Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Target Applications
- 2. Technical Parameters: An Objective In-depth Interpretation
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Bin System Description
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Luminous Intensity vs. Ambient Temperature
- 4.4 Spectral Distribution
- 5. Mechanical and Packaging Information
- 5.1 External Dimensions
- 5.2 Polarity Identification
- 5.3 Packaging Specification
- 6. Welding and Assembly Guide
- 6.1 Storage Conditions
- 6.2 Pin Forming and Processing
- 6.3 Soldering Process
- 6.4 Cleaning
- 7. Application Recommendations
- 7.1 Typical Application Circuit
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 9.1 What value of resistor should be used when operating with a 5V power supply?
- 9.2 Can I operate this LED continuously at 20mA?
- 9.3 Why is there a ±15% tolerance for luminous intensity?
- 9.4 How critical is the 168-hour floor life after opening the packaging bag?
- 10. Practical Application Examples
- 11. Brief Introduction to Working Principles
- 12. Technology Trends
1. Product Overview
LTL-R14FTGFH132T is a through-hole mount LED lamp designed for use as a Circuit Board Indicator (CBI). It features a black plastic right-angle bracket (housing) combined with an LED element, providing a solid-state light source suitable for various electronic devices. The product is designed for easy assembly onto a Printed Circuit Board (PCB).
1.1 Core Features and Advantages
- Easy to Assemble:Design optimization facilitates direct assembly onto the circuit board.
- Enhanced Contrast:The black housing enhances the visual contrast of the illuminated indicator light.
- Solid-State Reliability:Utilizes LED technology to provide a durable, shock-resistant light source.
- High Energy Efficiency:Features low power consumption and high luminous efficacy.
- Environmental Compliance:This is a lead-free product compliant with the RoHS directive.
- Optical Design:The T-1 (5mm) lamp is available in two colors: a 530nm green based on InGaN and a 600nm red-orange based on AlInGaP, both featuring a white diffused lens for a wide viewing angle.
1.2 Target Applications
This LED is suitable for a wide range of electronic applications, including but not limited to:
- Status indicator for communication equipment.
- Status lights for computers and peripheral devices.
- Consumer electronics, such as audio-video equipment, home appliances, and toys.
2. Technical Parameters: An Objective In-depth Interpretation
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended as it may affect reliability.
- Power Dissipation (Pd):Green: max 75 mW; Red-Orange: max 50 mW. This parameter is crucial for thermal management design.
- Peak Forward Current (IFP):Both colors are 60 mA. This is the maximum pulse current allowed under specific conditions (duty cycle ≤ 1/10, pulse width ≤ 10µs).
- DC Forward Current (IF):Both colors are 20 mA. This is the recommended maximum continuous operating current.
- Operating temperature range (Topr):-30°C to +85°C. The device is guaranteed to operate normally within this ambient temperature range.
- Storage temperature range (Tstg):-40°C to +100°C.
- Pin soldering temperature:Maximum 260°C for 5 seconds, measurement point 2.0mm (0.079 inches) from LED body. This is critical for hand soldering or wave soldering processes.
2.2 Electrical and Optical Characteristics
These parameters are measured at an ambient temperature (TA) of 25°C, defining the typical performance of the device.
- Luminous intensity (Iv):Measured at IF= 5mA. Green: typical value 310 mcd (minimum 85, maximum 400 mcd). Red-orange: typical value 65 mcd (minimum 18, maximum 240 mcd). Actual intensity is binned (see Section 4). Guaranteed Iv.
- Viewing angle (2θ1/2):Both colors have a viewing angle of approximately 100 degrees. This is the full angle at which the luminous intensity drops to half of its axial (on-axis) value, indicating a wide, diffuse light pattern.
- Peak Wavelength (λP):Green: 530 nm; Red-Orange: 611 nm. This is the wavelength at which the spectral emission is strongest.
- Dominant Wavelength (λd):Green: 520-535 nm; Red-orange: 596-612 nm. This is the single wavelength perceived by the human eye, derived from the CIE chromaticity diagram. It is also binned (see Section 4).
- Spectral line half-width (Δλ):Green: 17 nm; Red-orange: 20 nm. This indicates the spectral purity or bandwidth of the emitted light.
- Forward voltage (VF):Measured at IF= 5mA ake yi. Green: typical value 3.0V (minimum 2.0V, maximum 4.0V). Red-orange: typical value 2.0V (minimum 1.5V, maximum 3.0V). This is crucial for calculating the current-limiting resistor.
- Reverse current (IR):At VR= 5V, the maximum for both colors is 10 µA.
3. Bin System Description
LEDs are sorted (binned) according to key optical parameters to ensure consistency within the same production batch. The binning code is marked on the packaging bag.
3.1 Luminous Intensity Binning
LED an rarraba su bisa ga ƙarfinsa na haske da aka auna a ƙarƙashin 5mA.
Rarrabawar LED kore:
EF: 85 - 140 mcd
GH: 140 - 240 mcd
JK: 240 - 400 mcd
Red-orange LED binning:
3Y3Z: 18 - 30 mcd
AB: 30 - 50 mcd
CD: 50 - 85 mcd
Note: The tolerance for each grade limit is ±15%.
3.2 Dominant Wavelength Binning
LEDs are also grouped according to their dominant wavelength to control color consistency.
Green LED Wavelength Binning:
1: 520 - 525 nm
2: 525 - 530 nm
3: 530 - 535 nm
Red-orange LED wavelength binning:
1: 596 - 600 nm
2: 600 - 606 nm
3: 606 - 612 nm
Note: The tolerance for each bin limit is ±1 nm.
4. Performance Curve Analysis
Typical performance curves (as referenced in the datasheet) illustrate the relationship between key parameters. This is crucial for understanding the device's behavior under different operating conditions.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship between the current flowing through the LED and the voltage across its terminals. Green (higher VF) and red-orange (lower VFThe curve for different models will vary. Designers use this curve to select an appropriate current-limiting resistor for a given power supply voltage.
4.2 Luminous Intensity vs. Forward Current
This curve shows how the light output increases with the drive current. It is typically linear within the recommended operating range but saturates at higher currents. Operating beyond the absolute maximum ratings may lead to accelerated aging or failure.
4.3 Luminous Intensity vs. Ambient Temperature
The light output of an LED decreases as its junction temperature increases. This curve is crucial for applications operating over a wide temperature range, as it helps predict the minimum light output at the maximum operating temperature.
4.4 Spectral Distribution
These charts show the relative radiant power of each LED color across the entire wavelength spectrum. The green LED will show a peak near 530nm, while the red-orange LED shows a peak near 611nm. The FWHM value indicates the spectral broadening.
5. Mechanical and Packaging Information
5.1 External Dimensions
This device utilizes a standard T-1 (5mm) LED lamp, encapsulated within a black plastic right-angle bracket. Key dimensional specifications include:
- All dimensions are in millimeters (inches in parentheses).
- Unless otherwise specified, the standard tolerance is ±0.25mm (0.010 inches).
- The housing material is black plastic.
- LED lamp itself has a white diffusing lens.
Note: For specific dimensions, please refer to the detailed dimension drawing in the original specification.
5.2 Polarity Identification
Through-hole LEDs typically have a longer anode (+) pin and a shorter cathode (-) pin. Additionally, the LED casing usually has a flat edge near the cathode pin. Correct polarity must be observed during assembly.
5.3 Packaging Specification
LEDs are supplied in tape and reel packaging, suitable for automated assembly.
- Carrier Tape:Made from black conductive polystyrene alloy, thickness 0.50 ±0.06 mm.
- Reel quantity:Provided on 13-inch reels, containing 100, 200, or 400 pieces.
- Carton packaging:
- One reel is packaged in a Moisture Barrier Bag (MBB) together with one Humidity Indicator Card and desiccant.
- Two Moisture Barrier Bags (assuming 400 pieces per reel, 800 pieces total) are packaged in one inner box.
- Ten inner boxes (total 8000 pieces) are packed in one outer carton.
6. Welding and Assembly Guide
6.1 Storage Conditions
- Sealed Packaging:Store at ≤30°C and ≤70% RH. Use within one year after the package sealing date.
- Opened Packaging:If the Moisture Barrier Bag (MBB) is opened, the storage environment shall not exceed 30°C and 60% RH.
- Floor Life:Components removed from the original Moisture Barrier Bag shall be soldered within 168 hours (7 days) (e.g., for SMT components via IR reflow; for through-hole components, this refers to general assembly/wave soldering preparation).
- Extended Storage/Baking:For components stored outside their original packaging for more than 168 hours, it is recommended to bake them at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent "popcorn" effect or other moisture-induced defects.
6.2 Pin Forming and Processing
- Bend the leads at least 3mm away from the LED lens base.
- Do not use the base of the lead frame as a fulcrum during bending.
- All lead forming operations should be performed at room temperature, and在 soldering.
- During PCB assembly, apply the minimum necessary clamping force to avoid excessive mechanical stress on the LED body.
6.3 Soldering Process
- Keep the minimum gap between the lens base and the solder joint at 2mm.
- Avoid immersing the lens in solder.
- Do not apply external stress to the pins when the LED is at a high temperature due to soldering.
- Hand soldering is recommended:Use a temperature-controlled soldering iron. The tip temperature should be set appropriately according to the solder alloy. The soldering time per pin should be minimized, typically not exceeding 3-5 seconds, and the absolute maximum of 260°C for 5 seconds at 2mm from the body must be observed.
6.4 Cleaning
If cleaning is required after soldering, use alcohol-based solvents such as isopropanol. Avoid using strong or unknown chemical cleaners that may damage plastic lenses or housings.
7. Application Recommendations
7.1 Typical Application Circuit
The most common application is as a status indicator powered by a DC voltage rail (e.g., 3.3V, 5V, 12V). The current-limiting resistor (Rseries) is required, and calculated using Ohm's Law: Rseries= (Vsupply- VF) / IF. For conservative design, please use the typical value or maximum V from the datasheet.F. For example, to drive a green LED with a 5V supply at 5mA: R = (5V - 3.0V) / 0.005A = 400 Ω. A standard 390 Ω or 430 Ω resistor is suitable.
7.2 Design Considerations
- Current Drive:To achieve the longest service life and stable light output, please drive the LED at or below the recommended DC forward current (20mA). For indicator applications, using a lower current (e.g., 5-10mA) is common and can improve efficiency and lifespan.
- Thermal Management:Although power consumption is low, ensure sufficient airflow within the housing if multiple LEDs are used or if the ambient temperature is high. Operating at high currents increases junction temperature, thereby reducing light output and lifespan.
- Viewing Angle:A 100-degree viewing angle makes this LED suitable for applications where the indicator needs to be visible from a wide range of positions.
- Color Options:Don irin wannan ƙarfin haske (mcd), LED kore yawanci yana bayyana da haske a idon mutum fiye da ja-orange. Wannan ya kamata a yi la'akari da shi lokacin daidaita haske a cikin nunin launuka da yawa.
8. Technical Comparison and Differentiation
LTL-R14FTGFH132T yana ba da takamaiman fa'idodi a cikin rukuninsa:
- Right-angle form factor:The integrated right-angle black bracket distinguishes it from standard radial LEDs, offering built-in spacing and a specific mounting orientation without the need for a separate socket.
- Contrast enhancement:The black housing is a key feature that significantly improves the contrast between the off state (black) and the lit state (colored light), making the indicator easier to read, especially under bright ambient light.
- Binning Ensures Consistency:It provides detailed luminous intensity and wavelength binning, allowing designers to select components for applications requiring strict color or brightness matching between multiple indicators.
- The same package offers dual-color options:Providing both green and red-orange models in the same mechanical package simplifies inventory and PCB design for systems using multiple status colors.
9. Frequently Asked Questions (Based on Technical Parameters)
9.1 What value of resistor should be used when operating with a 5V power supply?
It depends on the required current and LED color. For a green LED at 5mA: R ≈ (5V - 3.0V) / 0.005A = 400Ω. For a red-orange LED at 5mA: R ≈ (5V - 2.0V) / 0.005A = 600Ω. For conservative design, to ensure the target current is not exceeded, always use the maximum supply voltage and minimum VFfor the calculation.
9.2 Can I operate this LED continuously at 20mA?
Ndiyo, 20mA ndiyo mkondo wa moja kwa moja unaopendekezwa kwa kiwango cha juu. Hata hivyo, kwa matumizi ya kawaida ya kiashiria, 5-10mA kwa kawaida inatosha, na itapunguza matumizi ya nguvu, na inaweza kuongeza maisha ya huduma. Hakikisha muundo wako hauzidi nguvu kamili ya juu zaidi (kijani kibichi 75mW, nyekundu-machungwa 50mW) chini ya mkondo uliochaguliwa na voltage halisi ya mbele.
9.3 Why is there a ±15% tolerance for luminous intensity?
This tolerance accounts for measurement deviations and minor production variations even within the same bin. The binning system (EF, GH, JK, etc.) provides a tighter guaranteed range. The ±15% applies to the limits of these bins, meaning a part from the GH bin (140-240 mcd) is guaranteed to be within 140±15% and 240±15% mcd.
9.4 How critical is the 168-hour floor life after opening the packaging bag?
This is a recommended guideline to prevent moisture-related soldering defects. If exposed components absorb excessive moisture from the ambient air, rapid heating during soldering can cause internal delamination or cracking. If this limit is exceeded, please follow the baking procedure (60°C, 48 hours) prior to soldering.
10. Practical Application Examples
Scenario: Designing a multi-state panel for a network router.
The designer is creating a front panel with three indicator lights: Power (green), Network Activity (flashing green), and Fault (red-orange).
- Component Selection:They selected LTL-R14FTGFH132T for all three positions. The right-angle bracket provides a consistent, professional appearance and simplifies assembly. The black housing ensures high contrast with the panel.
- Circuit Design:The system uses a 3.3V MCU power rail. For the green "Power" LED, they chose to drive it at 8mA for good visibility. Using a typical VFvalue of 3.0V: R = (3.3V - 3.0V) / 0.008A = 37.5Ω. A 39Ω resistor was selected. Using its V for the red-orange LED.FPerform the same calculation for a value of 2.0V.
- Bin consideration:To ensure the brightness of the two green LEDs (power and activity) matches, the designer specified the same luminous intensity bin (e.g., GH) for both in the Bill of Materials (BOM).
- PCB layout:PCB footprint is designed according to the dimension drawing in the datasheet. The designer ensures correct hole spacing and aperture, and provides a clear silkscreen mark for the cathode (flat side).
- Assembly and Storage:The production team receives components packaged in tape and reel. They ensure the moisture barrier bag is opened only shortly before needed on the assembly line, adhering to the 168-hour guideline. Any remaining reels are stored in a dry cabinet.
11. Brief Introduction to Working Principles
A Light Emitting Diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region.
- In this productGreen LEDUsing indium gallium nitride (InGaN) compound semiconductor, whose band gap corresponds to light in the blue-green spectrum.
- In this productRed-orange LEDUsing aluminum indium gallium phosphide (AlInGaP) compound semiconductor, whose band gap corresponds to light in the yellow-red spectrum.
- In this productWhite diffuser lensMade from epoxy or silicone with scattering particles. It serves two purposes: 1) Protect the fragile semiconductor chip; 2) Scatter light, which, compared to a transparent lens, broadens the viewing angle and creates a more uniform, softer appearance.
12. Technology Trends
Although through-hole LEDs like the T-1 package remain crucial for many applications, especially in prototyping, industrial control, and areas requiring manual assembly or high reliability, the broader trends in the LED industry are also noteworthy:
- Miniaturization:There is a strong trend towards smaller surface-mount device (SMD) packages (e.g., 0603, 0402) for high-density PCB design. However, through-hole components offer superior mechanical strength and are often preferred in high-vibration environments.
- Efficiency Improvement:Ongoing improvements in internal quantum efficiency and light extraction techniques are continuously increasing the luminous efficacy (more light output per watt of electrical input) for all LED colors, including green and red.
- Color Consistency and Binning:Advances in epitaxial growth and manufacturing control have continuously reduced variations in wavelength and intensity, enabling tighter binning and reducing the need for sorting, although precise binning remains crucial for high-end applications.
- Smart Integration:The growth of "smart" indicator lights that integrate control ICs (for dimming, sequencing, or addressability) directly into the LED package. While this is more common in SMD RGB LEDs, the demand for intelligent status indication may influence future through-hole form factors.
LTL-R14FTGFH132T represents a mature, reliable, and well-specified component that continues to effectively serve a wide range of basic electronic indicator needs.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical energy, the higher the more energy-efficient. | Directly determines the energy efficiency class and electricity cost of the luminaire. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determine if the lamp is bright enough. |
| Viewing Angle | ° (degrees), such as 120° | The angle at which light intensity drops to half, determining the beam's width. | Affects the illumination range and uniformity. |
| Color Temperature (CCT) | K (Kelvin), e.g., 2700K/6500K | The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. | Determines the lighting ambiance and suitable application scenarios. |
| Color Rendering Index (CRI / Ra) | No unit, 0–100 | The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended. | Affects color fidelity, used in high-demand places such as shopping malls and art galleries. |
| Color Tolerance (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | Quantitative indicator of color consistency, the smaller the step number, the more consistent the color. | Ensure no color difference among the same batch of luminaires. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (Red) | The wavelength value corresponding to the color of a colored LED. | Determine the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Shows the intensity distribution of light emitted by an LED across various wavelengths. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbols | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage required to turn on an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that allows the LED to emit light normally. | An da yawanci ake amfani da kwararar ruwa mai tsayayye, kuma ƙarfin ruwa yana ƙayyadaddun haske da tsawon rayuwa. |
| Mafi girman ƙarfin ruwan bugun jini (Pulse Current) | Ifp | Peak current that can be withstood in a short time, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | The circuit needs to prevent reverse connection or voltage surge. |
| Thermal Resistance | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will increase. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | Anti-static strike capability, the higher the value, the less susceptible to damage from static electricity. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for brightness to drop to 70% or 80% of the initial value. | Directly defines the "useful life" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | Percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to long-term high temperature. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Encapsulation and Materials
| Terminology | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Material casing yang melindungi chip dan menyediakan antarmuka optik serta termal. | EMC tahan panas baik, biaya rendah; keramik disipasi panas unggul, umur panjang. |
| Struktur chip | Front-side, Flip Chip | Chip Electrode Layout Method. | Flip-chip provides better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Planar, Microlens, Total Internal Reflection | Optical structures on the encapsulation surface control light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Terminology | Content of the grade | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous flux grading | Codes such as 2G, 2H | Grouped by brightness level, each group has a minimum/maximum lumen value. | Ensure uniform brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Group by forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color Grading | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Grouped by color temperature, each group has a corresponding coordinate range. | To meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Popular Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term illumination under constant temperature conditions, recording brightness attenuation data. | Used to estimate LED lifetime (combined with TM-21). |
| TM-21 | Standard for Life Projection | Projecting the lifespan under actual use conditions based on LM-80 data. | Provide scientific life prediction. |
| IESNA standard | Standard of the Illuminating Engineering Society | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental certification | Ensure the product does not contain harmful substances (e.g., lead, mercury). | Market access requirements for entering the international market. |
| ENERGY STAR / DLC | Energy Efficiency Certification | Energy efficiency and performance certification for lighting products. | Yawan da ake amfani da shi a cikin sayayyar gwamnati da ayyukan tallafi, don haɓaka gasar kasuwa. |