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EL3H7U-G Photocoupler Datasheet - 4-Pin SSOP Package - Profile 2.0mm - Isolation 3750Vrms - CTR 100-560% - English Technical Document

Complete datasheet for the EL3H7U-G series 4-pin SSOP phototransistor photocoupler. Features include halogen-free design, high isolation voltage, wide operating temperature, and multiple safety approvals.
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PDF Document Cover - EL3H7U-G Photocoupler Datasheet - 4-Pin SSOP Package - Profile 2.0mm - Isolation 3750Vrms - CTR 100-560% - English Technical Document

1. Product Overview

The EL3H7U-G series represents a family of compact, surface-mount phototransistor photocouplers (optocouplers) designed for reliable signal isolation in modern electronic circuits. These devices provide a crucial function by transferring electrical signals between two isolated circuits using light, thereby preventing high voltages or ground loops in one circuit from affecting or damaging the other.

The core construction consists of a gallium arsenide infrared light-emitting diode (IRED) optically coupled to a silicon NPN phototransistor. Both are encapsulated within a green, halogen-free compound and housed in a 4-pin Small Outline Package (SSOP) with a low profile of 2.0 mm. This package is ideal for space-constrained applications on printed circuit boards (PCBs).

1.1 Core Advantages and Target Market

The primary advantages of the EL3H7U-G series include its high isolation capability, compact form factor, and compliance with international safety and environmental standards. With an isolation voltage (Viso) of 3750 Vrms, it provides robust protection for sensitive circuitry. The halogen-free material composition aligns with environmental regulations like RoHS and REACH. The device is approved by major international safety agencies including UL, cUL, VDE, SEMKO, NEMKO, DEMKO, FIMKO, and CQC, making it suitable for global markets requiring certified components.

The target applications are diverse, focusing on areas where electrical isolation and noise immunity are paramount. Key markets include switch-mode power supplies (SMPS), particularly DC-DC converters, industrial programmable logic controllers (PLCs), telecommunication equipment, and general-purpose signal transmission across circuits with different ground potentials or impedance levels.

2. In-Depth Technical Parameter Analysis

Understanding the absolute maximum ratings and electrical characteristics is essential for reliable circuit design and ensuring the long-term reliability of the photocoupler.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

2.2 Electro-Optical Characteristics

These parameters, typically measured at 25°C, define the device's performance under normal operating conditions.

2.3 Transfer Characteristics and Grading System

The Current Transfer Ratio (CTR) is the most critical parameter for a photocoupler, defined as the ratio of output collector current (IC) to input LED forward current (IF), expressed as a percentage: CTR = (ICF) * 100%.

The EL3H7U-G series uses a CTR grading system to provide designers with consistent performance bins:

This grading allows for more precise design, especially in circuits where gain consistency is important, such as in feedback loops of power supplies. The standard part offers the widest range, suitable for general-purpose applications where exact CTR is less critical.

3. Performance Curve Analysis

The datasheet provides several graphs illustrating key performance trends. It is crucial to note that these curves represent typical behavior and are not guaranteed by production testing.

3.1 Forward Current vs. Forward Voltage (Figure 1)

This graph shows the I-V characteristic of the input IRED at different ambient temperatures (-40°C, 25°C, 125°C). The forward voltage (VF) has a negative temperature coefficient, meaning it decreases as temperature increases for a given current. This is a typical behavior for diodes and must be considered in thermal management and constant-current drive design.

3.2 Collector Current vs. Forward Current (Figure 2) and CTR vs. Forward Current (Figure 3)

Figure 2 plots the output collector current (IC) against the input LED current (IF) for two different collector-emitter voltages (VCE=0.4V and 5V). The relationship is linear at lower currents but shows saturation at higher IF levels, especially at the lower VCE. Figure 3 shows the normalized CTR decreasing as IF increases. This indicates that the device is most efficient (highest CTR) at lower drive currents, typically around the test condition of 0.5 mA.

3.3 Temperature Dependence (Figures 6 & 7)

Figure 6 demonstrates that the collector current (IC) for a fixed IF increases with temperature. Figure 7 shows that the normalized CTR peaks around room temperature and decreases at both higher and lower temperatures. This temperature dependence of CTR is a critical design factor. Circuits must be designed to function correctly over the entire specified temperature range, accounting for the variation in gain.

3.4 Switching Characteristics (Figure 9)

The graph for switching time vs. load resistance (RL) shows that both rise time (tr) and fall time (tf) decrease as the load resistance decreases. Faster switching is achieved with smaller load resistors, but this comes at the cost of higher power dissipation in the output stage. The test circuit (Figure 13) defines tr as the time from 10% to 90% of the output pulse and tf as from 90% to 10%.

4. Mechanical, Packaging, and Assembly Information

4.1 Pin Configuration and Polarity

The device uses a standard 4-pin SSOP footprint. The pinout is as follows: Pin 1: Anode of the IRED, Pin 2: Cathode of the IRED, Pin 3: Emitter of the phototransistor, Pin 4: Collector of the phototransistor. Correct polarity must be observed during PCB layout and assembly to prevent damage.

4.2 Soldering and Handling Guidelines

The absolute maximum rating for soldering temperature (TSOL) is 260°C for 10 seconds. This aligns with typical lead-free reflow soldering profiles. Standard IPC/JEDEC J-STD-020 guidelines for moisture-sensitive devices should be followed. The device should be stored in its original moisture-barrier bag with desiccant under controlled conditions and baked before soldering if the bag has been opened or the exposure time limit is exceeded.

5. Ordering Information and Packaging

The part number follows the structure: EL3H7U(X)(Y)-VG.

Examples: EL3H7UB-TA-VG would be a B-grade CTR device, packaged on a TA tape and reel, with VDE approval and halogen-free material.

6. Application Guidelines and Design Considerations

6.1 Typical Application Circuits

The primary application is signal isolation. A typical circuit involves driving the input LED with a current-limiting resistor from a digital signal source (e.g., a microcontroller GPIO). The output phototransistor can be used in a common-emitter configuration (collector connected to a pull-up resistor, emitter grounded) to produce an inverted output signal, or in an emitter-follower configuration for a non-inverted signal.

6.2 Key Design Considerations

7. Technical Comparison and FAQs

7.1 Differentiation from Other Photocouplers

The EL3H7U-G series differentiates itself through its combination of a compact SSOP package, high 3750 Vrms isolation rating, wide -40°C to +125°C operating temperature, and comprehensive international safety certifications. Many competing devices may offer similar CTR or speed but lack the full suite of approvals or the high-temperature capability.

7.2 Frequently Asked Questions (FAQs)

Q: What is the difference between the standard grade and the A/B/C grades?
A: The standard grade has a very wide CTR range (50-600%). The A, B, and C grades are binned into tighter, guaranteed CTR ranges (e.g., 200-400% for C-grade). Use graded parts for designs requiring predictable gain.

Q: Can I use this for AC input signal isolation?
A: Not directly. The input is an IRED, which is a diode and only conducts in one direction. To isolate an AC signal, you would need to first rectify it or use a dedicated AC-input photocoupler.

Q: How do I calculate the maximum data rate?
A>The maximum data rate is limited by the sum of the rise and fall times (tr + tf). A rough estimate for a digital signal is Bandwidth ≈ 0.35 / (tr). With typical tr of 8 μs, the bandwidth is about 44 kHz. For reliable digital communication, the practical data rate will be lower.

Q: Why is the isolation capacitance important?
A: Low isolation capacitance (CIO) is crucial for rejecting high-frequency common-mode noise. In applications with fast voltage transients across the isolation barrier (like in motor drives), a high CIO can couple noise from the primary to the secondary side, potentially causing malfunctions.

8. Operating Principle and Technology Trends

8.1 Fundamental Operating Principle

A photocoupler operates on the principle of electro-optical-electrical conversion. An electrical signal applied to the input side causes the IRED to emit infrared light proportional to the current. This light traverses a transparent isolation barrier within the package. On the output side, the phototransistor detects this light, generating a base current which in turn controls a much larger collector current. The two circuits are electrically isolated, with only optical coupling between them.

8.2 Industry Trends

The trend in photocoupler technology is towards higher speed, lower power consumption, higher integration, and smaller packages. While traditional phototransistor-based devices like the EL3H7U-G are excellent for DC and low-frequency isolation, newer technologies like digital isolators (using CMOS and RF or capacitive coupling) offer significantly higher data rates, lower power, and better timing characteristics. However, photocouplers maintain advantages in high common-mode transient immunity (CMTI), simplicity, and well-established safety certifications for high-voltage isolation, ensuring their continued relevance in power conversion and industrial control applications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.