Table of Contents
- 1. Product Overview
- 2. Bincike mai zurfi na sigogi na fasaha
- 2.1 Matsakaicin Matsakaici na Cikakke
- 2.2 Halaye na Lantarki da na Gani
- 4. Bincike na Lanƙwan Ayyuka
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 7. Bayanin Tufafi da Oda
- 8. Shawarar Aikace-aikace
- 8.1 Da'irar Aikace-aikace ta Al'ada
- 8.2 Tunani na Zane
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 11. Practical Design and Usage Cases
- 12. Introduction to Working Principles
- 13. Technology Trends and Development
- Detailed Explanation of LED Specification Terminology
- I. Core Indicators of Photoelectric Performance
- II. Electrical Parameters
- III. Thermal Management and Reliability
- IV. Packaging and Materials
- V. Quality Control and Binning
- VI. Testing and Certification
1. Product Overview
This document provides the complete technical specifications for a high-performance through-hole mount LED lamp. This device is designed for applications requiring reliable, visible indicator lighting with excellent luminous output and energy efficiency. Its primary function is to serve as a status indicator, backlight, or general illumination source in various electronic equipment.
The core advantages of this component include its high luminous intensity output, ensuring excellent visibility even in well-lit environments. It features low power consumption, making it suitable for battery-powered or energy-sensitive applications. The device is highly efficient, converting electrical energy into light with minimal waste heat. Its versatile mounting capability facilitates easy installation on printed circuit boards (PCBs) or panels. Furthermore, it is compatible with integrated circuits, requiring only low drive current, thereby simplifying circuit design. The component utilizes the popular T-1 3/4 package diameter, ensuring broad compatibility with standard PCB layouts and manufacturing processes.
The target markets for this LED include consumer electronics, industrial control panels, automotive interior lighting, instrumentation, and any application requiring a durable, bright, and efficient indicator light.
2. Bincike mai zurfi na sigogi na fasaha
2.1 Matsakaicin Matsakaici na Cikakke
Absolute Maximum Ratings define the stress limits that may cause permanent damage to the device. These ratings are specified at an ambient temperature (TA) of 25°C and must not be exceeded under any operating conditions.
- Power Dissipation (PD):75 mW. This is the maximum power the device can dissipate as heat. Exceeding this limit risks thermal runaway and failure.
- Peak Forward Current (IFP):60 mA. This is the maximum current allowed under pulse conditions, defined at a duty cycle of 1/10 and a pulse width of 0.1ms. It is significantly higher than the continuous current rating, allowing for short-duration high-brightness signal indication.
- Continuous Forward Current (IF):30 mA. Wannan shine mafi girman kwararar DC da za a iya ci gaba da amfani da ita ba tare da rage aikin LED ko tsawon rayuwa ba.
- Rage ƙimar ƙima:Rage layi daga 50°C, tare da ƙimar 0.4 mA/°C. Don yanayin zafi na muhalli sama da 50°C, dole ne a rage mafi girman izinin ci gaba da kwarara mai kyau. Misali, a 70°C, mafi girman IFYa kamata ya zama 30 mA - [0.4 mA/°C * (70°C - 50°C)] = 22 mA.
- Ƙarfin lantarki na baya (VR):5 V. Amfani da ƙarfin lantarki na baya fiye da wannan ƙimar na iya haifar da lalacewa nan take a haɗin LED.
- Kewayon zafin aiki:-40°C zuwa +100°C. An tabbatar da cewa na'urar tana aiki da kyau a cikin wannan kewayon zafin muhalli.
- Kewayon zafin ajiya:-55°C to +100°C. The device will not experience performance degradation when stored within this range.
- Pin soldering temperature:260°C for 5 seconds, measured at a point 1.6mm (0.063 inches) from the LED body. This defines the acceptable thermal profile for hand or wave soldering processes.
2.2 Halaye na Lantarki da na Gani
Electrical and optical characteristics are measured at TA=25°C, defining the typical performance of the device under normal operating conditions. These are key parameters for circuit design and performance expectations.
- Luminous intensity (IV):Minimum 180 mcd, typical 700 mcd (at IF= 20 mA). This is a measure of LED brightness as perceived by the human eye, measured using a sensor filtered to match the CIE photopic response curve. The wide range indicates a binning process; the specific luminous intensity of a unit is marked on its packaging.
- Viewing angle (2θ1/2):30 digiri. Wannan shine cikakken kusurwa lokacin da ƙarfin haske ya ragu zuwa rabin ma'aunin axial. Kusurwar digiri 30 tana nuna taron haske mai dacewa, yana dacewa da aikace-aikacen nuni mai ƙayyadaddun hanya.
- Peak emission wavelength (λP):595 nm. Wannan shine mafi girman tsawon raƙuman ruwa na fitarwar ƙarfin haske na LED. Yana cikin yankin amber-rawaya na bakan haske mai iya gani.
- Dominant wavelength (λd):592 nm. An samo shi daga taswirar launi na CIE, wannan shine mafi kyawun wakilcin launin hasken LED a fahimtar launi. Yana kusa da tsayin raƙuman ruwa mai kololuwa, yana tabbatar da tsantsar launin amber-rawaya.
- Spectral line half-width (Δλ):15 nm. Wannan siga tana nuna tsantsar bakan haske ko faɗin band na fitowar haske. 15 nm shine ƙimar al'ada ga LED na tushen AlInGaP, yana samar da launi mai cikar jiki.
- Forward voltage (VF):Typical 2.4 V, maximum 2.4 V (at IF= 20 mA). This is the voltage drop when the LED is operating. It is crucial for designing the current-limiting resistor in series with the LED. The datasheet shows a minimum value of 2.05V, but the typical/maximum value is given as 2.4V, indicating a tight distribution of values.
- Reverse Current (IR):Maximum 100 µA (at VR= 5 V). This is the small leakage current that flows when the LED is reverse-biased within its maximum ratings.
- Capacitance (C):40 pF (at VF= 0V, f = 1 MHz). This is the junction capacitance, which may be relevant in high-frequency switching applications.
3. Binning System Explanation
The datasheet implies the use of a binning system, primarily for luminous intensity. Note 3 states: "IvThe classification code is marked on each packaging bag." This indicates that the manufactured LEDs are tested and categorized (binned) according to their measured luminous intensity. The specifications list a range from 180 mcd (minimum) to 700 mcd (typical). Units are grouped into specific luminous intensity bins (e.g., 180-250 mcd, 250-350 mcd, etc.), and the bin code is printed on the packaging. This allows designers to select LEDs with consistent brightness for their application. Although this document does not explicitly detail binning for wavelength or forward voltage, these parameters are also commonly binned in LED manufacturing to ensure color and electrical consistency.
4. Bincike na Lanƙwan Ayyuka
The last page of the specification sheet is dedicated to "Typical Electrical/Optical Characteristic Curves." Although the text content does not provide specific curves, a standard LED specification sheet typically includes the following charts, which are crucial for understanding the device's behavior under different conditions:
- Relative Luminous Intensity vs. Forward Current (I-V Curve):This curve shows how light output increases with drive current. It is typically linear at lower currents but may saturate at higher currents due to thermal effects and efficiency droop.
- Forward Voltage vs. Forward Current:This shows the exponential relationship, confirming the diode characteristic. It is used to calculate power dissipation (VF* IF).
- Relative Luminous Intensity vs. Ambient Temperature:Wannan lanƙwasa yana nuna raguwar haske saboda zafi. Ga yawancin LED, ƙarfin haske yana raguwa yayin da zafin jiki ya ƙaru.
- Tsawon tsinkaya mafi girma vs. yanayin zafi:Wannan yana nuna yadda launin fitarwa ke canzawa tare da hauhawar zafi (yawanci zuwa tsawon tsinkaya mafi tsawo).
- Rarraba bakan:Zane na ƙarfin dangi da tsawon tsinkaya, yana nuna kololuwa a 595 nm da kuma rabin faɗin kusan 15 nm, wanda ke ayyana launin rawaya.
Waɗannan lanƙwaso suna ba masu ƙira damar yin hasashen aiki a cikin yanayin gaske inda zafi da ƙarfin tuƙi zasu iya canzawa.
5. Mechanical and Packaging Information
5.1 Package Dimensions
Wannan LED yana amfani da daidaitaccen "T-1 3/4" radial kai tsaye shigar da kunshe. Muhimman bayanan girma a cikin takardar ƙayyadaddun sun haɗa da:
- Duk ma'aunin girma a cikin millimita, an nuna inci a cikin baka.
