LTW-42FDP9H61Y Through-Hole LED Lamp Bead Datasheet - White Light, Water Clear Lens - 20mA, 3.2V - Chinese Technical Documentation

1. Product Overview

This document details the specifications of a through-hole mount LED lamp bead. This device belongs to the Circuit Board Indicator (CBI) type, utilizes a black plastic right-angle bracket (housing), and is designed to be used with a specific LED lamp bead. The component features a stackable design for easy assembly, enabling various mounting methods on printed circuit boards or panels.

1.1 Core Features

• Lead-free product compliant with the RoHS Directive.
• Low power consumption, high luminous efficacy.
• Multiple mounting configurations: top view (with spacer) or right-angle mount, arrangeable horizontally or vertically.
• IC compatible, low current requirement.
• Utilizes T-1 sized lamp bead, emits white light through water-clear lens.

1.2 Target Applications

This LED lamp bead is suitable for a wide range of electronic device applications, including but not limited to:

• Tsarin kwamfuta da na'urorin gefe.
• Na'urorin sadarwa.
• Kayayyakin lantarki na masu amfani.
• Na'urorin masana'antu da masu sarrafawa.

2. Detailed Technical Specifications

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage.

• Power Dissipation:74 mW
• Peak Forward Current:60 mA (Duty Cycle ≤ 1/10, Pulse Width ≤ 10μs)
• DC Forward Current:20 mA
• Current Derating:Linear derating from 30°C at a rate of 0.3 mA/°C
• Operating Temperature Range:-25°C to +85°C
• Storage Temperature Range:-30°C to +100°C
• Pin Soldering Temperature:Maximum 260°C for 5 seconds, measured 2.0mm (0.079 inches) from the lamp body.

2.2 Electrical and Optical Characteristics

Key performance parameters are measured at TA=25°C and forward current (IF)=20mA, unless otherwise specified.

• Luminous Intensity (Iv):Min. 400 mcd, Typ. 1000 mcd, Max. 1900 mcd. Measured according to the CIE human eye response curve. Guaranteed values include a ±15% test tolerance.
• Viewing Angle (2θ1/2):Typical value is 90 degrees. Defined as the off-axis angle where the luminous intensity drops to half of its axial value.
• Chromaticity Coordinates (x, y):Typical values are x=0.36, y=0.39, derived from the 1931 CIE chromaticity diagram.
• Correlated Color Temperature (CCT):Typical value is 5000 K.
• Forward Voltage (VF):Minimum 2.8 V, typical 3.2 V, maximum 3.7 V.
• Reverse Current (IR):Maximum 10 μA at a Reverse Voltage (VR) of 5V. This device is not designed for reverse operation.

3. Binning System Description

Don domin cikin aikace-aikacen, samfurin yana rarrabe bisa ga ƙarfin haske da launi.

3.1 Luminous Intensity Binning

A IF=20mA, ƙarfin yana rabuwa zuwa lambobin matakai uku. Kowane iyakar matakin tana da ƙimar giciye na ±15%.

• Matakin LM:400 mcd (mafi ƙanƙanta) zuwa 680 mcd (mafi girma)
• Matakin NP:680 mcd (mafi ƙanƙanta) zuwa 1150 mcd (mafi girma)
• Gear QR:1150 mcd (min) to 1900 mcd (max)

The Iv classification code is marked on each individual packaging bag.

3.2 Hue (Chromaticity) Binning

Chromaticity coordinates are grouped into specific hue grades (e.g., E3, E4, F3, F4, G3, G4). Each grade defines a quadrilateral area with specified angular coordinates (x, y) on the CIE 1931 chromaticity diagram. The measurement tolerance for chromaticity coordinates is ±0.01.

4. Performance Curve Analysis

This specification references typical electrical and optical characteristic curves. These graphical representations are crucial for understanding device behavior under various conditions, although specific curve data (e.g., IV curve, relative luminous intensity vs. ambient temperature, spectral distribution) are not detailed in the provided text. Designers should consult the complete specification to obtain these curves, thereby optimizing drive current, understanding the impact of thermal effects on light output, and ensuring color consistency.

5. Mechanical and Packaging Information

5.1 Outline Dimensions

The device consists of a black plastic holder and a T-1 white LED with a water-clear lens. All dimensions are in millimeters, with a general tolerance of ±0.25mm unless otherwise specified. The specification references a detailed dimensional drawing, which is critical for PCB pad design and panel cutout dimensions.

5.2 Polarity Identification and Lead Forming

During assembly, leads must be bent at a minimum distance of 3mm from the base of the LED lens. The base of the lead frame must not be used as a fulcrum. This operation must be performed before soldering at room temperature to avoid damaging the internal chip and bonding wires.

5.3 Packaging Specifications

The datasheet includes packaging specification drawings that detail the arrangement of components on reels, trays, or other packaging forms to facilitate automated or manual handling. This information is crucial for production planning and inventory management.

6. Soldering and Assembly Guide

6.1 Soldering Process

Important Note:A minimum distance of 2mm must be maintained from the lens/mount base to the solder joint. The lens/mount must not be immersed in solder.

• Soldering Iron:Maximum temperature 350°C, maximum 3 seconds (only once).
• Wave soldering:
  • Preheat: maximum 120°C, maximum 60 seconds.
  • Solder wave: maximum 260°C, maximum 5 seconds.

Note:Infrared reflow soldering is not suitable for this type of through-hole LED product. Exceeding temperature or time limits may cause lens deformation or catastrophic failure. The maximum wave soldering temperature does not represent the heat deflection temperature (HDT) or melting point of the leadframe.

6.2 Storage Conditions

Domin kuma mafi kyawun rayuwar kwanciyar hankali, LED ya kamata a adana shi a cikin yanayin da bai wuce 30°C ko 70% zafi ba. Abubuwan da aka cire daga fakitin hana danshi na asali ya kamata a yi amfani da su cikin watanni uku. Don adana dogon lokaci a waje da fakitin asali, ya kamata a adana su a cikin kwandon da aka rufe tare da maganin bushewa ko a cikin na'urar bushewar yanayin nitrogen.

6.3 Cleaning

Idan ana buƙatar tsaftacewa, yi amfani da kaushi na barasa, kamar isopropyl alcohol.

7. Application Notes and Design Considerations

7.1 Driving Method

LED na'urar tuƙi ce ta halin yanzu. Don tabbatar da daidaiton haske lokacin haɗa LED da yawa a layi daya, ana ba da shawarar sosai don sanya resistor mai iyakancewa a jere tare da kowane LED (Tsarin kewaye A). Ba a ba da shawarar tuƙin LED a layi daya ba tare da resistor mai zaman kansa ba (Tsarin kewaye B), saboda ƙananan bambance-bambance a halayen ƙarfin lantarki na gaba (Vf) na kowane LED zai haifar da rarraba halin yanzu daban-daban, wanda zai yi tasiri ga ƙarfin haske.

7.2 Electrostatic Discharge (ESD) Protection

LEDs are susceptible to damage from electrostatic discharge or power surges. Precautions must be taken:

• Operators should wear conductive wrist straps or anti-static gloves when handling LEDs.
• All workstations, tools, and equipment must be properly grounded.

7.3 Mechanical Stress During Assembly

During installation on the PCB, the minimum necessary clamping force should be used to avoid applying excessive mechanical stress to the LED package, which could otherwise lead to micro-cracks or other failures.

8. Technical Comparison and Differentiation

This through-hole LED differentiates itself with its integrated right-angle black bracket, simplifying the assembly process and providing consistent mounting height and appearance. Compared to a diffused lens, the combination of a water-clear lens and a white LED chip typically offers higher luminous intensity, making it suitable for applications requiring a more focused or brighter point light source. The binning system specified for intensity and chromaticity allows for tighter color and brightness matching in applications using multiple LEDs, which is a key advantage over unbinned or loosely binned components.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with 30mA for higher brightness?
A: No. The absolute maximum rating for DC forward current is 20mA. Exceeding this rating may shorten device life or cause immediate failure. For temperatures above 30°C, the derating curve must be followed.

Q: What is the function of the water-clear lens?
A: The water-clear (non-diffused) lens minimizes light scattering, producing a more directional beam and higher axial luminous intensity (candela) compared to a diffused lens, which spreads light more evenly (typically measured in lumens).

Q: How to understand the bin codes such as LM, NP, QR?
A: These codes represent guaranteed luminous intensity ranges. Specifying a bin code when ordering or designing ensures the LEDs you receive will have brightness within that specific range, which is crucial for achieving uniform illumination among multiple indicator lights.

Q: Why must each LED in parallel be connected in series with a resistor?
A: LEDs have a forward voltage (Vf) tolerance (Min 2.8V, Typ 3.2V, Max 3.7V). Without a series resistor to regulate current, an LED with a slightly lower Vf will draw a disproportionately large current from the common voltage source, leading to overdrive and potential failure, while other LEDs remain dim.

10. Practical Application Examples

Example 1: Front Panel Status Indicator:A right-angle bracket allows the LED to be mounted perpendicular to the PCB, directing its light outward through the panel aperture. Using binned LEDs (e.g., all from the NP bin) ensures all power, network, or HDD activity indicators on the device have the same brightness.

Example 2: Membrane Switch Backlight:Na'urar za a iya shigar da ita a bayan hular maɓalli mai wucewa haske. Farin haske daga LED mai tsabta yana ba da haske mai haske, bayyananne. Bukatunsa na ƙarancin wutar lantarki ya sa ya dace da na'urorin hannu masu amfani da baturi.

Misal 3: Tsarin jeri na tara don nuna matakin:Ƙirar ƙwanƙwasa na tara tana ba da damar ƙirƙirar jeri na tsaye ko na kwance (misali, don ma'aunin sautin VU ko nuna ƙarfin siginar). Daidaitaccen launi daga matakin sautin guda ɗaya yana tabbatar da daidaiton launi a ko'ina cikin jeri.

11. Hanyoyin Aiki

Wannan diode ne mai haskakawa na semiconductor. Lokacin da aka yi amfani da ƙarfin lantarki mai gaba (Vf) wanda ya wuce halayensa na musamman, electrons da ramuka suna haɗuwa a cikin kayan semiconductor (don farin haske, yawanci mahadi kamar InGaN) don sakin makamashi a cikin nau'in photon (haske). Takamaiman kayan da aka yi amfani da su da kuma doping suna ƙayyade tsawon zango na hasken da aka fitar (launi). Yawanci ana amfani da shafi na phosphor akan guntu na LED shuɗi, don canza wani ɓangare na hasken shuɗi zuwa haske mai tsayi, don haifar da fahimtar farin haske. Ruwan epoxy na ruwa yana ɗauke da guntu, yana ba da kariya ta injina, kuma yana siffanta tsarin fitar haske.

12. Trends na Fasaha

Fasahar LED mai shiga kai tsaye wacce wannan takamaiman takardar ke wakilta, wata mafita ce mai cikakken girma kuma abin dogaro. Trends na masana'antu suna ci gaba da mayar da hankali kan wasu mahimman fagage masu alaƙa da irin waɗannan sassa: Haɓaka ingancin haske (ƙarin fitar haske a kowace wutar lantarki), inganta ma'aunin launi (CRI) na farin LED, da haɓaka dogon lokacin aminci a cikin yanayin zafi da zafi. Haka nan, ci gaba da turawa zuwa ƙananan girma da kuma canji mafi faɗi zuwa na'urorin haɗawa da saman (SMD) don haɗawa ta atomatik yana gudana. Duk da haka, kamar yadda ƙirar haɗakar ƙwanƙwasa ta wannan ɓangaren ta nuna, LED ɗin da aka shigar kai tsaye yana da mahimmanci har yanzu don aikace-aikacen da ke buƙatar ƙarin ƙarfin injina, sauƙin ƙirƙira na hannu, ko takamaiman saitin haɗawa na gani.