EL TOP VIEW LED 67-11-UG0200H-AM Takardar Bayani - Kunshin PLCC-2 - Launi Kori - 3.1V Na Yau da Kullun - 20mA - Takardar Fasaha ta Hausa

. Product Overview

The 67-11-UG0200H-AM is a high-performance, surface-mount Top View LED designed primarily for demanding automotive applications. It utilizes a PLCC-2 (Plastic Leaded Chip Carrier) package, offering a robust and reliable solution for interior lighting and instrument cluster backlighting. Its core advantages include high luminous intensity, a wide viewing angle, and compliance with stringent automotive and environmental standards such as AEC-Q101, RoHS, REACH, and halogen-free requirements.

. In-Depth Technical Parameter Analysis

.1 Optoelectronic Characteristics

The device exhibits a typical luminous intensity of 1400 millicandelas (mcd) when driven at its standard forward current of 20mA. The dominant wavelength is typically 523nm, producing a green color. A key feature is its wide 120-degree viewing angle (with a tolerance of ±5°), ensuring uniform light distribution. The forward voltage (Vf) typically measures 3.1V at 20mA, with a specified range from 2.75V (Min) to 3.75V (Max) for 99% of production units.

.2 Absolute Maximum Ratings and Electrical Parameters

Critical limits for reliable operation include a maximum continuous forward current of 30mA and a maximum power dissipation of 112mW. The device can withstand a surge current of 300mA for pulses ≤10μs. It is not designed for reverse voltage operation. The operating and storage temperature range is specified from -40°C to +110°C, with a maximum junction temperature of 125°C. The component has an ESD sensitivity rating of 8kV (Human Body Model).

.3 Thermal Characteristics

Thermal management is crucial for LED performance and longevity. The datasheet specifies two thermal resistance values: a real thermal resistance (Rth JS real) of 130 K/W and an electrical thermal resistance (Rth JS el) of 100 K/W, both measured from the junction to the solder point. This parameter is essential for calculating the junction temperature under specific operating conditions and for proper heatsinking design.

. Performance Curve Analysis

.1 Spectral Distribution and Radiation Pattern

The relative spectral distribution graph shows a peak emission in the green wavelength region (~523nm). The radiation pattern diagram confirms the Lambertian-like distribution characteristic of this top-view LED, with the relative luminous intensity dropping to half its peak value at ±60 degrees from the centerline, defining the 120° viewing angle.

.2 Forward Current vs. Voltage (IV Curve)

The IV curve demonstrates the exponential relationship typical of LEDs. At the recommended 20mA operating point, the forward voltage clusters around 3.1V. Designers must consider the Vf range when designing current-limiting circuits to ensure consistent brightness across multiple units.

.3 Temperature Dependency

Several graphs detail performance variation with temperature. The forward voltage has a negative temperature coefficient, decreasing by approximately 2mV/°C. Luminous intensity also decreases as junction temperature rises, which is a critical consideration for maintaining brightness in high-temperature environments like automotive cabins. The dominant wavelength exhibits a slight positive shift (increase) with temperature.

.4 Current Derating and Pulse Handling

A forward current derating curve is provided, indicating that the maximum allowable continuous current must be reduced as the solder pad temperature (Ts) increases above 25°C. For example, at a Ts of 110°C, the maximum current is 30mA. The permissible pulse handling capability graph allows designers to calculate safe peak currents for pulsed operation based on duty cycle and pulse width.

. Binning System Explanation

The product is available in sorted bins for key parameters to ensure application consistency.

.1 Luminous Intensity Binning

A comprehensive binning table lists groups from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). The 67-11-UG0200H-AM part number corresponds to bins within the AA (1120-1400 mcd) and AB (1400-1800 mcd) ranges, as highlighted. This allows selection based on required brightness levels.

.2 Dominant Wavelength Binning

The dominant wavelength is binned with a measurement tolerance of ±1nm. The specific bin codes for this product are defined in the ordering information, enabling precise color selection for applications requiring tight color matching.

. Mechanical, Packaging & Assembly Information

.1 Mechanical Dimensions

The LED is housed in a standard PLCC-2 package. The detailed mechanical drawing (referenced in the PDF) provides exact dimensions for the package body, lead spacing, and overall height, which are critical for PCB footprint design and clearance checks.

.2 Recommended Solder Pad Layout

A recommended solder pad pattern is provided to ensure reliable soldering and proper thermal connection. Adhering to this layout helps prevent tombstoning and ensures optimal heat dissipation from the thermal pad of the component to the PCB.

.3 Reflow Soldering Profile

The component is suitable for reflow soldering. The profile must maintain the solder joint temperature above 217°C for a duration between 60 and 150 seconds. The peak temperature and time above liquidus must be controlled according to standard IPC/JEDEC guidelines to prevent thermal damage.

.4 Packaging Information

The LEDs are supplied on embossed tape and reel packaging suitable for automated pick-and-place assembly machines. The packing specifications include details on tape width, pocket spacing, reel diameter, and quantity per reel.

. Application Guidelines & Design Considerations

.1 Primary Application Scenarios

The primary designed applications areAutomotive interior lighting(e.g., footwell lights, door panel lights, switch backlighting) andClusterinstrumentation backlighting. The AEC-Q101 qualification and wide operating temperature range make it suitable for these harsh environments.

.2 Circuit Design Considerations

1. Current Driving:A constant current driver is strongly recommended over a constant voltage source with a series resistor for stable luminous output and longevity, especially given the Vf variation. The typical operating point is 20mA. 2.ESD Protection:Although rated for 8kV HBM, implementing external ESD protection on PCB lines connected to the LED is advisable for automotive applications. 3.Thermal Design:Use the provided thermal resistance values and derating curves to calculate the expected junction temperature. Ensure adequate copper area on the PCB under the LED's thermal pad to act as a heatsink and keep Ts within safe limits. 4.Optical Design:The 120° viewing angle is ideal for wide-area illumination. For focused light, secondary optics (lenses) may be required.

. Precautions for Use

• Avoid applying reverse voltage to the device.
• Do not operate below the minimum forward current of 3mA as indicated on the derating curve.
• Adhere strictly to the recommended reflow soldering profile to prevent package cracking or degradation of internal materials.
• Handle components in accordance with MSL (Moisture Sensitivity Level) 2 precautions if the packaging has been opened.
• Avoid mechanical stress on the lens during handling or assembly.

. Ordering Information and Part Number Breakdown

The part number 67-11-UG0200H-AM follows a specific coding system. While the full breakdown is detailed in the PDF, it typically encodes information such as package type (PLCC-2), color (Green), luminous intensity bin, and dominant wavelength bin. Specific bin selections for intensity and wavelength are made at the time of order to tailor the component to the application's needs.

. Technical Comparison and Differentiation

Compared to standard non-automotive PLCC-2 LEDs, the 67-11-UG0200H-AM offers key differentiators: 1.Automotive Qualification:AEC-Q101 certification ensures reliability under automotive-grade temperature cycling, humidity, and operational stress tests. 2.Extended Temperature Range:Operation from -40°C to +110°C exceeds the range of typical commercial-grade LEDs. 3.Enhanced Reliability Standards:Compliance with Halogen-Free (Br/Cl limits), RoHS, and REACH addresses environmental and regulatory requirements in automotive and other sensitive markets. 4.Consistent Binning:Tight binning on intensity and wavelength provides predictable performance in multi-LED arrays.

. Frequently Asked Questions (FAQ)

.1 What is the primary cause of luminous intensity drop over time?

The primary cause is junction temperature. Operating the LED above its recommended current or with insufficient heatsinking accelerates lumen depreciation. Always design to keep the junction temperature as low as possible within the application constraints.

.2 Can I drive this LED with a 5V supply and a resistor?

Yes, but it is not optimal. Using a series resistor (R = (Vsupply - Vf_led) / I_f) is common. However, due to the typical Vf variation (2.75V to 3.75V), the current and thus brightness will vary significantly from one unit to another. For consistent performance, a constant current circuit is recommended.

.3 Is this LED suitable for exterior automotive lighting?

The datasheet specifies applications for interior lighting and clusters. Exterior lighting often requires higher ingress protection (IP) ratings, different color specifications, and may be subject to different regulatory standards. This PLCC-2 package is typically not sealed for direct exposure to weather.

.4 How do I interpret the two different thermal resistance values?

Rth JS real (130 K/W) is measured using a physical thermal method. Rth JS el (100 K/W) is calculated from the electrical behavior (change in Vf with temperature). For detailed thermal modeling, consult the manufacturer's application notes, but the higher value (130 K/W) should be used for conservative design.

. Practical Design and Usage Examples

.1 Automotive Dashboard Backlighting

In a dashboard cluster, multiple LEDs are often arranged in an array behind a light guide plate. Using LEDs from the same intensity and wavelength bin (e.g., all from bin AA and a specific wavelength bin) is crucial to achieve uniform color and brightness across the display. The wide 120° viewing angle helps couple light efficiently into the edge of the light guide.

.2 Door Handle Pocket Light

A single LED, driven by a simple current-regulating circuit from the vehicle's 12V system (using a buck converter or linear regulator), can illuminate a door handle pocket. The high luminous intensity (1400mcd typical) ensures sufficient light output even when diffused by a lens or cover. The robust PLCC-2 package withstands vibration in the door assembly.

. Technology Principle Introduction

This LED is based on semiconductor electroluminescence. When a forward bias voltage is applied across the p-n junction of the semiconductor chip (typically InGaN for green light), electrons and holes recombine, releasing energy in the form of photons. The specific material composition and quantum well structure determine the dominant wavelength (color). The PLCC-2 package encapsulates the chip in a plastic mold with a built-in reflector cup to shape the light output into a top-viewing pattern, and it provides mechanical protection and thermal dissipation paths via the leads and thermal pad.

. Industry Trends and Developments

The automotive LED market continues to evolve with several clear trends: 1.Increased Integration:Movement towards multi-chip packages (e.g., RGB LEDs) and integrated driver LEDs for simplified design. 2.Higher Efficiency:Ongoing development of chip technology to deliver higher lumens per watt (efficacy), reducing power consumption and thermal load. 3.Advanced Communication:Integration of LEDs with sensors and communication protocols (like LIN or CAN) for smart, adaptive lighting systems. 4.Miniaturization:Development of smaller package footprints with maintained or improved optical performance for space-constrained designs. 5.Enhanced Reliability Demands:As LEDs become more critical in safety-signaling applications, lifetime and failure rate requirements become even more stringent, pushing for improved materials and manufacturing processes.