LTL-R42FGG1H214T Through-Hole LED Indicator Specification Sheet - Dimensions - Voltage 2.0V - Power 52mW - Yellow-Green - Technical Documentation

1. Product Overview

This document details the technical specifications of a through-hole mount LED indicator, designed specifically for Circuit Board Indication (CBI). It consists of a black plastic right-angle bracket (housing) that integrates an LED element. This design aims to provide clear and intuitive status indication for electronic circuit boards.

1.1 Siffofi da fa'idodi na asali

This product possesses several key features that enhance its performance and usability in electronic applications:

• Zane mai ƙarancin kwatankwacin haske:An zaɓi kayan hular baƙar fata da nufin samar da babban bambanci tare da LED masu haske, don haɓaka ganuwa.
• Ruwan tabarau mai watsawa:Ruwan tabarau na kore ne mai watsawa, yana taimakawa wajen laushawa da watsa hasken da ake fitarwa, rage hasken gilashi, da samar da kamanni mafi daidaito.
• Ingantaccen amfani da makamashi:Wannan na'urar tana da ƙarancin amfani da wutar lantarki yayin da take riƙe da ingantaccen ƙarfin haske.
• Daidaiton muhalli:The product complies with lead-free requirements and the Restriction of Hazardous Substances (RoHS) Directive.
• LED Technology:The light source utilizes an AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor chip, capable of emitting a yellow-green spectrum.
• Automation-Friendly Assembly:The components are supplied in tape-and-reel packaging, suitable for automated surface-mount assembly processes.

1.2 Aikace-aikace da kasuwa da aka yi niyya

This LED indicator is suitable for a wide range of electronic equipment across multiple industries, including:

• Computer Systems:Status indicators on motherboards, servers, and peripherals.
• Communication Equipment:Signal and status lights in network hardware, routers, and switches.
• Consumer Electronics:Power indicators and functional status lights in home appliances and audio/video equipment.
• Industrial Control:Machine status, fault indication, and panel lighting in automation and control systems.

2. Bincike mai zurfi na sigogi na fasaha

Wannan sashe yana bincika cikakken iyaka na aiki da halayen aiki na na'urar a daidaitattun yanayin gwaji (TA=25°C).

2.1 Matsakaicin ƙididdiga na cikakke

Waɗannan ƙimar suna ayyana iyakokin damuwa waɗanda za su iya haifar da lalacewar na'urar na dindindin. Don tabbatar da ingantaccen aiki, ba a ba da shawarar aiki a cikin yanayin da ya kai ko kusa da waɗannan iyakokin ba.

• Yin amfani da wutar lantarki (Pd):52 mW. Wannan shine matsakaicin ƙarfin wutar lantarki da na'urar za ta iya ɓata cikin aminci a matsayin zafi.
• Matsakaicin ƙarfin halin yanzu na gaba (I_FP):60 mA. Wannan na'urar tana ba da izinin wannan ƙarfin a cikin yanayin bugun jini kawai (duty cycle ≤ 1/10, bugun fadi ≤ 0.1ms).
• Ci gaba da ƙarfin gaba (I_F):20 mA. Wannan shine mafi girman ƙarfin da aka ba da shawarar don aiki na DC mai ci gaba.
• Rage ƙimar ƙarfin:Lokacin da yanayin yanayi ya wuce 30°C, dole ne a rage mafi girman ƙarfin gaba mai ci gaba da adadin 0.27 mA a kowace digiri Celsius.
• Kewayon zafin aiki:-30°C zuwa +85°C. Na'urar an ƙera ta don yin aiki a cikin wannan kewayon zafin yanayi.
• Kewayon zafin ajiya:-40°C to +100°C.
• Pin Soldering Temperature:260°C for a maximum of 5 seconds, measured at a point 2.0mm (0.079 inches) from the device body.

2.2 Electrical and Optical Characteristics

These parameters define the typical performance of the device under specified conditions (I_F= 10mA, TA=25°C).

