EHP-C04 LED Datasheet - High Power White LED - 160lm @ 1000mA - 5700K CCT - 2.04x1.64mm Package - English Technical Document

1. Product Overview

The EHP-C04/NT01A-P01/TR is a high-power, surface-mount white LED designed for demanding illumination applications. It utilizes InGaN chip technology to produce white light, offering a balance of high luminous output and compact form factor. This device is classified for mass production, indicating its maturity and reliability for volume manufacturing.

The core value proposition of this LED lies in its combination of high efficiency within a small package. It is engineered for applications where space is constrained but high light output is required. The device incorporates built-in Electrostatic Discharge (ESD) protection, enhancing its robustness during handling and assembly processes.

1.1 Key Features and Applications

The LED boasts several key features that define its performance envelope. It delivers a typical luminous flux of 160 lumens when driven at a forward current of 1000mA. The typical correlated color temperature (CCT) at this drive current is 5700 Kelvin, placing it in the \"cool white\" spectrum. Its optical efficiency is rated at 45 lumens per watt under the same conditions.

From a reliability standpoint, it offers ESD protection up to 8KV (Human Body Model) and is rated for Moisture Sensitivity Level (MSL) Class 1, meaning it has an unlimited floor life at conditions ≤30°C/85% RH and requires no baking before reflow soldering under standard conditions. The device is also compliant with RoHS and is lead-free.

The primary grouping parameters for production are total luminous flux and color coordinates, ensuring consistency in optical performance.

Target Applications:

• Mobile Device Camera Flash: The primary application is as a camera flash or strobe light for mobile phones and other portable devices, requiring high instantaneous light output.
• Digital Video (DV) Torch Light: Used for constant illumination in video recording applications.
• General Lighting: Suitable for various indoor lighting fixtures.
• Architectural and Safety Lighting: Can be used in orientation marker lights for steps, exit ways, and other signage.
• TFT Backlighting: Provides illumination for display panels.
• Automotive Lighting: Applicable for both exterior and interior automotive illumination, subject to meeting specific automotive-grade qualifications.
• Decorative and Entertainment Lighting: Used in accent lighting and effects.

2. Absolute Maximum Ratings and Thermal Characteristics

Understanding the absolute maximum ratings is crucial for ensuring reliable operation and preventing permanent damage to the LED. All ratings are specified at a solder pad temperature (T_{solder pad}) of 25°C.

2.1 Electrical and Thermal Limits

DC Forward Current (I_F): The maximum continuous DC current is 350 mA. Exceeding this limit risks overheating and accelerated degradation.

Peak Pulse Current (I_pulse): For pulsed operation, a peak current of 1500 mA is allowed under specific conditions: a pulse width of 400ms ON and 3600ms OFF. For shorter pulses, the datasheet specifies that the peak pulse current shall be applied with a maximum duration of 50ms and a maximum duty cycle of 10%. This is particularly relevant for flash applications.

Power Dissipation (P_d): In pulse mode, the maximum allowable power dissipation is 6.5 Watts. This rating is closely tied to thermal management.

Junction Temperature (T_J): The maximum allowable temperature at the semiconductor junction is 125°C. The device's lifetime and performance degrade significantly as this temperature is approached or exceeded.

Thermal Resistance (R_θ): The thermal resistance from the junction to the lead is specified as 10 °C/W. This parameter is vital for calculating the temperature rise of the junction based on the power dissipated (P_d = V_F * I_F). Effective heat sinking is required to maintain T_J within safe limits, especially at higher currents.

Operating and Storage Temperature: The device can operate in ambient temperatures from -40°C to +85°C and can be stored in temperatures from -40°C to +110°C.

Soldering: The LED can withstand a maximum soldering temperature of 260°C and is rated for a maximum of 2 reflow cycles, which is standard for SMD components.

2.2 Critical Design Notes

The datasheet includes several important warnings:

• The LED is not designed for reverse bias operation.
• Avoid operating the LED at its maximum operating temperature for periods exceeding one hour to ensure long-term reliability.
• All specifications are assured by a 1000-hour reliability test, with forward voltage degradation guaranteed to be less than 30%.
• Reliability testing at 1500mA was conducted with good thermal management using a 1.0cm x 1.0cm Metal Core PCB (MCPCB). Testing at 1000mA used a 1.0cm x 1.0cm FR4 PCB.
• Operating the LED continuously at maximum ratings will cause permanent damage. Applying multiple maximum rating parameters simultaneously is not allowed.

3. Electro-Optical Characteristics

These characteristics define the expected performance of the LED under normal operating conditions, measured at T_{solder pad} = 25°C and typically under a 50ms pulse condition to minimize self-heating effects.

3.1 Key Performance Parameters

Luminous Flux (Ф_v): The light output. The minimum is 140 lm, typical is 160 lm, with no maximum specified in the summary table. The measurement tolerance is ±10%.

Forward Voltage (V_F): The voltage drop across the LED at a specified current. At I_F=1000mA, V_F has a minimum of 2.95V and a maximum of 4.35V, with a measurement tolerance of ±0.1V. The typical value is not stated in the main table but is defined within bin ranges.

Correlated Color Temperature (CCT): Ranges from 4500K to 7000K, with a typical value of 5700K at 1000mA.

Viewing Angle (2θ_1/2): The full angle at which luminous intensity is half the peak value is 120 degrees, with a tolerance of ±5 degrees. The radiation pattern is Lambertian, meaning the intensity falls off with the cosine of the viewing angle.

4. Binning System Explanation

To manage production variances and allow designers to select LEDs with consistent performance, the devices are sorted into bins based on key parameters.

4.1 Forward Voltage (V_F) Binning

LEDs are categorized into five voltage bins at I_F=1000mA:

- Bin 2932: 2.95V to 3.25V

- Bin 3235: 3.25V to 3.55V

- Bin 3538: 3.55V to 3.85V

- Bin 3841: 3.85V to 4.15V

- Bin 4143: 4.15V to 4.35V

This allows for better current matching when multiple LEDs are used in series or for predicting power supply requirements.

4.2 Luminous Flux Binning

Light output is binned into three categories at I_F=1000mA:

- Bin J3: 140 lm to 160 lm

- Bin J4: 160 lm to 180 lm

- Bin J5: 180 lm to 200 lm

This helps in achieving uniform brightness in an array or application.

4.3 Color (White) Binning

The chromaticity coordinates (CIE x, y) are grouped into three primary bins defined by their target CCT and a quadrilateral area on the chromaticity diagram:

1. Color Bin (1) - 4550K: Targets 4500K-5000K. Defined by coordinates (0.3738, 0.4378), (0.3524, 0.4061), (0.3440, 0.3420), (0.3620, 0.3720).

2. Color Bin (2) - 5057K: Targets 5000K-5700K. Defined by coordinates (0.3300, 0.3200), (0.3300, 0.3730), (0.3440, 0.3420), (0.3524, 0.4061).

3. Color Bin (3) - 5770K: Targets 5700K-7000K. Defined by coordinates (0.3030, 0.3330), (0.3300, 0.3730), (0.3300, 0.3200), (0.3110, 0.2920).

The color coordinate measurement allowance is ±0.01. Bins are defined at I_F = 1000mA under 50ms pulse operation.

5. Performance Curve Analysis

The datasheet provides several graphs illustrating performance trends, all tested under superior thermal management with a 1.0x1.0 cm² MCPCB.

5.1 Spectral Distribution

The Relative Spectral Distribution curve shows a broad emission spectrum characteristic of a phosphor-converted white LED, with a peak in the blue region (from the InGaN chip) and a broader peak in the yellow-green region (from the phosphor). This combination produces white light.

5.2 Forward Voltage vs. Current

This curve shows the non-linear relationship between forward voltage (V_F) and forward current (I_F). V_F increases with I_F, but the rate of increase is not linear. This graph is essential for driver design, especially for constant-current drivers.

5.3 Luminous Flux vs. Current

The Relative Luminous Flux curve demonstrates that light output increases super-linearly with current at lower currents but tends to become more linear or even sub-linear at very high currents due to efficiency droop and thermal effects. This highlights the importance of thermal management to maintain efficiency.

5.4 Color Temperature vs. Current

The Correlated Color Temperature (CCT) vs. Forward Current graph shows how the color temperature shifts with drive current. Typically, CCT may increase (light becomes cooler) with higher current due to changes in phosphor conversion efficiency relative to the blue die emission.

5.5 Forward Current Derating Curve

This is one of the most critical graphs for reliable design. It shows the maximum allowable forward current as a function of the solder pad temperature. As the pad temperature rises, the maximum safe current decreases significantly. For example, at a solder pad temperature of 100°C, the maximum allowable continuous current is derated to approximately 100mA to keep the junction temperature below 125°C. This curve mandates effective heat sinking for high-current operation.

6. Mechanical and Package Information

6.1 Package Dimensions

The LED comes in a compact surface-mount package. Key dimensions from the drawing include:

- Overall package size: Approximately 2.04 mm in length and 1.64 mm in width.

- Chip position and optical center are indicated.

- Anode and cathode pads are clearly marked for polarity identification.

- Dimensions are in millimeters, with standard tolerances of ±0.1mm unless otherwise noted.

The top view shows the anode and cathode pads, which are crucial for correct PCB layout and soldering. The optical center is offset from the geometric center, which may be important for precise optical design in applications like camera flashes.

7. Soldering, Assembly, and Handling Guidelines

7.1 Moisture Sensitivity and Reflow

As an MSL Level 1 device, it has an unlimited floor life at ≤30°C/85% RH. Standard soak conditions for reflow are 168 hours (+5/-0) at 85°C/85% RH if required by other components on the board. The device can withstand a peak soldering temperature of 260°C for a standard reflow profile and is rated for a maximum of 2 reflow cycles.

7.2 Storage and Handling

Storage should be within the specified temperature range of -40°C to +110°C. Despite the 8KV ESD protection, standard ESD precautions should still be observed during handling to prevent potential latent damage.

8. Packaging and Ordering Information

8.1 Label Explanation

The packing label includes several codes essential for traceability and selection:

- CPN: Customer's Product Number.

- P/N: Manufacturer's Product Number (e.g., EHP-C04/NT01A-P01/TR).

- LOT NO: Manufacturing Lot Number for traceability.

- QTY: Quantity of devices in the package.

- CAT: Luminous Flux (Brightness) Bin code (e.g., J3, J4, J5).

- HUE: Color Bin code (e.g., 1, 2, 3).

- REF: Forward Voltage Bin code (e.g., 2932, 3235).

- MSL-X: Moisture Sensitivity Level.

9. Application Design Considerations

9.1 Thermal Management

This is the single most critical factor for reliable operation and performance. The derating curve clearly shows the necessity of keeping the solder pad temperature low. Designers must:

1. Use a PCB with adequate thermal conductivity (e.g., MCPCB for high-current applications like flash, as used in reliability testing).

2. Ensure a low thermal resistance path from the LED pad to the heat sink or environment.

3. Consider the operating ambient temperature.

4. For pulsed operation (like camera flash), the thermal mass of the system and the duty cycle will determine the average temperature rise.

9.2 Electrical Drive

The LED must be driven by a constant current source, not a constant voltage source, to ensure stable light output and prevent thermal runaway. The driver should be designed to:

- Provide the required current (e.g., 1000mA for full brightness).

- Accommodate the forward voltage bin range (2.95V to 4.35V) to ensure proper current regulation across all units.

- For flash applications, provide the high peak current (up to 1500mA under specified pulse conditions) with appropriate control of pulse width and duty cycle.

9.3 Optical Integration

The Lambertian radiation pattern and 120-degree viewing angle make it suitable for applications requiring wide illumination. For focused beams (e.g., torch), secondary optics (lenses or reflectors) will be required. The offset of the optical center from the package's geometric center must be accounted for in precise optical alignments.

10. Comparison and Selection Guidance

When selecting this LED, compare its key parameters against application requirements:

- Luminous Flux & Efficiency: 160 lm @ 1A and 45 lm/W are competitive for its package size and era of the datasheet. Newer LEDs may offer higher efficacy.

- Color Temperature: The 5700K typical CCT is a standard cool white. The availability of bins from 4500K to 7000K offers flexibility.

- Package Size: The 2.04x1.64mm footprint is compact, suitable for space-constrained designs like mobile phones.

- Drive Current: Its performance is characterized at 1000mA, which is a common drive current for high-power flash LEDs. The ability to handle 1500mA pulses is a key advantage for flash applications over LEDs rated only for lower currents.

- Thermal Performance: The 10 °C/W junction-to-lead thermal resistance necessitates careful thermal design. Compare this value with alternatives; a lower number indicates a package better at transferring heat.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V power supply?

A: It depends on the forward voltage bin of your specific LED and the desired current. For a 1000mA drive, the V_F ranges from 2.95V to 4.35V. A 3.3V supply would only be sufficient for LEDs in the lower V_F bins (e.g., 2932) and would require a very low-dropout constant current driver. A higher voltage supply (e.g., 5V) with a current regulator is more reliable.

Q: How do I achieve the rated 160 lumens in my application?

A: You must drive the LED at 1000mA DC or equivalent pulsed current while maintaining the solder pad temperature at or near 25°C. In a real application with higher ambient temperature and limited heat sinking, the light output will be lower due to thermal derating and efficiency droop.

Q: What is the difference between the 1000mA and 1500mA test conditions?

A: The 1000mA condition is used for characterizing typical performance (flux, V_F, CCT). The 1500mA rating is for short-duration pulses (max 50ms, 10% duty cycle), which is typical for camera flash operation. Reliability tests were performed differently: 1500mA tests used an MCPCB for better cooling, while 1000mA tests used FR4.

Q: Why is the viewing angle tolerance ±5 degrees?

A> This tolerance accounts for minor variations in the chip placement, phosphor coating, and lens geometry during manufacturing, which can slightly alter the radiation pattern.

12. Design and Use Case Examples

12.1 Mobile Phone Camera Flash

Scenario: Designing a single-LED flash for a smartphone camera.

Implementation:

1. Drive Circuit: Use a dedicated LED flash driver IC capable of delivering 1500mA pulses with tight control over pulse width (e.g., 400ms max for still photo assist light). The driver should have a high-voltage boost converter to generate sufficient voltage (e.g., >5V) to cover the highest V_F bin.

2. Thermal Management: The LED should be mounted on a dedicated thermal pad on the PCB, connected to internal ground planes or a metal mid-frame for heat spreading. The flash duty cycle must be limited by software to prevent overheating.

3. Optics: A plastic lens or light guide is placed over the LED to diffuse the light and reduce hotspots, matching the offset optical center to the lens axis.

12.2 Portable Video Light

Scenario: A constant-on torch light for a digital video camera.

Implementation:

1. Drive Circuit: A constant-current driver set to 350mA (the max DC rating) or lower to prioritize efficiency and longevity. A simple linear regulator or switching converter can be used.

2. Thermal Management: A small aluminum heatsink is attached to the PCB area behind the LED. The housing must allow for some air circulation.

3. Optics: A shallow reflector or frosted lens creates a wide, even flood beam suitable for video illumination.

13. Technical Principles

The EHP-C04 is a phosphor-converted white LED. The fundamental principle involves a semiconductor chip made of Indium Gallium Nitride (InGaN) that emits blue light when electrical current passes through it (electroluminescence). This blue light is partially absorbed by a layer of cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor coating the chip. The phosphor down-converts some of the blue photons to longer wavelengths, primarily in the yellow region. The mixture of the remaining blue light and the emitted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow emission, controlled by the phosphor composition and thickness, determines the Correlated Color Temperature (CCT). The compact package integrates the die, phosphor, and a primary silicone lens that shapes the initial radiation pattern.

14. Industry Context and Trends

This datasheet, with a release date of 2015, represents a mature generation of high-power white LEDs. At the time, an efficacy of 45 lm/W at 1A drive current was competitive for its package class. Key industry trends since then that designers should consider when evaluating this part for new designs include:

- Increased Efficacy: Modern high-power white LEDs can exceed 150-200 lm/W, significantly reducing power consumption and thermal load for the same light output.

- Improved Color Quality: Newer LEDs often offer higher Color Rendering Index (CRI) values and more consistent color point control across bins.

- Advanced Packaging: Trends include chip-scale packages (CSP) with no lead frame, which can offer better thermal performance and smaller size. Also, packages designed for higher current density and better light extraction.

- Integrated Solutions: For applications like camera flash, LEDs are increasingly integrated with drivers, sensors, and optics into complete modules.

- Reliability and Lifetime: While this LED guarantees less than 30% lumen depreciation after 1000 hours, newer products often quote L70 or L90 lifetimes (time to 70% or 90% of initial light output) of tens of thousands of hours under specific conditions.

When selecting components, engineers must weigh the proven reliability and cost of established parts like the EHP-C04 against the performance benefits of newer generations, considering the specific requirements and lifecycle of their product.