- Sai dai idan an faɗi daban, daidaitaccen ƙimar izini shine ±0.25mm (±0.010 inci).
- Resin da ke ƙarƙashin flange na iya fitowa har zuwa 1.0mm (0.04 inci).
- Ana auna tazarar ƙafar a wurin da ƙafar ta fito daga jikin kunshe, wannan yana da mahimmanci ga tazarar ramukan PCB.
Takamaiman zanen girmai zai nuna diamita na jiki (T-1 3/4 yana kusan 5mm), tsawon ƙafar, diamita na ƙafar da wurin flange. Ƙafar mafi tsayi yawanci tana nuna anode (ingantacce).
5.2 Polarity Identification
For through-hole LEDs, polarity is most commonly indicated by lead length (the longer lead is the anode), and sometimes by a flat spot on the LED lens or body near the cathode lead. Consult the datasheet for specific markings, but the lead length method is almost universally applicable.
6. Soldering and Assembly Guidelines
The key soldering parameter provided is the maximum allowable temperature for the leads: 260°C for 5 seconds, measured at a point 1.6mm from the body. This is crucial to prevent thermal damage to the internal bonding wires and epoxy lens.
Recommended Practices:
- Hand Soldering:Use a temperature-controlled soldering iron. Heat the pins and PCB pads, not the LED body. Complete the solder joint within 3-5 seconds.
- Wave soldering:Ensure the preheating and solder wave profile does not expose the LED pins to temperatures exceeding 260°C for longer than the specified duration. The LED body should be positioned above the solder wave.
- Cleaning:If cleaning is required, use a solvent compatible with the epoxy resin. Avoid ultrasonic cleaning as it may damage the LED structure.
- Bending leads:If lead forming is necessary, bend the leads at a minimum distance of 3mm from the body to avoid stress on the seal. Use appropriate tools to prevent scratching the leads.
Storage conditions:Store within the specified temperature range of -55°C to +100°C in a dry, anti-static environment. Avoid exposure to high humidity or corrosive gases.
7. Bayanin Tufafi da Oda
The model number of this device isLTL2R3KYK. A typical LED naming convention might be broken down as follows: "LTL" may indicate a through-hole lamp bead, "2" may relate to series or color, "R3" may specify the luminous intensity bin or viewing angle, "KYK" may indicate lens/color (water clear lens, amber yellow for AlInGaP light source).
Packaging typically uses anti-static bags or tape-and-reel (for automatic assembly), with the luminous intensity bin code marked on each bag according to Note 3. The standard quantity is typically 1000 pieces per bag or reel.
8. Shawarar Aikace-aikace
8.1 Da'irar Aikace-aikace ta Al'ada
The most common application is as a status indicator powered by a DC voltage source (e.g., 3.3V, 5V, 12V). A current-limiting resistor is mandatory. The resistor value (RS) Use Ohm's law to calculate: RS= (VCC- VF) / IF.
Taking a 5V power supply and a target IF= 20mA as an example:
VF(typical value) = 2.4V
RS= (5V - 2.4V) / 0.020A = 130 Ω.
The nearest standard values (120Ω or 150Ω) can be used. The resistor's power rating should be at least P = IF2* RS= (0.02)2* 130 = 0.052W, so a 1/8W (0.125W) resistor is sufficient.
For microcontroller GPIO pin driving, ensure the pin can source or sink the required 20mA current. Many modern MCUs have lower per-pin current limits (e.g., 8-10mA), so a transistor buffer may be necessary.
8.2 Tunani na Zane
- Thermal Management:Despite the low power dissipation (max 75mW), ensure adequate spacing between the LED and other heat sources on the PCB. Adhere to the current derating curve for ambient temperatures above 50°C.
- Current Control:Always use a series resistor or constant current driver. Driving the LED directly from a voltage source will cause excessive current and rapid failure.
- Reverse Voltage Protection:If there is a possibility of reverse voltage being applied (e.g., during AC circuit operation or board testing), a protection diode should be connected in parallel across the LED (cathode to anode) to clamp the reverse voltage to approximately 0.7V.
- Viewing Angle:A 30-degree viewing angle provides a directional beam. For illuminating broader areas, consider using a diffused lens or selecting an LED with a wider viewing angle.
9. Technical Comparison and Differentiation
This AlInGaP-based amber LED offers distinct advantages compared to older technologies such as filtered incandescent bulbs or standard GaAsP LEDs.
- Comparison with Incandescent Lamps:Significantly lower power consumption (milliwatts vs. watts), much longer lifetime (tens of thousands of hours vs. hundreds of hours), higher resistance to shock and vibration, and faster switching speed. The color is inherent to the semiconductor material, not a filter, so it does not fade.
- Compared to standard GaAsP yellow LEDs:AlInGaP technology offers significantly higher luminous efficiency and brightness (mcd/mA). It also provides better temperature stability and color consistency over time and under operating conditions.
- Compared to SMD LEDs:The through-hole design offers superior mechanical strength for applications subject to vibration or potential physical contact/manipulation. It is also easier for prototyping and manual assembly.
10. Frequently Asked Questions (FAQ)
Q1: What resistor value do I need for a 12V circuit?
A1: Using VF= 2.4V and IF= 20mA: R = (12 - 2.4) / 0.02 = 480 Ω. Use a standard 470 Ω resistor. Power dissipation: P = (0.02)^2 * 470 = 0.188W, so a 1/4W resistor is recommended.
Q2: Ina iya amfani da siginar PWM don tuka wannan LED don daidaita haske?
A2:可以,LED非常适合PWM调光。确保PWM频率足够高(通常>100Hz)以避免可见闪烁。每个脉冲中的峰值电流不应超过绝对最大峰值正向电流60mA。
Q3: Me ya sa LED dina ya fi duhu fiye da yadda ake tsammani?
A3: Na farko, tabbatar da cewa ainihin igiyar gaba ita ce 20mA ta hanyar auna faɗuwar ƙarfin lantarki akan resistor na jerin. Na biyu, duba yanayin zafi na muhalli; fitar da haske yana raguwa yayin da zafin jiki ya tashi. Na uku, tabbatar da matakin ƙarfin haske na LED akan marufi; ƙila kuna da naúrar da ke ƙasan kewayon matakin.
Q4: Ana buƙatar mai sanyaya?
A4:对于在20mA和室温下连续工作,由于功耗低(约48mW),通常不需要散热器。但是,如果在最大连续电流(30mA)或高环境温度(>50°C)下工作,确保引脚周围有良好的PCB铜面积有助于散热。
11. Practical Design and Usage Cases
Misali: Alamar Yanayi na Panel iko na Masana'antu
An industrial machine uses a central control panel with multi-status LEDs. A green LED indicates "Power On", a red LED indicates "Fault", and this amber yellow LED is used to indicate "Standby" or "Warning".
Implementation Plan:The LED is mounted on the front panel. It is driven by a 24V DC power rail common in industrial environments. A transistor switch controlled by an output from the machine's PLC controls the LED's on/off state. The series resistor is calculated for 20mA: R = (24V - 2.4V) / 0.02A = 1080 Ω (using 1.1kΩ). The resistor power rating needs to be P = (24-2.4)*0.02 = 0.432W, so a 0.5W resistor is selected. The 30-degree viewing angle ensures the warning light is clearly visible to an operator facing the panel directly, without excessive glare from a wide angle. The high luminous intensity (up to 700 mcd) ensures clear visibility even in brightly lit factory environments.
12. Introduction to Working Principles
This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material. When a forward voltage exceeding the diode junction potential (approximately 2.0-2.4V for AlInGaP) is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy in the form of photons (light). The specific wavelength of the emitted light (amber yellow, 592-595 nm) is determined by the bandgap energy of the AlInGaP alloy composition used in the active layer. The "water clear" lens is made of epoxy, transparent to the emitted wavelength, allowing light to escape efficiently while providing mechanical protection and shaping the beam pattern (30-degree viewing angle).
