Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Target Applications and Market
- 2. Technical Parameters: An In-depth Objective Interpretation
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Bin System Specification
- 4. Performance Curve Analysis
- 4.1 Current-Voltage Characteristic Curve
- 4.2 Light Intensity-Current Characteristic Curve
- 4.3 Temperature Dependence
- 5. Mechanical and Packaging Information
- 5.1 Outline Dimensions
- 5.2 Polarity Identification
- 6. Welding and Assembly Guide
- 6.1 Storage Conditions
- 6.2 Cleaning
- 6.3 Lead Forming
- 6.4 Soldering Process
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 8. Application Recommendations and Design Considerations
- 8.1 Drive Circuit Design
- 8.2 Electrostatic Discharge Protection
- 8.3 Thermal Management
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions
- 10.1 Can this LED be driven directly with a 5V power supply?
- 10.2 Why is there a ±30% tolerance in the luminous intensity specification?
- 10.3 What is the difference between peak wavelength and dominant wavelength?
- 10.4 Can this LED be used for outdoor applications?
- 11. Practical Application Examples
- 12. Brief Introduction to Working Principles
- 13. Technical Trends and Development
1. Product Overview
LTL1DETBYJR5, durum göstergesi ve sinyal uygulamaları için özel olarak tasarlanmış, düz takma tipinde bir LED göstergedir. Standart T-1 tipi paketleme kullanır ve çeşitli elektronik cihazlar için güvenilir ve ekonomik bir çözüm sunar.
1.1 Core Features and Advantages
This LED product features low power consumption and high efficiency, making it suitable for energy-sensitive designs. It complies with the RoHS directive and is a lead-free product. Furthermore, it is classified as a halogen-free product, with its chlorine and bromine content strictly controlled below 900 ppm each, and their combined total below 1500 ppm. The device utilizes InGaN technology for the blue light chip and AlInGaP technology for the yellow light chip, both encapsulated within a white diffused lens to provide a uniform lighting appearance.
1.2 Target Applications and Market
The primary application areas for this LED include communication equipment, computer peripherals, consumer electronics, and home appliances. Its versatility and standard form factor make it a common choice for power indicators, status lights, and backlighting in various electronic products.
2. Technical Parameters: An In-depth Objective Interpretation
2.1 Absolute Maximum Ratings
All ratings are specified at an ambient temperature of 25°C. Exceeding these limits may cause permanent damage.
- Power consumption:Yellow light: maximum 78 mW; Blue light: maximum 120 mW. This parameter defines the maximum power that the LED can dissipate in the form of heat.
- Peak forward current:Both colors are 90 mA, but only under pulse conditions (duty cycle ≤ 1/10, pulse width ≤ 10 µs).
- DC Forward Current:To ensure reliable operation, the recommended continuous forward current for both yellow and blue LEDs is 30 mA.
- Temperature Range:Operating Temperature: -40°C to +85°C; Storage Temperature: -40°C to +100°C.
- Pin Soldering Temperature:Maximum 260°C for 5 seconds, measured at a point 2.0mm from the LED body.
2.2 Electrical and Optical Characteristics
Key performance parameters are measured at TA=25°C, IF=20 mA, unless otherwise specified.
- Luminous intensity:Yellow Light: Minimum 140 mcd, typical value 680 mcd; Blue Light: Minimum 110 mcd, typical value 880 mcd. The test tolerance for luminous intensity is ±30%.
- Viewing Angle:Both colors are approximately 40 degrees, defined as the off-axis angle when the luminous intensity drops to half of the axial value.
- Wavelength:
- Yellow light: Peak wavelength approximately 595 nm; Dominant wavelength range 580-604 nm.
- Blue light: Peak wavelength approximately 468 nm; Dominant wavelength range 462-478 nm.
- Spectral line half-width:Yellow light: approximately 16 nm; blue light: approximately 35 nm. This indicates the spectral purity of the emitted light.
- Forward voltage:Yellow Light: Typical value 2.05-2.4 V; Blue Light: Typical value 3.1-3.8 V. The higher VF of blue light is a typical characteristic of InGaN-based LEDs.
- Reverse Current:Maximum 10 µA at VR=5V. This device is not designed for reverse bias operation.
3. Bin System Specification
LEDs are binned according to their luminous intensity at 20 mA current. This ensures brightness consistency in production applications. The tolerance for binning limits is ±30%.
- Blue LED Binning:FG, HJ, KL, MN.
- Yellow LED Binning:GH, JK, LM.
Designers should specify the required bin code to ensure the desired brightness level is achieved in the application.
4. Performance Curve Analysis
Although specific charts are referenced in the datasheet, the following trends are standard characteristics for this type of LED and can be inferred from the provided data.
4.1 Current-Voltage Characteristic Curve
The forward voltage increases with the increase in forward current. Blue LEDs with a higher bandgap have both a higher turn-on voltage and operating voltage than yellow LEDs.
4.2 Light Intensity-Current Characteristic Curve
Before reaching the maximum rated current, the luminous intensity is approximately proportional to the forward current. Operating above 20mA increases brightness but also increases power consumption and junction temperature, thereby affecting lifespan and wavelength.
4.3 Temperature Dependence
LED performance is temperature sensitive. Typically, luminous intensity decreases as the junction temperature increases. The forward voltage also slightly decreases with rising temperature. The specified operating range of -40°C to +85°C defines the environmental conditions under which the published characteristics are guaranteed.
5. Mechanical and Packaging Information
5.1 Outline Dimensions
This LED uses a standard T-1 radial lead package. Key dimension specifications include:
- All dimensions are in millimeters.
- Unless otherwise specified, the general tolerance is ±0.25mm.
- The maximum resin protrusion under the flange is 1.0mm.
- Pin pitch is measured at the point where the pins extend from the package body.
5.2 Polarity Identification
For radial LEDs, the longer pin typically indicates the anode, and the shorter pin indicates the cathode. The flat side on the lens flange may also indicate the cathode side. Always verify the polarity before soldering to prevent damage from reverse bias.
6. Welding and Assembly Guide
6.1 Storage Conditions
For optimal shelf life, store LEDs in an environment with a temperature not exceeding 30°C and relative humidity not exceeding 70%. If removed from the original moisture barrier bag, use within three months. For long-term storage outside the original packaging, use a sealed container with desiccant or a nitrogen environment.
6.2 Cleaning
For cleaning, use alcohol-based solvents such as isopropyl alcohol. Avoid harsh chemicals that may damage the epoxy resin lens.
6.3 Lead Forming
Bend the leads at a minimum distance of 3mm from the base of the LED lens. Do not use the lens base as a fulcrum. All bending operations should be performed at room temperature and prior to the soldering process. Apply minimal force when inserting into the PCB to avoid mechanical stress.
6.4 Soldering Process
Maintain a minimum distance of 2mm from the bottom of the lens to the solder joint. Do not immerse the lens in solder.
- Manual Welding:Maximum temperature 350°C, maximum soldering time per pin 3 seconds.
- Wave soldering:Preheat ≤100°C, time ≤60 seconds. Solder wave ≤260°C, time ≤5 seconds. Ensure immersion position is not less than 2mm from the bottom of the lens.
- Important Notice:Infrared reflow soldering is not suitable for this through-hole LED product. Excessive heat or prolonged exposure can cause lens deformation or catastrophic failure.
7. Packaging and Ordering Information
7.1 Packaging Specifications
LEDs are packaged in anti-static bags. The standard packaging configuration is:
- 500, 200, or 100 pieces per bag.
- Each inner box contains 10 packaging bags.
- Each outer carton contains 8 inner boxes.
- The last package in a shipment lot may not be a full package.
8. Application Recommendations and Design Considerations
8.1 Drive Circuit Design
LED is a current-driven device. To ensure uniform brightness, especially when multiple LEDs are connected in parallel,It is strongly recommendedto connect a current-limiting resistor in series with each LED. It is not recommended to drive multiple LEDs in parallel without independent resistors, as the forward voltage of individual LEDs varies, which can lead to uneven current distribution and different brightness levels.
8.2 Electrostatic Discharge Protection
These LEDs are sensitive to electrostatic discharge. Please implement the following ESD control measures during handling and assembly:
- Use a grounded wrist strap or antistatic gloves.
- Ensure all equipment, workbenches, and storage racks are properly grounded.
- Use an ion generator to neutralize static charges that may accumulate on plastic lenses.
- Provide continuous training and certification for personnel working in ESD protected areas.
8.3 Thermal Management
Although power consumption is low, a proper PCB layout aids in heat dissipation. Avoid placing LEDs near other heat-generating components. Operating LEDs at currents below the maximum rated 30mA improves long-term reliability by reducing the junction temperature.
9. Technical Comparison and Differentiation
LTL1DETBYJR5 combines multiple features, positioning it for general indicator applications:
- Halogen-Free Compliance:Meets stringent environmental requirements for chlorine and bromine content, which is advantageous for eco-friendly design and certain market regulations.
- Wide Viewing Angle:40-degree viewing angle and white diffused lens provide a wide, uniform illumination pattern, suitable for status indicators requiring visibility from various angles.
- Same package dual-color option:Offers both blue and yellow light choices within the same T-1 package, simplifying inventory and design for multi-color indication systems.
10. Frequently Asked Questions
10.1 Can this LED be driven directly with a 5V power supply?
No. A series current-limiting resistor must be used. For example, for a blue LED with a typical VF of 3.8V, driven with a 5V supply at 20mA: R = (5V - 3.8V) / 0.020A = 60 ohms. A standard 62-ohm resistor is suitable. Always calculate based on the maximum VF to ensure the current does not exceed the limit.
10.2 Why is there a ±30% tolerance in the luminous intensity specification?
This tolerance accounts for normal production variations in semiconductor chip and packaging processes. A binning system is used to classify LEDs into tighter luminous intensity groups, providing consistency for end-users who specify a particular bin code.
10.3 What is the difference between peak wavelength and dominant wavelength?
Peak wavelength is the wavelength at which the emission spectral intensity reaches its maximum. Dominant wavelength is derived from the CIE chromaticity diagram and represents the single wavelength of a pure spectral color that matches the perceived color of the LED. For color specification related to human vision, dominant wavelength is more relevant.
10.4 Can this LED be used for outdoor applications?
The datasheet indicates suitability for indoor and outdoor signage. However, for harsh outdoor environments involving prolonged exposure to UV radiation, moisture, and extreme temperatures, the long-term reliability of the epoxy lens material should be evaluated. Application of conformal coating on the PCB may be required to provide additional protection.
11. Practical Application Examples
Scenario:Design a multi-status indicator panel for a network router, including power, activity, and link indicator lights, all powered from a 3.3V power rail.
Design Steps:
- Component Selection:Select the yellow and blue light models of LTL1DETBYJR5. Choose the appropriate bin code for the desired brightness consistency.
- Current Setting:Determine the drive current, for example 15 mA, to achieve sufficient brightness and lower power consumption.
- Blue LED resistor calculation:Using VFmax=3.8V, supply=3.3V. R = (3.3V - 3.8V) / 0.015A = negative value. This indicates that 3.3V is insufficient to forward bias the blue LED at its typical voltage. The design must use a higher supply voltage for the blue LED, or select a blue LED with a lower VF.
- Yellow LED resistor calculation:Using maximum VF=2.4V. R = (3.3V - 2.4V) / 0.015A = 60 ohms.
- PCB Layout:Place the LED on the front panel. Ensure the pin hole dimensions are correct. Maintain a 2mm gap between the pad and the LED body. Route traces to power and ground.
- Assembly:Insert the LED, bend the pins on the soldering side and cut them off. Use a temperature-controlled soldering iron to quickly solder each pin.
This example emphasizes the importance of checking the power supply voltage matches the LED forward voltage during the design phase.
12. Brief Introduction to Working Principles
A light-emitting diode is a semiconductor device that emits light when an electric current passes through it. This phenomenon is called electroluminescence.
- Blue LED:The active region is made of indium gallium nitride. When electrons and holes recombine in this region, energy is released in the form of photons. The specific bandgap energy of the InGaN alloy determines the blue color.
- Yellow LED:The active region uses aluminum indium gallium phosphide. Compared to InGaN, this material system has a lower bandgap energy, resulting in yellow light emission.
- White Diffuser Lens:The epoxy lens serves two functions: 1) Encapsulating and protecting the semiconductor chip and bonding wires. 2) The white diffuser material scatters light from the small chip, creating a uniform, wide-angle emission pattern and giving the unpowered LED a white appearance.
13. Technical Trends and Development
Ko da yake kamar LED na T-1 packaging irin waɗannan na shigar kai tsaye suna da muhimmanci ga ƙirƙira samfuri, haɗa hannu, da wasu aikace-aikace, amma mafi faɗin yanayin masana'antu ya juya sosai zuwa na'urorin haɗawa saman. SMD packaging yana da fa'idodi a cikin haɗawa ta atomatik, ƙananan girma, ƙananan tsayi, da kuma yawanci mafi kyawun sarrafa zafi. Don aikace-aikace masu haske mai ƙarfi da ƙarfi mai ƙarfi, SMD packaging da keɓantaccen ƙarfi mai ƙarfi na LED sun mamaye.
Duk da haka, LED na shigar kai tsaye suna da alaƙa saboda ƙarfin injiniyoyi, sauƙin haɗa hannu, da kuma dacewa da kayan koyarwa, ayyukan masu sha'awa, da sauransu. Ci gaban kayan kuma ya inganta inganci da tsawon rayuwa na tsohuwar packaging na shigar kai tsaye. Maɓalli na irin waɗannan abubuwan yawanci yana kan cimma mafi girman aminci, mafi ƙarancin dacewa da muhalli, da kuma kiyaye fa'idar farashi don aikace-aikacen nuna alama mai yawa da mai hankali da farashi.
Bayanin kalmomin ƙayyadaddun LED
Complete Interpretation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Terminology | Unit/Representation | Popular Explanation | Aiseā e taua ai |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Luminous Flux | lm (lumen) | The total amount of light emitted by a light source, commonly known as "brightness". | Determines whether the luminaire is bright enough. |
| Viewing Angle | ° (degree), e.g., 120° | The angle at which luminous intensity drops to half, determining the beam width. | Affects the range and uniformity of illumination. |
| Correlated Color Temperature (CCT) | K (Kelvin), such as 2700K/6500K | Launin haske mai dumi ko sanyi, ƙananan ƙima sun karkata zuwa rawaya/dumi, manyan ƙima sun karkata zuwa fari/sanyi. | Yana ƙayyade yanayin hasken wuta da yanayin da ya dace. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Affects color authenticity, used in high-demand places such as shopping malls and art galleries. |
| Color tolerance (SDCM) | MacAdam ellipse step, such as "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Ensure no color difference among luminaires from the same batch. |
| Dominant Wavelength | nm (nanometer), e.g., 620nm (red) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Shows the intensity distribution of light emitted by an LED at each wavelength. | Affects color rendering and color quality. |
II. Electrical Parameters
| Terminology | Symbol | Popular Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | The peak current that can be withstood for a short period of time, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | LED yana iya jure mafi girman ƙarfin lantarki na baya, wanda ya wuce wannan yana iya haifar da fashewa. | A cikin da'ira, ya kamata a hana haɗuwa ta baya ko kuma ƙarfin lantarki mai tsanani. |
| Thermal Resistance (Thermal Resistance) | Rth (°C/W) | The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. | High thermal resistance requires stronger cooling design, otherwise junction temperature rises. |
| Electrostatic Discharge Immunity (ESD Immunity) | V (HBM), e.g., 1000V | Electrostatic discharge immunity; a higher value indicates greater resistance to ESD damage. | Anti-static measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Popular Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Directly define the "useful life" of LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to prolonged high temperatures. | It may lead to a decrease in brightness, color change, or open-circuit failure. |
IV. Packaging and Materials
| Terminology | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Types | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Chip Structure | Front-side, Flip Chip | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | Optical structure on the packaging surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Grading
| Terminology | Grading Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products in the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Ease of matching the driving power supply, improving system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color Temperature Grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Terminology | Standard/Test | Popular Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure the product does not contain harmful substances (such as lead, mercury). | Entry requirements for the international market. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |