1. Product Overview
LTL-M11TB1H310U wani Surface Mount Technology (SMT) Circuit Board Indicator (CBI) ne. Ya ƙunshi baƙar fata filastik mai kusurwar dama (majigi) wanda aka ƙera don ya dace da takamaiman fitilar LED. Babban aikin sa shine yin aiki azaman haske na matsayi ko mai nuna alama akan allunan da'irar lantarki. Iyalin samfurin yana ba da damar yin amfani da shi tare da zaɓuɓɓuka don kallon sama ko kusurwar dama da tsarawa a cikin jeri na kwance ko tsaye, waɗanda ake iya tara su don sauƙin haɗawa.
1.1 Fa'idodi na Asali
- Ƙirar Haɗawa ta Surface: Enables automated pick-and-place assembly, improving manufacturing efficiency and consistency.
- Enhanced Contrast: The black housing material provides a high contrast ratio against the illuminated LED, improving visibility.
- Energy Efficiency: Characterized by low power consumption and high luminous efficiency.
- Environmental Compliance: This is a lead-free product compliant with the RoHS (Restriction of Hazardous Substances) directive.
- Optical Design: Utilizes an InGaN (Indium Gallium Nitride) blue semiconductor chip paired with a white diffused lens to soften and spread the light output.
- Reliability Screening: Devices undergo preconditioning accelerated to JEDEC Moisture Sensitivity Level 3, indicating a robust package for typical SMT processes.
1.2 Target Applications
This indicator LED is suitable for a wide range of ordinary electronic equipment, including:
- Computer peripherals and internal components.
- Communication devices and networking equipment.
- Consumer electronics.
- Industrial control systems and instrumentation.
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Power Dissipation (Pd): 80 mW maximum. This is the total electrical power the device can safely dissipate as heat.
- Peak Forward Current (IFP): 100 mA maximum, but only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 0.1ms).
- DC Forward Current (IF): 20 mA maximum for continuous operation. This is the key parameter for circuit design.
- Operating Temperature (Topr): -40°C to +85°C. The device is rated for operation across this industrial temperature range.
- Storage Temperature (Tstg): -40°C to +100°C.
- Soldering Temperature: Withstands 260°C for a maximum of 5 seconds, which is compatible with lead-free reflow soldering profiles.
2.2 Electro-Optical Characteristics
Measured at an ambient temperature (TA) of 25°C and a forward current (IF) of 10mA, unless otherwise specified.
- Luminous Intensity (IV): 8.7 mcd (Min), 15 mcd (Typ), 38 mcd (Max). This is the perceived brightness in the axial direction. The classification code marked on the packing bag corresponds to the actual luminous intensity bin.
- Viewing Angle (2θ1/2): 40 degrees (Typical). This is the full angle at which the luminous intensity drops to half of its axial value, defining the beam spread.
- Peak Emission Wavelength (λP): 468 nm (Typical). This is the wavelength at which the spectral power output is highest.
- Dominant Wavelength (λd): 464 nm (Min), 470 nm (Typ), 476 nm (Max). Wannan ita ce tsayin raƙuman ruwa guda ɗaya da idon ɗan adam ke gani wanda ke ayyana launin hasken, wanda aka samo daga zanen launi na CIE.
- Ramin Rabin Layin Bakan (Δλ): 20 nm (Typical). Wannan yana nuna tsaftar bakan ko faɗin bandejin hasken shuɗi da aka fitar.
- Ƙarfafawa Gaba (VF): 2.7 V (Min), 3.1 V (Typ), 3.8 V (Max) at IF = 10mA. This is the voltage drop across the LED when conducting.
- Reverse Current (IR): 10 μA maximum at a reverse voltage (VR) of 5V. Important: The device is not designed for operation under reverse bias; this test condition is for characterization only.
