LTLR14FGFAJH213T Bicolor LED Indicator Datasheet - Orange/Yellow-Green - 20mA - 52mW - Through-Hole Package - Technical Documentation

1. Product Overview

LTLR14FGFAJH213T is a dual-color through-hole LED indicator designed specifically for use as a circuit board status indicator. It features a black plastic right-angle housing that, combined with the LED chip assembly, effectively enhances contrast and improves visual recognition. This device belongs to a family of indicator light products, offering various configurations including top-view and right-angle viewing angles. Its stackable and easy-to-assemble design makes it ideal for constructing horizontal or vertical arrays on printed circuit boards.

1.1 Main Features

• Designed to simplify circuit board assembly and integration.
• The black housing material provides a high-contrast background for the illuminated LED.
• Features low power consumption and high luminous efficiency.
• An yi amfani da tsarin samarwa mara gubar, ya bi umarnin RoHS (Ƙuntata Abubuwa Masu Cutarwa).
• Yana iya fitar da haske mai launi biyu: lemu da rawaya-kore, kuma an yi amfani da fasahar AlInGaP a cikin kayan semiconductor.
• An sanye shi da ruwan tabarau mai watsa farin haske, don samar da rarraba haske mai daidaito da faɗin kusurwa.
• Packaged in tape and reel for automated assembly processes.

1.2 Target Applications

This LED indicator is designed to provide reliability and high performance in a wide range of electronic devices. Its main application areas include:

• Computer systems:Status indicators on motherboards, servers, network switches, and peripheral devices.
• Communication Equipment:Signal and status indicators in routers, modems, telecommunications infrastructure, and network hardware.
• Consumer Electronics:Power, mode, and function indicator lights in audio-visual equipment, household appliances, and personal electronic devices.
• Industrial Control:Panel indicator lights for machinery, control systems, instrumentation, and automated equipment, where clear visual feedback is crucial in these applications.

2. Technical Parameters: In-depth and Objective Interpretation

The following sections provide a detailed and objective analysis of the device's technical specifications based on the datasheet content. Unless otherwise specified, all parameters are specified at an ambient temperature (TA) of 25°C.

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not normal operating conditions.

• Power Dissipation (PD):52 mW (applies to both orange and chartreuse). This is the maximum power the device can dissipate as heat without performance degradation.
• Peak Forward Current (IF(peak)):60 mA. This current can only be applied under pulse conditions with a duty cycle ≤1/10 and a pulse width ≤10µs. Exceeding this value in DC operation will damage the LED.
• DC Forward Current (IF):20 mA. This is the recommended normal operating continuous forward current to achieve the specified optical characteristics.
• Operating temperature range (Topr):-30°C to +85°C. The device is guaranteed to operate normally within this ambient temperature range.
• Storage temperature range (Tstg):-40°C to +100°C. The device can be stored within this temperature range without being powered.
• Pin Soldering Temperature:Maximum 260°C for a duration not exceeding 5 seconds, measured at a point 2.0mm (0.079 inches) from the LED body. This defines the thermal profile tolerance for hand or wave soldering processes.

2.2 Electrical and Optical Characteristics

These parameters define the typical performance of the device under normal operating conditions (IF=20mA, TA=25°C).

• Luminous Intensity (Iv):
  • Orange:The typical value is 140 mcd. The datasheet specifies a minimum of 23 mcd, but typical performance is significantly higher. The actual delivered intensity is subject to binning classification (see Section 4).
  • Yellow-green:The typical value is also listed as 140 mcd, following the same binning structure as the orange LED.
  • Measurement Description:Intensity measurement uses a combination of a sensor and filter approximating the CIE photopic response curve, ensuring the measured values align with human visual perception.
• Viewing Angle (2θ1/2):100 degrees (typical for two colors). This is the full angle at which the luminous intensity drops to half of its peak (on-axis) value. The white diffuser lens is responsible for achieving this wide viewing angle characteristic.
• Peak Emission Wavelength (λP):
  • Orange:611 nm (typical value).
  • Yellow-green:575 nm (typical value).
  • This is the wavelength at which the spectral power distribution of the emitted light reaches its maximum value.
• Dominant wavelength (λd):
  • Orange:Range from 598 nm (min) to 612 nm (max), typical value is 605 nm.
  • Yellow-green:Range from 565 nm (min) to 571 nm (max), typical value is 569 nm.
  • Dominant wavelength originates from the CIE chromaticity diagram, representing the perceived color of light, i.e., the monochromatic wavelength that best matches the color sensation.
• Spectral line half-width (Δλ):
  • Orange:17 nm (typical value).
  • Yellow-green:15 nm (typical value).
  • This parameter indicates the spectral purity or bandwidth of the emitted light, measured as the full width at half maximum (FWHM) of the emission peak.
• Forward Voltage (VF):
  • Orange:The range is from 2.1V (minimum) to 2.6V (typical). A maximum value is not specified in the provided table.
  • Yellow-green:Assumed to be similar, although not explicitly stated individually in the provided excerpt.
• Reverse Current (IR):Maximum 10 µA when a reverse voltage (VR) of 5V is applied.Key Considerations:The datasheet clearly states, "This device is not designed for reverse operation." This test condition is for characterization only; applying reverse bias in circuit design is not recommended.

3. Binning System Specifications

To ensure color and brightness consistency in production, LEDs are binned. The LTLR14FGFAJH213T uses a dual-code binning system for both luminous intensity and dominant wavelength.

3.1 Luminous Intensity Binning

Both orange and yellow-green LEDs are divided into three intensity grades, identified by a two-letter code (AB, CD, EF). The intensity binning code is marked on the packaging bag.

• AB Grade:23 mcd (minimum) to 50 mcd (maximum).
• CD grade:50 mcd (minimum) to 85 mcd (maximum).
• EF file:85 mcd (min) to 140 mcd (max).
• Tolerance:Each bin limit has a tolerance of ±30% during testing.

3.2 Dominant Wavelength Binning

LEDs are also binned using a numerical code based on their dominant wavelength (color point).

Yellow-green:

• Level 1:565.0 nm to 568.0 nm.
• 2nd gear:568.0 nm to 571.0 nm.

Orange (referred to as amber in the binning table):

• Grade 3:598.0 nm to 605.0 nm.
• Grade 4:605.0 nm to 612.0 nm.

Tolerance:Each wavelength bin limit has a tolerance of ±1 nm.

Design impact:For applications requiring strict color or brightness matching (e.g., multi-indicator light panels), designers should specify the required binning code or implement calibration at the circuit level to compensate for variations.

4. Performance Curve Analysis

The datasheet references typical electrical and optical characteristic curves. While specific charts are not reproduced in the provided text, they generally include the following fundamental relationships:

• Forward Current vs. Forward Voltage (I-V Curve):It demonstrates the exponential relationship between current and voltage in a semiconductor diode. The curve will have a specific "knee" voltage (approximately 2.1-2.6V), beyond which the current increases rapidly with a small increase in voltage. A current-limiting resistor must be connected in series to prevent thermal runaway.
• Luminous Intensity vs. Forward Current:Shows how light output increases with forward current. It is typically linear within the recommended operating range (up to 20mA), but saturates and eventually degrades at higher currents due to efficiency droop and heating.
• Luminous Intensity vs. Ambient Temperature:Illustrates the negative temperature coefficient of LED efficiency. As the junction temperature rises, light output typically decreases. The wide operating temperature range (-30°C to +85°C) indicates the device is designed to remain functional across this span, although output will vary.
• Spectral Distribution:A plot of relative intensity versus wavelength, showing the peak emission wavelength (λP) and spectral half-width (Δλ). The spectrum of the orange LED will be centered around 611 nm, and the yellow-green LED around 575 nm.

5. Mechanical and Packaging Information

5.1 Outline Dimensions and Structure

The device consists of a black or dark gray plastic housing (frame) and integrated pins for through-hole mounting. The LED component itself is an orange/yellow-green bicolor chip with a white diffused lens. Key mechanical specifications in the datasheet include:

• All dimensions are provided in millimeters, with inches in parentheses.
• A general tolerance of ±0.25mm (±0.010 inch) applies unless a specific feature is dimensioned with a different tolerance.
• The exact mechanical drawing showing pin pitch, body dimensions, and lens outline is referenced in the specification (implied by the "Outline Dimensions" section).

