designers to select LEDs with consistent color characteristics for applications where color uniformity across multiple units is critical, such as in large displays or lighting panels.

5. Performance Curve Analysis

The datasheet includes graphical representations of key performance relationships.

5.1 Relative Intensity vs. Wavelength (Spectral Distribution)

This curve shows the emission spectrum of each color chip (Red, Green, Blue). It typically displays distinct peaks corresponding to the dominant wavelengths. The width of these peaks indicates the spectral purity; narrower peaks suggest more saturated colors. The overlap between color spectra, particularly in the green-yellow region, will influence the quality and range of mixed colors (e.g., creating a pure yellow from red and green).

5.2 Forward Current vs. Ambient Temperature Derating Curve

Wannan zane yana da mahimmanci ga sarrafa zafi. Yana nuna matsakaicin ƙarfin kwarara da aka yarda da shi a kowane guntu LED a matsayin aikin yanayin zafi na muhalli. Yayin da zafin jiki ya karu, matsakaicin amintaccen ƙarfin kwarara yana raguwa. Misali, a 25°C, matsakaicin ƙarfin kwarara na iya kasancewa kusa da ƙimar 18mA, amma a 85°C, matsakaicin ƙarfin kwarara da aka yarda da shi ya ragu sosai. Masu zane dole ne su tabbatar da ƙarfin kwarara na aiki, musamman lokacin da duk launuka uku suke cikin cikakken haske, bai wuce iyakar rage ƙimar a mafi girman yanayin zafin muhalli da ake tsammani ba don tabbatar da dogon lokacin aminci.

5.3 Spatial Distribution (Radiation Pattern)

This polar plot illustrates how light intensity varies with the viewing angle relative to the LED's central axis. The provided 120-degree viewing angle (2θ_1/2) is the point where intensity drops to 50% of the on-axis value. The diffused lens creates a Lambertian-like pattern, providing even illumination over a wide area rather than a focused beam.

6. Mechanical and Packaging Information

6.1 Package Dimensions and Configuration

The device has a nominal footprint of 5.0 mm x 5.0 mm with a height of 1.6 mm. All dimensional tolerances are ±0.2 mm unless otherwise specified. A top-view diagram identifies the four pins: 1 (VDD - Power), 2 (DIN - Data Input), 3 (VSS - Ground), and 4 (DOUT - Data Output).

6.2 Recommended PCB Attachment Pad Layout

A land pattern diagram is provided to guide PCB design. Adhering to these recommended pad dimensions and spacing is essential for achieving reliable solder joints during the reflow process and ensuring proper mechanical stability.

7. Assembly and Handling Guidelines

7.1 Tsarin Solder

Na'urar ta dace da hanyoyin solder na infrared (IR) reflow wadanda suka dace da solder maras gubar (Pb-free). Takardar bayanan ta yi nuni ga bayanin martaba bisa ga ma'aunin J-STD-020B. Muhimman ma'auni a cikin irin wannan bayanin martaba sun hada da dumama kafin, jiƙa, zafin kololuwar reflow (wanda bai kamata ya wuce matsakaicin zafin jiki na na'urar ba), da kuma saurin sanyaya. Bin shawarar bayanin martaba yana da mahimmanci don hana girgiza zafi, lahani a haɗin solder, ko lalata fakitin LED da IC na ciki.

7.2 Tsaftacewa

Idan tsaftacewa bayan haɗawa ya zama dole, hanyar da aka ba da shawarar ita ce nutsar da allon da aka haɗa a cikin barasa na ethyl ko isopropyl a zafin daki na ƙasa da minti ɗaya. An haramta amfani da wuraren tsaftacewa na sinadarai waɗanda ba a bayyana su ba ko masu ƙarfi saboda suna iya lalata ruwan tabarau na filastik ko kayan marufi.

8. Marufi da Oda

The LEDs are supplied on 8mm wide embossed carrier tape wound onto 7-inch (178mm) diameter reels. Standard packing quantity is 4000 pieces per reel. The tape and reel specifications conform to ANSI/EIA 481 standards, ensuring compatibility with automated assembly equipment. Detailed dimensional drawings for the tape pockets and the reel are provided for logistics and machine setup purposes.

9. Application Design Considerations

9.1 Power Supply Design

A stable, low-noise power supply within the 4.2V to 5.5V range is essential. The total current demand for a string of LEDs must be calculated: I_total = (Number of LEDs) * (I_{DD_quiescent}) + (Number of Lit Pixels) * (I_{F_R} + I_{F_G} + I_{F_B}). For large installations, consider voltage drop along the power lines, which may require power injection at multiple points.

9.2 Data Signal Integrity

For long daisy chains or in electrically noisy environments, signal integrity on the data line (DIN/DOUT) can degrade. Strategies to mitigate this include using a lower data rate (if timing allows), adding a small series resistor (e.g., 100-470 Ω) at the microcontroller output to reduce ringing, and ensuring a solid, low-impedance ground connection throughout the system.

9.3 Thermal Management

While the constant current driver provides inherent protection, the power dissipated as heat (P = V_f * I_f For each chip, plus IC loss) must be managed. Ensure adequate ventilation or heatsinking if LEDs are operated at high brightness levels or in high ambient temperatures, especially in densely packed arrays. Refer to the derating curve in section 5.2.

10. Technical Comparison and Differentiation

The key differentiator of this component is the embedded constant current driver IC. Compared to a standard RGB LED which requires three external current-limiting resistors and an external multiplexing or PWM driver circuit, this integrated solution offers significant advantages:

• Simplified Design: Reduces Bill of Materials (BOM) and PCB layout complexity.
• Improved Consistency: The on-chip constant current source provides identical drive conditions for each color in every unit, leading to better color uniformity across a production run.
• Cascadability: The single-wire protocol allows control of hundreds of LEDs from one microcontroller pin, vastly simplifying wiring and control software for large installations.
• High Color Depth: 8-bit (256-step) control per color channel enables smooth gradients and a vast color palette, which is superior to simpler multiplexed or analog-controlled solutions.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I power this LED directly from a 3.3V microcontroller supply?
A: No. The absolute minimum supply voltage (V_DD) is 4.2V. A 3.3V supply is below the operating range and will not power the embedded IC correctly. You need a separate 5V (or 4.2-5.5V) power rail for the LEDs.

Q: Yaya zan iya lissafta ƙarfin da ake buƙata don aikin na tare da 100 na waɗannan LEDs?
A: Dole ne ka yi la'akari da abubuwa biyu: 1) Quiescent current don ICs: 100 LEDs * 0.8 mA = 80 mA. 2) LED current: Wannan ya dogara da launukan da aka nuna. A cikin mafi munin yanayi (duk LEDs suna nuna cikakken haske fari), kowane LED yana ɗaukar ~15 mA (3 launuka * 5 mA). Don haka, 100 LEDs * 15 mA = 1500 mA. Jimlar mafi munin yanayi na yanzu ≈ 1580 mA ko 1.58A a 5V. Dole ne a ƙididdige wutar lantarkin ku don wannan.

Q: Me zai faru idan lokacin siginar bayanai ya ɗan wuce ƙayyadaddun iyaka?
A: O mea faʻapipiʻi e mafai ona faʻaseseina faʻamatalaga, e mafua ai ona faʻaalia lanu sese poʻo le faʻaletonu atoa o fesoʻotaʻiga i lalo o le filifili. E taua tele le faʻatupuina o le faʻailoga faʻamatalaga ma le taimi e latalata i le masani masani, tumau i totonu o le ±150ns alauni.

Q: E manaʻomia se heatsink?
A: E faʻalagolago i tulaga faʻagaioiga. I le vevela o le potu ma le malamalama feololo, o le 99mW faʻatagaina faʻamalologa malosi e foliga mai e lava. Ae peitaʻi, afai e faʻagaioia i totonu o se siʻosiʻomaga maualuga vevela poʻo le maualuga o le malamalama faʻaauau, e tatau ona faia suʻesuʻega vevela. O le faʻaitiitia o le curve i le vaega 5.2 o loʻo faʻaalia ai o le maualuga o le taimi nei e tatau ona faʻaititia pe a maualuga le vevela, o se ituaiga le tuusao o le puleaina o le vevela.

12. Practical Application Example

Scenario: Designing a 10x10 RGB LED Matrix Panel for an Art Installation.

Design Steps:
1. Layout: Arrange 100 LEDs in a grid. Connect all VDD pins to a common 5V power plane and all VSS pins to a common ground plane.
2. Power: Calculate peak power: 100 LEDs * (0.015A * 5V) = 7.5W. Select a 5V, 8A (40W) power supply with ~20% headroom. Plan for power injection from multiple sides of the panel to minimize voltage drop.
3. Data Chain: Connect the DOUT of each LED in a row to the DIN of the next LED in the same row. At the end of each row, the DOUT can be connected to the DIN of the first LED in the next row, creating a single long chain of 100 LEDs.
4. Control: A microcontroller (e.g., ESP32, Arduino) generates the data stream. The software must send 2400 bits (100 LEDs * 24 bits) of color data, followed by a reset pulse >250 µs to make the LEDs update. Libraries exist to simplify this protocol.
5. Thermal: Mount the LEDs on an aluminum PCB or ensure the panel has ventilation, as 7.5W of heat in a confined space will raise the ambient temperature, triggering the need for current derating.

13. Operational Principle

The device operates on a simple but effective principle. The embedded IC contains a shift register and constant current sinks. Serial data clocked into the DIN pin is shifted through the internal 24-bit register. Once a reset signal is received, the IC latches this data. Each 8-bit segment of the latched data controls a Pulse Width Modulation (PWM) generator for one color channel (Red, Green, Blue). The PWM signal then drives a constant current sink connected to the corresponding LED chip. A value of 255 (8'b11111111) results in a 100% duty cycle (fully on), while a value of 127 results in a ~50% duty cycle, thereby controlling brightness. The constant current sink ensures the LED receives a stable current regardless of minor forward voltage (V_f) variations between chips or with temperature.

14. Technology Trends and Context

This component represents a clear trend in LED technology: increased integration and intelligence at the package level. Moving driver functionality onto the same substrate as the emitter (a concept often called "LEDs with integrated circuits" or "smart LEDs") addresses several industry challenges. It reduces system cost and complexity for end-users, improves performance consistency, and enables new applications like easily scalable, high-resolution addressable displays. This trend is evolving towards LEDs with more advanced integrated circuits capable of higher data rates (e.g., for video), built-in memory for patterns, and even sensors for ambient light or temperature feedback, paving the way for more autonomous and adaptive lighting systems.