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LTST-C190TGKT-2A SMD LED Datasheet - Size 1.6x0.8x0.6mm - Voltage 2.4-3.2V - Green - Technical Documentation

LTST-C190TGKT-2A Ultra-Thin 0.8mm InGaN Green SMD LED Complete Technical Datasheet, including detailed parameters, binning system, dimension drawings, soldering guidelines, and application notes.
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PDF Document Cover - LTST-C190TGKT-2A SMD LED Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 2.4-3.2V - Green - Chinese Technical Document

LTST-C190TGKT-2A ni kifaa cha LED cha kusakinishwa kwenye uso kilichoundwa kwa matumizi ya kisasa ya elektroniki yenye nafasi ndogo. Kifaa hiki ni sehemu ya mfululizo wa LED zenye chip nyembamba sana, na urefu wa kifungo ni milimita 0.8 tu. Inatumia chip ya semiconductor ya InGaN kutoa mwanga wa kijani, na kufikia usawa wa mwangaza na ufanisi katika kifungo kidogo. Kifaa hiki kinapatikana katika muundo wa mkanda wa 8 mm unaokubalika katika tasnia, na kipenyo cha reel ni inchi 7, na inaendana kabisa na vifaa vya usakinishaji wa chip otomatiki vya kasi ya juu.

1.1 Core Advantages and Target Market

The primary advantage of this LED lies in its extremely low profile height, which is crucial for applications with limited Z-axis space, such as ultra-thin displays, mobile devices, and wearable technology. Its compatibility with infrared reflow soldering processes aligns with standard SMT production lines, ensuring reliable and efficient manufacturing. The product is designated as a "Green Product," indicating its compliance with environmental regulations concerning hazardous substances. Its target markets include consumer electronics, indicator lights, backlighting for small displays, and various portable devices, all of which require reliable, bright indication functionality within a minuscule package.

2. In-depth Analysis of Technical Parameters

This section provides a detailed and objective analysis of the key electrical, optical, and thermal characteristics of the LED as defined in the datasheet. All parameters are specified at an ambient temperature of 25°C.

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not operating conditions.

Power dissipation:

Viewing Angle:

130 degrees. This is a very wide viewing angle, meaning the light output is distributed over a broad area, not a narrow beam. This angle is defined as the point where the intensity drops to half of its axial value.

Unit: millicandela, measured at 2 mA. Tolerance for each bin is ±15%.

Bin M:

18.0 millicandela to 28.0 millicandela

Gear N:

Bin AP:

520.0 nm to 525.0 nm

Gear AQ:

4.1 Forward Current vs. Forward Voltage Characteristic Curve

The forward voltage exhibits a logarithmic relationship with the forward current. Under a test condition of 2 milliamperes, the forward voltage ranges between 2.4 volts and 3.2 volts. As the current increases, the forward voltage increases slightly. The LED displays characteristics similar to a diode: the current is negligible below the threshold voltage, after which it increases rapidly with a small increase in voltage. Therefore, an LED must be driven by a current-limiting source, not a voltage source.

4.2 Luminous Intensity vs. Forward Current Relationship

5.3 Recommended Pad Layout

The datasheet provides recommended pad patterns for PCB design. Following this pattern ensures proper soldering, alignment, and mechanical stability. The design typically includes thermal connections to manage heat during soldering and operation.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Temperature Profile

This device is compatible with infrared reflow soldering processes using lead-free solder paste. A recommended temperature profile is provided, typically following JEDEC standards. Key parameters include:FPreheating:F120-150°C range.FPreheat time:FMaximum 120 seconds, to activate the solder paste flux and stabilize the temperature.

Peak temperature:

Maximum 260°C.VTime above liquidus:

The temperature profile should limit the time the LED pins are above the solder melting point to a maximum of approximately 10 seconds.

This temperature profile is characterized by preventing thermal shock, ensuring reliable solder joints, while not damaging the LED's internal structure or epoxy lens.d6.2 Manual Soldering

If manual soldering must be performed, extreme caution is required:

Soldering iron temperature:

Maximum 300°C.

Welding time:

Maximum 3 seconds per pad.

Mita:

Ya kamata a yi sau ɗaya kawai. Yin dumama akai-akai zai ƙara haɗarin lalacewa.

It is recommended to use a pointed soldering iron and appropriate flux.

6.3 Cleaning

Only specified cleaning agents should be used. Recommended solvents include ethanol or isopropyl alcohol at room temperature. LEDs should be immersed for less than one minute. Unspecified chemicals may damage the plastic package or lens.

Baking:

LEDs stored outside the original packaging for more than one week should be baked at approximately 60°C for at least 20 hours before assembly to remove absorbed moisture and prevent "popcorn" phenomenon during reflow soldering.

7. Packaging and Ordering Information

Quantity per roll:

4000 pieces.

Minimum Order Quantity:

The remaining quantity is 500.

Pocket Sealing:

Power, connection, or activity indicator lights in consumer electronics.

Backlight:

Edge lighting for small LCD displays or icons in slim devices.

9. Technical Comparison and Differentiation

The LTST-C190TGKT-2A is primarily differentiated by its ultra-thin 0.8mm profile height. Compared to standard 1.0mm or 1.2mm height LEDs, this allows for the design of thinner end products. The use of InGaN technology offers higher efficiency and brighter output compared to older AlGaInP technology, although the forward voltage is typically higher. The comprehensive binning system provides designers with fine control over color and brightness consistency, which is an advantage over LEDs with wider parameter ranges and unspecified characteristics.

A complete order code may specify the binning for forward voltage, luminous intensity, and dominant wavelength. For example, D5-N-AR would specify an LED with a forward voltage of 2.6-2.8 volts, a luminous intensity of 28-45 millicandelas, and a dominant wavelength of 530-535 nanometers. Consult the manufacturer for the exact ordering syntax.

. Technical Comparison & Differentiation

The LTST-C190TGKT-2A differentiates itself primarily through its ultra-thin 0.8mm profile. Compared to standard 1.0mm or 1.2mm height LEDs, this allows for design in thinner end products. The use of InGaN technology provides higher efficiency and brighter output compared to older technologies like AlGaInP for green, though at a typically higher forward voltage. The comprehensive binning system offers designers fine control over color and brightness consistency, which is an advantage over LEDs supplied with wider, unspecified parameter spreads.

. Fesili e Masani ona Fesiligia (FAQ)

.1 E mafai ona ou fa'aogaina lenei LED i le 20mA fa'aauau?

E, 20mA o le DC forward current fautuaina aupito maualuga. Mo le olaga umi ma le faʻamaoni, o le faʻaogaina i se galu maualalo e pei o le 10-15mA e masani ona fautuaina, aua e faʻaitiitia ai le vevela. Ia faʻasino i taimi uma i le derating curves pe a maua.

.2 O le a le resistor ou te manaʻomia mo se sapalai 5V?

Faʻaaogaina le fua faʻatatau R = (Vsupply- VF) / IF. For a target IFof 5mA and a maximum VFof 3.2V (Bin D7): R = (5V - 3.2V) / 0.005A = 360 Ohms. For a target of 10mA: R = (5V - 3.2V) / 0.01A = 180 Ohms. Always choose the next higher standard resistor value and consider power rating (P = I2R).

.3 Why is there a reverse current specification if I shouldn't apply reverse voltage?

The IRspecification at VR=5V is a quality and leakage test parameter performed during manufacturing. It verifies the integrity of the semiconductor junction. In an actual circuit, you should never subject the LED to a reverse bias, as even a small reverse voltage beyond the device's low reverse breakdown voltage can cause immediate and catastrophic failure.

.4 How do I interpret the bin codes in an order?

A full order code might specify bins for VF, IV, and λd(e.g., D5-N-AR). This would specify LEDs with a forward voltage of 2.6-2.8V, luminous intensity of 28-45 mcd, and a dominant wavelength of 530-535 nm. Consult the manufacturer for exact ordering syntax.

. Practical Design Case

Scenario:Designing a low-battery indicator for a portable device powered by a 3.7V Li-ion battery. The indicator should be clearly visible but minimize power consumption.Design Steps:

  1. Current Selection:Choose IF= 5mA for a good balance of brightness and low power.
  2. Voltage Consideration:Batire voltage ranges from ~4.2V (full) to ~3.0V (low). Use the minimum system voltage (3.0V) for worst-case resistor calculation to ensure the LED still turns on.
  3. Resistor Calculation (Worst-case):Assume using a VFBin D7 LED (max VF= 3.2V). At low battery (3.0V), there is insufficient voltage to forward bias the LED (3.0V<.2V). Therefore, select a lower VFbin (e.g., D4: max 2.6V) or use a charge pump/LED driver for consistent performance across the battery range. If using Bin D4 with max VF=2.6V at low battery: R = (3.0V - 2.6V) / 0.005A = 80 Ohms. At full charge (4.2V): IF= (4.2V - 2.4Vmin) / 80 = 22.5mA (exceeds 20mA max). This shows the challenge of driving LEDs directly from a varying voltage source. A constant-current circuit or a more sophisticated driver is recommended for optimal performance and LED safety.

. Operating Principle Introduction

Light-emitting diodes are semiconductor devices that convert electrical energy directly into light through a process called electroluminescence. The LTST-C190TGKT-2A uses an InGaN (Indium Gallium Nitride) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. InGaN materials are used to produce light in the blue, green, and ultraviolet parts of the spectrum. The green color of this LED is a result of the specific composition of indium, gallium, and nitrogen in its active layer.

. Technology Trends

The development of LEDs like the LTST-C190TGKT-2A follows several key industry trends. There is a continuous drive toward miniaturization, enabling thinner and smaller end products. Efficiency improvements in InGaN materials are leading to higher luminous efficacy (more light output per electrical watt), which is crucial for battery-powered devices. Another trend is the refinement of binning and tighter parameter control, allowing for more consistent performance in mass production and enabling applications with stringent color or brightness uniformity requirements. Finally, enhanced reliability and compatibility with lead-free, high-temperature soldering processes are essential to meet global environmental regulations and modern manufacturing standards.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Unit/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical energy, the higher the more energy-efficient. Directly determines the energy efficiency class and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determine if the lamp is bright enough.
Viewing Angle ° (degrees), such as 120° The angle at which light intensity drops to half, determining the beam's width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra) No unit, 0–100 The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended. Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM) MacAdam Ellipse Steps, e.g., "5-step" Quantitative indicator of color consistency, the smaller the step number, the more consistent the color. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), e.g., 620nm (Red) The wavelength value corresponding to the color of a colored LED. Determine the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Shows the intensity distribution of light emitted by an LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbols Popular Explanation Design Considerations
Forward Voltage Vf Minimum voltage required to turn on an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf, and the voltage adds up when multiple LEDs are connected in series.
Forward Current If The current value that allows the LED to emit light normally. Constant current drive is commonly used, where the current determines brightness and lifespan.
Maximum Pulse Current Ifp Peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. A cikin da'ira, ya kamata a hana haɗin baya ko kuma ƙarfin lantarki mai ƙarfi.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will increase.
Electrostatic Discharge Immunity (ESD Immunity) V (HBM), such as 1000V Anti-static strike capability, the higher the value, the less susceptible to damage from static electricity. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam Ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Degradation of packaging materials due to long-term high temperature. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Encapsulation and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Package Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC offers good heat resistance and low cost; ceramic provides excellent heat dissipation and long lifespan.
Chip structure Front-side, Flip Chip Chip Electrode Layout Method. Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, Silicate, Nitride Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design Flat, Microlens, Total Internal Reflection Optical structure on the encapsulation surface, controlling light distribution. Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Terminology Grading Content Popular Explanation Purpose
Luminous Flux Grading Codes such as 2G, 2H Grouped by brightness level, each group has a minimum/maximum lumen value. Ensure uniform brightness for products within the same batch.
Voltage binning Codes such as 6W, 6X Grouped by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color Grading 5-step MacAdam Ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven colors within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Meaning
LM-80 Lumen Maintenance Test Long-term illumination under constant temperature conditions, recording brightness attenuation data. Used to estimate LED lifespan (combined with TM-21).
TM-21 Standard for Life Projection Projecting the lifespan under actual use conditions based on LM-80 data. Provide scientific life prediction.
IESNA standard Standard of the Illuminating Engineering Society Covers optical, electrical, and thermal test methods. Industry-recognized testing basis.
RoHS / REACH Environmental certification Ensure the product does not contain harmful substances (e.g., lead, mercury). Conditions for access to the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy efficiency and performance certification for lighting products. Yawan da ake amfani da shi a cikin sayayyar gwamnati da ayyukan tallafi, don haɓaka gasar kasuwa.