LED Lamp 1313-2SYGD/S530-E2 Specification - 1.3x1.3x1.5mm - 2.0V - 40mW - Brilliant Yellow Green - English Technical Document

1. Product Overview

The 1313 series LED lamp is a through-hole component designed for applications requiring higher brightness levels. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip to produce a Brilliant Yellow Green light output. The device is encapsulated in a green diffused resin package, which helps in achieving a uniform light distribution. This series is characterized by its reliability, robustness, and compliance with modern environmental standards, making it suitable for a variety of consumer electronics.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its choice of viewing angles, availability on tape and reel for automated assembly, and its construction using lead-free (Pb-free) materials. It is compliant with the EU's RoHS (Restriction of Hazardous Substances) directive, REACH regulation, and is classified as Halogen-Free, with Bromine (Br) and Chlorine (Cl) content kept below specified limits (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). These features make it an ideal choice for manufacturers targeting global markets with strict environmental regulations.

The target applications are primarily within the consumer electronics sector, including use as indicator lights or backlighting in television sets, computer monitors, telephones, and general computer peripherals. Its specifications balance performance with cost-effectiveness for these high-volume applications.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed, objective analysis of the key technical parameters specified in the datasheet. Understanding these limits and typical values is crucial for reliable circuit design and ensuring long-term LED performance.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (IF): 25 mA. Exceeding this current continuously will generate excessive heat, degrading the LED's internal structure and luminous output over time, potentially leading to catastrophic failure.
• Peak Forward Current (IFP): 60 mA (at 1/10 duty cycle, 1 kHz). This rating allows for short pulses of higher current, useful for multiplexing or achieving momentary higher brightness, but the average power must remain within the continuous rating.
• Reverse Voltage (VR): 5 V. Applying a reverse bias voltage greater than this can cause a sudden increase in reverse current, damaging the LED's PN junction. Proper circuit design should include protection against reverse voltage spikes.
• Power Dissipation (Pd): 60 mW. This is the maximum amount of power the LED package can dissipate as heat at an ambient temperature (Ta) of 25°C. The actual permissible dissipation decreases as ambient temperature rises.
• Operating & Storage Temperature: -40°C to +85°C / -40°C to +100°C. These ranges define the environmental conditions the device can withstand during use and non-operational storage, respectively.
• Soldering Temperature (Tsol): 260°C for 5 seconds. This specifies the maximum thermal profile the LED leads can endure during wave or hand soldering without damaging the internal wire bonds or epoxy resin.

2.2 Electro-Optical Characteristics

These characteristics are measured under standard test conditions (Ta=25°C, IF=20mA unless noted) and represent the device's typical performance.

• Luminous Intensity (Iv): 63 mcd (Min), 125 mcd (Typ). This is the perceived brightness of the LED as measured in millicandelas. The wide range between min and typ indicates natural variation in the manufacturing process. Designers should use the minimum value for worst-case brightness planning.
• Viewing Angle (2θ1/2): 40° (Typ). This is the full angle at which the luminous intensity drops to half of its maximum value (on-axis). A 40° angle indicates a moderately wide beam, suitable for general indicator purposes where visibility from various angles is needed.
• Peak & Dominant Wavelength (λp / λd): ~575 nm / ~573 nm. Peak wavelength is the spectral point of maximum radiant power. Dominant wavelength is the single wavelength perceived by the human eye, which for this LED is in the yellow-green region of the spectrum.
• Forward Voltage (VF): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at 20mA. This is the voltage drop across the LED when operating. A current-limiting resistor is mandatory in series with the LED to set the operating point and prevent thermal runaway, as the VF has a negative temperature coefficient.
• Reverse Current (IR): 10 μA (Max) at VR=5V. This is the small leakage current that flows when the LED is reverse-biased within its maximum rating.

The datasheet also notes measurement uncertainties: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be considered in precision applications.

3. Performance Curve Analysis

The typical characteristic curves provide valuable insight into how the LED behaves under varying conditions, beyond the single-point data in the tables.

3.1 Spectral Distribution and Directivity

The Relative Intensity vs. Wavelength curve shows a relatively narrow spectral bandwidth (Δλ typ. 20 nm), centered around 575 nm, which is characteristic of AlGaInP materials. This results in a saturated yellow-green color. The Directivity curve visually represents the 40° viewing angle, showing how light intensity decreases as the observation angle moves away from the central axis.

3.2 Electrical and Thermal Relationships

The Forward Current vs. Forward Voltage (I-V Curve) is non-linear. A small increase in voltage beyond the "knee" voltage (around 1.8V-2.0V) causes a large increase in current. This underscores the importance of current-driven, not voltage-driven, operation.

The Relative Intensity vs. Forward Current curve is generally linear within the operating range, meaning brightness is approximately proportional to current. However, efficiency may drop at very high currents due to increased heat.

The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are critical for thermal management. Luminous output decreases as ambient temperature increases (thermal quenching). Simultaneously, for a fixed voltage, the forward current would increase with temperature due to the decreasing VF. This combination can lead to thermal runaway if not properly managed with a constant current source or sufficient series resistance.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED follows a standard 1313 (1.3mm x 1.3mm) radial through-hole package outline. Key dimensional notes include:

• Overall body dimensions are approximately 1.3mm x 1.3mm.
• The height of the flange (the flat base around the leads) must be less than 1.5mm to ensure proper seating on a PCB.
• The standard tolerance for dimensions is ±0.25mm unless otherwise specified on the drawing.
• The leads are designed to be formed and cut according to specific guidelines to avoid stress on the epoxy bulb.

4.2 Polarity Identification and Lead Forming

The cathode is typically identified by a flat spot on the LED lens or a shorter lead (though the specific marking should be verified on the dimensional drawing). The datasheet provides strict guidelines for lead forming: bending must occur at least 3mm from the base of the epoxy bulb, must be done before soldering, and must avoid stressing the package. Misalignment during PCB mounting can induce stress and degrade reliability.

5. Soldering and Assembly Guidelines

Proper handling is essential to maintain the LED's specified performance and longevity.

5.1 Recommended Soldering Conditions

• Hand Soldering: Iron tip temperature maximum 300°C (for a 30W max iron), soldering time maximum 3 seconds per lead. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
• Wave/Dip Soldering: Preheat temperature maximum 100°C for up to 60 seconds. Solder bath temperature maximum 260°C for a maximum immersion time of 5 seconds. Again, maintain the 3mm distance rule.

A recommended soldering profile graph would typically show a gradual ramp-up, a stable peak temperature zone, and a controlled cool-down phase to minimize thermal shock.

5.2 Storage and Cleaning

• Storage: LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The shelf life after shipping is 3 months. For longer storage (up to 1 year), a sealed container with nitrogen and desiccant is recommended.
• Cleaning: If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Ultrasonic cleaning is strongly discouraged as it can damage the internal structure through cavitation; if absolutely required, extensive pre-qualification is necessary.

5.3 Heat Management Consideration

The datasheet explicitly states that heat management must be considered during the application design stage. As ambient temperature rises or if the LED is operated in a confined space, the forward current should be de-rated (reduced) to keep the junction temperature within safe limits and prevent accelerated lumen depreciation or failure. Adequate PCB copper area or other heat sinking methods for the leads can improve thermal performance.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage during transport and storage.

• Primary packaging: Anti-electrostatic bags.
• Secondary packaging: Inner cartons containing 5 bags.
• Tertiary packaging: Outside cartons containing 10 inner cartons.
• Packing Quantity: Minimum 200 to 500 pieces per bag. Therefore, one outside carton contains between 10,000 and 25,000 pieces (10 inner cartons * 5 bags * 200-500 pcs).

6.2 Label Explanation

Labels on the packaging contain several codes for traceability and identification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 1313-2SYGD/S530-E2).
• QTY: Quantity of pieces in the package.
• CAT/HUE/REF: Codes for performance ranking (Binning), indicating the specific Dominant Wavelength (HUE) and Forward Voltage (REF) of the LEDs in that batch.
• LOT No: Manufacturing Lot Number for quality control traceability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

For operation from a standard voltage rail (e.g., 5V or 3.3V), a series current-limiting resistor is mandatory. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - VF_LED) / I_desired. For example, to drive the LED at 20mA from a 5V supply with a typical VF of 2.0V: R = (5V - 2.0V) / 0.020A = 150 Ω. A resistor with a power rating of at least I²R = (0.02)² * 150 = 0.06W (a standard 1/8W or 1/4W resistor is sufficient) should be used.

7.2 Design Considerations

• Current Driving: Always design for constant current operation, not constant voltage, to ensure stable brightness and prevent thermal runaway.
• PCB Layout: Ensure holes are correctly aligned to avoid lead stress. For indicators viewed directly, consider the viewing angle when positioning the LED on the board.
• ESD Protection: While the LED may have some inherent ESD robustness, handling according to ESD-safe practices is recommended, especially in dry environments.
• Thermal Environment: Avoid placing the LED near other heat-generating components. Consider the effects of the end-product's enclosure on ambient temperature around the LED.

8. Technical Comparison and Differentiation

Compared to older T-1 (3mm) or T-1 3/4 (5mm) LED packages, the 1313 surface offers a smaller footprint, allowing for higher density on PCBs. Its AlGaInP technology provides higher efficiency and brighter output in the yellow-green to red spectrum compared to older technologies like GaAsP. The specific combination of a 40° viewing angle, high typical brightness (125 mcd @ 20mA), and full environmental compliance (RoHS, REACH, Halogen-Free) positions this part as a modern, reliable choice for cost-sensitive, high-volume consumer applications where regulatory adherence is critical.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive this LED at 30mA for more brightness?

No. The Absolute Maximum Rating for continuous forward current is 25 mA. Operating at 30 mA exceeds this rating, which will generate excessive heat, significantly reduce the LED's lifespan, and likely cause premature failure. For higher brightness, select an LED model rated for a higher current.

9.2 Why is the forward voltage specified with a min/typ/max range?

Forward voltage varies due to inherent tolerances in the semiconductor manufacturing process. The circuit design must function correctly with any LED within this VF range. Using the maximum VF in your current-limiting resistor calculation ensures the LED will not be over-driven even if you receive a unit with a lower VF.

9.3 The storage condition is 3 months. What happens if I use older stock?

Beyond 3 months in standard factory storage, moisture can diffuse into the epoxy package. During soldering, this moisture can rapidly expand, causing internal cracks or "popcorning" that damages the LED. For older stock, a baking process (following the manufacturer's guidelines) is required to remove moisture before soldering. The recommended long-term storage in a nitrogen-filled container with desiccant prevents this issue.

10. Working Principle and Technology Trends

10.1 Basic Operating Principle

This LED is a semiconductor diode based on AlGaInP materials. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region of the PN junction, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the peak wavelength of the emitted light, in this case, yellow-green (~573-575 nm). The green diffused epoxy lens encapsulates the chip, protects it, and shapes the light output beam.

10.2 Objective Technology Context

AlGaInP technology is mature and highly efficient for producing light in the amber, yellow, and green wavelengths. Industry trends continue to focus on increasing luminous efficacy (more light output per electrical watt), improving color consistency through tighter binning, and enhancing reliability under higher temperature and current density conditions. There is also a strong, ongoing drive across the electronics industry to eliminate hazardous substances and reduce the environmental impact of components throughout their lifecycle, which is reflected in this product's compliance certifications.