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LTL-R14FTGFH132T LED Lamp Specification Sheet - 5mm Right Angle - 3.0V/2.0V - 75mW/50mW - Green/Red-Orange - Simplified Chinese Technical Document

Complete technical specification sheet for the LTL-R14FTGFH132T through-hole LED lamp. Includes specifications, electrical/optical characteristics, binning, packaging, and application guidelines for the green (530nm) and red-orange (611nm) models.
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PDF Document Cover - LTL-R14FTGFH132T LED Datasheet - 5mm Right Angle - 3.0V/2.0V - 75mW/50mW - Green/Red Orange - Simplified Chinese Technical Document

1. Product Overview

LTL-R14FTGFH132T is a through-hole mount LED lamp designed for use as a Circuit Board Indicator (CBI). It features a black plastic right-angle bracket (housing) combined with an LED element, providing a solid-state light source suitable for various electronic devices. The product is designed for easy assembly onto a Printed Circuit Board (PCB).

1.1 Core Features and Advantages

1.2 Target Applications

This LED is suitable for a wide range of electronic applications, including but not limited to:

2. Technical Parameters: An Objective In-depth Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended as it may affect reliability.

2.2 Electrical and Optical Characteristics

These parameters are measured at an ambient temperature (TA) of 25°C, defining the typical performance of the device.

3. Bin System Description

LEDs are sorted (binned) according to key optical parameters to ensure consistency within the same production batch. The binning code is marked on the packaging bag.

3.1 Luminous Intensity Binning

LED an rarraba su bisa ga ƙarfinsa na haske da aka auna a ƙarƙashin 5mA.

Rarrabawar LED kore:
EF: 85 - 140 mcd
GH: 140 - 240 mcd
JK: 240 - 400 mcd

Red-orange LED binning:
3Y3Z: 18 - 30 mcd
AB: 30 - 50 mcd
CD: 50 - 85 mcd

Note: The tolerance for each grade limit is ±15%.

3.2 Dominant Wavelength Binning

LEDs are also grouped according to their dominant wavelength to control color consistency.

Green LED Wavelength Binning:
1: 520 - 525 nm
2: 525 - 530 nm
3: 530 - 535 nm

Red-orange LED wavelength binning:
1: 596 - 600 nm
2: 600 - 606 nm
3: 606 - 612 nm

Note: The tolerance for each bin limit is ±1 nm.

4. Performance Curve Analysis

Typical performance curves (as referenced in the datasheet) illustrate the relationship between key parameters. This is crucial for understanding the device's behavior under different operating conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between the current flowing through the LED and the voltage across its terminals. Green (higher VF) and red-orange (lower VFThe curve for different models will vary. Designers use this curve to select an appropriate current-limiting resistor for a given power supply voltage.

4.2 Luminous Intensity vs. Forward Current

This curve shows how the light output increases with the drive current. It is typically linear within the recommended operating range but saturates at higher currents. Operating beyond the absolute maximum ratings may lead to accelerated aging or failure.

4.3 Luminous Intensity vs. Ambient Temperature

The light output of an LED decreases as its junction temperature increases. This curve is crucial for applications operating over a wide temperature range, as it helps predict the minimum light output at the maximum operating temperature.

4.4 Spectral Distribution

These charts show the relative radiant power of each LED color across the entire wavelength spectrum. The green LED will show a peak near 530nm, while the red-orange LED shows a peak near 611nm. The FWHM value indicates the spectral broadening.

5. Mechanical and Packaging Information

5.1 External Dimensions

This device utilizes a standard T-1 (5mm) LED lamp, encapsulated within a black plastic right-angle bracket. Key dimensional specifications include:

Note: For specific dimensions, please refer to the detailed dimension drawing in the original specification.

5.2 Polarity Identification

Through-hole LEDs typically have a longer anode (+) pin and a shorter cathode (-) pin. Additionally, the LED casing usually has a flat edge near the cathode pin. Correct polarity must be observed during assembly.

5.3 Packaging Specification

LEDs are supplied in tape and reel packaging, suitable for automated assembly.

6. Welding and Assembly Guide

6.1 Storage Conditions

6.2 Pin Forming and Processing

6.3 Soldering Process

6.4 Cleaning

If cleaning is required after soldering, use alcohol-based solvents such as isopropanol. Avoid using strong or unknown chemical cleaners that may damage plastic lenses or housings.

7. Application Recommendations

7.1 Typical Application Circuit

The most common application is as a status indicator powered by a DC voltage rail (e.g., 3.3V, 5V, 12V). The current-limiting resistor (Rseries) is required, and calculated using Ohm's Law: Rseries= (Vsupply- VF) / IF. For conservative design, please use the typical value or maximum V from the datasheet.F. For example, to drive a green LED with a 5V supply at 5mA: R = (5V - 3.0V) / 0.005A = 400 Ω. A standard 390 Ω or 430 Ω resistor is suitable.

7.2 Design Considerations

8. Technical Comparison and Differentiation

LTL-R14FTGFH132T yana ba da takamaiman fa'idodi a cikin rukuninsa:

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What value of resistor should be used when operating with a 5V power supply?

It depends on the required current and LED color. For a green LED at 5mA: R ≈ (5V - 3.0V) / 0.005A = 400Ω. For a red-orange LED at 5mA: R ≈ (5V - 2.0V) / 0.005A = 600Ω. For conservative design, to ensure the target current is not exceeded, always use the maximum supply voltage and minimum VFfor the calculation.

