LTL-R14FGFAJR3HKP Bicolor DIP LED Indicator Datasheet - Size 5.0x2.5x2.0mm - Voltage 2.6V - Power 0.052W - Yellow-Green/Orange - Simplified Chinese Technical Document

1. Product Overview

This document details the technical specifications of the LTL-R14FGFAJR3HKP bi-color through-hole LED indicator. This device is designed as a Circuit Board Indicator (CBI), featuring an integrated design of a black plastic right-angle bracket (housing) and the LED light source. This design facilitates easy assembly onto a Printed Circuit Board (PCB) and offers configurations suitable for different viewing angles and array layouts.

1.1 Core Features and Advantages

• Easy to Assemble:The design is optimized for the circuit board assembly process, ensuring a straightforward and efficient assembly procedure.
• Enhanced Contrast:The black housing material enhances the contrast between the illuminated indicator and its background.
• Solid-State Reliability:Using solid-state light source technology, it has a longer service life and stronger impact resistance compared to traditional bulbs.
• High Energy Efficiency:Low power consumption, high luminous efficiency.
• Environmental Compliance:This product is a lead-free product and complies with the RoHS (Restriction of Hazardous Substances) directive.
• Light Source:Built-in dual-color AlInGaP (Aluminum Indium Gallium Phosphide) chips, under a white diffused lens, can emit yellow-green light of approximately 569nm and orange light of approximately 605nm.

1.2 Target Applications

This LED indicator is suitable for a wide range of electronic devices and indication applications, including but not limited to:

• Communication equipment
• Computer Systems and Peripherals
• Consumer Electronics
• Industrial Control and Instrumentation Panels

2. Technical Parameters: An Objective In-Depth Interpretation

2.1 Absolute Maximum Ratings

The following ratings define the limiting conditions beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (P_D):52 mW (Dual-color)
• Peak Forward Current (I_FP):60 mA (Duty Cycle ≤ 1/10, Pulse Width ≤ 10μs)
• Direct forward current (I_F):20 mA
• Operating temperature range (T_opr):-40°C to +85°C
• Storage temperature range (T_stg):-45°C to +100°C
• Pin soldering temperature:Maximum 260°C for 5 seconds, measured 2.0mm (0.079 inches) from the device body.

2.2 Electrical and Optical Characteristics

Unless otherwise specified, these parameters are specified under the condition of an ambient temperature (T_A) of 25°C and a test forward current (I_F) of 10mA.

• Luminous intensity (I_v):The typical value for both yellow-green and orange light is 38 mcd, ranging from 14 mcd (minimum) to 65 mcd (maximum). A test tolerance of ±30% is applied to the guaranteed intensity value.
• Perspective (2θ_1/2):Approximately 110 degrees, defined as the off-axis angle when the luminous intensity drops to half of the axial value.
• Peak emission wavelength (λ_P):Yellow-green light: 574 nm (typical). Orange light: 611 nm (typical).
• Dominant Wavelength (λ_d):Yellow-green light: 568 nm (typical, range 563-570 nm). Orange light: 605 nm (typical, range 598-613 nm). This is the single wavelength perceived by the human eye that defines the color.
• Spectral Line Half-Width (Δλ):Yellow-green light: 15 nm (typical). Orange light: 17 nm (typical). This indicates the spectral purity of the emitted light.
• Forward voltage (V_F):Typical value for both colors is 2.1V, with a maximum of 2.6V at I_F= 10mA.
• Reverse current (I_R):When a reverse voltage (V_R) of 5V is applied, the maximum reverse current for both colors is 10 μA.Important Note:This device is not designed for operation under reverse bias; this test condition is for characterization only.

3. Bin System Description

LEDs are sorted (binned) based on key optical parameters to ensure consistency in applications. The binning table provides reference ranges.

3.1 Luminous Intensity Binning

Under the condition of I_F= 10mA, both yellow-green and orange LEDs are divided into three intensity bins (AB, CD, EF).

• AB bin:14 mcd (minimum) to 23 mcd (maximum)
• CD gear:23 mcd (minimum) to 38 mcd (maximum)
• EF gear:38 mcd (minimum) to 65 mcd (maximum)
• Tolerance:The limit for each grade shall apply a tolerance of ±30%.

3.2 Dominant Wavelength Binning

LEDs are also binned according to their dominant wavelength to control color consistency.

