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8-Pin DIP High Speed 1Mbit/s Transistor Photocoupler 6N135 6N136 EL450x Series Datasheet - Package DIP-8 - Isolation 5000Vrms - English Technical Document

Complete technical datasheet for the 8-pin DIP high-speed 1Mbit/s transistor photocoupler series (6N135, 6N136, EL4502, EL4503). Includes features, absolute maximum ratings, electrical characteristics, switching parameters, pin configurations, and application information.
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PDF Document Cover - 8-Pin DIP High Speed 1Mbit/s Transistor Photocoupler 6N135 6N136 EL450x Series Datasheet - Package DIP-8 - Isolation 5000Vrms - English Technical Document

1. Product Overview

The 6N135, 6N136, EL4502, and EL4503 are a family of high-speed transistor output photocouplers (optoisolators) designed for applications requiring fast digital signal isolation. Each device integrates an infrared light-emitting diode (LED) optically coupled to a high-speed photodetector transistor. The core advantage of this series lies in its dedicated pinout, which separates the photodiode bias and the output transistor's collector. This architectural choice significantly reduces the base-collector capacitance of the input transistor, enabling switching speeds up to 1 Megabit per second (1Mbit/s), which is orders of magnitude faster than conventional phototransistor-based couplers.

The devices are offered in a standard 8-pin Dual In-line Package (DIP) and are available with options for wide lead spacing and surface-mount configurations. They are characterized for operation over a wide temperature range and are compliant with major international safety standards, making them suitable for industrial, telecommunications, and power electronics applications.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. Operating the device continuously at or near these limits is not recommended. Key ratings include:

2.2 Electrical and Transfer Characteristics

These parameters are guaranteed over the operating temperature range of 0°C to 70°C unless otherwise noted. They define the device's performance under normal operating conditions.

3. Switching Characteristics

These parameters quantify the device's speed, which is its primary differentiator. Tests are performed at IF=16mA and VCC=5V.

4. Mechanical and Package Information

4.1 Pin Configuration

The devices use an 8-pin DIP package. The pinout differs slightly between the 6N135/6N136 and the EL4502/EL4503, primarily in the function of pin 7.

For 6N135 / 6N136:

  1. No Connection (NC)
  2. Anode (Input LED Anode)
  3. Cathode (Input LED Cathode)
  4. No Connection (NC)
  5. Ground (Output side ground, GND)
  6. Output Voltage (VOUT)
  7. Bias Voltage (VB) - This pin provides a separate connection to bias the internal photodiode, which is key to achieving high speed.
  8. Supply Voltage (VCC)

For EL4502 / EL4503:

  1. No Connection (NC)
  2. Anode (Input LED Anode)
  3. Cathode (Input LED Cathode)
  4. No Connection (NC)
  5. Ground (Output side ground, GND)
  6. Output Voltage (VOUT)
  7. No Connection (NC) - Note: Pin 7 is not connected in these variants.
  8. Supply Voltage (VCC)

5. Application Suggestions

5.1 Typical Application Scenarios

5.2 Design Considerations

6. Technical Comparison and Selection Guide

The primary differences within this series are in the Current Transfer Ratio (CTR) and the Common Mode Rejection (CMR).

7. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the main advantage of this photocoupler over a standard 4N35?
A: Speed. The dedicated bias pin (VB on 6N135/136) architecture reduces internal capacitance, enabling operation at 1Mbit/s, whereas a standard phototransistor coupler like the 4N35 is typically limited to below 100 kbit/s.

Q: Can I use a single 5V supply for both the input and output sides?
A: Electrically, yes, but this defeats the purpose of isolation. For true isolation, the input side (LED) and output side (detector, VCC, GND) must be powered from separate, non-connected power supplies or from an isolated DC-DC converter.

Q: Why are there two different recommended pull-up resistor values (4.1kΩ vs. 1.9kΩ)?
A: The different CTR specifications of the devices lead to different optimal operating points. The 6N135, with lower CTR, uses a higher pull-up resistor to limit the output current for a given output low voltage specification, while still achieving the target speed. The 6N136/EL450x, with higher CTR, can use a lower resistor value, which can further improve switching speed.

Q: What does "Pb free and RoHS compliant" mean for my assembly process?
A: It means the device is manufactured without lead (Pb) and complies with the Restriction of Hazardous Substances directive. This allows it to be used in products sold in regions with these environmental regulations. The soldering temperature rating (260°C for 10 seconds) is specified for lead-free solder processes.

8. Principle Introduction

A transistor output photocoupler operates on the principle of optical isolation. An electrical current applied to the input side causes an infrared Light Emitting Diode (LED) to emit light. This light travels across a small gap within the package and strikes the base region of a phototransistor on the output side. The incoming photons generate electron-hole pairs in the base, effectively acting as a base current. This "optical base current" turns the transistor on, allowing a much larger collector current to flow from VCC to the output pin, pulled low through the transistor. When the input current is zero, the LED is off, no light hits the transistor, and it remains in the off state, allowing the output pin to be pulled high by the external resistor. The key to high speed in this series is the separate connection for the internal photodiode that feeds the transistor's base, which minimizes the Miller capacitance that normally slows down phototransistors.

9. Packaging and Ordering Information

The devices follow a specific part numbering scheme: 6N13XY(Z)-V or EL450XY(Z)-V.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.