5.2 Packaging Specifications

This device is supplied in industry-standard tape and reel format, suitable for automated placement equipment.

• Carrier Tape:
  • Material: Black Conductive Polystyrene Alloy.
  • Thickness: 0.50 mm ±0.06 mm.
  • Cumulative tolerance of 10 sprocket hole pitches: ±0.20 mm.
• Reel:Standard 13-inch (330mm) diameter reel.
• Quantity per reel:500 pcs.
• Master carton packaging:
  • 2 reels (total 1000 pieces) are packed together with one humidity indicator card and desiccant into one moisture barrier bag.
  • One moisture barrier bag is packed into one inner box (1000 pieces/box).
  • 10 inner boxes are packed into one master shipping carton (total 10,000 pieces).

6. Welding and Assembly Guide

Proper handling is crucial to ensure reliability and prevent LED damage.

6.1 Storage Conditions

• Sealed Packaging (Moisture Barrier Bag):Store at ≤30°C and ≤70% relative humidity (RH). Components are usable for one year from the date code when the moisture barrier bag remains sealed.
• Opened Package:If the desiccant bag is opened, the storage environment must not exceed 30°C and 60% RH.
• Floor Life:Components removed from the original moisture barrier bag should undergo infrared reflow soldering within 168 hours (7 days).
• Long-term storage/baking:If components are stored outside the original packaging for more than 168 hours, they must be baked at approximately 60°C for at least 48 hours prior to the SMT assembly (reflow) process to drive out absorbed moisture and prevent "popcorn" effect or delamination during soldering.

6.2 Pin Forming and PCB Assembly

• Bend the pins at least 3mm away from the LED lens base.
• Do not use the base of the lead frame as a fulcrum during bending.
• All pin forming must be completedbefore solderingand at room temperature.
• When inserting into the PCB, use the minimum required clamping force to avoid applying excessive mechanical stress to the LED body or pins.

6.3 Soldering Process

• Maintain a gap of at least 2mm between the lens base and the solder joints on the pins.
• Avoid immersing the lens into the solder during wave soldering.
• Do not apply any external stress to the leads when the LED is at a high temperature due to soldering.
• Recommended soldering conditions:According to the specification, the maximum temperature is 260°C for 5 seconds when measured 2.0mm from the body. This is compatible with standard wave soldering or hand soldering temperature profiles.

6.4 Cleaning

If post-assembly cleaning is required, use only alcohol-based solvents such as isopropyl alcohol (IPA). Avoid aggressive or ultrasonic cleaning methods that may damage the plastic housing or lens.

7. Application Recommendations and Design Considerations

7.1 Typical Application Circuit

The most basic drive circuit for monochrome operation consists of a current-limiting resistor in series with the LED, connected to a DC power supply (Vcc). The resistor value (R) can be calculated using Ohm's law: R = (Vcc - VF) / IF, where VF is the LED's forward voltage (2.6V can be used for conservative design), and IF is the desired forward current (maximum 20 mA). For example, with a 5V supply: R = (5V - 2.6V) / 0.020A = 120 ohms. Standard 120Ω or 150Ω resistors are suitable. For dual-color operation, two independent current-limiting circuits are typically used, often in a common-cathode or common-anode configuration, controlled by logic signals or switches.

7.2 Design Considerations

• Current Drive:Always use constant current drive for LEDs or series resistors for current limiting. Direct connection to a voltage source will damage the LED.
• Thermal Management:Although the power consumption is low (52mW), if used in high-density arrays or high ambient temperatures, ensure sufficient spacing and possible airflow to keep the junction temperature within limits.
• Optical Design:A 100-degree wide viewing angle makes it suitable for front panel indicator lights where non-strict axial observation is required. The black housing minimizes stray light and improves contrast.
• Polarity:Pay attention to the correct anode/cathode orientation during PCB layout and assembly. Reverse connection will block current (LED off) and may cause damage if the voltage exceeds the reverse breakdown rating.

8. Technical Comparison and Differentiation

The LTLR14FGFAJH213T has several significant advantages in its category:

• Single Package Dual Color:Integrates two different colors (orange and yellow-green), saving PCB space and simplifying assembly compared to using two separate single-color LEDs.
• Right-Angle Package:The built-in right-angle bracket allows light to emit parallel to the PCB plane, making it ideal for edge-lighting or side-view indicators, which differs from top-view LEDs that emit light perpendicular to the board surface.
• AlInGaP Technology:For orange and yellow-green colors, AlInGaP semiconductors typically offer higher efficiency and better temperature stability compared to older technologies like GaAsP, resulting in brighter and more consistent output.
• Diffused Lens:The white diffuser lens provides a uniform, soft light appearance without visible chip hotspots, enhancing aesthetics and visibility from wider angles.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A1: Peak wavelength is the physical wavelength at which the LED emits its maximum optical power. Dominant wavelength is a value calculated based on human color vision (CIE chart) that best represents the perceived color. For such monochromatic LEDs, the two are usually close, but λd is the more relevant parameter for color specification.

Q2: Can I drive this LED with 30mA for higher brightness?
A2: No. The absolute maximum rating for continuous DC forward current is 20mA. Operating at 30mA exceeds this rating, which will significantly shorten lifespan, lead to rapid efficiency degradation, and may cause catastrophic failure. Always adhere to the recommended operating conditions.

Q3: The binning table shows intensity up to 140mcd, but the characteristics table lists a typical value of 140mcd. Which one is correct?
A3: Both are correct. The "Typical" value in the characteristics table represents the expected performance of the highest bin (EF bin) devices. The binning table defines the classification ranges. Not all devices will achieve the typical value; they will be distributed across the AB, CD, and EF bins.

Q4: Why are the storage and baking requirements so stringent?
A4: The plastic encapsulation of LEDs absorbs moisture from the atmosphere. During the rapid heating of the reflow soldering process, this trapped moisture vaporizes rapidly, causing internal cracks (delamination) or the "popcorn" effect, which damages the device. Moisture barrier bags, desiccants, and baking procedures are all designed to control moisture content and ensure soldering reliability.

10. Working Principle and Technology Trends

10.1 Basic Working Principles

LED (Light Emitting Diode) ni diode ya semiconductor p-n junction. Wakati voltage chanya inatumika, elektroni kutoka eneo la aina-n na mashimo kutoka eneo la aina-p huingizwa kwenye eneo la junction. Wakati hizi carrier zinapounganishwa tena, hutoa nishati kwa njia ya photon (mwanga). Wavelength maalum ya mwanga unaotolewa (rangi) imedhamiriwa na band gap ya nyenzo za semiconductor zinazotumiwa. Kwa machungwa na manjano-kijani katika kifaa hiki, AlInGaP ndio nyenzo hai, inayoruhusu mwanga wenye ufanisi katika anuwai ya wigo nyekundu hadi manjano-kijani. Utendaji wa rangi mbili unapatikana kwa kuweka chips mbili za semiconductor (moja kwa kila rangi) ndani ya kifurushi kimoja.

10.2 Industry Trends

Soko la LED za kuingizwa moja kwa moja (through-hole) ingawa limekomaa, bado linaendelea kukua kwa sambamba na teknolojia ya kushikanisha kwenye uso (SMT). Vipengele vya kuingizwa moja kwa moja kama vile LTLR14FGFAJH213T bado ni muhimu kwa matumizi yanayohitaji nguvu kubwa ya mitambo, urahisi wa kutengeneza mfano wa mikono na ukarabati, na ambapo wave soldering ndio mchakato mkuu wa kusanyiko. Mwelekeo katika uwanja huu unajumuisha mabadiliko endelevu kuelekea nyenzo zenye ufanisi zaidi (kama vile kuchukua nafasi ya GaAsP na AlInGaP), kuboresha uthabiti wa rangi kupitia binning kali zaidi, na kuunganisha rangi nyingi au utendaji ndani ya kifurushi kimoja. Zaidi ya hayo, umakini endelevu kwa uaminifu na maisha marefu yanaimarishwa, yanayosukumwa na mahitaji ya matumizi ya viwanda, magari na miundombinu. Kifurushi pia kinaendelea kubadilika ili kuwa sawa zaidi na mashine za kuingiza vipengele moja kwa moja kiotomatiki, huku kikidumisha gharama nafuu.