LTST-C193KFKT-5A Orange SMD LED Datasheet - Size 1.6x0.8x0.35mm - Voltage 1.7-2.3V - Power 75mW - Technical Documentation

1. Product Overview

The LTST-C193KFKT-5A is a surface-mount device (SMD) chip LED designed specifically for modern space-constrained electronic applications. Its key feature is an extremely slim profile with a height of only 0.35 mm, making it suitable for ultra-thin consumer electronics, backlighting, and indicator applications where component height is a critical design factor. The device utilizes AllnGaP (aluminum indium gallium phosphide) semiconductor material to emit bright orange light, a material renowned for its high efficiency and good color purity. It is supplied in 8 mm carrier tape packaging on 7-inch reels and is fully compatible with high-speed automated pick-and-place assembly equipment and standard infrared (IR) reflow soldering processes.

1.1 Main Features and Advantages

This LED offers designers several significant advantages. It complies with RoHS standards and carries a green product label, ensuring adherence to international environmental regulations. Its EIA-standard package dimensions guarantee compatibility with a wide range of existing PCB layouts and manufacturing tools. The device also features integrated circuit (IC) compatibility, meaning it can be driven directly by typical logic-level voltages with appropriate current-limiting measures, thereby simplifying circuit design. The combination of an ultra-thin profile, reliable performance, and manufacturing-friendly packaging makes this LED a versatile component suitable for mass production.

2. Absolute Maximum Ratings

Operating any electronic component beyond its absolute maximum ratings may cause permanent damage. For the LTST-C193KFKT-5A, the maximum continuous DC forward current is specified as 30 mA. Under pulsed conditions with a duty cycle of 1/10 and a pulse width of 0.1ms, it can withstand a peak forward current of 80 mA. The maximum power dissipation is 75 mW, a critical parameter for thermal management. The device can withstand a reverse voltage of up to 5 volts. The operating ambient temperature range is -30°C to +85°C, while the storage temperature range is slightly wider, from -40°C to +85°C. For assembly, this LED is suitable for infrared reflow soldering with a peak temperature of 260°C for a maximum duration of 10 seconds.

3. Electro-Optical Characteristics

The performance of the LED is characterized under standard test conditions with an ambient temperature (Ta) of 25°C. Key parameters define its light output and electrical behavior.

3.1 Luminous Intensity and Viewing Angle

At a forward current (IF) of 5 mA, the typical value of luminous intensity (Iv) falls within a binning range. The minimum starts at 11.2 millicandelas (mcd), with the maximum of the highest bin being 45.0 mcd. Luminous intensity is measured using a combination of a sensor and filter that approximates the photopic (CIE) human eye response curve. This device features an extremely wide viewing angle (2θ1/2) of 130 degrees. This parameter is defined as the full angle at which the luminous intensity drops to half of its axial (on-axis) value, indicating that the LED emits light over a broad area, making it suitable for applications requiring wide-angle visibility.

3.2 Spectral Characteristics

Spectral characteristics define the color of the emitted light. The peak emission wavelength (λP) is typically 611 nanometers (nm). The dominant wavelength (λd), which is the single wavelength perceived by the human eye as representative of the color, is typically 605 nm at 5 mA. The spectral line half-width (Δλ), a measure of spectral purity or concentration of light output around the peak wavelength, is 17 nm. These values are characteristic of high-quality orange AllnGaP LEDs.

3.3 Electrical Characteristics

The LED forward voltage (VF) measured under the condition IF=5mA ranges from a minimum of 1.70 volts to a maximum of 2.30 volts. This range is influenced by the binning process described later. The reverse current (IR) is very low, with a maximum of 10 microamperes (μA) when a 5V reverse voltage (VR) is applied, indicating good diode characteristics.

4. Binning System

To ensure consistency in mass production, LEDs are sorted into different bins based on key parameters. This allows designers to select components that meet the specific requirements of their application.

4.1 Forward Voltage Binning

The forward voltage is divided into three bins: E2 (1.70V - 1.90V), E3 (1.90V - 2.10V), and E4 (2.10V - 2.30V). Each bin has a tolerance of ±0.1 volts. Selecting LEDs from the same voltage bin helps maintain uniform brightness when multiple LEDs are connected in parallel, as they will experience similar voltage drops.

4.2 Luminous Intensity Binning

Luminous intensity is categorized into three classes: L (11.2 - 18.0 mcd), M (18.0 - 28.0 mcd), and N (28.0 - 45.0 mcd). Each intensity bin has a tolerance of ±15%. This binning is crucial for applications that require consistent brightness across multiple indicator lights or backlight elements.

5. Package and Mechanical Information

The physical dimensions and handling methods of components are crucial for PCB design and assembly.

5.1 Package Dimensions

This LED features a very compact footprint. The detailed dimension drawing in the datasheet specifies the length, width, height (0.35mm), and the location of the cathode identifier. Unless otherwise noted, all dimensions are in millimeters with a standard tolerance of ±0.10 mm. The package follows the EIA standard outline to ensure compatibility.

5.2 Recommended Pad Layout

The recommended pad layout design for the PCB is provided. This layout is optimized for forming reliable solder joints during the reflow soldering process. The datasheet recommends a maximum solder paste stencil thickness of 0.10mm to prevent bridging or excessive solder.

5.3 Carrier Tape and Reel Packaging

The LEDs are packaged in embossed carrier tape with a width of 8mm, wound onto reels with a diameter of 7 inches (178mm). Each reel contains 5000 pieces. The packaging complies with the ANSI/EIA 481-1-A-1994 specification. Empty component pockets are sealed with cover tape. Specific rules are noted, such as a maximum of two consecutive missing components allowed, and a minimum packaging quantity of 500 pieces for remaining reels.

6. Assembly and Handling Guide

Proper handling is crucial for maintaining reliability and performance.

6.1 Soldering Process

This LED is fully compatible with infrared (IR) reflow soldering processes, which are standard for SMD assembly. Detailed reflow temperature profile recommendations are provided for lead-free soldering processes. Key parameters include the preheat zone, controlled ramp-up rate, a peak temperature not exceeding 260°C, and the Time Above Liquidus (TAL) as defined by the profile. The total time at peak temperature should be a maximum of 10 seconds. For manual rework using a soldering iron, the tip temperature should not exceed 300°C, contact time should be limited to within 3 seconds, and it should be performed only once. The datasheet emphasizes that the final soldering profile must be characterized based on the specific PCB design, components used, and solder paste.

6.2 Cleaning

If cleaning is required after soldering, only specified solvents should be used. Unspecified chemicals may damage the epoxy encapsulation of the LED. The recommended method is to immerse the LED in ethanol or isopropyl alcohol at room temperature for no more than one minute. Unless specifically tested and certified, aggressive or ultrasonic cleaning is not recommended.

6.3 Yanayin Ajiya

Strict storage conditions are defined to prevent moisture absorption, which can lead to "popcorn" effect (package cracking) during reflow soldering. When the original moisture barrier bag with desiccant is sealed, LEDs should be stored at ≤30°C and ≤90% relative humidity and used within one year. Once the bag is opened, the "floor life" begins. LEDs should be stored at ≤30°C and ≤60% relative humidity, and infrared reflow soldering is recommended within 672 hours (28 days). For long-term storage outside the original bag, they should be kept in a sealed container with desiccant or in a nitrogen environment. If the floor life exceeds 672 hours, baking at approximately 60°C for at least 20 hours is required before assembly to remove moisture.

7. Bayanin Aikace-aikace da La'akari da Zane

Understanding the operating principles and design limitations is key to successful implementation.

7.1 Zane na Da'irar Tuƙi

LED na'urar ce da ke amfani da ƙarfin lantarki. Fitowar haskenta galibi aikin ƙarfin lantarki ne na gaba, ba ƙarfin lantarki ba. Saboda haka, ba a ba da shawarar amfani da tushen ƙarfin lantarki na dindindin ba, saboda wannan na iya haifar da rashin kulawa da zafi da lalata na'urar. Takardun ƙayyadaddun bayanai suna ba da shawara sosai lokacin haɗawa da tushen ƙarfin lantarki, a haɗa LED tare da resistor mai iyakancewa ƙarfin lantarki. Wannan resistor yana saita ƙarfin lantarki na aiki bisa ga dokar Ohm: R = (ƙarfin lantarki na wutar lantarki - ƙarfin lantarki na gaba na LED) / ƙarfin lantarki da ake so. Lokacin da aka haɗa LED da yawa a layi daya don tabbatar da raba ƙarfin lantarki daidai da daidaiton haske, wannan aiki yana da mahimmanci musamman, saboda ƙananan bambance-bambance na ƙarfin lantarki na gaba (VF) na na'urori daban-daban.

7.2 Gudanar da Zafi

Ko da yake ƙarfin lantarki ya yi ƙasa (matsakaicin 75 mW), daidaitaccen ƙirar zafi yana da mahimmanci don dogon lokaci na aminci da kwanciyar hankali na fitowar haske. Ayyukan LED, musamman ƙarfin lantarki na gaba da ƙarfin haske, suna da dogaro da zafin jiki. Tabbatar da isasshen yanki na tagulla na PCB a kusa da filaye yana taimakawa wajen kawar da zafi. Yin aiki a kusa ko kuma isa ga matsakaicin ƙarfin lantarki na iyaka yana haifar da ƙarin zafi, yana iya buƙatar ƙarin la'akari da zafi.

7.3 Application Scope and Precautions

Takardun ƙayyadaddun bayanai suna bayyana cewa, wannan LED ya dace da na'urorin lantarki na yau da kullun, kamar kayan aikin ofis, na'urorin sadarwa, da kayan amfani na gida. Don aikace-aikacen da ke buƙatar babban aminci, inda gazawar ta iya haifar da haɗari ga rayuwa ko lafiya (misali jiragen sama, na'urorin kiwon lafiya, tsarin amincin zirga-zirga), ana buƙatar tuntubar masana'anta kafin ƙirar amfani. Wannan shine daidaitaccen bayanin keɓancewa na ɓangaren kasuwanci.

8. In-depth Technical Analysis and Performance Evaluation

Beyond basic specifications, some fundamental principles and performance trends are important for advanced design.

8.1 Relationship Between Current, Voltage, and Intensity

Performance curves (implied in datasheets) typically show that luminous intensity increases approximately linearly with forward current within the normal operating range. However, efficiency (lumens per watt) may peak at a certain current value and then decline due to increasing thermal effects. Forward voltage has a negative temperature coefficient, meaning it decreases slightly as the junction temperature rises.

8.2 Material Technology: AllnGaP

The adoption of Aluminum Indium Gallium Phosphide (AllnGaP) as the active semiconductor material is significant. Compared to older technologies like GaAsP, AllnGaP LEDs are known for their high efficiency in the red, orange, and yellow wavelength regions. They offer good color stability over time and with operating current variations, along with relatively low forward voltage. The resulting 605-611 nm orange light is vibrant and easily recognizable.

8.3 Zane-zanen Gani da Hangin Nesa

The 130-degree viewing angle is achieved through chip design and the shape of the epoxy lens. A wide viewing angle is ideal for status indicators that need to be seen from various angles. For applications requiring a more focused beam, secondary optics are necessary.

9. Kwatance da Jagorar Zabi

When selecting an LED in a design, engineers must compare key parameters.

The main differentiating features of this LED:The primary differentiating feature is its ultra-low height of 0.35 mm. Compared to standard chip LEDs with heights of 0.6 mm or 1.0 mm, this contributes to thinner end products. The wide 130-degree viewing angle is another advantage for wide-area illumination. AllnGaP technology provides good efficiency and color for orange light.

Selection Criteria:Mai tsara su ƙayyade fifiko bisa ga buƙatun aikace-aikacen: iyakokin tsayi, haske da ake buƙata (matakan ƙarfin haske), wurin launi (babban zango), dacewar igiyar tuƙi da iyakokin zafi/iko. Tsarin rarrabawa yana ba da damar inganta farashi ta hanyar zaɓar matakin aiki da ya dace.

10. Tambayoyin da ake yawan yi (FAQ)

Tambaya: Zan iya tuƙa wannan LED kai tsaye ta hanyar fil ɗin microcontroller na 3.3V ko 5V?
Amsa: A'a, ba za a iya tuƙa kai tsaye ba. Dole ne a yi amfani da resistor mai iyakancewa a jere. Misali, yin amfani da wutar lantarki na 3.3V, VF na yau da kullun na 2.0V, kuma ana sa ran na'urar ta zama 5mA, ƙimar resistor ya kamata ya zama (3.3V - 2.0V) / 0.005A = 260 ohms. Ƙimar daidaitaccen resistor na 270 ohms ya dace.

Tambaya: Menene zai faru idan lokacin 260°C ya wuce iyakar dakika 10 yayin aikin sake narkewa?
Amsa: Wuce gona da iri na lokaci/zazzabi na iya haifar da matsaloli da yawa: lalacewar ruwan tabarau na epoxy (ya zama rawaya), lalacewar igiyar haɗin gwiwa na ciki ko kuma ƙwayar semiconductor ta ɗauki matsin lamba mai zafi sosai, wanda zai iya haifar da gazawa nan take ko rage dogon lokacin amincin.

Tambaya: Me yasa aka tsara rayuwar ajiya da na ɗakin aiki da tsauri haka?
A: Epoxy resin packaging materials absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture rapidly turns into steam, generating high internal pressure. This can lead to package delamination or even cracking, a phenomenon known as "popcorn effect." Storage and baking procedures control moisture content to prevent this.

Q: How to identify the cathode of an LED?
A: The package drawing in the datasheet indicates the cathode marking. Typically, for such chip LEDs, the cathode is marked by a green stripe, dot, or notch on the top or bottom of the component. Always refer to the mechanical drawing for specific marking information.