P-LCC-2 Package Top View LED Datasheet - Bright Red - 20mA - 120mW - Chinese Version

1. Product Overview

This document specifies the specifications of a surface-mount top-view LED in a P-LCC-2 package. The device features a white package body and a colorless transparent window, offering a wide viewing angle, making it highly suitable for indicator applications. Its design is compatible with modern assembly processes, including vapor phase reflow, infrared reflow, and wave soldering, and is suitable for automatic placement equipment. The product is supplied on 8mm carrier tape reels and complies with lead-free and RoHS requirements.

The primary application of this LED series is as an optical indicator. Its wide viewing angle and optimized light coupling achieved through internal reflector design make it particularly suitable for use with light guide pipes. The low forward current requirement also makes it an excellent choice for battery-powered or power-sensitive portable electronic devices.

2. Technical Parameters

2.1 Absolute Maximum Ratings

The device must not be operated beyond these limits, as doing so may cause permanent damage.

• Reverse voltage (V_R):5 V
• Continuous forward current (I_F):50 mA
• Peak forward current (I_FP):100 mA (duty cycle 1/10, 1 kHz)
• Power Consumption (P_d):120 mW
• Electrostatic Discharge (ESD) HBM:2000 V
• Operating Temperature (T_opr):-40°C to +85°C
• Storage Temperature (T_stg):-40°C to +90°C
• Welding temperature (T_sol):Reflow soldering: 260°C for 10 seconds; Hand soldering: 350°C for 3 seconds.

2.2 Photoelectric Characteristics (T_a= 25°C)

Typical performance parameters measured under standard test conditions.

• Luminous intensity (I_v):360 - 900 mcd (I_F= 20mA)
• Viewing angle (2θ_1/2):120° (I_F= 20mA)
• Peak wavelength (λ_p):632 nm (I_F= 20mA)
• Dominant Wavelength (λ_d):621 - 631 nm (I_F= 20mA)
• Spectral Bandwidth (Δλ):20 nm (I_F= 20mA)
• Forward Voltage (V_F):1.75 - 2.35 V (I_F= 20mA)
• Reverse Current (I_R):Max 10 μA (V_R= 5V)

Remark:The tolerance is specified as follows: luminous intensity ±11%, dominant wavelength ±1nm, forward voltage ±0.1V.

3. Binning System

To ensure color and brightness consistency in production, devices are sorted into different bins based on key parameters.

3.1 Luminous Intensity Binning

Bins are defined by codes (e.g., T2, U1), corresponding to I_FMinimum and maximum luminous intensity values at =20mA.

• T2:360 - 450 mcd
• U1:450 - 565 mcd
• U2:565 - 715 mcd
• V1:715 - 900 mcd

3.2 Dominant Wavelength Binning

Wavelength grouping is used to control the subjective color (hue) of red light.

• Group F, code FF1:621 - 626 nm
• Group F, code FF2:626 - 631 nm

3.3 Forward Voltage Binning

Forward voltage binning facilitates circuit design for current regulation.

• Group B, Code 0:1.75 - 1.95 V
• Group B, Code 1:1.95 - 2.15 V
• Group B, Code 2:2.15 - 2.35 V

4. Performance Curve Analysis

Graphical data reveals the behavioral characteristics of the device under different conditions.

4.1 Relationship between Relative Luminous Intensity and Forward Current

This curve shows how the light output increases with the forward current. It is typically nonlinear, and efficiency may decrease at extremely high currents. Designers should select an operating point that balances brightness, power consumption, and device lifetime.

4.2 Relationship between Luminous Intensity and Ambient Temperature

This curve illustrates the thermal derating characteristics of light output. Luminous intensity typically decreases as ambient temperature rises. For applications in high ambient temperatures, this derating effect must be considered to ensure sufficient brightness.

4.3 Relationship between Forward Current and Forward Voltage (I-V Curve)

I-V curve is the typical characteristic of a diode. The forward voltage has a positive temperature coefficient, which means that at a given current, it slightly decreases as the temperature increases.

4.4 Spectral Distribution

The spectrogram confirms the monochromaticity of the light, with its center at a peak wavelength of 632 nm, located in the bright red region of the visible spectrum. The narrow bandwidth indicates its good color purity.

4.5 Radiation Pattern Diagram

The polar plot demonstrates a wide viewing angle of 120°, exhibiting near-Lambertian emission characteristics. This confirms the device's suitability for applications requiring wide-angle visibility.

4.6 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating, the current must be reduced when the operating temperature exceeds a specific value (typically starting around 60-70°C).

5. Mechanical and Packaging Information

5.1 Package Dimensions

The P-LCC-2 package has specific mechanical outlines and pad layouts. Key dimensions include overall length, width, height, and the location of the cathode identification mark. All unspecified tolerances are ±0.1 mm. Designers must refer to the detailed dimensioned drawing to create the PCB footprint.

5.2 Polarity Marking

The cathode is typically identified by visual markers on the package, such as a notch, dot, or beveled corner. Correct orientation is crucial for circuit operation.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This device is rated for a peak reflow soldering temperature of 260°C for a maximum duration of 10 seconds. It is suitable for the IPC/JEDEC J-STD-020 standard temperature profile for lead-free assembly. The time above the liquidus must be precisely controlled to prevent thermal damage to the epoxy package.

6.2 Manual Welding

If manual soldering is required, the temperature of the soldering iron tip should not exceed 350°C, and the contact time for each pin should be limited to 3 seconds or less.

6.3 Moisture Sensitivity and Storage

The product is shipped in moisture barrier packaging (aluminum foil bag with desiccant). Once the sealed bag is opened, components should be used within the specified time frame (not explicitly stated, but standard practice is 168 hours at ≤30°C/60%RH for Level 3 devices) or baked according to standard procedures before reflow soldering to prevent "popcorn" effect.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel Specifications

The device is supplied in 8mm carrier tape format. The standard reel quantity is 2000 pieces. Other minimum packaging quantities include 250, 500, and 1000 pieces per reel. Detailed carrier tape and reel dimensions are provided to facilitate the setup of automated handling equipment.

7.2 Label Description

The reel label contains multiple codes:

• CAT:Corresponding luminous intensity bin code (e.g., V1).
• HUE:Code corresponding to dominant wavelength grading (e.g., FF1).
• REF:Corresponding forward voltage bin code (e.g., 1).

These codes allow for traceability and selection of specific performance grades.

8. Application Suggestions

8.1 Typical Application Scenarios

• Communication Equipment:Status indicator lights in telephones, fax machines, routers, and backlights for buttons or displays.
• Consumer Electronics:Power, silent, or connection status indicator lights in audio-visual equipment, computers, and peripherals.
• Industrial Control:Panel indicator lights for machine status, fault alarms, or operation modes.
• Light Guide Tube Application:Its wide viewing angle and optimized coupling characteristics make it very suitable for use with injection-molded light guide tubes to transmit light from the PCB to the front panel or display.
• General Indication:Any application requiring bright, reliable, low-power visual indication.

8.2 Design Considerations

• Current Limit:Ensure to use a series resistor or constant current driver to limit the forward current to a safe value, typically 20mA at standard brightness, and must not exceed the absolute maximum of 50mA.
• Thermal Management:Under high ambient temperatures or when driven with higher current, ensure sufficient PCB copper foil or other heat dissipation measures to keep the junction temperature within limits. Please refer to the derating curve.
• ESD Protection:Although rated for 2000V HBM, standard ESD precautions should still be observed during assembly and handling.
• Optical Design:For light guide applications, the radiation pattern of the LED and the design of the light guide entry point should be considered to maximize coupling efficiency.

9. Reliability and Quality Assurance

The product has undergone a series of comprehensive reliability tests with a confidence level of 90% and an LTPD of 10%. The test items and conditions include:

• Reflow Soldering Resistance:260°C ±5°C, minimum 10 seconds.
• Temperature Cycling:300 cycles between -40°C and +100°C.
• Thermal Shock:300 cycles between -10°C and +100°C.
• High and Low Temperature Storage:Store at +100°C and -40°C for 1000 hours respectively.
• DC operating life:Operate at 20mA, 25°C for 1000 hours.
• High temperature and high humidity (85/85):Operate for 1000 hours under conditions of 85°C and 85% relative humidity.

These tests verify the robustness of the device under typical environmental and operational stresses encountered in electronic products.

10. Technical Comparison and Differentiation

This P-LCC-2 LED offers differentiated advantages in several key areas for indicator light applications. Compared to simpler chip LEDs, the molded P-LCC package provides superior mechanical protection, easier handling for pick-and-place machines, and a more consistent optical interface. Its wide 120-degree viewing angle offers a significant advantage over narrow-viewing-angle LEDs when off-axis visibility is required. The use of AlGaInP semiconductor material for the red chip, compared to older technologies like GaAsP, delivers higher luminous efficiency and better temperature stability, resulting in brighter and more consistent red light output. A comprehensive binning system for intensity, wavelength, and voltage enables more precise color and brightness matching in the final product, which is crucial for multi-indicator panels or aesthetic applications.

11. FAQ

11.1 What is the recommended operating current?

The standard test condition and typical application current is 20mA. This provides a good balance of brightness and efficiency. The device can operate at its absolute maximum of 50mA, but this generates more heat and reduces long-term reliability unless proper thermal management is implemented.

11.2 Yaya ake fassara lambar rarrabawa akan lakabin?

Lambar CAT (misali V1) tana nuna kewayon ƙarfin haske. Lambar HUE (misali FF1) tana nuna kewayon babban tsawon raƙuman ruwa, tana sarrafa ainihin launin ja. Lambar REF (misali 1) tana nuna kewayon ƙarfin lantarki na gaba. Don tabbatar da daidaiton aikin na'urori da yawa a cikin haɗawa, ya kamata a ƙayyade ko a buƙaci amfani da abubuwa masu lambar rarrabawa iri ɗaya.

11.3 Shin za a iya kunna wannan LED ba tare da amfani da resistor mai iyakancewa ba?

No.LED is a current-driven device. Connecting it directly to a voltage source will cause excessive current to flow, which may immediately damage the LED. A series resistor or an active constant current circuit must be used.

11.4 Is this LED suitable for outdoor use?

Its operating temperature range extends from -40°C to +85°C, covering many outdoor conditions. However, it is not specified for long-term direct exposure to UV sunlight and weather (rain, moisture). For outdoor use, the LED should be placed behind a protective lens or cover, and the entire assembly should be properly sealed and have an appropriate environmental exposure rating.

12. Practical Design Case Analysis

Scenario:Design a status indicator panel for a network switch with 24 ports, each requiring a red link/activity LED. The LEDs must have wide viewing angle visibility, consistent color and brightness, and the design must be energy efficient.

Implementation Plan:

1. Component Selection:This P-LCC-2 bright red LED is selected for its 120° wide viewing angle, low drive current of 20mA, and availability of tight performance binning.
2. Circuit Design:Each LED is driven by a microcontroller GPIO pin through a 100Ω series resistor (based on a 3.3V supply and typical V_FCalculated for 2.0V, the current is approximately 13mA. This is below the 20mA test point but provides sufficient brightness while saving power.
3. PCB Layout:LEDs are placed in a grid pattern. The PCB footprint recommended in the datasheet was used. A small keep-out area was maintained beneath the LED to prevent solder wicking.
4. Optical Design:A custom injection-molded light guide array was designed to direct light from each SMD LED on the PCB to individual transparent windows on the front panel. The wide viewing angle of the LEDs ensures efficient coupling into the light guides.
5. Bin:To ensure uniform appearance, a single luminous intensity bin (e.g., U2) and a single dominant wavelength bin (e.g., FF1) for the LEDs are specified in the purchase order.
6. Thermal Considerations:Since all 24 LEDs may be lit simultaneously, the total power consumption is low (approximately 0.75W). No special thermal management is required on the PCB.

This case highlights how the LED's specifications directly guide and enable a successful and manufacturable design.

13. Working Principle

This LED is a semiconductor photonic device. Its core is a chip made from an aluminum gallium indium phosphide (AlGaInP) epitaxial layer grown on a substrate. When a forward voltage exceeding the diode's turn-on threshold (approximately 1.8V) is applied, electrons and holes are injected across the p-n junction. These carriers recombine within the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly dictates the wavelength (color) of the emitted light—in this case, a bright red at approximately 632 nm. The generated light is then extracted through the chip surface and is shaped and directed by the internal reflector and transparent epoxy lens of the P-LCC package to achieve the desired wide viewing angle.

14. Technology Trends

The indicator LED market continues to evolve. Overall trends include the pursuit of higher luminous efficacy (more light output per watt of electrical input), enabling brighter indicators at lower currents for portable and IoT devices, improving energy efficiency. Miniaturization is another trend, with packages smaller than P-LCC-2 becoming common for space-constrained applications. Enhanced reliability under higher temperature reflow profiles is another key focus area to accommodate advanced PCB assembly processes. Furthermore, the direct integration of control electronics (such as constant current drivers or even simple logic circuits) into the LED package ("smart LEDs") is a growing trend, simplifying circuit design for end users. While this specific device represents a mature and reliable technology, these ongoing developments in materials, packaging, and integration are shaping the future landscape of indicator components.