LTW-C193DS5 Ultra-Thin SMD LED Datasheet - 0.35mm Thickness - 3.15V Max Voltage - 70mW Power Consumption - White Light - Simplified Chinese Technical Document

1. Product Overview

This document details the specifications of an ultra-thin surface-mount device (SMD) light-emitting diode (LED). This component is specifically designed for applications requiring a compact form factor and high-brightness white light output. Its core structure utilizes indium gallium nitride (InGaN) semiconductor technology, which is renowned for its efficiency in generating white light. Its exceptionally thin package makes it ideally suited for space-constrained designs in modern electronic products.

The core advantages of this LED include compliance with environmental regulations, compatibility with automated assembly processes, and suitability for standard infrared reflow soldering techniques. This makes it an ideal choice for high-volume manufacturing. The target market encompasses a wide range of consumer electronics and industrial electronics fields, where indicator light, backlighting, or general illumination functions are required within extremely limited space.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Functional operation is not guaranteed under these conditions.

• Power Dissipation (Pd):70 mW. This is the maximum power that the LED can dissipate as heat without degrading performance or causing failure. Exceeding this limit risks thermal runaway.
• To ensure consistency in high-volume production, LEDs are binned according to performance. This allows designers to select products with tightly controlled characteristics._FP):100 mA. This is the maximum instantaneous current allowed under pulse conditions (1/10 duty cycle, 0.1ms pulse width). It is significantly higher than the continuous current rating.
• DC Forward Current (I_F):20 mA. This is the recommended maximum continuous forward current for reliable long-term operation. Designers should typically operate below this value.
• Operating Temperature Range (T_opr):-20°C to +80°C. Ensure the device operates normally within this ambient temperature range.
• Storage temperature range (T_stg):-55°C to +105°C. The device can be stored within this wider temperature range without being powered on.
• Infrared soldering conditions:260°C for 10 seconds. This defines the peak temperature and time profile that the package can withstand during the reflow soldering process.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard ambient temperature of 25°C and define the device's performance under normal operating conditions.

• Luminous Intensity (I_V):At a test current (I_F) of 5 mA, the range is from 45.0 mcd (minimum) to 180.0 mcd (typical). This parameter measures the luminous intensity perceived by the human eye using a filter approximating the CIE photopic response curve.
• Viewing angle (2θ_1/2):130 degrees (typical). This is the full angle at which the luminous intensity drops to half of its maximum (axial) value. Such a wide viewing angle indicates a more diffuse, Lambertian-like emission pattern, suitable for area lighting.
• Chromaticity coordinates (x, y):At I_F= 5mA, the typical values are x=0.294, y=0.286. These coordinates plot the color of the white light on the CIE 1931 chromaticity diagram, defining its specific hue or "whiteness." The tolerance for these coordinates is ±0.01.
• Forward Voltage (V_F):At I_F= 5mA, ranging from 2.70 V (min) to 3.15 V (max). This is the voltage drop across the LED when it is conducting current. It is a key parameter for driving circuit design (e.g., current-limiting resistor calculation).
• Reverse Current (I_R):at Reverse Voltage (V_R) = 5V, maximum 10 μA. This parameter is for test purposes only; the device is not designed to operate under reverse bias. Applying reverse voltage in a circuit may cause immediate failure.

Important Notes:The datasheet emphasizes sensitivity to Electrostatic Discharge (ESD). Standard operation must be performed using anti-static wrist straps and grounding equipment. The specified test instruments for chromaticity and luminous intensity are the CAS140B.

3. Grading System Description

Kwa kuhakikisha uthabiti katika uzalishaji wa wingi, LED zimepangwa katika makundi ya utendaji. Hii inawawezesha wabunifu kuchagua vipengele vilivyo na sifa zilizodhibitiwa kwa uangalifu.

3.1 Forward Voltage (V_F) Binning

Kulingana na voltage ya mbele kwenye 5mA, LED zimegawanywa katika makundi matatu:
- A Grade:2.70V - 2.85V
- B Grade:2.85V - 3.00V
- C grade:3.00V - 3.15V
The tolerance for each grade is ±0.1V. Selecting a specific grade ensures uniformity in brightness and current consumption within parallel arrays.

3.2 Luminous Intensity (I_V) Binning

Based on brightness at 5mA, LEDs are categorized into three grades:
- Grade P:45.0 mcd - 71.0 mcd
- Q gear:71.0 mcd - 112.0 mcd
- R gear:112.0 mcd - 180.0 mcd
The tolerance for each bin is ±15%. This allows selection based on the required brightness level.

3.3 Binning for Chromaticity (Color)

The chromaticity point of white light is precisely controlled through six bins (S1 to S6) defined by quadrilaterals on the CIE 1931 chromaticity diagram. Each bin specifies a small area of permissible x and y coordinate pairs. The typical value (x=0.294, y=0.286) falls within the S1 and S3 areas. The tolerance for the coordinates is ±0.01. This binning is crucial for applications requiring white color consistency across multiple LEDs, such as display backlighting.

4. Performance Curve Analysis

Although the datasheet references specific graphical curves (e.g., Figure 6 for viewing angle), the provided data allows for a conceptual analysis of key relationships.

• Current vs. Luminous Intensity (I-I_VCurve):Luminous intensity is proportional to the forward current, typically exhibiting a near-linear relationship at lower currents and tending towards saturation at higher currents. Operating at the recommended 5mA test point ensures linear and predictable brightness control.
• Current vs. Forward Voltage (I-V Curve):The I-V characteristic of an LED is exponential. V is specified at 5mA._FThe range is crucial. A small increase in voltage can lead to a significant increase in current, which is why constant current drivers are superior to constant voltage sources.
• Temperature Dependence:The luminous intensity of InGaN LEDs typically decreases with increasing junction temperature (thermal quenching). The operating temperature range of -20°C to +80°C must be considered, as output and color may shift at extreme temperatures. Proper PCB thermal management is crucial for maintaining performance.

5. Mechanical and Packaging Information

5.1 Package Dimensions

This LED adopts the industry-standard EIA package outline. Its key feature is an ultra-thin thickness of 0.35 mm. All dimensions are provided in millimeters, with a standard tolerance of ±0.10 mm unless otherwise specified. The datasheet includes detailed dimension drawings for PCB pad design.

5.2 Pad Layout

Recommended pad dimensions are provided to ensure reliable solder joint formation and proper alignment during the reflow process. A note suggests a maximum stencil thickness of 0.10mm for solder paste printing, which is crucial for controlling the solder volume on such small components.

5.3 Polarity Identification

The datasheet contains markings or diagrams identifying the anode and cathode terminals. Correct polarity is crucial for device operation. Applying reverse polarity will immediately damage the LED.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Parameters

Recommended detailed infrared (IR) reflow soldering temperature profile based on JEDEC standard:
- Preheating:150–200°C
- Preheating time:Maximum 120 seconds
- Peak Temperature:Maximum 260°C
- Time Above Liquidus:Mafi tsawon daƙiƙa 10 (ana ba da shawarar a yi zagaye na gudanar da ƙarfe sau biyu kawai)
Waɗannan sigogi an tsara su don narkar da man gudanar da ƙarfe daidai, tare da guje wa LED ɗin samun matsanancin zafi.

6.2 Manual Welding

Idan dole ne a yi gudanar da ƙarfe da hannu, ana buƙatar taka tsantsan sosai:
- Soldering iron temperature:Maximum 300°C
- Contact time:Kowane fil ɗin bai wuce daƙiƙa uku ba.
- Iyakance:Yi zagayen walda ɗaya kawai.
Zafin guntun ƙarfe na dogon lokaci yana iya lalata guntuwar semiconductor ko kuma kullin filastik cikin sauƙi.

6.3 Storage and Operating Conditions

• Sealed packaging:Store at ≤30°C and ≤90% RH. Use within one year after opening the moisture barrier bag.
• Opened Package:For components removed from dry packaging, ambient conditions should not exceed 30°C / 60% RH. It is recommended to complete infrared reflow soldering within 672 hours (28 days).
• Long-Term Storage:Components exposed for more than 672 hours should be baked at approximately 60°C for at least 20 hours before soldering to remove absorbed moisture and prevent the "popcorn" phenomenon during reflow soldering.

6.4 Cleaning

Only specified cleaning agents should be used. The recommended solvents are ethanol or isopropanol at room temperature. The LED immersion time should be less than 1 minute. Unspecified chemicals may damage the packaging material or the optical lens.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

LEDs are supplied in industry-standard 8mm carrier tape, wound on 7-inch (178mm) diameter reels. This packaging is compatible with automatic placement machines.

• Reel quantity:5000 pieces per full reel.
• Minimum Order Quantity (MOQ):The remaining quantity is 500 pieces.
• Quality:The carrier tape has a cover tape, and according to ANSI/EIA 481-1-A-1994, the maximum number of consecutive missing components (empty cavities) is two.

7.2 Part Number Interpretation

Part number LTW-C193DS5 contains encoding information:
- LTW:Likely indicates the product series (Lite-On White).
- C193:Specific device identifier within the series.
- DS5:Yana iya nufin nau'in kunshewa, lambar rarrabawa, ko wasu bayanan bambance-bambance. Cikakken rarrabuwar ya kamata a tabbatar da shi tare da cikakken jagorar lambar kayan masana'anta.

8. Application Recommendations

8.1 Typical Application Scenarios

• Status Indicator Light:Power, connection, or activity indicators in consumer electronics (routers, TVs, home appliances).
• Backlight:Edge lighting for small LCD displays, keyboard illumination.
• Decorative lighting:Accent lighting in ultra-thin devices.
• General Identification:Low-brightness lighting for space-constrained areas.

8.2 Key Design Considerations

• Current Limiting:Always use a series resistor or constant current driver. Use the formula R = (V_{Power Supply}- V_F) / I_F Calculate the resistance value. Use the maximum V_F (3.15V) from the datasheet to ensure that the current does not exceed the limit even when the LED forward voltage is low._F device.
• Thermal Management:Even with low power consumption (70mW), it is necessary to ensure the PCB provides sufficient heat dissipation, especially when using multiple LEDs or in high ambient temperatures. Copper pads and thermal vias can assist.
• ESD Protection:Add ESD protection diodes on the signal lines connected to the LEDs, or ensure the driving circuit has inherent protection functions. Follow strict ESD procedures during operation and assembly.
• Optical Design:Consider a 130-degree viewing angle. For focused light, secondary optical elements (lenses) may be required. The encapsulated yellow lens helps diffuse the light and achieve the specified chromaticity coordinates.

9. Technical Comparison and Differentiation

Compared to standard SMD LEDs (e.g., 0603, 0805 packages), the primary distinction of this device lies in its0.35mm thickness. This is significantly thinner than conventional packages, enabling its application in ultra-thin products. UsingInGaN technologyProduces white light, superior in efficiency and color stability compared to older technologies like phosphor-converted blue LEDs with different structures. It is compatible with standardInfrared reflow processda kumaKayan aikin sarrafa kayan aiki ta atomatikdaidaitawar sa, wanda ya sa ya dace da layin hadawa na SMT na zamani mai girma, yana rage hadaddun kera idan aka kwatanta da naɗaɗɗen ramuka ko kayan da aka sanya da hannu.

10. Frequently Asked Questions (Based on Technical Specifications)

1. Q: Can I drive this LED directly with a 5V power supply?
   A: No. Its typical V_Fis about 3V. Direct connection to 5V will cause excessive current and immediate failure. A current-limiting resistor must be used. For example, target I_F=5mA: R = (5V - 3.15V) / 0.005A = 370Ω. Use the next standard value, such as 390Ω.
2. Q: What is the difference between Peak Forward Current and DC Forward Current?
   A: DC Forward Current (20mA) is for continuous operation. Peak Forward Current (100mA) is a short-duration pulse rating for multiplexing or testing. Continuous operation at 100mA will damage the LED.
3. Q: Why are the storage conditions for opened packages so strict (672 hours)?
   A: SMD packages absorb moisture from the air. During the high-temperature reflow soldering process, this moisture rapidly vaporizes, causing internal delamination or cracking ("popcorn" effect). The 672-hour limit and baking procedures help mitigate this risk.
4. Q: How to interpret the chromaticity binning codes (S1-S6)?
   A: These codes define a small area on the CIE chromaticity diagram. To achieve consistent color across an entire panel, LEDs from the same chromaticity bin should be specified and used. Mixing bins may result in visibly different white shades to the naked eye.

11. Practical Design and Usage Cases

Scenario: Designing a status indicator panel for a wearable device.
The device requires four white LEDs to indicate battery level. Space is extremely limited, with a maximum component height of 0.5 mm.
Solution:Select LTW-C193DS5 with a thickness of 0.35mm. To ensure uniform brightness, all four LEDs are specified from the same luminous intensity bin (e.g., Q bin). To guarantee consistent white color, they are also specified from the same chromaticity bin (e.g., S3 bin). The drive circuit uses a microcontroller GPIO pin, with a 390Ω resistor in series for each LED (calculated for a 3.3V power supply). The PCB layout includes thermal pads connected to a small-area ground plane to aid heat dissipation. The LEDs are placed after all other reflow soldering steps to minimize thermal exposure, and the 672-hour rule is observed after opening the moisture barrier bag.

12. Brief Introduction to Technical Principles

This LED uses an indium gallium nitride (InGaN) semiconductor chip to produce white light. InGaN material can emit light from the blue to ultraviolet spectrum. The primary method to generate white light is to combine a blue-emitting InGaN chip with a yellow phosphor coating (cerium-doped yttrium aluminum garnet, or YAG:Ce). The blue light emitted by the chip excites the phosphor, causing it to emit yellow light. The remaining blue light mixes with the generated yellow light, which is perceived as white by the human eye. This is known as a phosphor-converted white LED. The specific formulation of the phosphor determines its correlated color temperature (CCT) and chromaticity coordinates (x, y) on the CIE diagram.

13. Industry Trends and Development

The trend for indicator and miniature lighting LEDs continues towardsHigher efficiency(More lumens per watt),Smaller form factor(Reduction in footprint and thickness) andImproved color rendering(Higher CRI - Color Rendering Index, although not specified for this indicator-type LED) development. Simultaneously, there is a strong push to achieveHigher reliability和Maisha marefu zaidiMchakato wa utengenezaji unaendelea kuboreshwa ili kufikia uvumilivu mkali zaidi wa kiwango, kutoa utendakazi thabiti zaidi kwa matumizi magumu kama vile taa za nyuma za skrini. Mwelekeo wa miniaturization, kama inavyoonyeshwa na kipengele hiki cha milimita 0.35, unaendeshwa na mahitaji ya tasnia ya elektroniki ya watumiaji kwa vifaa nyembamba na kompakt zaidi.