• Yellow-Green Light:
  • 5th gear:563.0 nm to 567.0 nm
  • 6th gear:567.0 nm to 570.0 nm
• Orange light:
  • 3 levels:598.0 nm to 605.0 nm
  • 4th gear:605.0 nm to 613.0 nm
• Tolerance:The limit for each wavelength band shall be applied with a tolerance of ±1 nm.

4. Performance Curve Analysis

Typical performance curves illustrate the relationship between key parameters. These are essential for design simulation and understanding device behavior under non-standard conditions.

• Typical performance curves illustrate the relationship between key parameters. These curves are crucial for design simulation and understanding device behavior under non-standard conditions.Forward Current vs. Forward Voltage (I-V Curve):
• It demonstrates an exponential relationship, which is essential for designing current-limiting circuits.Forward Current vs. Luminous Intensity:
• Demonstrates how light output increases with rising current until reaching the maximum rated limit.Ambient Temperature vs. Relative Luminous Intensity:
• Illustrates that light output decreases as junction temperature rises, a key consideration for thermal management.Spectral Distribution:
• A graph of relative radiant power versus wavelength is plotted, showing the peak wavelength, dominant wavelength, and spectral width.Angular Distribution Pattern:

Polar diagram depicting the spatial distribution of luminous intensity.

Note: For precise numerical design, refer to the original datasheet for the specific graphical data of these curves.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

• This device adopts a right-angle through-hole package. Key dimensional descriptions include:
• All primary dimensions are in millimeters (inches in parentheses).
• Unless otherwise specified, the standard tolerance is ±0.25mm (0.010 inches).
• The bracket/housing is made of black plastic that complies with the UL 94V-0 flame retardant rating.

The package contains three LED chips (LED1~LED3), which are yellow-green/orange bicolor types, equipped with a white diffuser lens.

Note: Precise dimensional drawings containing specific measurements (e.g., lead pitch, body height) must be obtained from the detailed outline drawings in the original specification document.

6. Welding and Assembly Guide

• 6.1 Storage and HandlingStorage:
• Recommended storage conditions are temperature ≤30°C, relative humidity ≤70%. LEDs removed from the original packaging should be used within three months. For longer storage, please use a sealed container with desiccant or a nitrogen environment.Cleaning:

If cleaning is required, please use alcohol-based solvents such as isopropyl alcohol.

• 6.2 Lead Forming and PCB Assembly
• Bend the leads at least 3mm away from the LED lens base. Do not use the lens base as a fulcrum.All lead forming operations should be performed at room temperature, and在
• Soldering process

Before

Completed.

• When inserting the PCB, apply the minimum clamping force to avoid excessive mechanical stress on the components.6.3 Welding Process
• Maintain a minimum distance of 2mm from the lens/mount base to the solder joint. Avoid immersing the lens/mount in the solder.
  • Hand soldering (soldering iron):
  • Maximum temperature 350°C, maximum 3 seconds, only once.
  • Wave soldering:
• Preheating: maximum 120°C, up to 100 seconds.
  • Solder wave: maximum 260°C, up to 5 seconds.
  • Immersion depth must not be less than 2mm below the epoxy bulb base._LReflow soldering temperature profile (reference):
  • Preheat/Soak: 150°C to 200°C, maximum 100 seconds._PTime above liquidus (T
  • =217°C): 60 to 90 seconds._CPeak temperature (T
  • ): Maximum 250°C.

Time within specified classification temperature ±5°C (T=245°C): Maximum 30 seconds.

Total time from 25°C to peak temperature: maximum 5 minutes.

Warning:Excessive soldering temperature or time may cause lens deformation or catastrophic LED failure.6.4 Driving Method

LED is a current-driven device. To ensure uniform brightness when multiple LEDs are connected in parallel,

must

Use independent current-limiting resistors or dedicated constant-current drive circuits for each LED. It is not recommended to connect LEDs directly to a voltage source without current regulation, as this will lead to inconsistent performance and potential damage due to overcurrent.

• 7. Packaging and Ordering Information
• 7.1 Packaging Specifications
• This device is supplied in industry-standard packaging to facilitate automated assembly and protect the components. The packaging specifications typically detail:

Carrier tape width, pocket size, and reel diameter.

Number of devices per reel.

Packaging structure (e.g., devices wound in tape-and-reel packaging, placed in an inner box, then in an outer carton).

Note: Specific packaging details (e.g., reel dimensions, quantity per bag/box) are defined in the dedicated packaging specification section of the original datasheet and are subject to change.

8. Application Notes and Design Considerations

• 8.1 Recommended Application ScopeThis LED indicator is suitable for indoor and outdoor signage as well as general indication applications in standard electronic equipment. Its dual-color characteristic allows for status indication (e.g., power on/standby, mode selection) within a single component footprint._{8.2 Design Considerations}Current Limiting:_FAlways use a series resistor or constant current driver. Use the formula R = (V_FPower supply_F- V
• ) / ICalculate the resistance value, where V
• Take the maximum forward voltage (2.6V) from the datasheet to ensure safe operation under all conditions.Thermal Management:
• Although the power consumption is low, maintaining the LED junction temperature within its specified range ensures long-term reliability and stable light output. Avoid placing the LED near other heat-generating components.Reverse Voltage Protection:

Since this device is not designed for reverse bias, ensure the circuit design prevents any reverse voltage from being applied across the LED.

Optical Design:

• 110-degree viewing angle and white diffused lens provide a wide, uniform illumination appearance, suitable for panel indicator lights.9. Technical Comparison and Differentiation
• Although a direct comparison requires specific competitor data, based on its datasheet, the key differentiating features of this device include:Dual-color in a single package:
• Integrating two different colors (yellow-green and orange) into a standard through-hole package saves PCB space compared to using two separate monochromatic LEDs.Right-angle bracket design:
• The integrated black right-angle housing simplifies assembly and provides built-in contrast enhancement, eliminating the need for separate light pipes or spacers in many applications.AlInGaP Technology:

Both colors utilize AlInGaP chips, which typically provide high luminous efficiency and good temperature stability for these specific wavelengths.

1. Detailed Binning:
   Provide separate bins for luminous intensity and dominant wavelength for each color, allowing for stricter color and brightness matching in critical applications._P10. Frequently Asked Questions (Based on Technical Parameters)_dQ: What is the difference between peak wavelength and dominant wavelength?
2. A: Peak wavelength (λ
   ) is the wavelength at which the emitted optical power is greatest. Dominant wavelength (λ
3. ) Derived from chromaticity coordinates, it represents the single wavelength that best matches the human eye's perception of color. Designers typically use the dominant wavelength for color specification definition.
   Q: Can I drive this LED at 20mA like many standard LEDs?
4. A: The absolute maximum rating for DC forward current is 20mA. However, the electrical/optical characteristics are specified at 10mA. To ensure long-term reliable operation and stay within the 52mW power dissipation limit, it is recommended to design the forward current at 10mA or lower, as used in the specification data.
   Q: Why is there a ±30% tolerance for luminous intensity binning limits?
5. A: This is to account for the variability of measurement systems during production testing. This means a device at the minimum bin limit (e.g., 14 mcd) in one test system may measure between approximately 9.8 mcd and 18.2 mcd on another calibrated system. Designers should use the minimum value of the bin for worst-case brightness calculations.
   Q: How to achieve different colors?

A: A bi-color LED contains two different semiconductor chips. Applying forward current to one set of pins will cause the yellow-green chip to emit light. Applying forward current (with correct polarity) to the other set of pins will cause the orange chip to emit light. The circuit must be designed to control the current flow through the respective chip.

• Q: Is a heat sink required?A: Considering the low power consumption (maximum 52mW), a dedicated heat sink is typically not required for most applications within the specified operating temperature range. Proper PCB layout and avoiding enclosed, unventilated spaces are usually sufficient.
• 11. Practical Application ExamplesNetwork Router Status Panel:
• Use yellow-green LED to indicate "Power On/Active", orange LED to indicate "Standby/Data Active". Right-angle design allows light to be emitted sideways for optimal panel visibility.Industrial Control Box:

Use this LED on the control board as a multi-state indicator. For example, steady yellow-green indicates "System Normal", flashing orange indicates "Warning", and alternating colors indicate specific fault codes.

Consumer Audio Equipment:

Utilize its dual-color function to display input source selection on the front panel within a single component footprint (e.g., orange for "AUX," yellow-green for "Bluetooth").

12. How It Works