3. Performance Curve Analysis
Datasheet ina nuna daidaitattun halaye masu mahimmanci ga injiniyoyin ƙira. Yayin da ba a sake buga takamaiman jadawali a cikin rubutun ba, yawanci sun haɗa da:
- I-V (Current-Voltage) Curve: Yana nuna alaƙa tsakanin ƙarfin lantarki na gaba da kuma halin yanzu na gaba, wanda ke da mahimmanci don zaɓar madaidaicin resistor mai iyakancewa halin yanzu.
- Relative Luminous Intensity vs. Forward Current: Illustrates how light output increases with drive current, helping to optimize brightness and efficiency.
- Relative Luminous Intensity vs. Ambient Temperature: Yana nuna haske fitarwa na zafin jiki, wanda yake mahimmanci ga aikace-aikacen zafi mai girma.
- Rarraba Spectral: Zane da ke nuna ƙarfin fitarwa mai alaƙa a cikin tsayin raƙuman ruwa, wanda ya ta'allaka a kan kololuwar tsayin raƙuman ruwa na 468 nm.
Waɗannan lanƙwasawa suna ba masu ƙira damar yin hasashen halayen na'urar a ƙarƙashin yanayin da ba daidai ba (motsi daban-daban ko yanayin zafi) kuma suna da mahimmanci ga ƙirar da'ira mai ƙarfi.
4. Mechanical and Packaging Information
4.1 Outline Dimensions
The device features a right-angle SMT package. Key dimensional notes include:
- All dimensions are provided in millimeters, with inches in parentheses.
- A general tolerance of ±0.25mm (±0.010\") applies unless otherwise specified.
- The housing material is black plastic.
- The integrated LED emits blue light through a white diffused lens.
4.2 Packing Specification
The components are supplied in a tape-and-reel format suitable for automated assembly.
- Carrier Tape: Made of black conductive polystyrene alloy, 0.40mm ±0.06mm thick. The 10-sprocket hole pitch has a cumulative tolerance of ±0.20mm.
- Reel Capacity: Each 13-inch reel contains 1,400 pieces.
- Carton Packaging:
- 1 reel is packed with a desiccant and humidity indicator card inside a Moisture Barrier Bag (MBB).
- 3 MBBs are packed in one Inner Carton (total 4,200 pieces).
- 10 Inner Cartons are packed in one Outer Carton (total 42,000 pieces).
5. Assembly and Application Guidelines
5.1 Storage and Handling
- Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year of the pack date.
- Opened Package: Store at ≤30°C and ≤60% RH. Components should be reflow-soldered within 168 hours (7 days) of exposure to ambient air.
- Extended Storage/Baking: If exposed for >168 hours, bake at 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.
5.2 Soldering Process
Reflow Soldering (Recommended):
- Pre-heat: 150–200°C for up to 120 seconds max.
- Peak Temperature: 260°C maximum at the solder joints.
- Time Above Liquidus: 5 seconds maximum within the peak temperature zone.
- Number of Cycles: The reflow process must not exceed 2 times.
Hand Soldering: Yi amfani da ƙarfe mai ƙonewa a matsakaicin zafin jiki na 300°C ba fiye da dakika 3 ba, sau ɗaya kawai. A guji amfani da matsin inji ga jagororin yayin ƙonewa.
Tsaftacewa: Yi amfani da kaushi masu tushen barasa kamar isopropyl alcohol idan tsaftacewa ya zama dole.
5.3 Drive Circuit Design
LEDs are current-driven devices. To ensure uniform brightness when using multiple LEDs:
- Recommended Circuit (A): Use a separate current-limiting resistor in series with each LED. This compensates for the natural variation in forward voltage (VF) between individual LEDs, ensuring each receives the same current and thus emits the same luminous intensity.
- Non-Recommended Circuit (B): Connecting multiple LEDs in parallel with a single shared resistor is discouraged. Small differences in the I-V characteristics of each LED can cause significant current imbalance, leading to uneven brightness.