• Luminous Intensity (I_V):8.7 mcd (min), 15 mcd (typ), 29 mcd (max). This parameter measures the perceived power of the emitted light. Guaranteed values include a ±15% test tolerance.
• Viewing Angle (2θ_1/2):100 digiri (ƙimar al'ada). Wannan shine cikakken kusurwa lokacin da ƙarfin haske ya ragu zuwa rabin ƙimar a tsaye.
• Kololuwar tsawon raƙuman fitarwa (λ_P):572 nm (ƙimar al'ada). Tsawon raƙuman da ke da mafi ƙarfin fitarwa a cikin bakan.
• Babban tsawon raƙuman (λ_d):566 nm (matsakaicin), 569 nm (ƙimar al'ada), 574 nm (matsakaicin). Wannan shine tsawon raƙuman guda ɗaya wanda ya fi wakiltar launin haske da ido ke gani, wanda aka samo daga taswirar launi na CIE.
• Ramin rabin faɗin layin bakan (Δλ):15 nm (ƙimar al'ada). Ma'auni na tsaftar bakan fitarwa ko faɗin bakan.
• Ƙarfafan ƙarfin lantarki na gaba (V_F):1.6 V (matsakaicin), 2.0 V (ƙimar al'ada), 2.5 V (matsakaicin). Faɗuwar ƙarfin lantarki a ƙarshen LED lokacin da ƙayyadadden ƙarfin lantarki na gaba ya bi ta ciki.
• Reverse current (I_R):At a reverse voltage (V_R) of 5V, maximum 100 µA.Important Notice:This device is not designed for reverse bias operation; this test condition is for characterization only.

3. Binning System Specifications

To ensure consistency in applications, LEDs are binned according to key optical parameters. This allows designers to select devices that meet specific brightness and color requirements.

3.1 Luminous Intensity Binning

LED an rarrabe su bisa ga haske da aka auna a cikin I_F= 10mA. Kowane matakin yana da ƙarancin da babban iyaka tare da karkatarwa na ±15%.

• Matakin L3:8.7 mcd (ƙarami) zuwa 12.6 mcd (maksimum)
• Matakin L2:12.6 mcd (ƙarami) zuwa 19 mcd (maksimum)
• Matakin L1:19 mcd (ƙarami) zuwa 29 mcd (maksimum)

3.2 Dominant Wavelength (Hue) Binning

LEDs are also binned according to their dominant wavelength to control color consistency. The tolerance for each bin limit is ±1 nm.

• H06 bin:566.0 nm to 568.0 nm
• H07 bin:568.0 nm to 570.0 nm
• H08 bin:570.0 nm to 572.0 nm
• H09 Range:572.0 nm to 574.0 nm

4. Performance Curve Analysis

Although the source document references specific graphical data, the typical performance curves for this type of LED will clarify the relationship between key parameters. These curves are crucial for detailed circuit design and for understanding the device's behavior under non-standard conditions.

4.1 Typical Characteristic Curve

Designers should expect to analyze curves that include the following:

• Forward Current vs. Forward Voltage (I-V Curve):It demonstrates an exponential relationship, which is crucial for determining the required drive voltage and series resistance values.
• Luminous Intensity vs. Forward Current:It illustrates how the light output increases with current until the maximum rated value is reached.
• Luminous Intensity vs. Ambient Temperature:It shows the decrease in light output as the junction temperature rises, which is influenced by ambient temperature and drive current.
• Spectral Distribution:A plot of relative intensity versus wavelength, showing the peak at approximately 572 nm and the spectral width.
• Viewing Angle Distribution Diagram:Mchoro wa polar unaoelezea usambazaji wa pembe ya nguvu ya mwanga unaotolewa.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

Kifaa hiki kimeundwa kwa usakinishaji wa moja kwa moja wa pembe ya kulia. Maelezo muhimu ya vipimo ni pamoja na:

• Vipimo vyote vikuu vinatolewa kwa milimita, na inchi iko kwenye mabano.
• Isipokuwa imeelezwa vinginevyo, uvumilivu wa jumla wa ±0.25mm (±0.010") unatumika.
• The housing material is black/dark gray plastic.
• The integrated LED is yellow-green with a green diffuser lens.

5.2 Girman Kunshe

The component supply form is suitable for automated assembly.

