1. Product Overview
LTC-5674JG wani ƙarfi ne, mai lambobi uku na LED nuni na'ura. Babban aikinsa shine samar da bayanan lambobi masu haske, masu gani a cikin na'urorin lantarki da kayan aiki daban-daban. Fasahar cibiyar tana amfani da AlInGaP (Aluminum Indium Gallium Phosphide) LED guntu da aka ɗora akan GaAs substrate marar gani. Wannan tsarin kayan sananne ne don ingantaccen aiki da ingantaccen launi a cikin bakan kore. Na'urar tana da fuskar fuska mai launin toka da sassan fari, waɗanda ke aiki tare don haɓaka bambanci da karantawa a ƙarƙashin yanayin haske daban-daban. An ƙera nuni don aikace-aikacen da ke buƙatar amintacce, mai dorewa, da kuma ingantaccen nuni na lambobi.
1.1 Core Advantages and Target Market
The display offers several key advantages that make it suitable for professional and industrial applications. Its low power requirement is a significant benefit for battery-operated or energy-conscious devices. The excellent character appearance, combined with high brightness and high contrast, ensures legibility from a distance and in various ambient light conditions. The wide viewing angle allows for readability from off-axis positions, which is crucial in multi-user environments or when the display is not directly facing the user. The solid-state construction provides inherent reliability, with no moving parts and high resistance to shock and vibration. The device is categorized for luminous intensity, meaning units are binned and sorted based on their light output, allowing designers to select parts for consistent brightness across a product line. Finally, the lead-free package ensures compliance with modern environmental regulations like RoHS. The target market includes industrial control panels, test and measurement equipment, medical devices, automotive dashboards (for secondary displays), and consumer appliances where clear numeric data presentation is required.
2. Technical Parameter Deep-Dive and Objective Interpretation
This section provides a detailed, objective analysis of the key electrical and optical parameters specified in the datasheet, explaining their significance for design engineers.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.
- Power Dissipation Per Segment (70 mW): This is the maximum amount of electrical power that can be converted into heat (and light) by a single segment without causing damage. Exceeding this limit risks overheating the semiconductor junction, leading to reduced lifespan or catastrophic failure. Designers must ensure the driving circuit limits current to keep power dissipation below this value, especially at high ambient temperatures.
- Peak Forward Current Per Segment (60 mA @ 1 kHz, 10% duty cycle): This rating allows for pulsed operation at higher currents than the continuous rating. The 10% duty cycle (on for 10% of the time, off for 90%) and 1 kHz frequency prevent heat buildup. This can be used for multiplexing schemes or for achieving momentary higher brightness. It is critical that the average current over time does not exceed the continuous rating.
- Continuous Forward Current Per Segment (25 mA): The maximum DC current that can be applied to a segment indefinitely under specified conditions (presumably at 25°C). This is the primary parameter for designing constant-current drivers. The derating factor of 0.33 mA/°C above 25°C is crucial. For example, at 85°C, the maximum allowable continuous current would be: 25 mA - ((85°C - 25°C) * 0.33 mA/°C) = 25 mA - 19.8 mA = 5.2 mA. This severe derating highlights the importance of thermal management in high-temperature environments.
- Reverse Voltage Per Segment (5 V): The maximum voltage that can be applied in the reverse direction (cathode positive relative to anode) before the LED junction breaks down. This is a relatively low value, typical for LEDs, emphasizing the need for protection in circuits where reverse voltage transients might occur (e.g., during power-up sequences or in inductive loads).
- Operating & Storage Temperature Range (-35°C to +85°C): Defines the ambient temperature limits for reliable operation and non-operational storage. Performance at temperature extremes will be affected (e.g., luminous intensity drops at high temperatures, forward voltage increases at low temperatures).
2.2 Electrical & Optical Characteristics
These are the typical and guaranteed performance parameters under specified test conditions.
- Average Luminous Intensity Per Segment (IV): This is the key measure of brightness.
- Min/Typ/Max: 200 / 577 / 6346 μcd @ IF=10mA: The wide range from 200 to 6346 μcd indicates a significant binning process. The typical value of 577 μcd is the expected median performance. Designers must use the minimum value (200 μcd) for worst-case brightness calculations to ensure readability under all conditions. The high maximum value shows the potential brightness of selected units.
- Test Condition Note: Luminous intensity is measured using a sensor filtered to match the CIE photopic (day-adapted) eye response curve (V(λ)). This ensures the measurement correlates with human perception of brightness, not just raw radiant power.
- Forward Voltage Per Segment (VF): Typ/Max: 2.1 / 2.6 V @ IF=20mA. This is the voltage drop across the LED when operating. The maximum value of 2.6V is critical for designing the power supply or driver circuitry; it must provide at least this voltage to ensure all units turn on properly. The variation (2.1V to 2.6V) is due to normal semiconductor manufacturing tolerances.
- Peak Emission Wavelength (λp): Typ: 571 nm @ IF=20mA. This is the wavelength at which the LED emits the most optical power. 571 nm is in the green-yellow region of the visible spectrum. This parameter is fixed by the AlInGaP material composition.
- Dominant Wavelength (λd): Typ: 572 nm. Slightly different from peak wavelength, this is the single wavelength perceived by the human eye as matching the LED's color. It is the primary determinant of the displayed color.
- Spectral Line Half-Width (Δλ): Typ: 15 nm. This measures the spread of the emitted spectrum. A value of 15 nm indicates a relatively pure, narrowband green color, which is desirable for high color saturation.
- Reverse Current Per Segment (IR): Max: 100 μA @ VR=5V. This is the small leakage current that flows when the LED is reverse-biased at its maximum rating. It is generally negligible in circuit design.
- Luminous Intensity Matching Ratio (IV-m): Max: 2:1 @ IF=1mA. This is a critical parameter for multi-segment/displays. It guarantees that within a single device, the brightness of the dimmest segment will be no less than half the brightness of the brightest segment (a 2:1 ratio). This ensures uniform appearance of all digits and segments.
3. Binning System Explanation
The datasheet explicitly states the device is "categorized for luminous intensity." This implies a binning process where manufactured units are tested and sorted into different groups (bins) based on their measured light output at a standard test current (likely 10mA or 20mA).
- Purpose: To provide designers with predictable and consistent brightness levels. By purchasing parts from a specific bin, an engineer can ensure that all displays in a production run have similar brightness, avoiding noticeable variations between units in a product.
- Evidence in Datasheet: The very wide range specified for Luminous Intensity (200 to 6346 μcd) strongly suggests this is the total spread across all bins. A specific order code or suffix (not detailed in this excerpt) would typically indicate the bin grade.
- Design Implication: For applications where brightness consistency is paramount (e.g., instrumentation panels), the designer must specify the required bin when ordering. Using a random mix of bins could lead to unacceptable brightness variation.
4. Performance Curve Analysis
While the provided PDF excerpt mentions "Typical Electrical / Optical Characteristic Curves," the specific graphs are not included in the text. Based on standard LED behavior, we can infer the likely content and its importance.
4.1 Inferred Curve Information
- Forward Current (IF) vs. Forward Voltage (VF) Curve: This graph would show the exponential relationship typical of a diode. It helps designers understand the dynamic resistance of the LED and the precise voltage required for a given drive current, especially important when using simple resistor-based current limiting.
- Luminous Intensity (IV) vs. Forward Current (IF) Curve: This is crucial. It would show how brightness increases with current. It is typically linear over a range but will saturate at very high currents due to thermal effects and efficiency droop. This curve allows designers to trade off between brightness and power consumption/heat generation.
- Luminous Intensity (IV) vs. Ambient Temperature Curve: This graph would quantify the brightness reduction as temperature increases. AlInGaP LEDs generally have better high-temperature performance than older technologies like GaP, but brightness still decreases. This data is essential for designing systems that operate reliably over the full temperature range.
- Relative Intensity vs. Wavelength (Spectrum) Curve: This would visually depict the narrow emission peak around 571-572 nm with the 15 nm half-width, confirming the color purity.
Importance: These curves provide dynamic performance data that the static tables cannot. They enable predictive modeling of the display's behavior under real-world, non-standard operating conditions.
5. Mechanical and Packaging Information
5.1 Physical Dimensions
The datasheet includes a "PACKAGE DIMENSIONS" diagram (details not in text). Key features of a typical 0.52-inch triple-digit display include the overall length, width, and height, the digit height (13.2mm), the segment width, and the spacing between digits. The seating plane and lead positions are defined. All dimensions have a tolerance of ±0.25 mm unless otherwise noted, which is standard for this type of component and must be accounted for in PCB footprint design and panel cutouts.
5.2 Pin Connection and Internal Circuit
The device has a common anode configuration. This means the anodes of all LEDs for a given digit are connected together internally. The pinout table is essential:
- Digits: Common anodes for Digit 1, 2, and 3 are available on pins 12, 13, 27, 28, 29 (note: pins 13 & 28 both for Digit 2; 12 & 29 both for Digit 1; 27 for Digit 3). This duplication provides layout flexibility.
- Segments: Individual cathodes for segments A through G are on pins 23, 16, 17, 18, 22, 21, 20 respectively.
- Decimal Points: Three separate cathode pins for the decimal point of each digit (DP1, DP2, DP3) on pins 26, 19/10, 24. Pin 19 and 10 are both connected to DP for Digit 2.
- No Connection (NC) Pins: Several pins (1-11, 15, 30) are marked "NO CONNECTION." These have no internal electrical connection and can be left floating or used for mechanical stability during soldering.
- Internal Circuit Diagram: This would show the common anode for each digit connected to its pin(s), with each segment LED cathode connected to its respective pin. Understanding this is vital for designing the multiplexing driver circuit.
6. Soldering and Assembly Guidelines
The datasheet specifies a single soldering condition: 1/16 inch (approximately 1.6mm) below the seating plane for 3 seconds at 260°C.
- Interpretation: This is a wave soldering or hand soldering guideline. It indicates the leads can withstand immersion in solder at 260°C for a short duration. The "below seating plane" instruction prevents solder wicking up the lead too far, which could cause thermal or mechanical stress on the package.
- Reflow Soldering: Datasheet ya ba da bayanin reflow profile. Don haɗin SMT na zamani (ko da yake wannan na'urar ta taɓo ce), daidaitaccen reflow profile maras gubar tare da kololuwar zafin jiki kusan 245-260°C zai yiwu a karɓa, amma dole ne a lura da matsakaicin zafin jikin fakitin don ci gaba da kasancewa cikin iyakar zafin ajiya (85°C).
- Gargadi na Gabaɗaya:
- Guji matsanancin damuwa na injiniya akan igiyoyin yayin shigarwa.
- Use appropriate flux and ensure complete cleaning if required to prevent corrosion.
- Do not exceed the specified soldering time and temperature to avoid damaging the internal wire bonds or the LED chips.
- Storage Conditions: Store in the specified range of -35°C to +85°C, in a dry environment to prevent moisture absorption which could cause "popcorning" during soldering.
7. Application Suggestions and Design Considerations
7.1 Typical Application Scenarios
- Industrial Control Panels: For displaying setpoints, process values (temperature, pressure, count), timer readouts.
- Test & Measurement Equipment: Digital multimeters, frequency counters, power supplies, oscilloscopes (for secondary readouts).
- Medical Devices: Patient monitors (for non-critical parameters), infusion pumps, diagnostic equipment.
- Automotive Aftermarket/Secondary Displays: Trip computers, boost gauges, voltage monitors.
- Consumer/Commercial Appliances: Microwave ovens, coffee makers, fitness equipment, point-of-sale terminals.
7.2 Critical Design Considerations
- Current Limiting: LEDs are current-driven devices. Always use a current-limiting resistor or a constant-current driver circuit. Calculate the resistor value using the maximum forward voltage (2.6V) and the desired current (≤25 mA derated for temperature) from your supply voltage (Vsupply): R = (Vsupply - VF_max) / IF.
- Multiplexing Drive: For a multi-digit common anode display, multiplexing is the standard driving technique. A microcontroller sequentially turns on one digit's common anode at a time while applying the cathode pattern for that digit's number. The refresh rate must be high enough (typically >60 Hz) to avoid visible flicker.
- Current Calculation: In multiplexing, since each digit is only on for a fraction of the time (1/3 for a 3-digit display), the instantaneous segment current can be higher to achieve the same average brightness. If you want an average current of 10 mA per segment, and you have 3 digits multiplexed with equal duty cycle, you could use a peak instantaneous current of 30 mA. This must still respect the peak forward current rating (60 mA under pulsed conditions).
- Thermal Management: Consider the power dissipation (70 mW per segment max). If driving multiple segments in a digit continuously, the heat can add up. Ensure adequate airflow or heatsinking if operating near maximum ratings, especially in high ambient temperatures. Remember the current derating rule.
- Viewing Angle: Position the display so the intended viewing axis aligns with the device's optimal viewing angle (typically perpendicular to the face).
- ESD Protection: While not explicitly stated, LEDs are sensitive to electrostatic discharge. Implement standard ESD handling precautions during assembly.
8. Technical Comparison and Differentiation
Although a direct comparison with other part numbers is not provided, we can highlight the inherent advantages of the AlInGaP technology used in this display compared to older or alternative technologies:
- vs. Traditional GaP (Gallium Phosphide) Green LEDs: AlInGaP oferă o eficiență luminoasă semnificativ mai mare, rezultând afișaje mult mai strălucitoare la același curent de antrenare. De asemenea, are în general o performanță mai bună la temperaturi ridicate și o stabilitate mai mare a culorii.
- vs. LED-uri GaN (Azotură de Galiu) Albastre/Albe de Înaltă Luminozitate cu Filtre: Pentru a produce lumină verde, s-ar putea folosi un LED GaN albastru cu fosfor (creând alb) și un filtru verde, dar această metodă este în mod inerent mai puțin eficientă decât un LED verde cu emisie directă precum AlInGaP, deoarece filtrul absoarbe cea mai mare parte a luminii. Emisia directă oferă o culoare mai pură și o eficiență mai mare pentru verdele monocromatic.
- vs. VFD (Vacuum Fluorescent Display) sau LCD cu Iluminare de Fundal: This LED display is solid-state, more rugged, has a wider operating temperature range, and requires simpler, lower-voltage DC drive electronics compared to VFDs (which need high voltage). Compared to LCDs, it offers superior viewing angles, brightness, and performance in low-temperature environments, though it consumes more power for multi-segment displays and is limited to emitting light, not forming arbitrary graphics.
9. Frequently Asked Questions (Based on Technical Parameters)
- Q: Can I drive this display directly from a 5V microcontroller pin? A: Hapana. Pini ya microcontroller kwa kawaida hutoa/hukamata hadi 20-25mA kiwango cha juu na iko kwenye 5V (au 3.3V). LED forward voltage ni takriban 2.1-2.6V. Lazima utumie resistor ya kuzuia mkondo. Kwa usambazaji wa 5V na lengo la 20mA: R = (5V - 2.6V) / 0.020A = 120Ω. Pini ya MCU inaweza isiweze kutokeza 20mA kila wakati; tumia transistor au driver IC.
- Q: Why is the luminous intensity range so large (200 to 6346 μcd)? A: This reflects the binning process. Units are sorted after production. You will purchase from a specific bin (e.g., a 1000-2000 μcd bin) to get consistent brightness. The datasheet shows the total possible spread.
- Q: What does "common anode" mean for my circuit design? A: It means you control the display by switching the positive voltage (anode) to each digit on/off, while the microcontroller or driver IC grounds the appropriate cathode pins to light specific segments. This is the opposite of a common cathode display.
- Q: Derating curve ya ce zan iya amfani da 5.2 mA kawai a 85°C. Shin nuni na zai yi duhu sosai? A: Yana yiwuwa. Dole ne ka duba Luminous Intensity vs. Current da vs. Temperature curves. A ƙaramin ƙarfin lantarki da zafi mai girma, haske yana raguwa sosai. Don aiki mai zafi, kuna iya buƙatar zaɓar bin mai haske mafi girma da farko ko kuma karɓi nuni mai duhu. Gudanar da zafin jiki don rage LED junction temperature shine mabuɗi.
- Q: Ta yaya zan haɗa decimal points? A: They are separate LEDs with their own cathodes (pins 26, 19/10, 24). Treat them like an extra segment ("DP"). To light the decimal on Digit 1, you would ground pin 26 while the anode for Digit 1 is powered.
10. Practical Design and Usage Case Study
Scenario: Designing a 3-digit temperature meter for an industrial oven.
- Requirements: Display range 0-999°C. Operate in ambient up to 70°C. Must be clearly readable from 2 meters away in a well-lit factory.
- Component Selection: LTC-5674JG ya dace saboda kewayon zafin jiki (-35 zuwa +85°C) da haske mai ƙarfi.
- Lissafin Haske: A yanayin zafin muhalli na 70°C, rage ci gaba na halin yanzu: 25 mA - ((70-25)*0.33) ≈ 25 - 14.85 = 10.15 mA max continuous. For multiplexing 3 digits, use a 1/3 duty cycle. To achieve a good average brightness, use a peak current of 25 mA (within the 60mA pulsed rating). Average current per segment = 25mA / 3 ≈ 8.3 mA, which is safe for the temperature.
- Driver Circuit: Use a microcontroller with sufficient I/O pins. Employ 3 NPN transistors (or P-channel MOSFETs) to switch the 3 common anode pins (Digits 1,2,3) to Vcc. Use current-limiting resistors on each of the 7 segment cathode lines (A-G). The decimal points may not be used. The microcontroller runs a multiplexing routine, turning on one digit transistor at a time and outputting the 7-segment code for that digit.
- Thermal Consideration: Mount the display on the external panel where some airflow exists. Avoid placing it directly next to a major heat source on the PCB.
- Result: A reliable, bright display that meets the environmental and readability requirements.
11. Technology Principle Introduction
The LTC-5674JG is based on AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology grown on a GaAs (Gallium Arsenide) substrate. Otu usoro ihe nwere oghere oghere kpọmkwem nke kwekọrọ na mpụta ọkụ na mpaghara uhie, oroma, odo, na akwụkwọ ndụ akwụkwọ ndụ nke ụdịdị. A na-enweta agba a kapịrị ọnụ (571-572 nm akwụkwọ ndụ akwụkwọ ndụ) site na ịchịkwa kpọmkwem nha nke Aluminom, Indium, Gallium, na Phosphorus n'oge uto kristal. Mgbe etinyere voltaji na-aga n'ihu n'ofe njikọ p-n, electrons na oghere na-ejikọta, na-ahapụ ike n'ụdị foton (ìhè). Ihe ndabere GaAs na-adịghị ahụ anya na-amịkọrọ ụfọdụ n'ime ìhè a na-ewepụta, mana atụmatụ mgbawa ọgbara ọhụrụ na geometry mmịpụta dị irè na-enye ohere arụmọrụ quantum mpụga dị elu. "Ihu isi awọ na akụkụ ọcha" bụ akụkụ nke nkwakọ ngwaahịa rọba. Ihu isi awọ (na-abụkarị isi awọ gbara ọchịchịrị ma ọ bụ ojii) na-arụ ọrụ dị ka ndabere ntụgharị uche dị ala iji melite ọdịiche. Akụkụ ọcha bụ ebe mgbasa ọkụ nke na-anọdụ kpọmkwem n'elu obere mgbawa LED, na-agbasa ìhè isi iyi n'otu n'otu n'ofe mpaghara akụkụ iji mepụta ọdịdị na-egbuke egbuke na-enweghị atụ.
Okwu Nkọwa LED
Nkọwa zuru ezu nke okwu teknụzụ LED
Ịrụ Ọrụ Fotoelectric
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Kallon Kallo | ° (digiri), misali, 120° | Kallo inda ƙarfin haske ya ragu zuwa rabi, yana ƙayyade faɗin katako. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), misal, 2700K/6500K | Moto wa mwanga, thamani za chini ni za manjano/moto, za juu ni nyeupe/baridi. | Huamua mazingira ya taa na matukio yanayofaa. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | E fa'amautinoa le lanu tutusa i le vaega lava e tasi o LED. |
| Dominant Wavelength | nm (nanometers), fa'ata'ita'iga, 620nm (mumu) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Kupungua kwa Lumen | L70 / L80 (masaa) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: yana da kyau mai jure zafi, ƙarancin farashi; Ceramic: mafi kyau zubar da zafi, tsawon rai. |
| Tsarin Chip | Gaba, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | An rarraba ta hanyar kewayon ƙarfin lantarki na gaba. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | An rarrabe ta hanyar daidaitawar launi, tabbatar da ƙuntataccen kewayon. | Yana ba da tabbacin daidaiton launi, yana guje wa rashin daidaiton launi a cikin kayan haske. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Standard ya kukadiria maisha | Inakadiria maisha chini ya hali halisi kulingana na data ya LM-80. | Inatoa utabiri wa kisayansi wa maisha. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Takardun Muhalli | Yana tabbatar da babu abubuwa masu cutarwa (dariya, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |