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White LED 3030 SMD Datasheet - Dimensions 3.0x3.0x0.66mm - Voltage 5.9V - Power 0.71W - Technical Documentation

A complete technical datasheet for a high-performance 3030 SMD white LED, covering photoelectric characteristics, binning structure, thermal data, package dimensions, and application guidelines.
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PDF Document Cover - White LED 3030 SMD Datasheet - Dimensions 3.0x3.0x0.66mm - Voltage 5.9V - Power 0.71W - Chinese Technical Document

1. Product Overview

This document details the specifications of a high-performance, top-emitting white LED housed in a compact 3030 surface-mount device (SMD) package. Designed for general lighting applications, this device integrates high luminous output, excellent thermal management capability, and reliable operation under demanding conditions. Its primary target markets include luminaire retrofit solutions, general lighting, and indoor/outdoor signage backlighting.

The core advantage of this LED series stems from its enhanced thermal dissipation package design, which facilitates the efficient removal of heat generated at the semiconductor junction. This is crucial for maintaining device performance and operational lifetime, especially when operating at high drive currents. The package offers a wide viewing angle of 120 degrees, ensuring uniform light distribution. Furthermore, it is RoHS compliant and suitable for lead-free reflow soldering processes, aligning with modern manufacturing and environmental standards.

2. Detailed Technical Parameters

The performance of this LED is characterized under specific test conditions, typically at a junction temperature (Tj) of 25°C and a forward current (IF) of 120mA. It must be understood that actual performance will vary with operating temperature and drive current.

2.1 Photoelectric Characteristics

Luminous flux output is directly related to correlated color temperature (CCT) and color rendering index (Ra). Under standard test conditions of IF=120mA, the typical luminous flux range is approximately: about 94 lumens for a 2700K, Ra90 LED, while it can reach up to 129 lumens for cool white LEDs (4000K-6500K, Ra70). The typical forward voltage (VF) at 120mA is 5.9V, with a tolerance of ±0.2V. The viewing angle (2θ1/2), defined as the off-axis angle where luminous intensity drops to half its peak value, is 120 degrees.

2.2 Absolute Maximum Ratings and Electrical Characteristics

Don kiyaye amincin na'urar, yanayin aiki bai kamata ya wuce ƙimar iyakar ba. Matsakaicin ci gaba na ci gaba na yau da kullun (IF) shine 200mA, a cikin yanayi na musamman (faɗin bugun jini ≤100μs, aikin aiki ≤10%) matsakaicin bugun jini na gaba (IFP) shine 300mA. Matsakaicin amfani da wutar lantarki (PD) shine 1280 mW. Na'urar tana iya jure har zuwa 5V na juyawa (VR). Yanayin zafin aiki (Topr) shine -40°C zuwa +105°C, matsakaicin izinin zafin jiki (Tj) shine 120°C.

2.3 Thermal Characteristics

Gudanar da zafi yana da mahimmanci ga aikin LED da rayuwa. Maɓalli mai mahimmanci a nan shine juriya na zafi daga haɗin gwiwa zuwa wurin walda (Rth j-sp), wanda aka tsara shi azaman 13°C/W. Wannan ƙimar tana nuna yadda zafin da ke fitowa daga guntu na LED ke wucewa zuwa allon da'ira (PCB). Ƙarancin juriya na zafi yana da kyau. Takardar ƙayyadaddun bayanai tana ba da lanƙwasa rage daraja, yana nuna yadda matsakaicin izinin ci gaba na gaba ke raguwa yayin da yanayin yanayi ya tashi don hana haɗin gwiwa ya wuce iyakarsa.

3. Explanation of the Binning System

Due to manufacturing variations, LEDs are sorted into different performance bins to ensure consistency in applications. This product employs a multi-dimensional binning system.

3.1 Luminous Flux Binning

LEDs are grouped based on their luminous flux measured at 120mA. The bin code (e.g., 5G, 5H, 5J) defines a specific lumen range. For example, for a 4000K, Ra80 LED, bin code 5H corresponds to a luminous flux range of 115-120 lumens, while 5J corresponds to 120-125 lumens. Available bins vary with CCT and CRI combinations.

3.2 Forward Voltage Binning

Forward voltage is also binned to assist circuit design, especially when driving multiple LEDs in series. The bins are labeled Z3 (5.6-5.8V), A4 (5.8-6.0V), B4 (6.0-6.2V), and C4 (6.2-6.4V). Selecting LEDs from the same voltage bin helps achieve more uniform current distribution in parallel branches.

3.3 Chromaticity Binning (Color)

For each nominal CCT (2700K, 3000K, 4000K, 5000K, 5700K, 6500K), its chromaticity coordinates (x, y on the CIE diagram) are controlled within a 5-step MacAdam ellipse. The 5-step ellipse ensures that, under standard viewing conditions, the color difference between LEDs within the same bin is nearly imperceptible to the human eye. The datasheet provides the center coordinates and ellipse parameters for each CCT grade at both 25°C and 85°C junction temperatures, acknowledging the color shift that occurs with temperature.

4. Performance Curve Analysis

The datasheet contains several charts that are crucial for design engineers.

4.1 Spectral Power Distribution

Spectral diagrams for Ra≥70, Ra≥80, and Ra≥90 are provided. Spectra with higher CRI exhibit fuller spectra, particularly in the red region, enabling more accurate color reproduction of illuminated objects.

4.2 Relationship Between Forward Current and Relative Light Intensity and Voltage

The relative light intensity curve exhibits an approximately linear relationship with current in the lower current range, typically tending to saturate at higher currents due to efficiency droop and thermal effects. The forward voltage curve demonstrates an exponential increase with current, which is crucial for designing constant current drivers.

4.3 Thermal Derating Curve

The "Ambient Temperature vs. Relative Luminous Flux" curve illustrates the reduction in light output as the LED operating temperature increases. The "Ambient Temperature vs. Relative Forward Voltage" curve shows the decrease in VF with rising temperature, which is a typical negative temperature coefficient of semiconductors. The "Maximum Forward Current vs. Ambient Temperature" graph is the derating curve, defining the maximum safe operating current to keep Tj below 120°C at any given ambient temperature.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED uses a 3030 package, meaning its footprint is approximately 3.0mm x 3.0mm. The overall height is 0.66mm. Detailed mechanical drawings show the top view, bottom view, and side view, with key dimensions annotated, including lens curvature and pad layout. All unspecified tolerances are ±0.2mm.

5.2 Pad Design and Polarity Identification

The bottom view clearly shows two anode and two cathode pads. Polarity is clearly marked on the package body, with a special indicator denoting the cathode side. This is crucial for correct orientation during assembly. The pad pattern design aims to promote good solder joint formation during reflow soldering and ensure mechanical stability.

6. Soldering and Assembly Guide

This component is suitable for lead-free reflow soldering. The maximum soldering temperature profile is specified: depending on the specific profile used, the package body temperature must not exceed 230°C or 260°C for more than 10 seconds. The standard IPC/JEDEC J-STD-020 profile for lead-free processes is applicable. It is recommended to follow the manufacturer's suggested profile to avoid thermal shock, solder joint defects, or damage to the internal materials of the LED. The device should be stored in a dry, controlled environment before use.

7. Application Suggestions

7.1 Typical Application Scenarios

This LED is highly suitable for:
- Retrofit luminaires:Directly replacing traditional incandescent, halogen, or CFL lamps in downlights, track lights, and bulbs.
- General Lighting:Linear modules, panel lights, and high-bay lights requiring high luminous flux output.
- Signage and Architectural Lighting:With its wide viewing angle and high brightness, it is suitable for indoor/outdoor sign backlighting, channel letters, and decorative accent lighting.

7.2 Design Considerations

1. Thermal Management:Low Rth j-sp is effective only when the PCB has a low thermal resistance path to the heat sink. It is recommended to use metal core PCBs (MCPCB) or other enhanced heat dissipation substrates.
2. Drive Current:Although capable of withstanding 200mA, operating at a test current of 120mA or below typically achieves a better balance between efficiency, lifespan, and thermal load.
3. Optical Design:For applications requiring a narrower beam, a 120-degree viewing angle may necessitate secondary optical elements (lenses, reflectors).
4. Electrical Design:Use a constant current driver that matches the forward voltage range and the desired operating current. When designing the feedback loop, the negative temperature coefficient of VF must be considered.

8. Frequently Asked Questions Based on Technical Parameters

Question: What is the actual power consumption at the typical operating point?
Answer: At IF=120mA and VF=5.9V, the electrical power input is approximately 0.71 watts (120mA * 5.9V = 0.708W).

Question: How does the Color Rendering Index (CRI) affect the light output?
A: As shown in the photoelectric characteristics table, for the same CCT, LEDs with a higher CRI (Ra90) typically have a lower luminous flux compared to those with a standard CRI (Ra70). This is a fundamental trade-off in phosphor-converted white LEDs.

Q: Can I drive this LED with a constant voltage source?
A: It is strongly not recommended. The exponential I-V relationship of an LED means that a small change in voltage can cause a large change in current, leading to thermal runaway and failure. Always use a constant current driver.

Q: What does a 5-step MacAdam ellipse mean for my application?
A: It guarantees extremely high color consistency. LEDs from the same CCT bin will appear nearly identical in color to most observers, which is crucial for multi-LED luminaires to avoid visible color differences (color mixing).

9. Working Principle

This is a phosphor-converted white LED. When electric current passes through the core semiconductor chip, the chip emits blue light (electroluminescence). The blue light irradiates the phosphor layer deposited on or near the chip. The phosphor absorbs a portion of the blue photons and re-emits light at longer wavelengths (yellow light, and typically also red light for high-CRI types). The remaining blue light combines with the broad-spectrum light emitted by the phosphor, ultimately creating the perception of white light. The specific formulation of the phosphor determines the final output's CCT and CRI.

10. Industry Trends

The 3030 package format represents a balance between high-power handling capability and a compact footprint, making it a popular choice in the mid-power LED segment. Industry trends continue to focus on improving luminous efficacy (lumens per watt), enhancing color consistency and color rendering, and increasing reliability at higher operating temperatures. Concurrently, there is a move towards more sustainable manufacturing processes and materials. The integration of advanced phosphors for better spectral quality and the optimization of package geometry for superior thermal performance are areas of ongoing development for this package type.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Photoelectric Performance

Terminology Units/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; higher values indicate greater energy efficiency. Directly determines the energy efficiency rating and electricity cost of the luminaire.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether a luminaire is bright enough.
Viewing Angle ° (degrees), such as 120° The angle at which light intensity drops to half determines the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
SDCM (Standard Deviation of Color Matching) MacAdam ellipse steps, e.g., "5-step" A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), misali 620nm (ja) Rangi ya LED zenye rangi inayolingana na thamani ya urefu wa wimbi. Inaamua rangi ya LED moja kama nyekundu, manjano, kijani, n.k.
Spectral Distribution Wavelength vs. Intensity Curve Display the intensity distribution of light emitted by the LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; voltages add up when multiple LEDs are connected in series.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Maximum Pulse Current (Pulse Current) Ifp Peak current that can be sustained for a short period, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled to prevent overheating damage.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit must be protected against reverse polarity or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat transfer from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a stronger heat dissipation design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V The higher the ESD immunity rating, the more resistant the device is to electrostatic damage. Anti-static measures must be implemented during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Metrics Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Packaging Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC tahan panas baik, biaya rendah; keramik pendinginan unggul, umur panjang.
Struktur chip Face-up, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical design Flat, Microlens, Total Internal Reflection Optical structure on the encapsulation surface, controlling light distribution. Determine the beam angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Classification Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within a minimal range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standards/Testing Popular Explanation Significance
LM-80 Lumen Maintenance Test Record brightness attenuation data under constant temperature conditions over a long period of illumination. Used to estimate LED lifetime (combined with TM-21).
TM-21 Standard for Life Projection Projecting lifetime under actual use conditions based on LM-80 data. Provide scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized testing basis.
RoHS / REACH Environmental Certification Ensure products are free from hazardous substances (e.g., lead, mercury). Market access requirements for entering the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.