13. Technology Trends and Development
While through-hole LEDs remain crucial for specific applications requiring robustness and ease of manual assembly, the overall industry trend has shifted significantly towards Surface-Mount Device (SMD) packages. SMD LEDs offer advantages in automated assembly, smaller footprint, lower profile height, and often better PCB thermal management. For AlInGaP technology itself, ongoing development focuses on increasing luminous efficacy (lumens per watt), improving high-temperature performance, and achieving tighter color and intensity binning for applications requiring precise color matching, such as full-color displays and automotive lighting. Furthermore, the development of phosphor-converted LEDs, which use a blue or violet chip to excite phosphors to produce amber/yellow light, provides an alternative pathway to achieve specific color points, potentially with higher efficiency or color rendering.
Detailed Explanation of LED Specification Terminology
Full Explanation of LED Technical Terms
I. Core Indicators of Photoelectric Performance
| Term | Unit/Representation | Layman's Explanation | Why It Is Important |
|---|---|---|---|
| Luminous Efficacy | lm/W | The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. | Directly determines the energy efficiency rating and electricity cost of a luminaire. |
| Luminous Flux | lm | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether a luminaire is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | The angle at which light intensity drops to half, determining the width of the light beam. | Affects the illumination range and uniformity. |
| Correlated Color Temperature (CCT) | K (Kelvin), e.g., 2700K/6500K | The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. | Determines the lighting ambiance and suitable application scenarios. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to restore the true color of an object, Ra≥80 is preferred. | Affects color authenticity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative indicator of color consistency, the smaller the step number, the more consistent the color. | Ensures no color difference among the same batch of luminaires. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | The wavelength value corresponding to the color of a colored LED. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity curve | Display the intensity distribution of light emitted by the LED across various wavelengths. | Affects color rendering and color quality. |
II. Electrical Parameters
| Term | Symbol | Layman's Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | Thamani ya mkondo inayofanya LED mwangaza kwa kawaida. | A yawanci ana amfani da tuƙi mai tsayayyen kwarara, kwararar ruwa tana ƙayyadaddun haske da rayuwa. |
| Mafi girman ƙarfin bugun jini (Pulse Current) | Ifp | Ƙarfin kololuwar da za a iya jurewa a cikin ɗan gajeren lokaci, ana amfani dashi don daidaita haske ko walƙiya. | Dole ne a sarrafa faɗin bugun jini da rabon aiki da ƙarfi, in ba haka ba zai lalata saboda zafi. |
| Ƙarfin juzu'i (Reverse Voltage) | Vr | The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | Reverse connection or voltage surges must be prevented in the circuit. |
| Thermal Resistance | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint; a lower value indicates better heat dissipation. | High thermal resistance requires stronger heat dissipation design, otherwise junction temperature will increase. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), such as 1000V | The ability to withstand electrostatic strikes; a higher value indicates greater resistance to electrostatic damage. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Term | Key Metrics | Layman's Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for brightness to drop to 70% or 80% of its initial value. | Directly defines the "service life" of an LED. |
| Lumen Maintenance | % (e.g., 70%) | Yawanci haske da ya rage bayan amfani da lokaci. | Halin riƙe haske bayan dogon amfani. |
| Color Shift | Δu′v′ ko MacAdam ellipse | Matsakaicin canjin launi yayin amfani. | Yana shafar daidaiton launi a yanayin haske. |
| Thermal Aging | Material Performance Degradation | Degradation of packaging materials due to prolonged exposure to high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Term | Common Types | Layman's Explanation | Features and Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Chip Structure | Front-side, Flip Chip | Chip electrode arrangement method. | Flip Chip offers better heat dissipation, higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, Silicate, Nitride | Coated on the blue LED chip, partially converts to yellow/red light, mixes to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | The optical structure on the package surface controls light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Term | Bin Content | Layman's Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Grouped by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness within the same batch of products. |
| Voltage Binning | Codes such as 6W, 6X | Grouped according to forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color Binning | 5-step MacAdam ellipse | Group by color coordinates, ensuring colors fall within an extremely narrow range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Term | Standards/Testing | Layman's Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording data on luminous flux depreciation. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime extrapolation standard | Estimating lifetime under actual use conditions based on LM-80 data. | Providing scientific lifetime prediction. |
| IESNA standard | Standard of the Illuminating Engineering Society | Covers optical, electrical, and thermal testing methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental certification. | Ensures products do not contain harmful substances (e.g., lead, mercury). | Conditions for entering the international market. |
| ENERGY STAR / DLC | Energy efficiency certification. | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |