LED Lamp Array A694B/SURSYG/S530-A3 Datasheet - Red/Yellow-Green - 20mA - English Technical Document

1. Product Overview

The A694B/SURSYG/S530-A3 is a versatile LED lamp array designed for use as a status or function indicator in various electronic instruments and equipment. It consists of a plastic holder that allows for the combination of different LED lamps, providing flexibility in design and application. The product is engineered for low power consumption, high efficiency, and ease of assembly, making it suitable for integration into panels and printed circuit boards (PCBs).

1.1 Core Advantages

• Low Power Consumption: Designed for energy-efficient operation.
• High Efficiency and Low Cost: Offers a cost-effective solution for indicator applications.
• Design Flexibility: Allows for good control and free combinations of LED colors within the array.
• Ease of Assembly: Features a good locking mechanism and is easy to assemble. The array is stackable both vertically and horizontally.
• Versatile Mounting: Can be mounted on PCBs or panels.
• Environmental Compliance: The product complies with RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

Primarily used as indicators for displaying degree, function, position, and other status information in electronic instruments and control panels.

2. Device Selection and Technical Parameters

2.1 Device Selection Guide

The array can be configured with different LED types. The datasheet specifies two part numbers:

• 234-10SURD/S530-A3: Utilizes AlGaInP chip material to emit Brilliant Red light. The resin color is Red Diffused.
• 234-10SYGD/S530-E2: Utilizes AlGaInP chip material to emit Brilliant Yellow Green light. The resin color is Green Diffused.

2.2 Absolute Maximum Ratings (Ta=25°C)

The following ratings define the limits beyond which permanent damage to the device may occur.

Parameter	Symbol	Rating	Unit	Note
Continuous Forward Current	IF	25	mA	Applies to both SUR and SYG types.
Peak Forward Current (Duty 1/10 @ 1KHz)	IFP	60	mA	Applies to both SUR and SYG types.
Reverse Voltage	VR	5	V
Power Dissipation	Pd	60	mW	Applies to both SUR and SYG types.
Operating Temperature	Topr	-40 ~ +85	°C
Storage Temperature	Tstg	-40 ~ +100	°C
Soldering Temperature	Tsol	260	°C	For 5 seconds maximum.

2.3 Electro-Optical Characteristics (Ta=25°C)

These are the typical electrical and optical performance parameters under specified test conditions.

Parameter	Symbol	Min	Typ	Max	Unit	Condition
Forward Voltage	VF	1.7	2.0	2.4	V	IF=20mA (Both SUR & SYG)
Reverse Current	IR	--	--	10	µA	VR=5V (Both SUR & SYG)
Luminous Intensity	IV	40	80	--	mcd	IF=20mA (SUR)
Luminous Intensity	IV	25	50	--	mcd	IF=20mA (SYG)
Viewing Angle (2θ1/2)	--	--	60	--	deg	IF=20mA (Both SUR & SYG)
Peak Wavelength	λp	--	632	--	nm	IF=20mA (SUR)
Peak Wavelength	λp	--	575	--	nm	IF=20mA (SYG)
Dominant Wavelength	λd	--	624	--	nm	IF=20mA (SUR)
Dominant Wavelength	λd	--	573	--	nm	IF=20mA (SYG)
Spectrum Radiation Bandwidth	Δλ	--	20	--	nm	IF=20mA (Both SUR & SYG)

3. Performance Curve Analysis

The datasheet provides characteristic curves for both the SUR (Red) and SYG (Yellow-Green) LED types, illustrating performance under varying conditions.

3.1 SUR (Red LED) Characteristics

Relative Intensity vs. Wavelength: Shows the spectral distribution with a typical peak around 632 nm. Directivity Pattern: Illustrates the 60-degree viewing angle (2θ1/2). Forward Current vs. Forward Voltage (I-V Curve): Demonstrates the relationship between current and voltage, crucial for driver design. At 20mA, the typical V_F is 2.0V. Relative Intensity vs. Forward Current: Shows how light output increases with current up to the maximum rated level. Relative Intensity vs. Ambient Temperature: Indicates the decrease in luminous intensity as ambient temperature rises. Forward Current vs. Ambient Temperature: Can be used to understand derating requirements.

3.2 SYG (Yellow-Green LED) Characteristics

Similar sets of curves are provided for the SYG type, with key differences in wavelength (typical peak at 575 nm) and luminous intensity values. The general trends regarding temperature and current dependence follow similar patterns to the SUR type.

4. Mechanical and Packaging Information

4.1 Package Dimension

A detailed dimensional drawing is provided in the datasheet. Key notes include:

• All dimensions are in millimeters (mm).
• The standard tolerance is ±0.25mm unless otherwise specified.
• Lead spacing is measured at the point where the leads emerge from the package body.

Specific numerical dimensions from the drawing should be referenced for PCB footprint design.

4.2 Polarity Identification

The package drawing indicates the anode and cathode leads. Correct polarity must be observed during assembly to ensure proper function and prevent damage.

5. Soldering and Assembly Guidelines

5.1 Lead Forming

• Bending should occur at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid stressing the LED package during forming to prevent damage or breakage.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage

• Recommended storage: ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipping is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in high humidity to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Method	Parameter	Condition
Hand Soldering	Iron Tip Temperature	300°C Max. (30W Max.)
	Soldering Time	3 seconds Max.
Dip (Wave) Soldering	Preheat Temperature	100°C Max. (60 sec Max.)
	Bath Temperature & Time	260°C Max., 5 sec Max.
	Fluxing	As per standard process

Additional Critical Notes:

• Avoid mechanical stress on leads at high temperatures.
• Do not perform dip or hand soldering more than once.
• Protect the LED from shock/vibration until it cools to room temperature after soldering.
• Avoid rapid cooling processes.
• Always use the lowest effective temperature and shortest time.

A recommended soldering temperature profile graph is provided, showing the time-temperature relationship for preheat, laminar wave, and cooling phases.

6. Packing and Ordering Information

6.1 Packing Specification

The LEDs are packed using moisture-resistant materials.

• Unit Pack: 270 pieces per anti-electrostatic plate.
• Inner Carton: 4 plates per inner carton (1,080 pieces total).
• Master (Outside) Carton: 10 inner cartons per master carton (10,800 pieces total).

6.2 Label Explanation

Labels on the packaging contain the following information:

• CPN: Customer's Production Number.
• P/N: Production Number (e.g., A694B/SURSYG/S530-A3).
• QTY: Packing Quantity.
• CAT: Ranks of Luminous Intensity (binning).
• HUE: Ranks of Dominant Wavelength (binning).
• REF: Ranks of Forward Voltage (binning).
• LOT No: Lot Number for traceability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

This LED array is ideal for applications requiring clear, multi-color status indication:

• Front panels of test and measurement equipment.
• Industrial control units and PLCs.
• Audio/Video equipment status displays.
• Network and communication device indicators.
• Any instrument where "degree, functions, positions" need visual signaling.

The stackable design allows for creating custom clusters or bars of indicators.

7.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit I_F to 20mA (typical) or a maximum of 25mA continuous. The resistor value can be calculated using R = (V_supply - V_F) / I_F.
• Power Dissipation: Ensure the total power dissipation (V_F * I_F) per LED does not exceed 60mW, considering ambient temperature.
• Viewing Angle: The 60-degree viewing angle provides a wide beam, suitable for front-panel mounting where the user may view from slightly off-axis.
• Thermal Management: While these are low-power indicators, proper PCB layout and avoiding enclosed spaces without ventilation will help maintain performance and longevity, especially at high ambient temperatures.
• ESD Protection: Although not explicitly stated as sensitive, handling with standard ESD precautions is recommended during assembly.

8. Technical Comparison and Differentiation

This LED array differentiates itself through its modular "holder + lamp" concept. Unlike single discrete LEDs, it offers a pre-assembled, multi-LED solution that simplifies panel design and assembly. The stackability feature is a key advantage, allowing designers to create linear or block indicators without custom tooling. The use of AlGaInP technology for both red and yellow-green provides good luminous efficiency and color saturation. Compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is a baseline requirement but is explicitly confirmed, which is important for many markets.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between SUR and SYG?

SUR denotes a Brilliant Red LED (typical λ_d 624nm), while SYG denotes a Brilliant Yellow-Green LED (typical λ_d 573nm). They use the same AlGaInP chip technology but are doped differently to produce distinct colors.

9.2 Can I drive these LEDs at 30mA for brighter output?

No. The Absolute Maximum Rating for continuous forward current (I_F) is 25mA. Exceeding this rating risks permanent damage to the LED and voids any reliability specifications. The typical operating current is 20mA.

9.3 The forward voltage has a range (1.7V-2.4V). How do I design my circuit?

Design for the worst-case scenario to ensure proper current limiting across all units. Use the maximum V_F (2.4V) in your series resistor calculation to guarantee the current does not exceed the limit even if an LED with a lower V_F is used. Alternatively, use a constant current driver which is less sensitive to V_F variation.

9.4 What does "stackable vertically and horizontally" mean?

The mechanical design of the plastic holder allows multiple array units to be physically connected side-by-side (horizontally) or on top of each other (vertically), enabling the creation of larger indicator panels or custom shapes without additional brackets or fixtures.

10. Operational Principle and Technology Overview

The LEDs in this array are based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP layers determines the wavelength (color) of the emitted light. A diffused resin lens is used over the chip to scatter the light, creating the wide 60-degree viewing angle and a more uniform appearance. The array concept involves mounting these discrete LED components into a unified plastic housing that provides mechanical support, alignment, and simplifies the electrical connection process for multiple LEDs.

11. Industry Context and Trends

Indicator LEDs are a mature technology, but trends focus on increased efficiency, lower power consumption, and greater design integration. The move towards RoHS, REACH, and Halogen-Free compliance is now standard, driven by global environmental regulations. There is also a trend towards surface-mount device (SMD) indicators for automated assembly, though through-hole designs like this array remain relevant for applications requiring higher mechanical robustness, easier manual assembly, or specific aesthetic profiles. The modular and stackable nature of this product aligns with the trend of providing designers with flexible, building-block components to reduce development time and cost.