5.4 Electrostatic Discharge (ESD)
The device is susceptible to damage from electrostatic discharge. Standard ESD handling precautions must be observed during assembly and handling, including the use of grounded workstations, wrist straps, and conductive containers.
6. Design Considerations and Application Notes
6.1 Thermal Management
While the power dissipation is low (80 mW max), maintaining the junction temperature within limits is crucial for long-term reliability. Ensure adequate PCB copper area or thermal vias if the device is operated at high ambient temperatures or near its maximum current rating.
6.2 Optical Integration
The 40-degree viewing angle and white diffused lens provide a wide, soft illumination suitable for panel indicators. The black housing minimizes light piping and stray reflections, enhancing the on/off contrast. Designers should consider the final assembly's viewing angle requirements when selecting the mounting orientation (right-angle as provided).
6.3 Reliability and Lifespan
Operation within the Absolute Maximum Ratings, especially the DC forward current and temperature limits, is paramount for reliability. The JEDEC Level 3 preconditioning indicates the package can withstand typical factory floor exposure times before reflow, but the post-opening storage and baking guidelines must be followed to prevent moisture-induced failures.
7. Frequently Asked Questions (Based on Technical Parameters)
Q1: What resistor value should I use to drive this LED at 10mA from a 5V supply?
A1: Using Ohm's Law: R = (Vsupply - VF) / IF. With a typical VF of 3.1V, R = (5V - 3.1V) / 0.01A = 190 Ω. To ensure the current does not exceed the maximum under worst-case conditions (min VF), recalculate using VF(min)=2.7V: R = (5V - 2.7V) / 0.01A = 230 Ω. A standard 220 Ω resistor is a safe and practical choice, yielding approximately 10.5mA at typical VF.
Q2: Can I pulse this LED at higher currents for increased brightness?
A2: Ee, amma a cikin Ƙididdiga Mafi Girma kawai. Kuna iya buga shi har zuwa 100mA, muddin zagayowar aiki ≤10% ne (misali, bugun 0.1ms a kowane 1ms) kuma matsakaicin halin yanzu na lokaci bai wuce ƙimar DC ko iyakokin narkewa ba. Ƙarfin haske na nan take zai fi na 10mA DC girma.
Q3: Tsawon tsayin tsayi shine 464-476nm. Shin za a sami bambancin launi da ake iya gani tsakanin raka'a?
A3: A cikin wannan kewayon 12nm na binning, idon ɗan adam na iya ganin ɗan ƙaura a cikin launin shuɗi, musamman lokacin kwatanta na'urori daga ƙarshen mafi ƙanƙanta da mafi girma na kewayon gefe-da-gefe. Don yawancin aikace-aikacen nuna alama inda ake kallon LEDs ɗaya ɗaya, wannan bambancin yana karɓuwa. Don aikace-aikacen da ke buƙatar daidaita launi mai tsauri, ƙayyadaddun ƙaramin tsayin tsayi ko amfani da LEDs daga jigon samarwa ɗaya ana shawarwari.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Haske a kowane watt na wutar lantarki, mafi girma yana nufin mafi ingancin makamashi. | Kai tsaye yana ƙayyade matakin ingancin makamashi da farashin wutar lantarki. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Mwangaza wa joto/baridi, thamani za chini ni manjano/joto, za juu nyeupe/baridi. | Huamua mazingira ya taa na matukio yanayofaa. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Yanzu aiki zazzabi a cikin LED chip. | Kowane raguwa 10°C na iya ninka tsawon rayuwa; yana da yawa yana haifar da lalacewar haske, canjin launi. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Ihe mgbanwe agba n'oge ojiji. | Na-emetụta nkwụsi ike agba na ihe ngosi ọkụ. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Usoro Chip | Ihu, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Phosphors ya daban-daban suna tasiri inganci, CCT, da CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. | Inatoa utabiri wa kisayansi wa maisha. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |