LED Lamp 383-2USOC/S530-A6 Datasheet - Orange - 621nm Peak Wavelength - 2.0V Forward Voltage - 60mW Power Dissipation - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip to produce a sunset-orange color, encapsulated in a water-clear resin package. Its primary design goal is to deliver reliable and robust performance in a compact form factor.

1.1 Core Advantages and Target Market

The series offers a choice of various viewing angles to suit different application needs and is available on tape and reel for automated assembly processes, enhancing production efficiency. It is designed to be reliable and robust, ensuring consistent performance. The product complies with key environmental regulations, including the EU RoHS (Restriction of Hazardous Substances) directive, EU REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations, and is Halogen-Free, with Bromine (Br) and Chlorine (Cl) content strictly controlled below 900 ppm individually and 1500 ppm combined.

The target applications for this LED are primarily in consumer electronics and display backlighting, including television sets, computer monitors, telephones, and general computer indicator applications where a distinct, bright orange signal is required.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed and should be avoided for reliable long-term performance.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (IFP): 160 mA. This is the maximum pulsed current, applicable under a duty cycle of 1/10 at 1 kHz frequency.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can damage the LED junction.
• Electrostatic Discharge (ESD) Human Body Model: 2000 V. This indicates the LED's sensitivity to static electricity; proper ESD handling precautions are necessary.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate without exceeding its thermal limits.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range over which the device is designed to function.
• Storage Temperature (Tstg): -40°C to +100°C. The temperature range for non-operational storage.
• Soldering Temperature (Tsol): 260°C for 5 seconds. The maximum temperature and time the leads can withstand during wave or reflow soldering.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of an ambient temperature (Ta) of 25°C and a forward current (IF) of 20 mA, unless otherwise specified. They define the typical performance of the LED.

• Luminous Intensity (Iv): 6300 mcd (Min), 8000 mcd (Typ). This is a measure of the perceived brightness of the LED in a specific direction. The measurement uncertainty is ±10%.
• Viewing Angle (2θ1/2): 6° (Typ). This is the full angle at which the luminous intensity is half of the intensity at 0° (on-axis). A 6° angle indicates a very narrow, focused beam.
• Peak Wavelength (λp): 621 nm (Typ). The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λd): 615 nm (Typ). The single wavelength perceived by the human eye that matches the color of the LED. Uncertainty is ±1.0 nm.
• Spectrum Radiation Bandwidth (Δλ): 18 nm (Typ). The range of wavelengths where the radiant power is at least half of the peak power, indicating the spectral purity.
• Forward Voltage (VF): 2.0 V (Typ), 2.4 V (Max). The voltage drop across the LED when operating at the specified current. Uncertainty is ±0.1 V.
• Reverse Current (IR): 10 μA (Max). The small leakage current that flows when the specified reverse voltage (5V) is applied.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate how key parameters change with operating conditions. These are essential for circuit design and thermal management.

3.1 Spectral Distribution and Directivity

The Relative Intensity vs. Wavelength curve shows a sharp peak centered around 621 nm, confirming the orange color emission. The Directivity curve visually represents the very narrow 6° viewing angle, showing how intensity drops rapidly off-axis, which is ideal for focused indicator applications.

3.2 Electrical and Thermal Dependencies

The Forward Current vs. Forward Voltage (IV Curve) shows the exponential relationship typical of a diode. At 20 mA, the voltage is approximately 2.0V. The Relative Intensity vs. Forward Current curve demonstrates that light output increases linearly with current up to the maximum rated continuous current.

The Relative Intensity vs. Ambient Temperature curve is critical for thermal design. It shows that luminous output decreases as the ambient temperature rises. For example, at 85°C, the output may be only 50-60% of its value at 25°C. Conversely, the Forward Current vs. Ambient Temperature curve (likely under constant voltage) would show how current changes with temperature, important for designing constant-current drivers to maintain stable brightness.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is housed in a standard 3mm round package, often referred to as a \"T-1\" size. The detailed dimension drawing specifies the diameter of the lens, the lead spacing, the lead diameter, and the overall height. A key note specifies that the height of the flange (the rim at the base of the dome) must be less than 1.5mm (0.059\"). All dimensions are in millimeters, with a standard tolerance of ±0.25mm unless otherwise declared. Precise dimensions are crucial for PCB footprint design and ensuring proper fit in housings.

4.2 Polarity Identification

The LED has two leads: the anode (positive) and the cathode (negative). Typically, the cathode is identified by a flat spot on the plastic lens rim or by the shorter lead. The datasheet diagram should be consulted to confirm the exact polarity marking for this specific part number to prevent reverse installation.

5. Soldering and Assembly Guidelines

Proper handling is essential to prevent damage and ensure reliability.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid stress on the seal.
• Forming must be done before soldering.
• Avoid stressing the package. Misaligned PCB holes that force the leads during insertion can cause cracks or degradation.
• Cut leads at room temperature.

5.2 Soldering Process

Hand Soldering: Iron tip temperature should not exceed 300°C (for a max 30W iron), and soldering time per lead should be 3 seconds maximum. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Wave (DIP) Soldering: Preheat temperature should not exceed 100°C for a maximum of 60 seconds. The solder bath temperature should be a maximum of 260°C with a dwell time of 5 seconds. Again, maintain a 3mm distance from the joint to the bulb.
A recommended soldering profile graph would typically show a gradual preheat ramp, a brief peak at 260°C, and a controlled cooling slope. Rapid cooling is not recommended. Dip or hand soldering should not be performed more than once.

5.3 Storage and Cleaning

Storage: LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The shelf life after shipping is 3 months. For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.
Cleaning: If necessary, clean only with isopropyl alcohol at room temperature for no more than one minute. Do not use ultrasonic cleaning unless absolutely necessary and only after pre-qualification, as it can cause internal damage.

6. Heat Management Principle

While not a high-power LED, heat management is still a critical design consideration. The forward voltage and current produce heat (Power = Vf * If). This heat, if not dissipated, raises the junction temperature inside the LED. As shown in the performance curves, high junction temperature directly reduces light output (luminous intensity) and can accelerate long-term degradation, shortening the LED's lifespan. Therefore, during the application design stage, consideration should be given to the thermal path from the LED leads to the PCB and possibly to a heatsink, especially if operating near the maximum continuous current or in high ambient temperatures. The 60mW power dissipation rating is the limit for the package; exceeding it will cause the junction temperature to exceed safe limits.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed in anti-static bags to protect from ESD. The packing hierarchy is as follows:
1. Reel/Bag: Minimum 200 to 500 pieces per anti-static bag.
2. Inner Carton: 6 bags per inner carton.
3. Master/Outside Carton: 10 inner cartons per master carton.

7.2 Label Explanation

Labels on the packaging contain several codes:
- CPN: Customer's Part Number.
- P/N: Manufacturer's Part Number (e.g., 383-2USOC/S530-A6).
- QTY: Quantity of pieces in the package.
- CAT: Ranks or bins for Luminous Intensity (Iv).
- HUE: Ranks or bins for Dominant Wavelength (λd).
- REF: Ranks or bins for Forward Voltage (Vf).
- LOT No: Traceable manufacturing lot number.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

This LED should be driven by a constant current source for stable brightness. A simple series resistor is common for low-current applications. The resistor value (R) is calculated as R = (Vsupply - Vf) / If. For example, with a 5V supply, a Vf of 2.0V, and a desired If of 20mA: R = (5 - 2.0) / 0.02 = 150 Ω. The resistor power rating should be at least (5-2.0)*0.02 = 0.06W, so a 1/8W or 1/4W resistor is sufficient. For applications requiring stable brightness over temperature or supply voltage variations, a dedicated LED driver IC is recommended.

8.2 Design Considerations

• Viewing Angle: The 6° narrow angle makes it suitable for panel indicators where light should be directed straight at the viewer, not for wide-area illumination.
• Current Limiting: Always use a current-limiting resistor or circuit. Connecting directly to a voltage source will cause excessive current flow, destroying the LED.
• PCB Layout: Ensure the PCB footprint matches the datasheet dimensions and polarity. Provide adequate copper area around the leads to act as a minor heatsink.
• ESD Protection: Implement ESD protection on input lines if the LED is user-accessible, and follow ESD-safe handling procedures during assembly.

9. Technology Introduction and Differentiation

9.1 AlGaInP Chip Technology

This LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. This material system is highly efficient for producing light in the amber, orange, red, and yellow-green spectrum. Compared to older technologies like GaAsP (Gallium Arsenide Phosphide), AlGaInP LEDs offer significantly higher brightness and efficiency for a given current, which is why this part can achieve 8000 mcd at only 20mA. The water-clear resin lens, as opposed to a diffused or tinted one, maximizes light extraction, contributing to the high luminous intensity.

9.2 Differentiation from Similar Products

The key differentiators of this specific LED are its very high luminous intensity (8000 mcd) at a standard 20mA drive current and its very narrow viewing angle (6°). Many standard 3mm orange LEDs may have intensities in the 100-1000 mcd range with wider angles (15-30°). This makes it a specialist component for applications where a highly visible, focused beam of orange light is required from a small source, such as a high-brightness status indicator on professional equipment or a precise optical sensor trigger.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 25mA continuously?
A1: Yes, 25mA is the Absolute Maximum Continuous Forward Current. For optimal longevity and to account for real-world thermal conditions, operating at or slightly below the typical test current of 20mA is recommended.

Q2: The luminous intensity is 8000 mcd typical. Why does my measurement differ?
A2: The datasheet specifies a ±10% measurement uncertainty. Furthermore, intensity is measured under specific conditions (20mA, 25°C) with the photodetector placed on-axis (0°). Any deviation in current, temperature, or measurement angle (especially critical with a 6° beam) will result in a different reading.

Q3: What do the CAT, HUE, and REF bins mean?
A3: Due to manufacturing variations, LEDs are sorted (binned) after production. CAT groups LEDs by similar luminous intensity (e.g., 7000-8000 mcd, 8000-9000 mcd). HUE groups by dominant wavelength (e.g., 613-617 nm). REF groups by forward voltage (e.g., 1.9-2.1V). For applications requiring color or brightness consistency, specifying or purchasing within a tight bin is important.

Q4: How do I interpret the 2000V ESD rating?
A4: A 2000V HBM (Human Body Model) rating is considered relatively robust for an LED but still requires basic ESD precautions. It means the device can typically withstand a 2000V discharge from a human model. Always handle on grounded surfaces, use wrist straps, and package in anti-static materials.