LTST-C171KFKT-5A Orange SMD LED Datasheet - Dimensions 3.2x1.6x0.8mm - Voltage 1.7-2.3V - Power 75mW - English Technical Document

1. Product Overview

Wannan takarda ta cika cikakkun bayanai game da ƙayyadaddun ƙirar LED na guntu mai ƙira a saman, mai ƙarfi sosai kuma siriri. An ƙera na'urar don aikace-aikacen da ke buƙatar ƙirar ƙira mai ƙarfi, haske mai ƙarfi, da aiki mai dogaro a cikin hanyoyin haɗawa ta atomatik. Tana amfani da kayan semiconductor na AlInGaP (Aluminum Indium Gallium Phosphide) don samar da hasken orange, tana ba da ingantaccen ingancin haske idan aka kwatanta da fasahohin gargajiya.

Manyan fa'idodin wannan ɓangaren sun haɗa da ƙirar sa ta ƙanƙanta, dacewa da daidaitattun dabarun siyar da reflow, da kuma dacewa don kayan aikin sanya atomatik mai yawa. An yi niyya don haɗa shi cikin nau'ikan kayan lantarki na mabukaci masu yawa, masu nuna alama, hasken baya, da aikace-aikacen hasken gabaɗaya inda sarari da haske suke da matuƙar ƙayyadaddun iyaka.

2. Cikakken Bayanin Fasaha

2.1 Matsakaicin Matsakaici na Gaskiya

Ba na iya aiki na'urar ba tare da wuce waɗannan iyakokin ba don hana lalacewa ta dindindin.

• Ragewar Wutar Lantarki (Pd): 75 mW. Wannan shine matsakaicin jimlar wutar lantarki da fakiti zai iya ragewa a matsayin zafi a ƙarƙashin ƙayyadaddun yanayi.
• Matsakaicin Halin Gaba (I_FP): 80 mA. Wannan shine matsakaicin halin gaba na nan take da aka halatta, yawanci ana ƙayyade shi a ƙarƙashin yanayin bugun jini (1/10 aikin aiki, 0.1ms faɗin bugun) don hana dumama.
• Ci gaba da Halin Gaba (I_F): 30 mA DC. Wannan shine matsakaicin halin da za'a iya amfani dashi akai-akai.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Operating Temperature Range (T_opr): -30°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature Range (T_stg): -55°C to +85°C.
• Infrared Reflow Soldering Condition: 260°C peak temperature for a maximum of 10 seconds. This defines the thermal profile tolerance during assembly.

2.2 Halayen Lantarki da Haske

These parameters are measured at an ambient temperature (T_a) of 25°C and a standard test current (I_F) of 5 mA, unless otherwise noted.

• Luminous Intensity (I_V): Ranges from 11.2 mcd (minimum) to 45.0 mcd (maximum), with a typical value provided. Intensity is measured using a sensor filtered to match the photopic (CIE) human eye response curve.
• Viewing Angle (2θ_1/2): 130 degrees. This is the full angle at which the luminous intensity drops to half of its peak (on-axis) value, indicating a very wide viewing pattern.
• Peak Emission Wavelength (λ_P): 611 nm (typical). The wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d): 597.0 nm to 612.0 nm. This is the single wavelength perceived by the human eye to define the color, derived from the CIE chromaticity diagram. The specific value for a given unit depends on its bin code.
• Spectral Line Half-Width (Δλ): 17 nm (typical). The spectral bandwidth measured at half the maximum intensity (Full Width at Half Maximum - FWHM).
• Forward Voltage (V_F): 1.7 V to 2.3 V at I_F = 5mA. The voltage drop across the LED when conducting current.
• Reverse Current (I_R): 10 μA (maximum) at V_R = 5V. Ƙarancin ruwa na ƙananan lokacin da na'urar ke da juyin juya hali.

3. Bayanin Tsarin Binning

Don tabbatar da daidaiton launi da haske a cikin samarwa, ana rarraba LEDs zuwa kwandon bin bisa mahimman ma'auni. Wannan yana ba masu zane damar zaɓar sassa waɗanda suka dace da takamaiman buƙatun aikace-aikace.

3.1 Binning na Ƙarfafawa Gaba

Ana rarraba raka'a ta ƙarfin wutar lantarki na gaba (V_F) a 5 mA.

• Bin E2: V_F = 1.70V - 1.90V
• Bin E3: V_F = 1.90V - 2.10V
• Bin E4: V_F = 2.10V - 2.30V

Tolerance within each bin is ±0.1V. Matching V_F bins is important when connecting multiple LEDs in parallel to ensure uniform current sharing.

3.2 Binning na Ƙarfin Haskakawa

Units are categorized by their luminous intensity (I_V) a 5 mA.

• Bin L: I_V = 11.2 mcd - 18.0 mcd
• Bin M: I_V = 18.0 mcd - 28.0 mcd
• Bin N: I_V = 28.0 mcd - 45.0 mcd

Tolerance within each bin is ±15%. This allows selection based on required brightness levels.

3.3 Binning na Tsawon Zango Mai Rinjaye

Ana rukuni an rarraba ta mafi rinjayen tsayin raƙuman ruwa (λ_d) a 5 mA, wanda kai tsaye yake da alaƙa da launin da ake gani.

• Bin N: λ_d = 597.0 nm - 600.0 nm
• Bin P: λ_d = 600.0 nm - 603.0 nm
• Bin Q: λ_d = 603.0 nm - 606.0 nm
• Bin R: λ_d = 606.0 nm - 609.0 nm
• Bin S: λ_d = 609.0 nm - 612.0 nm

Tolerance within each bin is ±1 nm. Tight wavelength control is crucial for applications requiring precise color matching.

4. Nazarin Lanƙwan Ayyuka

While specific graphical curves are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 6 for viewing angle), the typical relationships can be described.

Forward Current vs. Forward Voltage (I-V Curve): The V_F of an AlInGaP LED has a logarithmic relationship with I_F. It increases with current but exhibits a "knee" voltage below which very little current flows. Operating at the recommended 5mA test condition ensures stable performance within the specified V_F range.

Luminous Intensity vs. Forward Current: The light output (I_V) is approximately proportional to the forward current (I_F) within the device's operational limits. However, efficiency may drop at very high currents due to increased heat generation.

Temperature Dependence: The forward voltage (V_F) of LEDs typically decreases with increasing junction temperature (negative temperature coefficient). Conversely, luminous intensity generally decreases as temperature rises. Proper thermal management is essential to maintain consistent brightness and longevity.

Spectral Distribution: The AlInGaP material system produces a relatively narrow emission spectrum centered in the orange-red region (peak at ~611 nm). The dominant wavelength may shift slightly with changes in drive current and temperature.

5. Bayanin Injiniya da Kunshin

5.1 Girman Kunshin

The device features an industry-standard EIA package outline. Key dimensions include a super-thin profile with a height of 0.80 mm. The length and width are typical for this class of chip LED. Detailed mechanical drawings specify all critical dimensions, including pad locations and tolerances (typically ±0.10 mm).

5.2 Tsarin Pad da Polarity

The datasheet includes a suggested soldering pad layout for PCB design. This layout is optimized for reliable solder joint formation during reflow and helps prevent tombstoning. The anode and cathode are clearly marked on the package, typically with a visual indicator such as a notch, dot, or cut corner. Correct polarity orientation is mandatory for device operation.

6. Jagororin Solder da Taro

6.1 Bayanin Solder Reflow

The component is compatible with infrared (IR) reflow soldering processes. A suggested profile compliant with JEDEC standards for lead-free (Pb-free) assembly is provided. Key parameters include:

• Pre-heat: Ramp-up to 150-200°C.
• Soak/Pre-heat Time: Maximum 120 seconds to activate flux and minimize thermal shock.
• Peak Temperature: Maximum 260°C.
• Time Above Liquidus: The device should be exposed to the peak temperature for a maximum of 10 seconds. Reflow should not be performed more than twice.

The specific profile must be characterized for the actual PCB design, solder paste, and oven used.

6.2 Solder da Hannu

If hand soldering is necessary, extreme care must be taken:

• Zazzabi na Iron: Matsakaicin 300°C.
• Lokacin Solder: Matsakaicin dakika 3 a kowane fili.
• Iyaka: Ya kamata a yi gishiri na hannu sau ɗaya kawai don guje wa lalacewar zafi ga fakitin epoxy da kuma mutuwar semiconductor.

6.3 Tsaftacewa

Kada a yi amfani da wadataccen maganin tsaftacewa kawai. Abubuwan da aka ba da shawarar sun haɗa da ethyl alcohol ko isopropyl alcohol a yanayin daki na yau da kullun. Ya kamata a nutsar da LED na ƙasa da minti ɗaya. Ruwayen sinadarai da ba a ƙayyade ba na iya lalata kayan marufi ko ruwan tabarau na gani.

6.4 Ajiya da Gudanarwa

LEDs na'urori ne masu kula da danshi (MSD).

• Kunshin da aka Rufe: Ajiye a ≤30°C da ≤90% Danshi na Dangi (RH). Rayuwar shiryayye a cikin jakar hana danshi ta asali tare da busassun abu shine shekara guda.
• Kunshin da aka Buɗe: Don abubuwan da aka cire daga marufinsu na asali, yanayin ajiyar bai kamata ya wuce 30°C / 60% RH ba. Ana ba da shawarar kammala sake kwararar IR cikin sa'o'i 672 (kwanaki 28) na fallasa. Don fallasa mai tsawo, ajiye a cikin akwati mai rufi tare da busassun abu ko a cikin na'urar bushewar nitrogen. Abubuwan da aka fallasa fiye da sa'o'i 672 yakamata a gasa su a kusan 60°C na akalla sa'o'i 20 kafin a yiya don cire danshin da aka sha da kuma hana "popcorning" yayin sake kwarara.

7. Bayanin Marufi da Oda

The device is supplied in tape-and-reel packaging compatible with automated pick-and-place equipment.

• Reel Size: 7-inch diameter.
• Quantity per Reel: 3000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Tape Specifications: Compliant with ANSI/EIA 481-1-A-1994. Empty component pockets are sealed with a top cover tape.
• Quality: The maximum number of consecutive missing components in the tape is two.

The part number LTST-C171KFKT-5A encodes specific attributes: likely the series (LTST-C171), lens type (K=Water Clear), color (FKT=Orange AlInGaP), and binning codes (5A).

8. Shawarwarin Aikace-aikace

8.1 Yanayin Aikace-aikace na Al'ada

• Status Indicators: Power, connectivity, or mode indicators in consumer electronics, appliances, and industrial equipment.
• Backlighting: Edge-lit or direct backlighting for small LCD panels, keypads, or symbols.
• Automotive Interior Lighting: Dashboard indicators, switch illumination (subject to qualification for specific automotive standards).
• Decorative Lighting: Accent lighting in devices where a thin profile is essential.

8.2 Abubuwan Tunani na Zane

• Current Drive: LEDs are current-operated devices. Use a constant current source or a current-limiting resistor in series with a voltage source to set the desired operating current. Do not connect directly to a voltage source without current limiting.
• Parallel Connection: When connecting multiple LEDs in parallel, slight variations in V_F can cause significant current imbalance, leading to uneven brightness and potential overstress of lower-V_F units. It is strongly recommended to drive each LED or series string with its own current-limiting resistor or use a dedicated multi-channel driver IC.
• Thermal Management: Ko da yake ɓarnawar wutar lantarki ƙarama ce, tabbatar da isasshen yanki na tagulla na PCB don kafofin gyaɗa yana taimakawa wajen zubar da zafi, musamman lokacin aiki kusa da matsakaicin ƙididdigewa ko cikin yanayin zafi mai girma. Wannan yana taimakawa wajen kiyaya fitowar haske da amincin na'urar.
• Kariya daga ESD: Duk da cewa ba a bayyana shi a sarari a matsayin mai hankali a cikin wannan takardar bayanan ba, sarrafa duk na'urorin semiconductor tare da matakan kariya na ESD da suka dace kyakkyawan aiki ne.

9. Technical Comparison and Differentiation

Wannan na'urar ta bambanta kanta da farko ta hanyar zurfin siriri na 0.80 mm, wanda ke da fa'ida ga aikace-aikacen da ke da ƙarancin sarari kamar nunin siriri mai siriri ko na'urorin lantarki masu sawa. Amfani da AlInGaP technology provides higher luminous efficiency and better temperature stability for orange/red colors compared to older technologies like GaAsP. Its compatibility with standard IR reflow processes and 8mm tape on 7" reels makes it ideal for high-volume, automated SMT assembly lines, reducing manufacturing cost and complexity.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λ_P) is the physical point of highest energy output in the spectrum. Dominant Wavelength (λ_d) is a calculated value based on human color perception (CIE chart) and is the single wavelength that best describes the perceived color. λ_d is more relevant for color matching in applications.

Q: Why is binning important?
A: Manufacturing variations cause slight differences in V_F, intensity, and color between individual LEDs. Binning sorts them into groups with tightly controlled parameters. Selecting from the same bin ensures visual consistency (same color and brightness) and electrical consistency (similar V_F) in a final product.

Q: Can I drive this LED at 20mA continuously?
A: Yes. The maximum continuous forward current is 30 mA. Operating at 20mA is within specification. However, luminous intensity and forward voltage at 20mA will be higher than the 5mA test condition values. Refer to typical performance curves for guidance.

Q: Yaya zan fassara kusurwar kallo na 130°?
A: Kusurwar kallo na 130° (2θ_1/2) tana da faɗi sosai. Yana nufin LED tana fitar da haske a kan mazugi mai faɗi. Ƙarfin yana da mafi girma idan ana kallo kai tsaye (0°), kuma idan ka motsa 65° daga axis (130°/2), ƙarfin ya ragu zuwa 50% na ƙimar akan-axis. Wannan ya dace da aikace-aikace inda ake buƙatar LED ta kasance bayyane daga kusurwoyi da yawa.

11. Design and Usage Case Study

Labari: Ƙirar allon nuna alamu da yawa don na'urar likita mai ɗaukuwa.
Bukatu: Dole ne LEDs da yawa na orange na yanayi su kasance masu haske iri ɗaya da launi iri ɗaya. Ginin na'urar yana da siriri sosai, yana iyakance tsayin kayan aiki. Haɗawa cikakke ne ta atomatik.

Design Choices Based on This Datasheet:
1. The 0.80mm height allows the LEDs to fit within the mechanical constraints.
2. To ensure uniform color, the designer specifies LEDs from a single, tight Dominant Wavelength bin (e.g., Bin Q: 603-606 nm).
3. To ensure uniform brightness, LEDs from a single Luminous Intensity bin (e.g., Bin M: 18-28 mcd) are selected.
4. To prevent brightness mismatch due to V_F variation, each LED is driven by its own current-limiting resistor connected to a common voltage rail, rather than connecting them directly in parallel.
5. The PCB layout follows the suggested pad dimensions to ensure reliable soldering during the IR reflow process specified in the document.
6. The manufacturing team follows the moisture handling guidelines, baking components that have been out of the bag for more than 28 days before assembly.

12. Technology Principle Introduction

This LED is based on AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor junction. Their recombination releases energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly dictates the wavelength (color) of the emitted light—in this case, orange. The chip is encapsulated in an epoxy package that serves to protect the semiconductor die, provide mechanical stability, and act as a primary optical element. The "water clear" lens material does not alter the color but helps in extracting and directing the light. The thin profile is achieved through advanced chip design and packaging techniques.

13. Industry Trends and Developments

Yarjejeniyar a cikin LED na nuni da ƙananan haske na yanki yana ci gaba zuwa mafi inganci (ƙarin fitowar haske a kowace naúrar wutar lantarki), ƙananan girman fakitin, da ƙananan bayanan martaba don ba da damar samfuran ƙarshe masu sirfi. Akwai kuma yunƙuri don ingantacciyar daidaiton launi da ƙaramin binning daga masu kera. Karɓar kayan da ba su da gubar (Pb-free) da tsarin RoHS, kamar yadda aka gani a cikin bayanan sake kwararar wannan ɓangaren, yanzu ya zama ma'auni. Bugu da ƙari, ci gaba a cikin ƙirar guntu da fasahar phosphor (ko da yake ba a amfani da shi a cikin wannan na'urar AlInGaP mai launi ɗaya) yana tura iyakokin abin da zai yiwu dangane da haske da yin launi na fararen LED, wanda ke rinjayar duk tsammanin kasuwa don aiki da aminci.