LTW-R4NLDJDJH239 LED Lamp Specification Sheet - Through-Hole Type - White Diffused Lens - 3.2V - 30mA - Chinese Technical Documentation

1. Product Overview

LTW-R4NLDJDJH239 is a through-hole mount LED indicator designed specifically for Circuit Board Indicator (CBI) applications. It consists of a black plastic right-angle bracket (housing) combined with a white LED. This design aims to facilitate assembly onto a Printed Circuit Board (PCB). The product features low power consumption, high efficiency, and compliance with RoHS and lead-free requirements.

1.1 Core Features

• Designed to simplify circuit board assembly.
• The black housing enhances contrast, improving visibility.
• Low power consumption and high luminous efficiency.
• Lead-free product compliant with RoHS directive.
• LED uses InGaN technology, combined with a white diffusing lens, to emit white light.

1.2 Target Applications

• Computer systems and peripheral equipment.
• Communication equipment.
• Consumer Electronics.
• Industrial Control and Instrumentation.

2. Technical Parameters: In-depth Analysis

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage to the device.

• Power consumption:108 mW
• Peak forward current:100 mA (duty cycle ≤ 1/10, pulse width ≤ 10ms)
• DC forward current:30 mA
• Current derating:Linear derating from 30°C at a rate of 0.45 mA/°C.
• Operating Temperature Range:-40°C to +85°C
• Temperature Range for Storage:-40°C to +100°C
• Pin Soldering Temperature:Maximum 260°C for 5 seconds, measurement point 2.0mm from lamp body.

2.2 Electrical and Optical Characteristics

Key performance parameters are measured at TA=25°C and forward current (IF)=20 mA, unless otherwise specified.

• Luminous intensity (Iv):Typical value is 300 mcd, ranging from 140 mcd (min) to 520 mcd (max). Measurement includes a ±15% test tolerance.
• Viewing angle (2θ1/2):Horizontal (H) is 130 degrees, vertical (V) is 120 degrees. These are the off-axis angles at which the luminous intensity drops to half of the axial value.
• Chromaticity coordinates (x, y):Typical values are x=0.30, y=0.29, derived from the CIE 1931 chromaticity diagram.
• Forward voltage (VF):Typical value is 3.2V, ranging from 2.8V (min) to 3.6V (max) at IF=20mA.
• Reverse Current (IR):Maximum is 10 μA at a Reverse Voltage (VR) of 5V. Note: This device is not designed for reverse operation; this test condition is for characterization only.

3. Binning System Description

LEDs are sorted (binned) based on their measured luminous intensity and chromaticity to ensure consistency in applications.

3.1 Luminous Intensity Binning

Binning is defined by letter codes, indicating the minimum and maximum luminous intensity at IF=20mA. Each bin limit has a tolerance of ±15%.

• G:140 mcd (minimum) to 180 mcd (maximum)
• H:180 mcd to 240 mcd
• J:240 mcd to 310 mcd
• K:310 mcd to 400 mcd
• L:400 mcd to 520 mcd

Iv classification code is marked on each individual packaging bag.

3.2 Hue (Chromaticity) Binning

Hue is classified into different grades (e.g., B1, B2, C1, C2, D1, D2) based on specific quadrilateral areas defined by (x, y) coordinate boundaries on the CIE 1931 chromaticity diagram. The color coordinate measurement tolerance is ±0.01. The provided specification includes a table listing the exact coordinate boundaries for each hue grade, along with a reference CIE chromaticity diagram for visualization.

4. Mechanical and Packaging Information

4.1 External Dimensions and Materials

This product adopts a right-angle straight plug-in design. Key mechanical descriptions include:

• All dimensions are in millimeters (inches in parentheses).
• Unless otherwise specified, the standard tolerance is ±0.25mm (±0.010 inches).
• The bracket (housing) material is black plastic (PA9T).
• The LED light itself is white.

(Note: The specific dimensional drawings are referenced in the original PDF but are not reproduced here in text form. Please refer to the specification sheet for precise dimensions).

4.2 Packaging Specifications

LEDs are packaged in trays for easy handling and transportation. The exact tray dimensions and capacity are detailed in the packaging diagram of the original specification sheet.

5. Assembly, Welding, and Operation Guide

5.1 Storage Conditions

For optimal storage life, LEDs should be stored in an environment with a temperature not exceeding 30°C and a relative humidity not exceeding 70%. If removed from the original moisture-proof packaging, it is recommended to use them within three months. For long-term storage outside the original packaging bag, please store them in a sealed container with desiccant or in a nitrogen environment.

5.2 Cleaning

If cleaning is required, use alcohol-based solvents such as isopropanol. Avoid using other harsh chemicals.

5.3 Pin Forming and PCB Assembly

• Bend the pins at least 3mm away from the LED lens base. Do not use the base of the lead frame as a fulcrum.
• Pin forming must be performed at room temperature and在completed before the soldering process.
• When inserting into the PCB, use the minimum required clamping force to avoid applying excessive mechanical stress to the components.

5.4 Soldering Recommendations

Maintain a minimum distance of 2mm from the lens/mount base to the solder joint. Avoid immersing the lens/mount in the solder.

• Soldering iron:Maximum temperature 350°C, maximum time 3 seconds (one time only).
• Wave soldering:Maximum preheat temperature 120°C, maximum duration 100 seconds. Maximum solder wave temperature 260°C, maximum duration 5 seconds.

Warning:Excessive soldering temperature or duration may cause LED lens deformation or catastrophic failure.

6. Application Design Considerations

6.1 Drive Circuit Design

LED is a current-driven device. To ensure uniform brightness when using multiple LEDs, it is strongly recommended to drive each LED with an independent current-limiting resistor in series (Circuit Model A). It is not recommended to directly connect multiple LEDs in parallel (Circuit Model B), as slight differences in the forward voltage (Vf) characteristics between individual LEDs can lead to significant differences in current distribution, resulting in uneven brightness.

6.2 Kariya daga Zubar da Wutar Lantarki (ESD)

Wannan LED yana da saukin lalacewa ta hanyar fitar da lantarki na tashin hankali (ESD) ko ƙarfin wutar lantarki. Matakan rigakafin sun haɗa da:

• Operatoren sollten beim Umgang mit LEDs leitfähige Armbänder oder antistatische Handschuhe tragen.
• Alle Geräte, Werkzeuge und Arbeitsplätze müssen ordnungsgemäß geerdet sein.
• Verwenden Sie einen Ionisator, um elektrostatische Ladungen zu neutralisieren, die sich durch Handhabungsreibung auf der Oberfläche von Kunststofflinsen ansammeln können.

6.3 Applicable Applications and Limitations

This LED is suitable for indoor/outdoor signage and general indicator applications in common electronic equipment. Designers must ensure that operating conditions (current, temperature) remain within the absolute maximum ratings and recommended operating conditions specified in this document.

7. Performance Curves and Typical Characteristics

The original datasheet references the "Typical Electrical/Optical Characteristic Curves" section. These graphs typically illustrate the relationship between forward current and luminous intensity, forward voltage and temperature, and may also include spectral distribution. For detailed curve analysis, please refer to the graphical data in the official PDF, as it provides visual confirmation of performance trends under various conditions.

8. Technical Comparison and Differentiation

Although this independent specification sheet does not provide direct comparisons with other specific models, the key differentiating features of this product can be inferred from its specifications:

• Right-angle through-hole design:Provides a specific mounting orientation compared to vertical or surface-mount alternatives, suitable for side-view or space-constrained applications.
• Black housing:Offers higher contrast relative to the light-emitting lens, improving visibility under various lighting conditions.
• Wide viewing angle:A viewing angle of 130° (horizontal) x 120° (vertical) provides a broad visible range, suitable for applications where the indicator light may be viewed from off-axis positions.
• Comprehensive Binning:Detailed luminous intensity and chromaticity binning allow for tighter color and brightness matching in critical applications.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the recommended operating current?

The typical test condition is 20mA. The absolute maximum rating for continuous DC current is 30mA. For long-term reliable operation, it is recommended to drive the LED at 20mA or below. If the ambient temperature exceeds 30°C, appropriate derating may be necessary.

9.2 Yaya za a fassara lambobin rarrabawa?

The letter code (G, H, J, K, L) on the package bag indicates the luminous intensity range. You must cross-reference it with the binning table in Section 7 of the datasheet to know the precise min/max mcd values for your batch. The chromaticity bin information is usually provided in the master package or batch file.

9.3 Shin zan iya amfani da wannan LED ba tare da resistor na iyakancewar kwarara ba?

A'a. Ba a ba da shawarar haɗa LED kai tsaye zuwa tushen ƙarfin lantarki ba, wannan yana iya lalata na'urar saboda wuce gona da iri na kwarara. Dole ne a haɗa resistor a jere, bisa ga ƙarfin lantarki mai tuƙi da halayen Vf na LED don saita madaidaicin kwarara mai gaba.

9.4 Madhumuni ya vipimo vya kupunguza mzigo ni nini?

The derating factor (0.45 mA/°C from 30°C) indicates the amount by which the maximum allowable continuous forward current must be reduced for each 1°C increase in ambient temperature. This is crucial for thermal management and ensuring device reliability at higher operating temperatures.

10. Mifano ya Ubunifu na Matumizi

Scene:Design a status indicator panel for an industrial controller. The panel requires multiple white power indicator lights that are visible from all angles on the assembly line.

Component Selection Rationale:LTW-R4NLDJDJH239 is selected because its right-angle through-hole design allows it to be mounted perpendicular to the PCB, making the light output parallel to the panel surface. The wide viewing angle ensures visibility for operators standing at different positions. The black housing increases contrast against the metal panel. The designer specified the manufacturer to supply "J" or "K" bins to ensure all indicators have a consistently bright visual appearance.

Circuit Implementation:Each LED is driven from the 5V supply rail through an independent 100Ω series resistor (approximately 18mA calculated at a typical Vf of 3.2V), implementing the recommended circuit model A. The PCB layout ensures a 2mm gap between the solder joint and the LED base. Wave soldering parameters are set within the datasheet limits.

11. Technical Principle Introduction

This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology, which is commonly used in modern LEDs to produce white light. White light is typically generated by using a blue InGaN chip coated with a phosphor layer. The phosphor absorbs part of the blue light and re-emits it as yellow light. The remaining blue light combines with the broad-spectrum yellow phosphorescence to create the perception of white light. A diffuser lens above the chip is used to scatter the light, creating a more uniform appearance and widening the effective viewing angle.

12. Industry Trends and Background

Although through-hole LEDs like these remain crucial for many applications requiring robust mechanical mounting or hand soldering, the broader industry trend continues to shift towards Surface-Mount Device (SMD) packages to enable automated assembly, higher density, and lower-profile designs. However, through-hole components maintain advantages in certain scenarios: high-reliability applications where solder joint integrity is critical, prototyping, educational use, and situations requiring the specific mechanical form factor (such as right-angle mounting) offered by this product. As shown in this datasheet, the emphasis on RoHS compliance and lead-free soldering profiles reflects global environmental regulations that have now become standard across the electronics industry.