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LTL-R42NM1H229 LED Indicator Specification Sheet - Through-Hole - Yellow/Green Bicolor - 20mA - 52mW - Technical Documentation

LTL-R42NM1H229 Complete Technical Datasheet for Through-Hole Yellow/Green Bicolor LED Indicator, Covering Electrical/Optical Characteristics, Dimensions, Binning, and Application Guide.
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PDF Document Cover - LTL-R42NM1H229 LED Indicator Datasheet - Through-Hole - Yellow/Green Bicolor - 20mA - 52mW - Chinese Technical Document

1. Product Overview

LTL-R42NM1H229 is a through-hole LED indicator specifically designed for Circuit Board Indication (CBI). It consists of a black plastic right-angle bracket (housing) and two independent LED chips. This component is designed for easy installation onto a Printed Circuit Board (PCB), providing a reliable and cost-effective solution for status indication.

1.1 Core Advantages

1.2 Target Applications

This LED indicator is suitable for various electronic devices that require clear status or indicator lights. The main application areas include:

2. Detailed Technical Parameters

This section provides a detailed and objective analysis of the key electrical, optical, and thermal parameters of the LTL-R42NM1H229 LED indicator.

2.1 Absolute Maximum Ratings

These ratings define the limiting conditions beyond which permanent damage to the device may occur. Functional operation under these conditions is not guaranteed.

2.2 Electrical and Optical Characteristics

These are typical performance parameters, measured under the condition of TA=25°C, IF=10mA, unless otherwise specified.

3. Binning System Description

This product employs a binning system, which classifies LEDs based on their luminous intensity (IV) and hue (dominant wavelength). This ensures consistency within the same production batch.

3.1 Luminous Intensity Binning

LEDs are sorted into different bins (A, B, C, D) based on their light output measured at 10mA. The datasheet specifies the IVBin limits have a ±15% tolerance. This means the brightness levels of LEDs within the same bin will be very close, which is crucial for applications requiring uniform appearance of multiple indicator lights.

3.2 Hue (Wavelength) Binning

LED further classified by its dominant wavelength. Tolerance for each hue bin is ±1nm. This strict control ensures minimal color variation between individual LEDs of the same nominal color (yellow or green), which is crucial for aesthetic consistency and color-coded indicator systems.

The binning table (e.g., codes like L2, L3, H06, 3ST) associates specific luminous intensity and hue bin combinations with final product codes (A, B, C, D), allowing for precise selection based on application requirements.

4. Performance Curve Analysis

Although the PDF references typical characteristic curves, the behavior of a standard LED can be inferred:

4.1 Forward Current vs. Forward Voltage (I-V Curve)

LED ni diode, yana nuna alaƙar I-V mara layi. Ƙarfin lantarki mai gaba (VF) yana da ƙimar zafin jiki mara kyau, ma'ana yana raguwa kaɗan yayin da zafin haɗin gwiwa ya ƙaru. V da aka ƙayyade a 10mAFyana kusan 2.0-2.5V, shine ma'auni mai mahimmanci don ƙirar kewaye na tuƙi mai iyakancewar ƙarfin lantarki.

4.2 Luminous Intensity vs. Forward Current

Within the recommended operating range (up to 20mA), the light output (IV) is approximately proportional to the forward current (IF). Driving the LED beyond this current increases brightness, but also increases power consumption and junction temperature, potentially shortening lifespan and causing color shift.

4.3 Temperature Dependence

LED performance is sensitive to temperature. Luminous intensity typically decreases as junction temperature increases. The specified operating temperature range of -30°C to +85°C defines the environmental conditions under which the published optical characteristics are valid. Operation at higher temperatures will result in reduced light output.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

The device adopts a right-angle through-hole design. Key dimension specifications include:

Lura: Cikakkun zane-zanen girma an ambace su a cikin littafin ƙayyadaddun bayanai, amma ba a kwafi su a nan a cikin rubutu ba. Masu zane dole ne su koma ga ainihin zane don samun cikakkun bayanai game da sanyawa da cikakkun bayanai na kunshe.

5.2 Polarity Identification

For through-hole LEDs, the cathode is typically identified by a flat edge on the LED lens, a shorter lead, or a marking on the housing. The dimension drawing in the datasheet should clearly indicate the polarity. Correct polarity is crucial; reverse connection will prevent illumination and may damage the device if the reverse voltage exceeds 5V.