9.2 Can I operate this LED continuously at 20mA?

Ndiyo, 20mA ndiyo mkondo wa moja kwa moja unaopendekezwa kwa kiwango cha juu. Hata hivyo, kwa matumizi ya kawaida ya kiashiria, 5-10mA kwa kawaida inatosha, na itapunguza matumizi ya nguvu, na inaweza kuongeza maisha ya huduma. Hakikisha muundo wako hauzidi nguvu kamili ya juu zaidi (kijani kibichi 75mW, nyekundu-machungwa 50mW) chini ya mkondo uliochaguliwa na voltage halisi ya mbele.

9.3 Why is there a ±15% tolerance for luminous intensity?

This tolerance accounts for measurement deviations and minor production variations even within the same bin. The binning system (EF, GH, JK, etc.) provides a tighter guaranteed range. The ±15% applies to the limits of these bins, meaning a part from the GH bin (140-240 mcd) is guaranteed to be within 140±15% and 240±15% mcd.

9.4 How critical is the 168-hour floor life after opening the packaging bag?

This is a recommended guideline to prevent moisture-related soldering defects. If exposed components absorb excessive moisture from the ambient air, rapid heating during soldering can cause internal delamination or cracking. If this limit is exceeded, please follow the baking procedure (60°C, 48 hours) prior to soldering.

10. Practical Application Examples

Scenario: Designing a multi-state panel for a network router.

The designer is creating a front panel with three indicator lights: Power (green), Network Activity (flashing green), and Fault (red-orange).

  1. Component Selection:They selected LTL-R14FTGFH132T for all three positions. The right-angle bracket provides a consistent, professional appearance and simplifies assembly. The black housing ensures high contrast with the panel.
  2. Circuit Design:The system uses a 3.3V MCU power rail. For the green "Power" LED, they chose to drive it at 8mA for good visibility. Using a typical VFvalue of 3.0V: R = (3.3V - 3.0V) / 0.008A = 37.5Ω. A 39Ω resistor was selected. Using its V for the red-orange LED.FPerform the same calculation for a value of 2.0V.
  3. Bin consideration:To ensure the brightness of the two green LEDs (power and activity) matches, the designer specified the same luminous intensity bin (e.g., GH) for both in the Bill of Materials (BOM).
  4. PCB layout:PCB footprint is designed according to the dimension drawing in the datasheet. The designer ensures correct hole spacing and aperture, and provides a clear silkscreen mark for the cathode (flat side).
  5. Assembly and Storage:The production team receives components packaged in tape and reel. They ensure the moisture barrier bag is opened only shortly before needed on the assembly line, adhering to the 168-hour guideline. Any remaining reels are stored in a dry cabinet.

11. Brief Introduction to Working Principles

A Light Emitting Diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region.

12. Technology Trends

Although through-hole LEDs like the T-1 package remain crucial for many applications, especially in prototyping, industrial control, and areas requiring manual assembly or high reliability, the broader trends in the LED industry are also noteworthy:

LTL-R14FTGFH132T represents a mature, reliable, and well-specified component that continues to effectively serve a wide range of basic electronic indicator needs.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical energy, the higher the more energy-efficient. Directly determines the energy efficiency class and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determine if the lamp is bright enough.
Viewing Angle ° (degrees), such as 120° The angle at which light intensity drops to half, determining the beam's width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting ambiance and suitable application scenarios.
Color Rendering Index (CRI / Ra) No unit, 0–100 The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM) MacAdam Ellipse Steps, e.g., "5-step" Quantitative indicator of color consistency, the smaller the step number, the more consistent the color. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), e.g., 620nm (Red) The wavelength value corresponding to the color of a colored LED. Determine the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbols Popular Explanation Design Considerations
Forward Voltage Vf Minimum voltage required to turn on an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series.
Forward Current If The current value that allows the LED to emit light normally. An da yawanci ake amfani da kwararar ruwa mai tsayayye, kuma ƙarfin ruwa yana ƙayyadaddun haske da tsawon rayuwa.
Mafi girman ƙarfin ruwan bugun jini (Pulse Current) Ifp Peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit needs to prevent reverse connection or voltage surge.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), such as 1000V Anti-static strike capability, the higher the value, the less susceptible to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of the initial value. Directly defines the "useful life" of an LED.
Lumen Maintenance % (e.g., 70%) Percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to long-term high temperature. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Encapsulation and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Package Type EMC, PPA, Ceramic Material casing yang melindungi chip dan menyediakan antarmuka optik serta termal. EMC tahan panas baik, biaya rendah; keramik disipasi panas unggul, umur panjang.
Struktur chip Front-side, Flip Chip Chip Electrode Layout Method. Flip-chip provides better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Planar, Microlens, Total Internal Reflection Optical structures on the encapsulation surface control light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Content of the grade Popular Explanation Purpose
Luminous flux grading Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure uniform brightness for products within the same batch.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color Grading 5-step MacAdam Ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven colors within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term illumination under constant temperature conditions, recording brightness attenuation data. Used to estimate LED lifetime (combined with TM-21).
TM-21 Standard for Life Projection Projecting the lifespan under actual use conditions based on LM-80 data. Provide scientific life prediction.
IESNA standard Standard of the Illuminating Engineering Society Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification Ensure the product does not contain harmful substances (e.g., lead, mercury). Market access requirements for entering the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy efficiency and performance certification for lighting products. Yawan da ake amfani da shi a cikin sayayyar gwamnati da ayyukan tallafi, don haɓaka gasar kasuwa.