LTL750RGBHBJH292U Through-Hole RGB LED Technical Datasheet - 20mA - Red/Green/Blue - Technical Documentation

1. Product Overview

LTL750RGBHBJH292U, kırmızı, yeşil ve mavi (RGB) üç renkli LED çipini tek bir siyah plastik gövde içinde birleştiren, düz takma tipinde bir dik açılı devre kartı göstergesidir (CBI). Beyaz dağıtıcı lens kullanarak renk karışımı ve homojen ışık dağılımı sağlar. Bu bileşen, baskılı devre kartlarına (PCB) veya panellere esnek montaj için tasarlanmış olup, çok renkli gösterge ihtiyaçları için istiflenebilir ve kolay monte edilebilir bir çözüm sunar.

1.1 Core Features

• Constructed with lead-free (Pb) and RoHS-compliant materials.
• Low power consumption, high luminous efficiency.
• Flexible installation method, suitable for PCB or panel integration.
• Integrated RGB LED chip, equipped with a white diffuser lens for color mixing.

1.2 Target Applications

This LED is suitable for a wide range of electronic devices requiring multi-color status indication, signaling, or backlighting. Main application areas include:

• Communication Equipment
• Computer Peripherals and Systems
• Consumer Electronics
• Home Appliances
• Industrial Control Systems

2. Detailed Technical Parameters

Unless otherwise specified, all specifications are defined at an ambient temperature (TA) of 25°C.

2.1 Absolute Maximum Ratings

Exceeding these stress limits may cause permanent damage to the device.

• Power Dissipation:Red: 80 mW, Green: 108 mW, Blue: 108 mW.
• Peak Forward Current:(1/10 duty cycle, 0.1ms pulse) Red: 90 mA, Green: 100 mA, Blue: 100 mA.
• DC Forward Current (Continuous):All colors are 30 mA.
• Derating Factor:All colors derate linearly from 50°C at a rate of 0.57 mA/°C.
• Operating Temperature Range:-40°C to +85°C.
• Storage Temperature Range:-40°C to +100°C.
• Pin soldering temperature:Maximum 260°C for 5 seconds, measured at a point 2.0mm from the LED body.

2.2 Electrical and Optical Characteristics

Typical performance parameters are measured at a forward current (IF) of 20mA.

• Luminous Intensity (Iv):
  • Red: 140 - 725 mcd
  • Green: 170 - 870 mcd
  • Blue: 38 - 180 mcd
• Viewing angle (2θ1/2):All colors are approximately 110 degrees. This is the off-axis angle at which the luminous intensity drops to half of its axial value.
• Peak wavelength (λP):
  • Red: ~634 nm
  • Green: ~525 nm
  • Blue: ~470 nm
• Dominant Wavelength (λd):
  • Red: 618 - 630 nm
  • Green: 513 - 530 nm
  • Blue: 465 - 477 nm
• Forward Voltage (VF):
  • Red: 1.7V (Min), 2.2V (Typ), 2.7V (Max)
  • Green: 2.5V (Min), 3.2V (Typ), 3.6V (Max)
  • Blue: 2.5V (min), 3.2V (typ), 3.6V (max)
• Reverse Current (IR):Measured at VR = 5V. Red: max. 10 μA, green/blue: max. 50 μA. This device is not designed for reverse bias operation.

3. Binning System Specifications

LEDs are classified into bins based on their luminous intensity at 20mA. This ensures consistency in color and brightness within defined ranges across production batches. Each bin limit allows a tolerance of ±15%.

3.1 Luminous Intensity Binning

• Red Binning:
  • RA: 140 - 240 mcd
  • RB: 240 - 420 mcd
  • RC: 420 - 725 mcd
• Green bin:
  • GA: 170 - 290 mcd
  • GB: 290 - 500 mcd
  • GC: 500 - 870 mcd
• Blue binning:
  • BA: 38 - 65 mcd
  • BB: 65 - 110 mcd
  • BC: 110 - 180 mcd

The specific bin code for luminous intensity is marked on each packaging bag to facilitate precise selection during production.

4. Mechanical and Packaging Information

4.1 Overall Dimensions

The device adopts a standard right-angle through-hole package. Key dimension descriptions include:

• All dimensions are in millimeters (inch units are provided in the original drawing).
• Unless otherwise specified, the general tolerance is ±0.25mm.
• The maximum resin protrusion under the flange is 1.0mm.
• Pin pitch is measured at the point where the lead exits from the package body.

4.2 Packaging Specifications

The product is supplied with a multi-layer packaging system to protect the components and facilitate handling.

• Tube:Holds 46 pieces. Dimensions: 520mm x 12.7mm x 8.9mm.
• Inner box:Contains 156 tubes, total 7,176 pieces. Dimensions: 544mm x 180mm x 141mm.
• Outer Carton:Contains 4 inner boxes, total 28,704 pieces. Dimensions: 550mm x 370mm x 302mm.

5. Welding and Assembly Guide

Proper handling is crucial to ensure device reliability and prevent damage.

5.1 Pin Forming

• Bending must be performed at a location at least 3mm away from the LED lens base.
• Do not use the base of the lead frame as a fulcrum.
• Pin forming must be completed at room temperature and before the soldering process.
• During PCB assembly, use the minimum necessary clamping force to avoid applying excessive mechanical stress to the pins or package.

5.2 Welding Process

A minimum gap of 2mm must be maintained between the lens holder and the solder joint. Immersion of the lens into the solder must be avoided.

• Electric Soldering Iron Welding:
  • Temperature: Maximum 350°C.
  • Time: Maximum 3 seconds (only once).
• Wave soldering:
  • Preheating temperature: maximum 100°C.
  • Preheating time: maximum 60 seconds.
  • Wave soldering temperature: maximum 260°C.
  • Soldering time: maximum 5 seconds.

Important note:Excessive soldering temperature and/or time may cause lens deformation or catastrophic LED failure. Infrared (IR) reflow soldering is not suitable for this type of through-hole LED lamp.

5.3 Storage and Cleaning

• Storage:Recommended storage conditions are ≤30°C and relative humidity ≤70%. LEDs removed from the original packaging should be used within three months. For longer storage, use a sealed container with desiccant or a nitrogen environment.
• Cleaning:If necessary, clean only with alcohol-based solvents such as isopropyl alcohol.

6. Application and Design Considerations

6.1 Drive Circuit Design

LED is a current-driven device. To ensure uniform brightness when driving multiple LEDs (especially in parallel configurations), it is strongly recommended to connect a current-limiting resistor in series with each LED (Circuit Model A). It is not advisable to drive multiple LEDs in parallel without independent series resistors (Circuit Model B), as slight differences in the forward voltage (Vf) characteristics among LEDs can lead to significant variations in current distribution, resulting in uneven brightness.

6.2 Electrostatic Discharge (ESD) Protection

Waɗannan LED suna da hankali ga fitar da lantarki ta tashin hankali da ƙarfin igiyar wutar lantarki, wanda zai iya haifar da lalacewa nan take ko a ɓoye. Don hana lalacewar ESD:

• Operatives must wear conductive wrist straps or anti-static gloves when handling LEDs.
• All equipment, machinery, workbenches, and storage racks must be properly grounded.
• Use ionizing fans to neutralize static charges in the work area.

6.3 Application Suitability

This LED light is suitable for general indoor and outdoor signage applications as well as standard electronic equipment. Its specified operating temperature range of -40°C to +85°C supports use under various environmental conditions.

7. Performance Curves and Typical Characteristics

This specification references typical performance curves, which graphically represent key relationships. These curves are essential for detailed design analysis.

• Relative Luminous Intensity vs. Forward Current:Shows how the light output of each color increases with current, typically up to the maximum rated current.
• Forward Voltage vs. Forward Current:Illustrates the V-I characteristics of each LED chip, which is crucial for calculating the appropriate series resistor value.
• Relative luminous intensity vs. ambient temperature:It demonstrates the derating of light output with increasing junction temperature, highlighting the importance of thermal management in high-power or high ambient temperature applications.
• Spectral distribution:Depict the relationship between the relative radiant power of each color and the wavelength, visually showing the peak wavelength and dominant wavelength.

Designers should refer to these curves to optimize driving conditions, understand efficiency trade-offs, and predict performance under non-standard temperatures.

8. Technical Comparison and Design Advantages

LTL750RGBHBJH292U provides several design advantages for multi-color indication:

• Integrated RGB solution:Integrating three individual color chips in a right-angle package saves PCB space compared to using three separate monochromatic LEDs.
• White diffuser lens:Provides color mixing and a wider, more uniform viewing angle pattern, ideal for status indicators that need to be visible from different angles.
• Standardized binning:The defined luminous intensity binning system allows for predictable and consistent brightness levels in production, reducing color and brightness matching issues in final assembly.
• Robust Through-Hole Design:Provides a secure mechanical connection to the PCB, suitable for applications subject to vibration or requiring manual assembly.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λP) is the wavelength at which the emitted optical power is greatest. Dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength of a pure monochromatic light that matches the perceived color of the LED. For LEDs, λd is generally more relevant to human perception of color.

9.2 Can I drive this LED without a series resistor?

A'a. Ba a ba da shawarar sarrafa LED kai tsaye daga tushen ƙarfin lantarki ba, saboda wannan yana iya lalata na'urar saboda yawan wutar lantarki. Dole ne a sarrafa LED da sarrafa wutar lantarki, yawanci ta amfani da mai sarrafa wutar lantarki na dindindin ko mafi yawanci tushen ƙarfin lantarki tare da resistor na iyakance wutar lantarki a jere.

9.3 Kwa nini lenzi na sehemu ya kuunganishia inahitaji pengo la angalau 2mm?

This gap prevents thermal damage to the LED's epoxy lens during the soldering process. Overheating can cause the lens to crack, discolor, or deform, which compromises optical performance and may expose the semiconductor chip to environmental contaminants.

9.4 Yaya za a zaɓi ƙimar da ta dace don aikace-aikacena?

Select the bin based on the minimum luminous intensity required for your design. For example, if your application requires at least 300 mcd of red intensity at 20mA, you need to specify the RB or RC bin. Consulting the binning table ensures that the components you receive meet your brightness specifications.

10. Nazarin ainihin ƙirar ƙira.

Scenario:Design a multi-state indicator panel for an industrial controller. This panel needs to use a single indicator position to display power (steady green), fault (flashing red), and standby (steady blue) statuses.

Implement using LTL750RGBHBJH292U:

1. Circuit Design:The microcontroller drives three independent output pins, each connected to a color channel (R, G, B) of an LED. Each channel includes a series resistor, whose value is calculated based on the desired current (e.g., 15mA for sufficient brightness), the typical forward voltage (Vf, from the datasheet) for that color, and the supply voltage.
2. Resistor Calculation Example (Green Channel, Vcc=5V):
   • Target IF = 15mA, typical Vf (green) = 3.2V.
   • Resistance value R = (Vcc - Vf) / IF = (5V - 3.2V) / 0.015A ≈ 120 ohms.
   • Resistor power rating P = (Vcc - Vf) * IF = 1.8V * 0.015A = 0.027W. A standard 1/8W (0.125W) resistor is sufficient.
3. Advantages of implementation:
   • Space saving:One component replaces three.
   • Simplified assembly:Just insert and solder one component.
   • Consistent appearance:The white diffuser lens ensures all colors emit from the same point with similar beam patterns, presenting a professional look.
   • Flexibility:The microcontroller can easily create other states, such as yellow (red + green) or cyan (green + blue), by activating multiple channels simultaneously.

11. Working Principle

Light-emitting diode (LED) is a semiconductor device that emits light when an electric current passes through it. This phenomenon is called electroluminescence, which occurs when electrons and holes recombine within the device, releasing energy in the form of photons. The color of the emitted light is determined by the bandgap of the semiconductor material used. In the LTL750RGBHBJH292U, three different semiconductor chips—each designed with a specific bandgap—are packaged together to independently produce red, green, and blue light. The white diffuser lens above the chips scatters and mixes the light, providing a uniform visual output.

12. Technical Trends

Çok renkli ve RGB LED pazarı sürekli gelişmektedir. LTL750RGBHBJH292U gibi bileşenleri etkileyen önemli trendler şunlardır:

• Verimlilik Artışı:Continuous improvements in materials science and chip design have led to higher luminous efficacy (more light output per watt of electrical input), enabling brighter indicator lights at lower power or with reduced thermal load.
• Miniaturization:While through-hole packages remain crucial for ruggedness, there is also a trend toward smaller surface-mount device (SMD) RGB LEDs to accommodate high-density PCB designs.
• Integrated Control:An increasing trend is to integrate LED chips with micro-controller ICs within the same package, creating "smart LEDs" that can be digitally addressed and programmed without the overhead of an external microcontroller, enabling complex color sequences.
• Color Consistency and Binning:Manufacturing processes are continuously improved to produce LEDs with tighter parameter distributions, reducing the need for extensive binning and providing more consistent production performance.

Through-hole RGB indicators like these remain a fundamental and reliable solution for applications where durability, ease of manual assembly, and proven performance are critical.