5.3 Packaging Specification

Products are supplied in packaging suitable for automatic assembly or manual handling. The packaging specifications detail the quantity of components per reel, tube, or tray, as well as the orientation of components within the packaging to facilitate pick-and-place machines or prevent damage during transportation and storage.

6. Welding and Assembly Guide

Proper handling is crucial to ensure reliability and prevent damage.

6.1 Storage Conditions

For long-term storage outside the original moisture barrier bag, it is recommended to store LEDs in an environment of ≤30°C and relative humidity ≤70%. If removed from the original packaging, use within three months. For longer storage, use a sealed container with desiccant or a nitrogen environment.

6.2 Cleaning

For cleaning, use only alcohol-based solvents such as isopropyl alcohol. Avoid using strong or unknown chemical cleaners that may damage plastic lenses or housings.

6.3 Pin Forming

If pin bending is required, it must be performedbefore solderingat room temperature. The bending point should be at least 3mm away from the LED lens base. Do not use the LED body as a fulcrum. Apply minimal force when inserting into the PCB to avoid mechanical stress on the pins or epoxy seal.

6.4 Soldering Parameters

Key Rules:Maintain a minimum distance of 2mm between the solder joint and the root of the LED lens. Do not immerse the lens in solder.

7. Application Design Recommendations

7.1 Drive Circuit Design

LED ni abin da ke amfani da ƙarfin lantarki. Don tabbatar da aiki mai ƙarfi da tsawon rayuwa, dole ne a haɗa resistor mai iyakancewa a jere tare da kowane LED. Ana lissafta ƙimar resistor (R) ta amfani da dokar Ohm: R = (VWutar lantarki- VF) / IF, where VFis the LED forward voltage (use typical or maximum value for design margin), IFis the required forward current (≤20mA).

Circuit Model A (Recommended):Each LED has its own dedicated current-limiting resistor. This provides optimal brightness uniformity and independent current control, as it compensates for the slight differences in the I-V characteristics of each LED.

Circuit Model B (not recommended for uniformity):Multiple LEDs are connected in parallel, sharing a single resistor. Due to the natural differences in the forward voltage of each LED, this can lead to significant brightness variations among the LEDs. VFAn LED with a slightly lower forward voltage will draw more current and appear brighter, potentially leading to uneven current distribution and uneven wear.

7.2 ESD (Electrostatic Discharge) Protection

LEDs are sensitive to electrostatic discharge. Precautions must be taken during handling and assembly:

7.3 Thermal Management

Although the power consumption is low (52mW per LED), ensuring the device operates within its specified temperature range is crucial for maintaining light output and lifespan. Avoid placing LEDs near other heat-generating components. Sufficient spacing on the PCB allows for some natural convection cooling.

8. Technical Comparison and Differentiation

LTL-R42NM1H229 offers specific advantages in its niche:

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED with 30mA for extra brightness?
A: A'a. Matsakaicin ƙimar ƙarfin kai tsaye na DC shine 20mA. Yin aiki a 30mA ya wuce wannan ƙimar, wanda zai ƙara yawan zafin jiki, hanzarta raguwar haske, kuma yana iya haifar da gazawa da wuri. Da fatan za a ci gaba da cikin sharuɗɗan aiki da aka ba da shawarar.

Q2: An jera ƙarfin kai tsaye a matsayin 2.0V (na al'ada) zuwa 2.5V (matsakaicin). Wane ƙimar ne ya kamata in yi amfani da shi don ƙididdige resistor na iyakancewar kwarara?
A: Don ƙirar ƙarfi, tabbatar da cewa kwarara ba zai taɓa wuce matsakaicin ƙimar ba ko da a cikin yanayin ƙimar kayan aiki, yi amfani daMaximum value VF(2.5V). This ensures that even if the VFis at the low end of its range, the actual current will be at or below your target value.

Q3: What is the difference between peak wavelength and dominant wavelength?
A:Peak Wavelength (λP)It is the physical wavelength at which the spectral power output is highest.Dominant Wavelength (λd)It is a calculated value based on human color perception (CIE chromaticity diagram); it is the wavelength of a pure monochromatic light that appears the same color as the LED. λdIt is more relevant for describing the perceived color.

Q4: Ina iya amfani da wannan LED a waje?
A: Takardar ƙayyadaddun bayanai ta nuna cewa ta dace da alamomin cikin gida da na waje. Duk da haka, don muhallin waje mai tsanani wanda ke fuskantar hasken UV kai tsaye, ɗanɗano, da sauye-sauyen yanayin zafi, ana buƙatar ƙarin la'akari da ƙira, kamar shafa PCB da kariya uku, amfani da harsashi na kariya, da tabbatar da aiki a cikin yanayin zafi mai tsanani.

10. Practical Design and Usage Cases

Scenario: Designing a dual-state indicator light for a network router.
LTL-R42NM1H229 is an ideal choice. The green LED can indicate "Power On/System Normal", while the yellow LED can indicate "Network Activity" or "Warning".

Implementation Plan:
1. Place components on the PCB near the front panel.
2. Design two independent drive circuits, each with a current-limiting resistor. Using a 5V supply for a 15mA drive current (well below the 20mA limit), calculate: R = (5V - 2.5V) / 0.015A ≈ 167Ω (use a standard 180Ω or 150Ω resistor).
3. Connect the anode of the green LED to a GPIO pin, which is set high in the "normal" state.
4. Connect the anode of the yellow LED to another GPIO pin, which toggles with data activity.
5. Ensure the PCB layout maintains a 2mm gap from the solder pad to the lens.
6. During assembly, strictly adhere to ESD, pin forming, and soldering guidelines.

Thus, using a single component package enables a concise, professional, and reliable status indication system.

11. Introduction to Working Principles

Light-emitting diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific color (wavelength) of the emitted light is determined by the energy band gap of the semiconductor material constituting the LED chip. The yellow and green in this device are achieved by using different semiconductor material compositions (e.g., AlInGaP for yellow, InGaN for green). The diffused plastic lens above the chip is used to scatter the light, creating a wide viewing angle of 100 degrees.

12. Teknoloji Trendleri

Through-hole LED indicators remain mainstream in electronics due to their simplicity and durability, especially in applications requiring high mechanical strength or where manual assembly is common. However, the overall industry trend is shifting toward surface-mount device (SMD) LEDs, which offer smaller package sizes, lower profile heights, and compatibility with high-speed automated pick-and-place assembly lines, thereby reducing manufacturing costs for high-volume products. Furthermore, advancements in LED chip technology continuously improve luminous efficacy (more light output per watt of electrical input), allowing the same brightness to be achieved with lower drive currents, thus enhancing energy efficiency and thermal performance. The principles of careful current control, thermal management, and ESD protection remain crucial across all LED package types.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Optoelectronic Performance

Terminology Units/Notation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. Directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether a light fixture is bright enough.
Viewing Angle ° (degrees), e.g., 120° The angle at which the light intensity drops to half, determining the beam width. Affects the illumination range and uniformity.
Correlated Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM) MacAdam Ellipse Steps, e.g., "5-step" A quantitative metric for color consistency; a smaller step number indicates higher color consistency. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Display the intensity distribution of light emitted by the LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; when multiple LEDs are connected in series, the voltages add up.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current (Pulse Current) Ifp Peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. Circuit ina buƙatar hana jujjuyawar baya ko ƙarfin wutar lantarki.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a more robust thermal design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V The higher the ESD immunity rating, the more resistant the device is to electrostatic damage. Anti-static measures must be taken during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Metrics Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Packaging Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC tahan panas baik, biaya rendah; keramik pendinginan unggul, umur panjang.
Struktur chip Face-up, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, Silicate, Nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical design Flat, Microlens, Total Internal Reflection Optical structure on the encapsulation surface, controlling light distribution. Determine the beam angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Classification Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver matching and improves system efficiency.
Color binning. 5-step MacAdam Ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standards/Testing Popular Explanation Significance
LM-80 Lumen Maintenance Test Record brightness attenuation data under constant temperature conditions over an extended period. Used to estimate LED lifetime (in conjunction with TM-21).
TM-21 Lifespan Projection Standard Estimating lifespan under actual operating conditions based on LM-80 data. Provide scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure products are free from hazardous substances (e.g., lead, mercury). Market access requirements for entering the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.