LTL-M12YB1H310U SMT CBI Bicolor LED Indicator Datasheet - Yellow/Blue - 10mA - 72/78mW - Chinese Version

1. Product Overview

LTL-M12YB1H310U is a Circuit Board Indicator (CBI) utilizing Surface Mount Technology (SMT). It consists of a black plastic right-angle housing designed to work with a specific LED chip. This component is engineered for easy assembly onto Printed Circuit Boards (PCBs), featuring a stackable structure that facilitates the creation of horizontal or vertical arrays. Its primary function is to provide clear, high-contrast visual status indication in electronic devices.

1.1 Core Features and Advantages

• Surface Mount Design:Fully compatible with automated SMT assembly processes, enabling high-volume and efficient PCB mounting.
• Enhanced Visibility:The black housing material creates high contrast with illuminated LEDs, improving readability under various lighting conditions.
• Bicolor Light Source:Integrated with AlInGaP for yellow light emission and InGaN for blue light emission, combined with a white diffuser lens to achieve a uniform light appearance.
• High Energy Efficiency:Yana da siffofi na ƙarancin wutar lantarki da ingantaccen haske, ya dace da aikace-aikacen da ke da hankali ga amfani da wutar lantarki.
• Daidaiton muhalli:Wannan samfurin ba shi da gubar, ya bi ka'idodin RoHS (Ƙuntata Abubuwa Masu Illa).
• Gwajin amincin aiki:The device underwent preconditioning accelerated to JEDEC (Joint Electron Device Engineering Council) Level 3 standards, indicating it possesses a robust moisture sensitivity level suitable for standard SMT reflow soldering processes.

1.2 Target Applications and Market

This indicator light is designed for general electronic equipment in multiple key industries:

• Computer systems:Status lights on motherboards, servers, storage devices, and peripherals.
• Communication equipment:Indicators for network switches, routers, modems, and telecommunications equipment.
• Consumer Electronics:Power, mode, or function indicators in audio/video equipment, household appliances, and personal devices.
• Industrial Control:Indicators for machinery, instrumentation, and control system panels requiring reliable visual feedback.

2. Technical Specifications and Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (P_d):Yellow: 72 mW, Blue: 78 mW. This parameter limits the total electrical power that can be converted into heat within the LED package.
• Peak Forward Current (I_FP):Both colors are 80 mA. This is the maximum allowable instantaneous current, typically applicable for pulse operation with a duty cycle ≤1/10 and pulse width ≤0.1ms. Exceeding this value may lead to catastrophic failure.
• DC forward current (I_F):Yellow: 30 mA, Blue: 20 mA. This is the maximum continuous current recommended for reliable long-term operation. The lower rating for the blue LED reflects the typical characteristics of InGaN material.
• Temperature range:Operating temperature: -40°C to +85°C; storage temperature: -40°C to +100°C. These wide ranges ensure functionality and safe storage conditions in harsh environments.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured at an ambient temperature (T_A) of 25°C under specific test conditions.

• Luminous intensity (I_V):At I_F= 10mA, yellow: 18 mcd (min.), blue: 12.6 mcd (min.). This parameter measures the brightness perceived by the human eye. I_VThe binning code is marked on the packaging bag for sorting.
• Peak emission wavelength (λ_P):Yellow: 592 nm (typical), Blue: 468 nm (typical). This is the wavelength at which the spectral power output is maximum.
• Dominant Wavelength (λ_d):At I_FAt I_F = 10mA, Yellow: 582-595 nm, Blue: 464-476 nm. This value is derived from the CIE chromaticity diagram and is the single wavelength that best represents the perceived color of the LED, defining its color bin.
• Spectral Line Half-Width (Δλ):Yellow: 15 nm (typical), Blue: 25 nm (typical). This indicates spectral purity; a smaller value means the light is closer to monochromatic. The spectrum of yellow AlInGaP LEDs is typically narrower than that of blue InGaN LEDs.
• Forward voltage (V_F):At I_F= 10mA, Yellow: 1.7-2.4V, Blue: 2.7-3.8V. This is the voltage drop when the LED conducts current. The higher V_Fof blue LEDs is characteristic of InGaN technology.
• Reverse current (I_R):In V_R= 5V, both colors are 10 µA (maximum). The LED is not designed for reverse bias operation; this parameter is for leakage current testing only.

3. Binning System Description

The datasheet implies a binning system based on key optical parameters to ensure color and brightness consistency in production.

• Wavelength/Color Binning:Dominant Wavelength (λ_d) range (Yellow: 582-595nm, Blue: 464-476nm) defines acceptable color variation. Products are sorted into different bins within these ranges.
• Luminous intensity binning:Luminous intensity (I_V) has a specified minimum value. Devices may be tested and binned for intensity, with the specific bin code marked on the packaging (as described in the datasheet).
• Forward voltage binning:Although not explicitly stated as a binning parameter, the specified V_Frange indicates the allowable deviation. A consistent V_Fis very important for current matching in parallel circuits.

4. Performance Curve Analysis

The datasheet references typical characteristic curves that are crucial for design.

• I-V (Current-Voltage) Curve:Shows the relationship between forward current (I_F) and forward voltage (V_F). It is nonlinear, with a turn-on/threshold voltage (approximately 1.5V for yellow, 2.5V for blue). Beyond this voltage, the current increases rapidly with a small increase in voltage. This necessitates current-limiting measures in the drive circuit.
• Luminous intensity vs. forward current:Typically displayed at lower currents, I_VIncreases linearly with I_FMay saturate at higher currents due to thermal effects and efficiency degradation.
• Temperature Dependence:The luminous intensity typically decreases as the junction temperature increases. The forward voltage also decreases with rising temperature (negative temperature coefficient).
• Spectral Distribution:This chart will show the relationship between relative radiant power and wavelength, with a peak at λ_P, and the width defined by Δλ. The dominant wavelength is λ_dIt is calculated based on this spectrum.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

This component features a right-angle (90-degree) mounting profile. Key dimensional specifications include:

• All dimensions are in millimeters. Unless otherwise specified, the default tolerance is ±0.25mm.
• The housing material is black plastic.
• The integrated LED is a yellow/blue bicolor type with a white diffuser lens for light mixing and a wider viewing angle.

5.2 Polarity Identification and Installation

Although the provided text does not detail the specific pad layout, SMT LEDs require correct polarity orientation. The PCB pad design must match the component's pin configuration. The black housing and right-angle design aid in mechanical alignment during mounting.

6. Welding and Assembly Guide

6.1 Storage and Handling

• Sealed Package:Store at ≤30°C and ≤70% RH. Use within one year after the bag sealing date.
• Opened Package:For components removed from moisture barrier bags, store at ≤30°C and ≤60% RH. It is recommended to complete infrared reflow soldering within 168 hours (1 week) after exposure to the environment.
• Prolonged exposure:If the exposure time exceeds 168 hours, baking at approximately 60°C for at least 48 hours is required before soldering to remove absorbed moisture and prevent "popcorn" damage during the reflow process.

6.2 Welding Process Parameters

• Manual Welding (Soldering Iron):Maximum temperature 350°C, maximum 3 seconds per solder joint. Can only be soldered once.
• Wave soldering:Preheating: 150-200°C, maximum 120 seconds. Solder wave: maximum 260°C, maximum 5 seconds. Process can be performed up to two times.
• Reflow soldering:The component complies with JEDEC Level 3 standards. An example reflow profile is provided, emphasizing the need to adhere to JEDEC limits and the solder paste manufacturer's recommendations. The reflow process must not exceed two cycles. The profile typically includes preheat, thermal soak, reflow peak (recommended approximately 245-260°C), and cooling stages.

6.3 Cleaning and Mechanical Stress

• If necessary, clean using alcohol-based solvents such as isopropyl alcohol.
• Avoid applying mechanical stress to the pins or housing during assembly. Do not use the lead frame base as a bending fulcrum.

7. Packaging and Ordering Information

7.1 Packaging Specifications

• Carrier Tape:Standard 10-sprocket hole pitch design. Material: Black conductive polystyrene alloy. Thickness: 0.40 ±0.06 mm.
• Reel:Standard 13-inch (330mm) diameter reel. Quantity: 1,400 pieces per reel.
• Carton:One reel is packaged with desiccant and humidity indicator card in a Moisture Barrier Bag (MBB). Three MBBs are packaged in one inner box (total 4,200 pieces). Ten inner boxes are packaged in one master carton (total 42,000 pieces).

7.2 Part Number and Revision

The basic part number is LTL-M12YB1H310U. The document revision history is recorded, and the effective date of the current specification is April 1, 2021.

8. Application Design Recommendations

8.1 Drive Circuit Design

Key Considerations:LED is a current-driven device. To ensure uniform brightness, especially when multiple LEDs are connected in parallel, a series current-limiting resistor must be used for each LED (Circuit Model A). It is not recommended to drive multiple parallel LEDs directly from a voltage source (Circuit Model B), because slight differences in the individual LED forward voltage (V_F) will lead to significant differences in current and brightness.

The series resistor value (R_s) can be calculated using Ohm's Law: R_s= (V_{Power supply}- V_F) / I_F, where I_FI is the required operating current (e.g., 10mA), V_Fis the typical forward voltage from the datasheet.

8.2 Thermal Management

Although the power consumption is low, maintaining the LED junction temperature within the specified operating range is crucial for long-term reliability and stable light output. Ensure sufficient copper area around the PCB pads or thermal design for heat dissipation, especially when operating near the maximum DC current.

9. Technical Comparison and Differentiation

Compared to discrete LED chips or simpler SMT LEDs, this CBI (Circuit Board Indicator) offers distinct advantages:

• Integrated Solution:The integration of LED chip, lens, and structural right-angle housing into a single SMT package simplifies mechanical design and assembly.
• Enhanced Readability:Compared to many transparent lens, no-shell LEDs, the black shell and diffused lens provide superior contrast and viewing angle.
• Dual-color function:Integrating two different semiconductor materials (AlInGaP and InGaN) in one package allows for dual-state indication (e.g., power on/standby, mode A/mode B) without occupying additional PCB space.
• Stackable design:Facilitates the creation of multi-indicator light bars or arrays with consistent spacing and alignment.

10. Frequently Asked Questions (FAQ)

Q1: Can I drive this LED directly from a 5V or 3.3V logic output?
A1: A'a. Dole ne ka yi amfani da resistor mai iyakancewar kwarara a jere. Misali, yin amfani da wutar lantarki na 5V don tuka LED shuɗi (V_FƘimar al'ada kusan 3.2V) a 10mA: R_s= (5V - 3.2V) / 0.01A = 180 Ω. Don mafi girman kwarara ko yawan amfani, yana iya buƙatar tuka transistor ko takamaiman LED driver IC.

Q2: Tsayin zango mafi girma (λ_P) and dominant wavelength (λ_d) what is the difference?
A2: λ_Pis the physical peak of the spectrum. λ_dis a calculated value representing the color perceived by the human eye, derived from the complete spectrum and the CIE color matching functions._dFor color specifications and grading, it is more relevant.

Q3: How to understand JEDEC Level 3 preconditioning?
A3: JEDEC Level 3 means that after the moisture barrier bag is opened, components can be exposed to factory ambient conditions (≤30°C/60% RH) for up to 168 hours (1 week) without requiring baking prior to reflow soldering. This provides flexibility in manufacturing scheduling.

Q4: Why is the maximum current different for yellow and blue?
A4: Different semiconductor materials (AlInGaP and InGaN) have different electrical and thermal characteristics, leading to different maximum safe operating current densities defined by manufacturer reliability testing.

11. Practical Application Examples

Scenario: Designing a status panel for a network switch.The panel requires a green light to indicate "Link Active", a yellow light for "Activity", and a blue light for "PoE (Power over Ethernet) Active". Although this specific component is a yellow/blue bicolor, a similar green CBI component can be used. The designer will:

1. Place three CBI pads (for green, yellow, blue) in a vertical array on the front panel area of the PCB.
2. For each LED, calculate the appropriate series resistor based on the system's 3.3V digital I/O voltage and the required 8mA drive current (for sufficient brightness).
3. Route the control signal from the switch's main microcontroller to the current-limiting resistor, then to the LED anode. Connect all cathodes to ground.
4. In the assembly instructions, specify that the SMT production line must follow the JEDEC Level 3 reflow profile, and any board with CBI exposure exceeding 168 hours prior to soldering must be baked.

This method produces a professional, visually consistent indicator panel that is easy to automate for assembly.

12. Brief Introduction to Working Principles

A light-emitting diode (LED) is a semiconductor p-n junction device. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region (active layer). There, they recombine and release energy. In these materials (AlInGaP and InGaN), this energy is primarily released in the form of photons (light) – a process called electroluminescence. The specific color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active layer. The bandgap of AlInGaP corresponds to red, orange, and yellow light, while InGaN can produce light from green to ultraviolet, with blue being a common output. A white diffuser lens scatters the light, creating a more uniform and wider viewing angle.

13. Teknoloji Trendleri

The development of SMT indicator lights like CBI follows the broader trends in the electronics industry:

• Miniaturization and Integration:Package size continues to shrink, with more functions (e.g., RGB multi-color, built-in IC drivers) integrated into a single SMT package.
• Higher Efficiency:Internal Quantum Efficiency (IQE) and continuous improvements in light extraction technology lead to higher luminous intensity per unit input electrical power.
• Higher reliability and robustness:Advancements in packaging materials and chip mounting technology enhance performance over a wider temperature range and longer lifespan.
• Standardization:Adopt standardized pad layouts and optical characteristics more widely to simplify engineers' design and procurement.