• Carrier Tape:Made of black conductive polystyrene alloy, with a thickness of 0.50 mm ±0.06 mm.
• Carrier Tape Dimensions:The cumulative tolerance for 10 sprocket hole pitches is ±0.20 mm.
• Reel quantity:Each standard 13-inch reel contains 350 pieces.
• Reel dimensions:Standard reel dimensions (e.g., PS6 type) are used to ensure compatibility with automated equipment.

6. Jagorar Walda da Haɗawa

Proper handling is crucial for maintaining reliability and preventing damage.

6.1 Ajiyewa da Tsaftacewa

• Storage:For long-term storage (exceeding 3 months) outside the original packaging, use a sealed container with desiccant or a nitrogen environment. Recommended storage conditions are ≤30°C and relative humidity ≤70%.
• Cleaning:If necessary, clean only with alcohol-based solvents such as isopropyl alcohol.

6.2 Siffata Ƙugiya da Haɗa PCB

• Bend the leads at a minimum distance of 3mm from the LED lens base. Do not use the lens base as a fulcrum.
• All pin forming operations shall be performed at room temperature, and在 soldering.
• During PCB insertion, apply minimal clamping force to avoid mechanical stress on components.

6.3 Soldering Process

Maintain a minimum distance of 2mm from the lens/mount base to the solder joint. Avoid immersing the lens in solder.

• Hand soldering (soldering iron):Maximum temperature 350°C, not exceeding 3 seconds per solder joint.
• Wave soldering:Maximum preheat temperature 120°C, maximum 100 seconds. Maximum solder wave temperature 260°C, not exceeding 5 seconds. Ensure the solder wave does not contact the area within 2mm of the lens base.
• Critical Considerations:Excessively high temperature or duration may cause lens deformation or catastrophic LED failure. Avoid applying stress to the pins while the LED is at high temperature.

7. Application Design Recommendations

7.1 Drive Circuit Design

LEDs are current-driven devices. To ensure uniform brightness when using multiple LEDs, especially in parallel configurations,It is strongly recommendedConnect a current-limiting resistor in series with each LED.

• Recommended circuit (A):Each LED has its own independent series resistor connected to the power supply. This compensates for the normal differences in forward voltage (V_F) between individual LEDs, ensuring they all receive similar current and thus have similar brightness.
• Not recommended circuit (B):It is not recommended to directly parallel multiple LEDs and share a single resistor. Minor differences in the I-V characteristics of each LED can lead to significant current imbalance, causing uneven brightness, where one device may be overdriven while others are underdriven.

7.2 Electrostatic Discharge (ESD) Protection

LEDs are susceptible to damage from electrostatic discharge. The following precautions should be taken in handling and assembly environments:

• Personnel shall wear grounding wrist straps or antistatic gloves.
• All equipment, workstations, and storage furniture must be properly grounded.
• Use ionizers to neutralize static charges that may accumulate on plastic lenses during handling.
• Maintain training and certification programs for personnel working in ESD Protected Areas.

7.3 Application Scope and Limitations

This LED is suitable for general indicator applications in indoor/outdoor electronic signage and standard electronic equipment. Designers must ensure operating conditions (current, temperature) remain within the Absolute Maximum Ratings and Recommended Operating Conditions specified in this document.

8. Technical Comparison and Design Considerations

8.1 Key Differentiating Characteristics

Compared to basic LED lights, this product offers integrated features:

• Integrated Housing:The right-angle black bracket provides mechanical support, simplifies PCB layout, and enhances contrast without the need for a separate bezel or light guide.
• Diffused Output:The built-in diffuser lens provides a softer, wider viewing angle light source compared to clear lens LEDs, typically making it more suitable for status indication.
• Automation-Ready Packaging:Tape and reel packaging directly supports high-volume manufacturing processes.

8.2 Design Checklist

• Confirm the required luminous intensity and select the appropriate level (L1, L2, L3).
• Confirm the acceptable color range and select the corresponding wavelength level (H06-H09).
• According to the power supply voltage (V_{Power Supply}), typical V of LED_F(e.g., 2.0V) and the desired operating current (≤20mA DC) to calculate the series resistor value. Formula: R = (V_{Power Supply}- V_F) / I_F.
• Ensure the PCB layout provides the specified 2mm spacing between the pad and the device body.
• If the operating current is close to the maximum value or under high ambient temperature, consider the derating curve and plan a heat dissipation solution.

9. Tambayoyin da ake yawan yi (bisa sigogin fasaha)

9.1 Menene bambanci tsakanin madaidaicin tsayin kalaman da babban tsayin kalaman?

Peak Wavelength (λ_P):This is the physical wavelength at which the LED chip emits its strongest optical power. It is a property of the semiconductor material.Babban tsawon raƙuman (λ_d):This is a calculated value based on the CIE color-matching functions, representing the light color perceived by the human eye. For monochromatic light sources like this yellow-green LED, the two are usually close, but λ_dis the key parameter for color specification in applications.

9.2 Zan iya amfani da 20mA a ci gaba da tuƙa wannan LED?

Yes, 20mA is the specified maximum continuous forward current at an ambient temperature of 25°C. However, to improve long-term reliability and account for higher ambient temperatures, it is generally recommended to drive the LED at a lower current (e.g., 10-15mA) if the application's brightness requirements allow. Remember to apply derating when the ambient temperature exceeds 30°C.

9.3 Me ya sa har yanzu ina buƙatar resistor a jere ko da wutar lantarki na tana da iyaka?

A dedicated series resistor provides local, precise current regulation for each LED. It also protects against transient voltage spikes and helps balance current in parallel branches. Relying solely on a system-level current-limited power supply may not provide sufficient protection or balancing for individual LED components, especially when the power supply regulation is not tight enough or when wiring impedance varies.

10. Practical Application Examples

10.1 Designing a Dual-State Indicator Panel

Scenario:A network router requires two status LEDs: "Power On" (steady) and "Network Activity" (blinking). Both need to be clearly visible on a dark panel.

Design Steps:

1. Component Selection:Due to its high-contrast black housing and scattered green light, this LED is suitable. Select the bin to ensure color consistency (e.g., H07) and sufficient brightness (e.g., L2).
2. Circuit Design:The router motherboard provides a 3.3V power rail. For a target current of 10mA:
   R = (3.3V - 2.0V) / 0.010A = 130 ohms. The nearest standard values of 130Ω or 150Ω can be used.
3. PCB Layout:将LED放置在电路板边缘。直角设计使其垂直于电路板指向面板开孔。确保焊盘与安装孔边缘的距离>2mm，以保持所需间距。
4. Driving:The "Power On" LED is connected directly to the 3.3V power rail via its series resistor. The "Network Activity" LED is connected to the main microcontroller's GPIO pin via its series resistor, enabling software-controlled blinking.
5. Result:A simple, reliable indicator solution with uniform color and brightness, easily assembled via automated processes using tape-and-reel supply.

11. Technical Principles

11.1 LED Working Principle

A light-emitting diode (LED) is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type material recombine with holes from the p-type material in the active region of the junction. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap of the semiconductor material used—in this case, AlInGaP for yellow-green emission. The scattering lens above the chip, made of epoxy or similar material, scatters the light to create a wider, more uniform beam pattern.

12. Industry Trends and Background

12.1 Evolution of Indicator LEDs

Duk da yanzu LED na asali suna da muhimmanci, amma abubuwan da ke faruwa sun haɗa da juyawa zuwa kayan aiki mafi inganci (kamar InGaN don launuka masu faɗi), ƙananan wutar lantarki, da kuma kayan aikin SMD don ƙananan girma. Duk da haka, abubuwan da suke shiga kai tsaye kamar wannan samfurin suna ci gaba da kasancewa masu dacewa a cikin aikace-aikacen da ke buƙatar ƙarfin injiniya mafi girma, samfuri ko ƙananan samarwa, ko kuma siffar kusurwa ta musamman don shigar da panel. Kamar yadda aka nuna a cikin wannan labarin, haɗa harsashi tare da LED yana wakiltar hanya mai ƙima don sauƙaƙe tsarin haɗin gwiwar mai amfani na ƙarshe.