ELCS14G-NB2530J6J7293910-F3Y LED Datasheet - Package 2.5x3.0mm - Voltage 2.95-3.95V - Luminous Flux 220lm @1A - Warm White 2500-3000K - English Technical Document

1. Product Overview

The ELCS14G-NB2530J6J7293910-F3Y is a high-performance, surface-mount LED designed for applications requiring high luminous output and excellent efficiency in a compact form factor. This device utilizes InGaN chip technology to produce a warm white light with a correlated color temperature (CCT) range of 2500K to 3000K. Its primary design goals are to deliver high luminous flux while maintaining a small footprint, making it suitable for space-constrained designs. The core advantages of this LED include a typical luminous flux of 220 lumens at a drive current of 1000mA, resulting in a high optical efficiency of approximately 63.77 lumens per watt. The target markets are diverse, spanning consumer electronics, general lighting, and specialized illumination applications where reliability and performance are critical.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device is specified to operate within strict limits to ensure long-term reliability. The absolute maximum ratings define the boundaries beyond which permanent damage may occur. The DC forward current for continuous (torch mode) operation is rated at 350mA. For pulsed operation, a peak pulse current of 1000mA is allowed under a specific duty cycle (400ms on, 3600ms off, for 30000 cycles). The maximum junction temperature is 145°C, with an operating temperature range of -40°C to +85°C. The device can withstand a soldering temperature of 260°C for a maximum of two reflow cycles. It is important to note that these LEDs are not designed for reverse bias operation. The thermal resistance from junction to solder pad is specified as 8.5°C/W, which is a key parameter for thermal management design.

2.2 Electro-Optical Characteristics

The key performance parameters are measured under controlled conditions with a solder pad temperature (Ts) of 25°C. The primary characteristic is the luminous flux (Iv), which has a typical value of 220 lumens at an IF of 1000mA, with a minimum of 200 lm and a maximum of 300 lm as per the binning structure. The forward voltage (VF) at this current ranges from 2.95V (Min) to 3.95V (Max), with a typical value of 3.45V. The correlated color temperature is centered around 2750K, with a range from 2500K to 3000K. All electrical and optical data is tested using a 50ms pulse condition to minimize self-heating effects during measurement, ensuring the data represents the LED's performance before significant thermal rise.

3. Binning System Explanation

The product is grouped according to three key parameters: luminous flux, forward voltage, and chromaticity (color coordinates). This binning ensures consistency in application design.

3.1 Luminous Flux Binning

The luminous flux is binned under the code 'J6'. This bin specifies a luminous flux range from a minimum of 200 lm to a maximum of 300 lm when driven at 1000mA, with the typical value being 220 lm.

3.2 Forward Voltage Binning

The forward voltage is binned under the code '2939'. This bin defines a VF range from 2.95V to 3.95V at 1000mA, with a typical value of 3.45V.

3.3 Chromaticity Binning

The color is binned under the code '2530'. This refers to a specific region on the CIE 1931 chromaticity diagram that corresponds to a warm white color with a CCT between 2500K and 3000K. The bin structure is defined by specific (x, y) coordinate boundaries to ensure color consistency. The measurement allowance for color coordinates is ±0.01.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The relationship between forward voltage (VF) and forward current (IF) is non-linear, typical of diode behavior. The curve shows VF increasing with IF. Designers use this curve to estimate the voltage drop across the LED at different operating currents, which is crucial for driver circuit design and power dissipation calculations.

4.2 Relative Luminous Flux vs. Forward Current

This curve illustrates the light output relative to the drive current. Initially, luminous flux increases nearly linearly with current but may show signs of efficiency droop (a reduction in efficiency) at higher currents, often due to increased junction temperature and other semiconductor physics effects. This curve helps determine the optimal operating point for balancing brightness and efficiency.

4.3 CCT vs. Forward Current

The correlated color temperature can shift with drive current. This curve shows the variation of CCT over the operating current range. For this warm white LED, the CCT remains relatively stable across the current range, staying between approximately 2500K and 3000K, which is important for applications where consistent color appearance is required.

4.4 Relative Spectral Distribution

The spectral power distribution (SPD) graph shows the intensity of light emitted at each wavelength. For a white LED, this typically shows a broad blue peak from the InGaN chip and a broader yellow/red emission from the phosphor. The peak wavelength (λp) and the shape of the spectrum determine the color rendering properties of the light.

4.5 Typical Radiation Pattern

The polar radiation pattern indicates the spatial distribution of light. This device features a Lambertian emission pattern, where the luminous intensity is proportional to the cosine of the viewing angle. The viewing angle (2θ1/2), where intensity drops to half of the peak value, is specified as 120 degrees (±5° tolerance). This wide viewing angle is suitable for general illumination applications.

5. Mechanical and Package Information

The LED is housed in a compact surface-mount device (SMD) package. The package dimensions are 2.5mm in length and 3.0mm in width, as indicated by the '2530' in the part number. The detailed dimensioned drawing provides exact measurements for the LED body, solder pads (anode and cathode), and any mechanical features. The polarity is clearly marked on the package, typically with a cathode indicator. The solder pad design is crucial for both electrical connection and, more importantly, for heat dissipation. A proper footprint on the PCB ensures good solder joint reliability and optimal thermal transfer from the LED junction to the printed circuit board.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering

The device is rated for a maximum soldering temperature of 260°C and can withstand a maximum of two reflow cycles. It is critical to follow the recommended reflow profile to avoid thermal shock, which can cause package cracking or internal delamination. The peak temperature and time above liquidus must be controlled.

6.2 Storage and Handling

The LEDs are moisture-sensitive (MSL Level specified). The moisture-proof bag should not be opened until the components are ready for use. If the bag is opened or the specified floor life is exceeded, a baking pre-conditioning (e.g., 60±5°C for 24 hours) is required to remove absorbed moisture and prevent "popcorning" (package cracking) during reflow.

6.3 Thermal Management

Effective thermal management is paramount for maintaining performance and longevity. The LED should be mounted on a suitable metal-core PCB (MCPCB) or other substrate with good thermal conductivity. The thermal resistance of 8.5°C/W is from the junction to the solder pad; the total system thermal resistance to ambient must be managed to keep the junction temperature well below the maximum rating of 145°C, especially during continuous operation. Operating at maximum temperature for extended periods (exceeding 1 hour) should be avoided.

6.4 Electrical Protection

Although the device may have some ESD protection, it is not designed for reverse bias. An external series resistor or constant-current driver is essential to limit current and protect against voltage transients. Without current limiting, a small increase in voltage can cause a large, potentially destructive, increase in current.

7. Packaging and Ordering Information

The LEDs are supplied in moisture-resistant packing. They are typically delivered on embossed carrier tapes, which are then wound onto reels. A standard reel contains 3000 pieces, with a minimum order quantity of 1000 pieces. The product labeling on the reel includes critical information: the part number (P/N), lot number (LOT NO), packing quantity (QTY), and the specific bin codes for luminous flux (CAT), color (HUE), and forward voltage (REF). The MSL level is also indicated (MSL-X). The carrier tape and reel dimensions are provided to facilitate automated pick-and-place machine setup.

8. Application Suggestions

8.1 Typical Application Scenarios

• Mobile Device Camera Flash: The high pulsed current capability (1000mA) and high luminous output make it suitable for camera flash/strobe applications in smartphones and digital cameras.
• Torch and Portable Lighting: Used in digital video cameras, handheld torches, and other portable lighting devices.
• General and Decorative Lighting: Ideal for indoor lighting, accent lighting, step lights, exit signs, and other architectural or decorative applications benefiting from warm white light.
• TFT Backlighting: Can be used as a high-brightness backlight source for small to medium displays.
• Automotive Lighting: Suitable for both interior (ambient lighting, reading lights) and exterior (auxiliary lighting) automotive applications, subject to meeting relevant automotive standards.

8.2 Design Considerations

• Driver Selection: Use a constant-current driver appropriate for the desired operating current (up to 350mA DC or 1000mA pulsed). Ensure the driver's compliance voltage exceeds the LED's maximum VF.
• PCB Layout: Design the PCB with adequate copper area or thermal vias under the LED pads to act as a heat sink. This is critical for dissipating the several watts of heat generated (Power ≈ VF * IF).
• Optical Design: The Lambertian 120-degree viewing angle may require secondary optics (lenses, reflectors) to achieve desired beam patterns for specific applications like flash or spotlighting.
• Color Consistency: For applications requiring tight color matching, use LEDs from the same production lot or specify tight binning requirements.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this device offers significantly higher luminous flux for its package size (2.5x3.0mm). Its typical efficiency of ~64 lm/W at 1A is competitive. The key differentiators are its combination of high flux output, warm white color temperature in a compact SMD package, and robust specification for pulsed operation. It fills a niche between smaller, lower-power LEDs and larger, higher-power COB (Chip-on-Board) LEDs. The defined binning structure for flux, voltage, and color provides designers with predictable performance, reducing the need for extensive system calibration.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between DC forward current (350mA) and peak pulse current (1000mA)?
A: The DC forward current (350mA) is the maximum current that can be applied continuously without risking damage. The peak pulse current (1000mA) is a much higher current that can only be applied for very short durations (400ms in this case) with a long off time (3600ms) to allow the junction to cool. This is typical for camera flash applications.

Q: How do I interpret the luminous flux bin 'J6' (200-300 lm)?
A: This means any LED labeled with bin J6 will have a measured luminous flux between 200 and 300 lumens when tested at 1000mA. The typical value is 220 lm. For design, using the minimum value (200 lm) is conservative for ensuring minimum light output.

Q: Why is thermal management so emphasized?
A> LED performance degrades with increasing junction temperature. Luminous output decreases, forward voltage shifts, and color can change. More critically, operating at high temperatures drastically reduces the LED's lifetime. The 8.5°C/W thermal resistance is the path from the semiconductor junction to your solder pad; you must design the rest of the path (PCB, heatsink) to keep the junction cool.

Q: Can I drive this LED directly from a 3.3V or 5V supply?
A: No. LEDs are current-driven devices. Connecting it directly to a voltage source will cause an uncontrolled current to flow, likely exceeding the maximum ratings and destroying the LED instantly. You must use a current-limiting mechanism, such as a constant-current driver or a series resistor calculated based on the supply voltage and the LED's VF.

11. Practical Use Case Examples

Case 1: Smartphone Camera Flash Module: A designer is creating a dual-LED flash for a smartphone. They use two of these LEDs driven in parallel by a dedicated flash driver IC. The driver provides the 1000mA pulsed current for a duration controlled by the camera software. The compact size allows them to fit the module next to the camera lens. They design a small metal slug on the flex PCB under the LEDs to manage the heat generated during a flash sequence.

Case 2: Architectural Step Lighting: For illuminating stair treads in a commercial building, an engineer designs a low-profile aluminum extrusion with a channel. Multiple LEDs are spaced along the channel, driven by a constant-current LED driver at 300mA (below the DC max) for continuous operation. The warm white light (2750K) provides good visibility and ambiance. The aluminum extrusion acts as both a housing and a heatsink, ensuring long-term reliability.

12. Operating Principle Introduction

This LED is a solid-state light source based on semiconductor physics. It uses an Indium Gallium Nitride (InGaN) chip that emits blue light when electrons and holes recombine across the chip's bandgap upon application of a forward voltage (electroluminescence). This blue light is then partially converted to longer wavelengths (yellow, red) by a layer of phosphor material deposited on or near the chip. The mixture of the remaining blue light and the phosphor-converted light results in the perception of white light. The specific ratios of the phosphor composition determine the correlated color temperature (CCT) and color rendering index (CRI) of the emitted white light.

13. Technology Trends

The general trend in LED technology is towards higher efficacy (more lumens per watt), improved color quality (higher CRI and more precise color consistency), and increased power density (more light from smaller packages). There is also a strong drive for improved reliability and longer lifetimes under higher operating temperatures. In packaging, advancements aim to improve light extraction efficiency and thermal management within the package itself. For white LEDs, phosphor technology continues to evolve to provide more stable performance over temperature and time, and to enable a wider range of color temperatures and spectral qualities. The device described in this datasheet represents a mature point in these ongoing trends, offering a balance of performance, size, and cost for its target applications.