T-1 3/4 LED Lamp Bead 334-15/X1C5-1QSA Datasheet - Warm White - Typical Voltage 3.2V - 50° Viewing Angle - Chinese Technical Document

1. Product Overview

This document details the technical specifications of a high-performance warm white LED lamp bead. The device is designed for applications requiring significant luminous output within a compact, industry-standard package. Its core function is to provide efficient and reliable illumination for various indicator lights and lighting applications.

1.1 Core Advantages and Target Market

The primary advantages of this LED lie in its high luminous power output and the warm white emission achieved through a phosphor conversion system. It utilizes the popular T-1 3/4 round package, ensuring broad compatibility with existing sockets and designs. The device also complies with relevant environmental and operational standards, featuring ESD protection and RoHS compliance. Its target application fields are extensive, covering information panels, optical indicator lights, backlight modules, and sign lamps requiring clear and bright signal indication.

2. In-depth Analysis of Technical Parameters

This section objectively analyzes the key electrical, optical, and thermal characteristics of the device based on the content of the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device and are not applicable under normal operating conditions.

• Continuous Forward Current (IF):30 mA. Kuendelea kuzidi mkondo huu kutasababisha kiungo cha semiconductor kukabiliwa na mkazo mwingi.
• Kilele cha mkondo wa mbele (IFP):Ni 100 mA kwa uwiano wa kazi 1/10 na mzunguko wa 1 kHz. Hii inaruhusu mipigo mifupi ya mkondo wa juu, inayofaa kwa matumizi ya maonyesho ya multiplexing.
• Voltage ya nyuma (VR):5 V. Applying a reverse bias exceeding this value may cause junction breakdown.
• Power Dissipation (Pd):110 mW. This is the maximum thermal power the package can dissipate under specified conditions.
• Operating and Storage Temperature:They are -40°C to +85°C and -40°C to +100°C respectively, defining the environmental endurance of the device.
• ESD Withstand (HBM):4 kV, indicating its good anti-electrostatic discharge protection capability during operation.
• Welding temperature:260°C for 5 seconds, specifying the tolerance of the reflow soldering temperature profile.

2.2 Electro-Optical Characteristics

These are typical performance parameters measured under standard test conditions at 25°C (unless noted, IF=20mA).

• Forward Voltage (VF):2.8V to 3.6V. The voltage drop across the LED when it is conducting. The typical value is centered around 3.2V. Designers must ensure the drive circuit can accommodate this voltage range.
• Luminous Intensity (IV):Depending on the specific bin (see Section 3), the minimum luminous intensity ranges from 3600 mcd to 7150 mcd. This high intensity is a key characteristic for applications requiring high visibility.
• Viewing Angle (2θ1/2):50 degrees (typical). This defines the angular width at which the luminous intensity drops to half of its peak value, resulting in a medium-width beam.
• Chromaticity Coordinates (x, y):According to the CIE 1931 chromaticity diagram, the typical values are x=0.40, y=0.39. This places its emission color in the warm white region.
• Zener Reverse Voltage (Vz):At Iz=5mA, the typical value is 5.2V. This integrated protection feature helps protect the LED from reverse voltage transients.
• Reverse Current (IR):At VR=5V, the maximum value is 50 µA, indicating extremely low leakage current in the off state.

3. Explanation of the Grading System

The device is categorized based on key parameters to ensure consistency. This allows designers to select LEDs that meet their specific brightness and forward voltage requirements.

3.1 Luminous Intensity Grading

Based on their minimum luminous intensity at 20mA, LEDs are categorized into three main bins:
- Bin Q:3600 - 4500 mcd
- Gear R:4500 - 5650 mcd
- Gear S:5650 - 7150 mcd
These values allow a tolerance of ±10%. Selecting a higher gear (e.g., Gear S) ensures the device is brighter.

3.2 Forward Voltage Binning

For ease of current matching in series connection or precise driver design, LEDs are also binned according to forward voltage:
- Bin 0:2.8 - 3.0 V
- Bin 1:3.0 - 3.2 V
- Gear 2:3.2 - 3.4 V
- Gear 3:3.4 - 3.6 V
The measurement uncertainty is ±0.1V.

