LTW-R4MLDGDJH234 LED Lamp Specification Sheet - White Diffused Lens - 20mA Forward Current - 3.2V Typical Forward Voltage - Technical Documentation

1. Product Overview

This document details the specifications of a through-hole mount LED lamp assembly. The product consists of a white LED with a diffused lens, encapsulated within a black plastic right-angle bracket (housing). This design is specifically intended for use as a Circuit Board Indicator (CBI), providing clear visual status indication for electronic equipment.

1.1 Core Advantages and Target Market

The core advantages of this LED component include: convenient PCB assembly facilitated by the through-hole design and lead frame, high visual contrast provided by the black housing, and high efficiency with low power consumption. This is a lead-free product compliant with the RoHS directive. The emitted white light is generated by an InGaN (Indium Gallium Nitride) chip and achieves a uniform appearance through a white diffused lens.

Target applications span several key electronic fields, including computers, communication equipment, consumer electronics, and industrial equipment, all of which require reliable and clear status indication.

2. Technical Parameters: In-depth and Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (TA) of 25°C.

• Power Consumption:Maximum 108 mW. This is the total power the device can safely dissipate as heat.
• Forward Current:30 mA DC forward current is the maximum continuous current. Only under pulse conditions (duty cycle ≤ 1/10, pulse width ≤ 10ms) is a higher peak forward current of 100 mA permitted.
• Thermal Derating:When the ambient temperature exceeds 30°C, the maximum permissible DC forward current must be linearly reduced by 0.45 mA for every 1°C increase.
• Temperature Range:The operating temperature rating of the device is from -40°C to +85°C, and the storage ambient temperature range is from -40°C to +100°C.
• Soldering Temperature:During pin soldering, the temperature at a distance of 2.0mm from the device body must not exceed 260°C for more than 5 seconds.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured at TA=25°C and a forward current (IF) of 20 mA (standard test conditions).

• Luminous Intensity (Iv):The range is from a minimum of 140 mcd to a maximum of 520 mcd, with a typical value of 300 mcd. The intensity of specific units is binned and categorized (see Section 4). Measurements include a test tolerance of ±15%.
• Viewing Angle (2θ1/2):Defined as the full angle where the intensity drops to half of the axial value. It is 130 degrees in the horizontal plane and 120 degrees in the vertical plane, indicating a wide viewing cone.
• Chromaticity coordinates (x, y):The white light chromaticity point is defined on the CIE 1931 chromaticity diagram. Typical coordinates are x=0.30, y=0.29. Specific hue grades are defined in the binning table.
• Forward voltage (VF):A 20 mA, ƙimar al'ada ita ce 3.2V, kewayon daga 2.8V zuwa 3.6V. Wannan sigar yana da mahimmanci don ƙirar da'irar iyakancewar igiyar ruwa.
• Kwararar baya (IR):Lokacin da aka yi amfani da ƙarfin baya na 5V (VR), matsakaicin ƙimar kwararar baya shine 10 μA. Na'urar ba a ƙirƙira ta don aiki a ƙarfin baya ba.

3. Explanation of the Grading System

To ensure consistency in applications, LEDs are sorted (binned) according to key optical parameters.

3.1 Luminous Intensity Grading

LED binning is classified according to its luminous intensity measured at 20 mA, represented by letter grades (G, H, J, K, L). Each grade has defined minimum and maximum intensity ranges. A tolerance of ±15% is applied to the bin limits. For example, the 'J' bin covers intensities from 240 mcd to 310 mcd.

3.2 Hue (Color) Binning

White color points are also binned. The datasheet provides chromaticity coordinate ranges for multiple hue grades (B1, B2, C1, C2, D1, D2). Each grade is defined by a quadrilateral area on the CIE chromaticity diagram, specified by four pairs of (x, y) coordinates. A deviation of ±0.01 is allowed for color coordinate measurement.

4. Mechanical and Packaging Information

4.1 Outline Dimensions and Materials

The product features a right-angle through-hole design. The bracket (housing) is made of black plastic (material: PA9T). The LED itself is white. Unless otherwise specified, all dimensional tolerances are ±0.25mm. Please refer to the original specification for the exact mechanical drawings.

4.2 Packaging Specifications

LEDs are packaged in bags, with each bag containing 400, 200, or 100 pieces. Seven such bags are placed into an inner box, totaling 2,800 pieces. Then, eight inner boxes are packed into an outer shipping carton, with each outer carton totaling 22,400 pieces. Please note that within each shipping lot, only the last bag may not be a full bag.

5. Welding and Assembly Guide

Aikin daidai yana da mahimmanci don tabbatar da dogaro da hana lalacewa.

5.1 Storage and Cleaning

During storage, the ambient temperature should not exceed 30°C or relative humidity 70%. LEDs removed from the original packaging should be used within three months. For long-term storage outside the original packaging, they should be kept in a sealed container with desiccant or in a nitrogen environment. For cleaning, only alcohol-based solvents such as isopropyl alcohol should be used.

5.2 Pin Forming and PCB Assembly

If pin bending is required, it must be performed at room temperature and before soldering. The bending point should be at least 3mm away from the LED lens base. Do not use the base of the lead frame as a fulcrum. During PCB assembly, apply the minimum possible pressing force to avoid excessive mechanical stress on the component.

5.3 Soldering Process

A minimum clearance of at least 2mm must be maintained between the lens/stand base and the solder joint. The lens/stand must not be immersed in the solder. When the LED is at a high temperature due to soldering, no external stress should be applied to the pins.

Recommended soldering conditions:

• Soldering iron:Temperature: max 350°C. Time: max 3 seconds (only once). Position: not less than 2mm from the base.
• Wave soldering:Preheating: up to 120°C, maximum 100 seconds. Solder wave: up to 260°C, maximum 5 seconds. Immersion position: not less than 2mm from the base.

Excessively high temperature or time may cause lens deformation or catastrophic failure.

6. Application Suggestions and Design Considerations

6.1 Driving Method

LED is a current-driven device. To ensure uniform brightness when multiple LEDs are connected in parallel, it is strongly recommended to connect an independent current-limiting resistor in series with each LED. Driving multiple LEDs in parallel without independent resistors (as shown in the non-recommended circuit diagram) may lead to brightness differences due to the natural variation in the forward voltage (I-V characteristics) of each LED.

6.2 Kariya ta Hatsarin Wutar Lantarki (ESD)

These LEDs are susceptible to damage from electrostatic discharge or power supply surges. To prevent ESD damage: Operators should wear conductive wrist straps or anti-static gloves when handling LEDs; all equipment, fixtures, and machinery used during handling and assembly must be properly grounded.

6.3 Yanayin Aikace-aikace na Al'ada

This LED is suitable for indoor and outdoor signage applications, as well as status indication in general electronic devices. Its right-angle bracket makes it ideal for applications where the PCB mounting direction is perpendicular to the viewing direction, such as front panel indicator lights.

7. Technical Comparison and Differentiation

While the datasheet provides specifications for a single part number, key market differentiators for such products typically include: the use of dedicated brackets for easier assembly and improved contrast; a wide viewing angle suitable for multi-directional observation; a defined intensity and color binning structure for design consistency; and clear, detailed application notes covering soldering, handling, and driving, which help improve design reliability.

8. Frequently Asked Questions (Based on Technical Specifications)

Q: What is the function of the black housing?
A: The black plastic housing serves as the LED's mounting bracket, simplifying PCB assembly. More importantly, it provides a high-contrast background for the emitted white light, making the indicator visually more prominent.

Q: How to choose the correct current-limiting resistor?
A: Use Ohm's Law: R = (Supply Voltage - VF) / IF. For a conservative design, use the maximum forward voltage (VF) from the datasheet (3.6V) to ensure the current does not exceed 20mA. For example, with a 5V supply: R = (5V - 3.6V) / 0.020A = 70 ohms. A standard 68 or 75 ohm resistor is suitable.

Q: Can I drive this LED directly with a voltage source?
A: No. It is not recommended to drive an LED directly with a voltage source, as it is likely to be damaged due to excessive current. LEDs must be driven with a current-limiting source; the simplest method is to use a series resistor as described above.

Q: What does the 'Binning Code' marked on the packaging bag mean?
A: It indicates the luminous intensity bin (e.g., G, H, J) of the LEDs in that bag. Designers can specify the binning code when placing an order to ensure all LEDs in their product have a consistent brightness level.

9. Introduction to Working Principles

This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology. When a forward voltage is applied between the anode and cathode of the LED, electrons and holes recombine within the semiconductor's active region, releasing energy in the form of photons (light). The specific composition of the InGaN layer determines the wavelength of the emitted light, which in this case is in the blue/ultraviolet spectrum. This light then excites the phosphor coating inside the package, generating a broad spectrum perceived as white light through down-conversion. A diffuser lens scatters this light, creating a uniform, glare-free emission pattern.

10. Development Trends

The overall trend in indicator LED technology continues to move towards higher efficiency (more light output per unit of electrical power), improved color consistency and Color Rendering Index (CRI) for white LEDs, and the development of smaller packages while maintaining or improving optical performance. Simultaneously, there is a strong focus on enhancing reliability and extending lifespan under a wider range of environmental conditions. As shown in this datasheet, clear binning, robust mechanical design, and comprehensive application guidelines remain fundamental to providing reliable components for industrial and consumer electronics.