Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Hue (Dominant Wavelength) Binning
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Tolerances
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Lead Forming and PCB Assembly
- 6.2 Soldering Process
- 6.3 Cleaning
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Part Number and Labeling
- 8. Application Recommendations
- 8.1 Typical Application Circuits
- 8.2 Electrostatic Discharge (ESD) Protection
- 8.3 Storage Conditions
- 9. Technical Comparison and Design Considerations
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Practical Application Example
- 12. Operating Principle Introduction
- 13. Technology Trends and Context
1. Product Overview
This document provides the complete technical specifications for a high-efficiency, through-hole mounted LED lamp. The device is designed for general-purpose indicator and illumination applications where reliable performance and clear visibility are required. It utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology to produce a yellow-orange light output. The product is characterized by its popular T-1 3/4 package diameter, making it compatible with a wide range of standard PCB layouts and panel cutouts.
Babban fa'idodin wannan kayan aikin sun haɗa da fitowar haske mai ƙarfi, wanda ke tabbatar da bayyane mai haske ko da a cikin yanayi mai haske, da ƙarancin amfani da wutar lantarki, yana ba da gudummawa ga ƙirar tsarin mai inganci. An tsara shi don haɗawa da yawa akan allunan da'ira da aka buga ko kai tsaye akan alluna. Na'urar kuma tana dacewa da IC, tana da ƙarancin buƙatun wutar lantarki wanda ke ba da damar tuƙi kai tsaye daga yawancin fitar da matakin dabaru tare da madaidaicin resistor na jerin.
Kasuwar da aka yi niyya don wannan LED ta ƙunshi fa'ida mai faɗi na kayan lantarki, gami da na'urori na sarrafa ofis, kayan aikin sadarwa, na'urorin masu amfani, da aikace-aikacen gida daban-daban. Ƙirarta ta fifita daidaiton aiki, aminci, da sauƙin haɗawa.
2. In-Depth Technical Parameter Analysis
2.1 Absolute Maximum Ratings
The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (TA) of 25°C. The maximum continuous power dissipation is 120 mW. The DC forward current should not exceed 50 mA under normal operating conditions. For pulsed operation, a peak forward current of 90 mA is permissible under specific conditions: a 1/10 duty cycle and a pulse width of 0.1 ms.
The device can withstand a reverse voltage of up to 5 V. The operating temperature range is specified from -40°C to +80°C, while the storage temperature range is wider, from -55°C to +100°C. For soldering, the leads can be subjected to a temperature of 260°C for a maximum of 5 seconds, provided the soldering point is at least 2 mm (0.08 inches) away from the body of the LED.
A derating factor of 0.75 mA/°C applies to the DC forward current from 40°C upwards. This means that as the ambient temperature increases beyond 40°C, the maximum allowable continuous current must be reduced linearly to prevent overheating and ensure long-term reliability.
2.2 Electrical and Optical Characteristics
The electrical and optical characteristics are the key performance parameters under typical operating conditions, also specified at TA=25°C.
Optical Parameters:
- Luminous Intensity (IV): This is the measure of the perceived power of light. The value ranges from a minimum of 3200 mcd (millicandela) to a typical 9300 mcd when driven at a forward current (IF) of 20 mA. The measurement is performed using a sensor and filter combination that approximates the standard CIE photopic eye-response curve. A tolerance of ±15% is applied to the guaranteed luminous intensity value.
- Viewing Angle (2θ1/2): Defined as the full angle at which the luminous intensity is half of the intensity measured on the central axis. For this LED, the viewing angle is 30 degrees, indicating a relatively focused beam suitable for directional indication.
- Peak Emission Wavelength (λP): The wavelength at which the optical output power is maximum. It is specified as 611 nm.
- Dominant Wavelength (λd): This parameter defines the perceived color of the LED. It is derived from the CIE chromaticity diagram and represents the single wavelength that best matches the color. The value ranges from 600 nm to 610 nm.
- Spectral Line Half-Width (Δλ): The spectral bandwidth measured at half the maximum intensity (Full Width at Half Maximum - FWHM). It is 17 nm, which is characteristic of the relatively narrow emission spectrum of AlInGaP materials.
Electrical Parameters:
- Forward Voltage (VF): The voltage drop across the LED when conducting. At IF = 20 mA, the forward voltage is typically 2.0 V, with a range from 1.8 V (min) to 2.4 V (max). This parameter is crucial for designing the current-limiting circuitry.
- Reverse Current (IR): The small leakage current that flows when a reverse voltage is applied. It is 100 μA maximum when a reverse voltage (VR) of 5 V is applied.
3. Binning System Explanation
LEDs are sorted into bins based on key optical parameters to ensure consistency within a production batch and for specific application requirements.
3.1 Luminous Intensity Binning
The luminous intensity is classified into four bins, identified by the codes U, V, W, and X. The classification is marked on each packing bag.
- Bin U: 3200 mcd (min) to 4200 mcd (max)
- Bin V: 4200 mcd (min) to 5500 mcd (max)
- Bin W: 5500 mcd (min) to 7200 mcd (max)
- Bin X: 7200 mcd (min) to 9300 mcd (max)
All measurements are taken at IF = 20 mA, with an allowance of ±15% for measurement precision.
3.2 Hue (Dominant Wavelength) Binning
The color, defined by the dominant wavelength, is also binned to control color consistency. The bins are identified as H23, H24, and H25.
- Bin H23: 600.0 nm (min) to 603.0 nm (max)
- Bin H24: 603.0 nm (min) to 606.5 nm (max)
- Bin H25: 606.5 nm (min) to 610.0 nm (max)
The tolerance for measurement precision is ±1 nm. This binning allows designers to select LEDs with very specific color points if required for their application.
4. Performance Curve Analysis
While the PDF references typical performance curves, the specific graphical data for parameters like the current vs. luminous intensity (I-V curve), temperature dependence of forward voltage, and the spectral distribution curve are not provided in the text excerpt. In a full datasheet, these curves are critical for design.
Yawanci, ga LED na AlInGaP irin wannan, lanƙwasa I-V zai nuna alaƙa mai ma'ana tsakanin halin yanzu da ƙarfin lantarki da zarar an wuce ƙarfin lantarki na kunna (kusan 1.8-2.0V). Lanƙwasa ƙarfin haske gabaɗaya yana da layi tare da halin yanzu a cikin kewayon aiki na yau da kullun (misali, har zuwa 20-30mA), bayan haka inganci na iya raguwa saboda dumama. Ƙarfin lantarki na gaba yana da ƙimar zafin jiki mara kyau, ma'ana yana raguwa kaɗan yayin da zafin haɗin gwiwa ya ƙaru. Lanƙwasa rarraba bakan zai nuna kololuwa guda ɗaya da ke tsakiya a kusan 611 nm tare da bayyana 17 nm FWHM, yana tabbatar da fitar da launin rawaya-lemu.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Tolerances
The LED is housed in a standard T-1 3/4 diameter package. All dimensions are provided in millimeters, with inches in parentheses. The general tolerance for dimensions is ±0.25 mm (±0.010") unless a specific note states otherwise. Key mechanical notes include:
- The resin under the flange may protrude by a maximum of 1.0 mm (0.04").
- Lead spacing is measured at the point where the leads emerge from the package body.
The specific dimensional drawing, which would detail the body diameter, lens shape, lead length, and lead diameter, is referenced but not described in detail in the provided text.
5.2 Polarity Identification
For through-hole LEDs, polarity is typically indicated by the lead length (the longer lead is usually the anode, or positive terminal) and sometimes by a flat spot on the lens rim or a notch in the flange. The exact method for this specific part should be verified on the physical component or the detailed package drawing.
6. Soldering and Assembly Guidelines
Proper handling is essential to maintain device integrity and performance.
6.1 Lead Forming and PCB Assembly
- Lead forming must be performed before soldering and at normal room temperature.
- The bend should be made at a point at least 3 mm from the base of the LED lens. The base of the lead frame itself must not be used as a fulcrum during bending.
- During PCB assembly, use the minimum clinching force necessary to hold the component in place, avoiding excessive mechanical stress on the leads or package.
6.2 Soldering Process
A minimum clearance of 2 mm must be maintained between the base of the lens and the soldering point. The lens must never be immersed in solder.
Recommended Soldering Conditions:
- Soldering Iron: Maximum temperature of 300°C. Soldering time should not exceed 3 seconds per lead. This should be done only once.
- Wave Soldering:
- Pre-heat temperature: Maximum 100°C.
- Pre-heat time: Maximum 60 seconds.
- Solder wave temperature: Maximum 260°C.
- Soldering time: Maximum 5 seconds.
Important Note: Infrared (IR) reflow soldering is explicitly stated as not suitable for this through-hole type LED lamp product. Excessive soldering temperature or time can cause lens deformation or catastrophic failure of the LED.
6.3 Cleaning
If cleaning is necessary, only alcohol-based solvents such as isopropyl alcohol should be used.
7. Packaging and Ordering Information
7.1 Packaging Specifications
The LEDs are packaged in the following hierarchy:
- Packing Bag: Contains 1000, 500, or 250 pieces.
- Inner Carton: Contains 8 packing bags, totaling 8000 pieces.
- Outer Carton (Shipping Carton): Contains 8 inner cartons, totaling 64,000 pieces.
A note specifies that in every shipping lot, only the final pack may contain a non-full quantity.
7.2 Part Number and Labeling
The primary part number for this device is LTL2V3WFKThe luminous intensity bin code (U, V, W, X) is marked on each individual packing bag, allowing for traceability and selection of specific brightness grades.
8. Application Recommendations
8.1 Typical Application Circuits
LED ni kayan aiki na halin yanzu. Don tabbatar da haske iri ɗaya lokacin sarrafa LED-ko da yawa, musamman a layi daya, ana ba da shawarar sosai don amfani da resistor mai iyakance halin yanzu na musamman a jere tare da kowane LED (Tsarin Kewayawa A).
Haɗa LED kai tsaye a layi daya ba tare da resistor na kowane ɗaya ba (Tsarin Kewayawa B) ba a ba da shawarar ba. Saboda bambance-bambancen halitta a cikin halayen ƙarfin lantarki na gaba (VF) daga LED ɗaya zuwa wani, halin yanzu—don haka hasken—ba zai raba daidai ba. LED tare da mafi ƙarancin VF zai jawo ƙarin halin yanzu kuma ya bayyana mai haske, mai yuwuwa ya haifar da gazawa da wuri, yayin da wasu na iya zama duhu.
The series resistor value (Rs) can be calculated using Ohm's Law: Rs = (Vsupply - VF) / IF. Using the typical VF of 2.0V and a desired IF of 20mA with a 5V supply, the resistor would be (5V - 2.0V) / 0.02A = 150 Ω. A standard value like 150 Ω or 180 Ω would be appropriate, considering the min/max VF range to ensure current stays within safe limits.
8.2 Electrostatic Discharge (ESD) Protection
LEDs are sensitive to electrostatic discharge. To prevent ESD damage during handling and assembly:
- Operators should wear a conductive wrist strap or anti-static gloves.
- All equipment, workbenches, and storage racks must be properly grounded.
- An ionizer (ion blower) can be used to neutralize static charge that may accumulate on the plastic lens.
8.3 Storage Conditions
Mo le teuina umi i fafo atu o le afifi muamua, e fautuaina e teuina le LEDs i totonu o se atigipusa faʻamaufaʻailoga ma le desiccant poʻo i totonu o le siosiomaga o le nitrogen. Afai e aveese mai le afifi muamua, e tatau ona faʻaaoga le LEDs i totonu o le tolu masina. O le siosiomaga fautuaina e teuina e le tatau ona sili atu i le 30°C ma le 70% susū faʻatatau.
9. Technical Comparison and Design Considerations
Compared to older technologies like GaAsP (Gallium Arsenide Phosphide), this AlInGaP LED offers significantly higher luminous efficiency, resulting in much brighter output for the same drive current. The 30-degree viewing angle provides a more focused beam compared to wide-angle or diffused LEDs, making it suitable for applications where the light needs to be directed, such as in panel indicators viewed from a specific angle.
The forward voltage of ~2.0V is lower than that of blue or white InGaN LEDs (typically ~3.0V+), which can be advantageous in low-voltage systems. Designers must carefully consider heat dissipation, especially when operating near the maximum current rating or in elevated ambient temperatures, utilizing the provided derating curve.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED directly from a 3.3V microcontroller pin?
A: Possibly, but a series resistor is still mandatory. Calculate the resistor value based on the pin's output voltage (likely 3.3V), the LED's VF (~2.0V), and the desired current (e.g., 10-20mA). Ensure the microcontroller pin can source the required current.
Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λP=611 nm) is the physical point of highest power in the emission spectrum. Dominant Wavelength (λd=600-610 nm) is a calculated value that defines the perceived color by the human eye, based on the CIE color matching functions. They are often close but not identical.
Q: Why is a 30-degree viewing angle specified as 2θ1/2?
A> The symbol 2θ1/2 denotes the full viewing angle. The half-angle (θ1/2) is 15 degrees off-axis, where intensity drops to 50%. The full angle between the two 50% intensity points is therefore 30 degrees.
Q: Can I use this for a battery-powered device?
A: Yes, its low VF and ability to operate at currents as low as a few milliamperes (with reduced brightness) make it suitable for battery-powered applications. Always include a series resistor to control current.
11. Practical Application Example
Scenario: Designing a multi-status indicator panel for a piece of test equipment.
The panel requires four distinct yellow-orange indicators for "Power," "Standby," "Test in Progress," and "Fault." Uniform brightness is critical for a professional appearance.
Design Steps:
- Component Selection: Specify the LTL2V3WFK LED and request components from the same luminous intensity bin (e.g., all from Bin W) to minimize brightness variation.
- Circuit Design: The system uses a 5V rail. For each LED, place a 150 Ω, 1/4W resistor in series. Calculation: (5V - 2.0V) / 0.02A = 150Ω. Power dissipation in the resistor: (0.02A)^2 * 150Ω = 0.06W, well within rating.
- PCB Layout: Ensure the holes for the LED leads are spaced according to the datasheet's lead spacing dimension. Include a silkscreen outline showing polarity (e.g., a flat side or "+" for anode).
- Assembly: During manual assembly, bend the leads carefully >3mm from the body. Use a temperature-controlled soldering iron set to 280°C, applying heat for less than 3 seconds per joint.
- Drive Circuit: Connect each LED-resistor pair to a separate digital output pin of a microcontroller. Driving the pin HIGH (5V) will illuminate the LED with ~20mA.
This approach ensures reliable, consistent, and long-lasting operation of all indicator lights.
12. Operating Principle Introduction
This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlInGaP (Aluminum Indium Gallium Phosphide). When a forward voltage exceeding the junction's built-in potential (approximately 1.8-2.4V) is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. Here, they recombine, releasing energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light—in this case, in the yellow-orange spectrum around 611 nm. The epoxy lens serves to protect the semiconductor chip, shape the light output beam (30-degree viewing angle), and in this "diffused" version, it also scatters the light to reduce glare and create a more uniform appearance when viewed directly.
13. Technology Trends and Context
Through-hole LEDs kamar fakitin T-1 3/4 suna ci gaba da yin amfani da su sosai a aikace-aikacen da haɗa hannu, babban amincin yanayi mai tsanani, ko sauƙin maye gurbin filin suke fifiko. Duk da haka, mafi girman yanayin masana'antu yana ƙwarai zuwa fakitin na'urar hawa saman (SMD) (misali, 0603, 0805, 2835) don haɗawa ta atomatik, mafi girman yawa, da ingantaccen sarrafa zafi.
In terms of materials, AlInGaP technology represents a mature and highly efficient solution for red, orange, amber, and yellow colors. It has largely superseded older, less efficient technologies like GaAsP. For colors like blue, green, and white, InGaN (Indium Gallium Nitride) is the dominant material system. Ongoing development focuses on increasing luminous efficacy (lumens per watt), improving color consistency and stability over temperature and lifetime, and enabling higher power densities in smaller packages. While this datasheet represents a standard, reliable component, newer products may offer higher brightness in similar packages or the same brightness with lower drive currents.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Kwanin da ƙarfin haske ya ragu zuwa rabi, yana ƙayyade faɗin katako. | Yana shafar kewayon haskakawa da daidaito. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Metric ya Consistency ya Rangi, hatua ndogo zina maana rangi inayolingana zaidi. | Inahakikisha rangi sawa kwenye kundi moja la LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: kona mafuta bora, ufanisi wa juu, kwa nguvu kubwa. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | E kia mau tonu te tūrama i roto i te pātaka kotahi. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Yana tabbatar da babu abubuwa masu cutarwa (gubar, mercury). | Bukatar shiga kasuwa a duniya. |
| ENERGY STAR / DLC | Ilimin ingancin makamashi | Ilimin ingancin makamashi da aiki don hasken wuta. | Used in government procurement, subsidy programs, enhances competitiveness. |