3.3 Color Binning (Chromaticity)

Warm white color is defined within a specific region on the CIE 1931 chromaticity diagram. The datasheet provides the angular coordinates for six color grades (D1, D2, E1, E2, F1, F2), which are grouped together (Group 1). This grouping indicates that all these grades fall within the acceptable warm white color gamut, where F1/F2 are warmer (lower correlated color temperature) and D1/D2 are cooler. The typical coordinates (x=0.40, y=0.39) lie within this grouping region.

4. Performance Curve Analysis

The provided charts facilitate a deeper understanding of the device's behavior under various conditions.

4.1 Relative Intensity vs. Wavelength

The spectral power distribution curve shows a broad emission peak in the visible spectrum, characteristic of phosphor-converted white LEDs. The peak is located in the yellow region, with the blue component from the InGaN chip serving as the base, together creating a warm white appearance.

4.2 Forward Current vs. Forward Voltage (IV Curve)

This curve demonstrates the typical exponential relationship of a diode. The forward voltage increases logarithmically with current. This curve is crucial for designing constant current drivers, as a small change in voltage leads to a large change in current.

4.3 Relative Intensity vs. Forward Current

Light output increases with forward current, but not in a linear relationship. The curve may show a near-linear growth region, followed by a roll-off at higher currents due to efficiency droop and thermal effects. It is recommended to operate at or below the recommended 20mA test current for optimal efficiency and lifetime.

4.4 Chromaticity vs. Forward Current and Thermal Performance

Chromaticity coordinates may shift slightly with drive current. The graph showing the relationship between forward current and ambient temperature is crucial for thermal management. As ambient temperature increases, the maximum allowable forward current for a given junction temperature decreases. This derating curve must be followed to prevent overheating.

4.5 Directivity Pattern

The radiation pattern diagram illustrates the spatial distribution of light. The T-1 3/4 package with a circular lens produces a smooth, wide beam with a nominal 50-degree viewing angle.

5. Mechanical and Packaging Information

5.1 Package Dimensions

This LED employs a standard T-1 3/4 (5mm) round package. Key dimensional specifications include:
- Unless otherwise specified, all dimensions are in millimeters, with a general tolerance of ±0.25mm.
- Lead spacing is measured at the point where the leads extend from the package body.
- The maximum protrusion of the resin below the flange is 1.5mm.
- The dimension drawing provides precise measurements for overall length, lens diameter, lead diameter, and bend point, which are crucial for PCB pad design and mechanical assembly.

5.2 Polarity Identification

Polarity is typically indicated by lead length (the longer lead is the anode) or a flat mark on the package flange. The cathode is usually connected to the lead adjacent to this flat. Correct polarity is essential for proper operation and to avoid applying reverse bias.

6. Soldering and Assembly Guide

Correct operation is crucial for reliability.

6.1 Pin Forming

• The bending point must be at least 3mm away from the bottom of the epoxy lamp bead to avoid stress on the internal chip and bonding wires.
• Form the pins before soldering. Applying stress to a soldered joint may damage the PCB or LED.
• Use appropriate tools to avoid applying stress to the package. Misalignment during PCB installation may cause permanent stress.
• Cut the leads at room temperature. High-temperature cutting may transfer heat and damage the device.
• Ensure the PCB holes are perfectly aligned with the LED leads to avoid forced insertion.

6.2 Welding Parameters

• Manual Welding:Maximum soldering iron tip temperature 300°C (suitable for irons up to 30W). Soldering time per pin should not exceed 3 seconds.
• Wave soldering/Dip soldering:Maximum preheat temperature 100°C, duration should not exceed 60 seconds.
• Maintain a distance greater than 3mm between the solder joint and the epoxy resin LED. Soldering is recommended outside the base of the tie bar (the small metal support between pins inside the package).

6.3 Storage Conditions

• After receipt, store at ≤30°C and ≤70% relative humidity. The recommended storage life under these conditions is 3 months.
• For longer storage (up to one year), place the LED in a sealed container filled with nitrogen and containing a desiccant.
• Avoid sudden temperature changes in high humidity environments to prevent condensation on the package surface and inside.

7. Packaging and Ordering Information

7.1 Packaging Specifications

LED packaging is designed to prevent damage from moisture, static electricity, and physical impact:
- Packaged in anti-static bags.
- Minimum 200 pieces per bag, maximum 500 pieces.
- Five bags are placed in one inner box.
- Ten inner boxes are packed into one master carton.

7.2 Labeling Instructions

Label on packaging bag contains key traceability and specification information:
- P/N:Part number.
- QTY:Quantity per bag.
- CAT:Combination code for luminous intensity and forward voltage binning.
- HUE:Color grade (e.g., D1, F2).
- LOT No:Production batch number, used for traceability.

7.3 Model Naming Rules

Part number 334-15/X1C5-1QSA follows a structured format, where the placeholder square (□) may represent codes for specific luminous intensity, forward voltage, and color grade binning, to precisely order the required performance grade.

8. Application Suggestions

8.1 Typical Application Scenarios

• Information Panel and Scoreboard:Its high intensity and wide viewing angle make it suitable for character illumination in indoor/outdoor displays.
• Optical Indicator Light:Suitable for status indicator lights on industrial equipment, consumer electronics, or control panels, especially for applications requiring warm white light indication.
• Backlighting:Edge lighting suitable for small panels, signage, or decorative illumination.
• Signage lighting:Suitable for position indicators, exit signs, or low-luminance environment channel lighting.

8.2 Design Considerations

• Current Limiting:It is essential to use a constant current source or a current-limiting resistor for driving. Calculate the resistor value based on the supply voltage (Vs), the LED's forward voltage (Vf from its binning), and the desired current (e.g., 20mA): R = (Vs - Vf) / I_f.
• Thermal Management:Although this package is not designed for high power dissipation, sufficient ventilation must be ensured in the application, especially when using multiple LEDs or operating near the maximum current. For elevated ambient temperatures, please follow the current derating curve.
• ESD Protection:Although rated for 4kV HBM, standard ESD precautions must still be observed during assembly.
• Optical Design:A 50° viewing angle provides a good balance between beam width and intensity. Secondary optics (lenses) are required for a narrower beam.

9. Technical Comparison and Differentiation

Compared to generic 5mm white LEDs, this device offers several significant advantages:
1. High Luminous Intensity:Its minimum luminous intensity rating is as high as 7150 mcd, providing significantly more light output than standard indicator LEDs, enabling its use in conditions with stronger ambient light.
2. Distinct Warm White Chromaticity:The specified chromaticity coordinates and binning ensure a stable, pleasing warm white color, distinct from cool white or bluish white LEDs.
3. Integrated Zener Protection:The built-in 5.2V Zener diode across the LED provides a degree of protection against reverse voltage spikes, enhancing reliability in electrically noisy environments.
4. Detailed specifications:Detailed maximum ratings, performance curves, and operating guidelines provide engineers with the data needed for reliable, long-term design.

10. Frequently Asked Questions (Based on Technical Specifications)

Q: What is the difference between Q, R, and S bins?
A: These bins are classified according to the minimum luminous intensity. The S bin is the brightest (minimum 5650-7150 mcd), the R bin is medium (minimum 4500-5650 mcd), and the Q bin is standard brightness (minimum 3600-4500 mcd). Please select according to the brightness requirements of your application.

Q: Can I operate this LED continuously at 30mA?
A: While 30mA is the absolute maximum continuous rating, the standard test condition and typical operating point is 20mA. Operating at 30mA will produce more light but also more heat, potentially shortening lifespan and causing color shift. For best reliability, it is recommended to design for 20mA or lower current.

Q: How to interpret the chromaticity coordinates (x=0.40, y=0.39)?
A: These coordinates plot a point on the CIE 1931 chromaticity diagram. This specific point falls within the "warm white" region, typically corresponding to a correlated color temperature of approximately 3000K-4000K, similar to the warm white light of incandescent or halogen lamps.

Q: LED yana da diode na Zener. Shin wannan yana nufin ba na buƙatar resistor a jere don kariya daga juyawa?
A: A'a. Babban aikin diode na Zener shine ya daure ƙarfin juyawa a kusan 5.2V, don kare LED daga juyawar baya. Lokacin da kuke tuka LED a gaba, har yanzu kuna buƙatar resistor mai iyakancewar kwarara a jere (ko mai tuka mai dindindin) don sarrafa kwarara da hana gudu mai zafi.

11. Design and Application Case Studies

Scenario: Design a multi-LED exit sign.
1. Requirements:12 LEDs are used to illuminate the "EXIT" text. All LEDs require consistent brightness and color. Powered by a 12VDC power supply in an indoor environment (maximum ambient temperature approximately 40°C).
2. LED Selection:Select LEDs from the same luminous intensity bin (e.g., R bin) and the same color group (Group 1) to ensure consistency. If connecting in parallel, selecting LEDs from the same forward voltage bin (e.g., Bin 1) is also beneficial.
3. Circuit Design:Connect 3 LEDs in series with a current-limiting resistor, then parallel 4 groups of such identical branches. For 1st bin LEDs (typical Vf 3.1V), the voltage drop of three in series is about 9.3V. For a 12V power supply and a target current of 18mA (slightly derated for extended lifespan), R = (12V - 9.3V) / 0.018A ≈ 150 Ω. Calculate resistor power rating: P = I²R = (0.018)² * 150 ≈ 0.049W, thus a standard 1/8W (0.125W) resistor is sufficient.
4. Layout:Follow the mechanical drawing for PCB pad spacing design. If forming leads is required, adhere to the 3mm bending rule. Leave some spacing between LEDs to facilitate heat dissipation.
5. Result:A sign with reliable illumination and uniform appearance, all operating parameters within the specified limits of the LEDs.

12. Introduction to Working Principles

This is a phosphor-converted white LED. The core light-emitting element is an indium gallium nitride (InGaN) semiconductor chip that emits blue light (electroluminescence) when a forward current is applied across its p-n junction. This blue light is not emitted directly. Instead, the reflector cup of the LED is filled with a yellow (or yellow-red) phosphor material. When blue photons from the chip strike the phosphor particles, they are absorbed. Subsequently, the phosphor re-emits light over a broader spectral range, primarily in the yellow and red regions. The remaining unabsorbed blue light mixes visually with the newly emitted yellow/red light to form white light. The specific formulation of the phosphor determines the color temperature—in this case, a "warm white" containing more red spectral components. The integrated Zener diode is a separate semiconductor component, connected in parallel with the LED but in reverse polarity (cathode to anode), to protect the fragile LED junction from reverse voltage breakdown.

13. Technical Trends and Background

The described device represents a mature and widely adopted technology. The T-1 3/4 (5mm) through-hole package has been an industry standard for indicator lights and low-brightness lighting applications for decades. The broader LED industry's current trends are moving in the following directions:
1. Efficiency improvement (lm/W):Updated chip design and advanced phosphor technology continue to increase light output per watt of electrical power, reducing energy consumption.
2. Surface-Mounted Device (SMD) dominance:For most new designs, SMD packages (such as 3528, 5050, or smaller sizes) are preferred due to their smaller size, better suitability for automated assembly, and generally superior PCB thermal conduction paths.
3. Higher Color Quality and Consistency:Tighter color binning (using metrics like MacAdam ellipses) and higher Color Rendering Index (CRI) are becoming standard for lighting applications.
4. Integrated Solutions:LED single-package products with built-in drivers (constant current ICs), controllers, or multi-color channels (RGB, RGBW) are becoming increasingly popular in the smart lighting field.
Despite these trends, through-hole LED beads remain highly relevant in applications requiring simple replacement, high single-point luminous intensity, robustness in harsh environments, or the use of specified through-hole PCB components. Their well-defined characteristics and long history make them a reliable and predictable choice for many engineering designs.