C4516SDWN3S1-RGBC0120-2H Smart Pixel LED Datasheet - P-LCC-6 Package - 5V - 120° Viewing Angle - English Technical Document

1. Product Overview

The C4516SDWN3S1-RGBC0120-2H is an integrated smart pixel LED component. It combines red, green, and blue LED chips with a dedicated 3-channel driver integrated circuit (IC) within a single P-LCC-6 surface-mount device (SMD) package. This integration simplifies design by eliminating the need for external driver components for each color channel.

The core function of the integrated driver IC (referred to as 4516-IC in the document) is to provide individual 8-bit Pulse Width Modulation (PWM) linear control for each of the red (R), green (G), and blue (B) LEDs. This allows for the creation of 16.7 million colors (2^24) through precise intensity mixing. Control is achieved via a simple, single-wire serial communication protocol, making it highly cost-effective and easy to implement in various lighting designs.

The package features an inner reflector and is molded from colorless clear resin, contributing to its wide 120-degree viewing angle. The mixture of light from the three primary color LEDs results in a white emission, making this component particularly suitable for backlighting and light pipe applications where uniform, wide-angle illumination is required.

2. Technical Parameter Deep-Dive Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation outside these ranges is not guaranteed.

• Power Supply Voltage (VDD): 6.5V maximum. The typical operating voltage is 5V, providing a safe margin.
• Power Dissipation (PD): Less than 400 mW. This limits the total heat generated by the IC and LEDs combined.
• LED Output Current (Iout): 25 mA maximum per channel. The typical output current is specified as 20 mA in the electrical characteristics.
• Operating Temperature (Topr): -25°C to +85°C. This defines the ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40°C to +90°C.
• Electrostatic Discharge (ESD): Withstands 2000V, indicating a basic level of handling protection.
• Soldering Temperature: Compatible with lead-free (Pb-free) processes: IR reflow soldering at 260°C for a maximum of 10 seconds, or hand soldering at 350°C for a maximum of 3 seconds.

2.2 Electro-Optical Characteristics

Measured at Ta=25°C and VDD=5V, these parameters define the light output performance.

• Luminous Intensity (Iv):
  • Red (R): 450 mcd (Min) to 1120 mcd (Max). Typical value is implied within this range.
  • Green (G): 1120 mcd (Min) to 2800 mcd (Max). Green is typically the brightest channel.
  • Blue (B): 280 mcd (Min) to 710 mcd (Max).
  • Tolerance: ±11% for luminous intensity.
• Viewing Angle (2θ1/2): 100° (Min), 120° (Typical), 140° (Max). The wide 120° typical angle is a key feature.
• Dominant Wavelength (λd):
  • Red: 618 nm to 630 nm.
  • Green: 520 nm to 535 nm.
  • Blue: 463 nm to 475 nm.
  • Tolerance: ±1 nm.
• Chip Materials: Red uses AlGaInP, while Green and Blue use InGaN, which are standard for high-efficiency LEDs.

2.3 Electrical Characteristics

Parameters for the integrated driver IC, specified over Ta=-20 to +70°C and Vdd=4.5 to 5.5V.

• Output Current (IOL): 19 mA (Min), 20 mA (Typ), 21 mA (Max). This is the constant current sourced to each LED.
• Input Logic Levels (for DIN, SET pins):
  • VIH (High-level input voltage): Minimum 2.7V.
  • VIL (Low-level input voltage): Maximum 0.3 * Vdd (e.g., 1.5V max at Vdd=5V).
• Hysteresis Voltage (VH): Typical 0.35V. This provides noise immunity on the input pins.
• Dynamic Current Dissipation (IDD_dyn): Typical 2 mA. This is the operating current of the driver IC itself.

3. Communication Protocol & Timing

The device uses a single-wire, non-return-to-zero (NRZ) communication scheme to receive 24-bit data (8 bits for each R, G, B channel).

3.1 Data Transfer Timing

Logic levels are defined by the duration of the high pulse within a fixed cycle time of 1.2 µs.

• Logic '0': High voltage time (T0H) = 0.30 µs (±0.15µs), Low voltage time (T0L) = 0.90 µs.
• Logic '1': High voltage time (T1H) = 0.90 µs (±0.15µs), Low voltage time (T1L) = 0.30 µs.
• Reset/Latch Signal: A low-level signal on the DIN pin for more than 50 µs (specifically, above 250 µs is shown) latches the received 24-bit data into the output registers, updating the LED brightness.

The data is transmitted MSB (Most Significant Bit) first for each color. The sequence for a single pixel is: R[7], R[6], ... R[0], G[7], ... G[0], B[7], ... B[0]. The DOUT pin retransmits the signal, allowing multiple devices to be daisy-chained from a single controller data line.

4. Mechanical & Package Information

4.1 Package Dimension and Pinout

The device is housed in a P-LCC-6 (Plastic Leaded Chip Carrier) package. The provided dimension drawing shows a typical SMD footprint. Pin configuration is as follows:

1. DI (Data Input): Control data signal input.
2. VDD: Power supply for the control circuit / IC (typically 5V).
3. Anode (Pin 3 & 4): These are connected internally. Power supply input for the R, G, B LED chips. Must be connected to a voltage source through appropriate current-limiting resistors.
4. GND (Ground): Common ground for the IC and LEDs.
5. DOUT (Data Output): Control data signal output for daisy-chaining to the next device's DI pin.

Critical Design Note: The datasheet explicitly warns that external current-limiting resistors must be applied in series with the Anode pins. Without them, even a slight increase in the anode supply voltage can cause a large, destructive current change through the LEDs.

5. Soldering, Assembly & Storage Guidelines

5.1 Soldering Conditions

The component is Pb-free and compatible with IR reflow soldering. A recommended lead-free temperature profile is provided:

• Pre-heating: 150–200°C for 60–120 seconds (max ramp 3°C/sec).
• Reflow: Above 217°C for 60–150 seconds, with peak temperature not exceeding 260°C for a maximum of 10 seconds.
• Cooling: Maximum ramp-down rate of 6°C/sec.
• Important: Reflow soldering should not be performed more than two times. Stress should not be applied to the package during heating, and the PCB should not be warped after soldering.

5.2 Moisture Sensitivity and Storage

The device is packaged in moisture-resistant barrier bags with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH). Do not open the bag until ready for use.
• After Opening (Floor Life): Components must be soldered within 24 hours of opening the moisture-proof bag.
• Baking: If the storage time is exceeded or the desiccant indicates moisture ingress, a baking treatment of 60°C ±5°C for 24 hours is required before use.

6. Packaging and Ordering

The product is supplied on embossed carrier tape, which is then wound onto reels. The standard loaded quantity is 2000 pieces per reel. The packaging materials and process are designed to be moisture-resistant. Labels on the reel include standard identifiers such as Product Number (P/N), quantity (QTY), and lot number (LOT No.). The datasheet also references bins for Luminous Intensity Rank (CAT), Dominant Wavelength Rank (HUE), and Forward Voltage Rank (REF), indicating the product may be available in pre-sorted performance grades.

7. Application Suggestions and Design Considerations

7.1 Typical Applications

• Indoor/Outdoor LED Video Displays: Ideal for low-to-medium resolution full-color displays, signage, and message boards due to integrated control and daisy-chaining capability.
• Full-Color LED Light Strips: Enables addressable RGB LED strips for decorative, architectural, and entertainment lighting.
• LED Decorative Lighting: Suitable for color-changing lighting fixtures, accent lighting, and interactive installations.
• Gaming Exterior Lighting: Can be used in PC case lighting, keyboard backlighting, or other gaming peripherals.
• Light Pipe/Backlighting: The wide viewing angle and white emission mix make it a good candidate for edge-lit or direct-lit light guide applications.

7.2 Critical Design Considerations

1. Current Limiting Resistors: This is the most critical external component. Resistors must be placed in series with the Anode supply for each color channel (or a common resistor if using a single supply voltage for all colors) to set the maximum current and protect the LEDs. The value must be calculated based on the Anode supply voltage (V_anode), the LED forward voltage (Vf, estimated from typical curves), and the desired current (I, typically 20mA). R = (V_anode - Vf) / I.
2. Power Supply Decoupling: A bypass capacitor (e.g., 0.1µF) should be placed close to the VDD pin to stabilize the IC's power supply and filter noise.
3. Data Line Integrity: For long daisy-chains or in electrically noisy environments, consider adding a small series resistor (e.g., 100Ω) at the controller output and/or a pull-up resistor on the data line to ensure clean signal edges.
4. Thermal Management: While the package is low-power, high ambient temperatures or driving all three LEDs at maximum brightness simultaneously can approach the power dissipation limit. Ensure adequate PCB copper or heatsinking if used in high-density arrays.
5. Timing Compliance: The microcontroller or driver generating the data signal must adhere strictly to the T0H, T1H, and reset timing specifications to ensure reliable communication.

8. Technical Comparison and Differentiation

The C4516SDWN3S1 integrates the driver and LEDs, which differentiates it from discrete solutions (separate LED + external driver IC). Key advantages include:

• Simplified Design: Reduces component count, PCB footprint, and assembly complexity.
• Single-Wire Control: Minimizes wiring, especially in multi-pixel arrays, compared to solutions requiring separate clock and data lines (e.g., SPI).
• Integrated Form Factor: The P-LCC-6 is a common, easy-to-assemble SMD package.
• Wide Viewing Angle: The 120° angle is superior to many LEDs with narrower beams, beneficial for diffuse lighting applications.
• Potential Limitations: The integration means the LED performance (wavelength, intensity) is fixed to the chosen bins. The maximum output current per channel (25mA) is suitable for indicator and decorative purposes but may be lower than high-power discrete LEDs.

9. Frequently Asked Questions (FAQ)

9.1 How many of these LEDs can I daisy-chain?

Theoretically, a very large number, limited primarily by the data refresh rate. Each pixel requires 24 bits of data. The data rate is determined by the 1.2 µs per bit time. To update a chain of N pixels, you need (24 * N) bits plus a final reset pulse (>50 µs). For a 30 Hz refresh rate, you could chain hundreds of pixels. The practical limit is set by signal integrity and power distribution over long chains.

9.2 Why are external resistors absolutely necessary?

The integrated driver IC provides a constant current sink on the cathode side of each LED (connected internally). However, the current value is set by the voltage difference between the Anode pin (supplied externally) and the IC's internal reference. Without a series resistor, the Anode voltage directly sets the current. LED forward voltage (Vf) has a negative temperature coefficient (it decreases as the LED heats up). A slight increase in supply voltage or a decrease in Vf due to heating can cause a runaway increase in current, leading to rapid failure. The resistor provides negative feedback, stabilizing the current.

9.3 Can I use a 3.3V microcontroller to control the DIN pin?

Potentially, but with caution. The VIH minimum is 2.7V. A 3.3V logic high (~3.3V) meets this specification. However, noise margins are reduced. It is crucial to ensure clean signals. If possible, using a 5V microcontroller or a level shifter is recommended for robust operation.

9.4 What is the purpose of the SET pin mentioned in electrical characteristics?

While the primary data pin is DIN, the reference to a SET pin in the input voltage specifications suggests there may be an additional pin for configuration (e.g., setting a global brightness or mode). The main pin description only lists DI, VDD, Anode, GND, DOUT. Designers should consult the most detailed version of the driver IC datasheet for clarification on pin functionality if the SET pin is present on a specific variant.

10. Operating Principle Introduction

The device operates on a simple serial-in, parallel-out shift register principle combined with constant current sinks. The 24-bit serial data stream is clocked into an internal shift register via the timing on the DI pin. Each bit corresponds to the desired on/off state for a specific sub-period within the PWM cycle for one color channel. Once the entire 24-bit frame is received, a prolonged low signal (reset) latches this data into a second set of registers that directly control the output current sinks. These current sinks then turn on for a fraction of each PWM period proportional to the 8-bit value for each color, creating the perceived brightness and color. The DOUT pin provides the shifted-out data from the internal register, enabling the cascade.

11. Development Trends and Context

Devices like the C4516SDWN3S1 represent a mature and cost-optimized segment of the addressable LED market. The technology trends in this area include:

• Higher Integration: Moving towards drivers that control more channels (e.g., 4-channel RGBW) or include additional functions like gamma correction and error diffusion in the IC.
• Improved Communication Protocols: While single-wire is simple, newer protocols offer higher data rates (like the WS2812B's 800kHz) or improved noise immunity (differential signaling, like in professional LED panels).
• Higher Bit Depth: Progression from 8-bit (256 levels) to 10-bit, 12-bit, or even 16-bit PWM per channel for smoother color gradients and high dynamic range in professional lighting.
• Enhanced Thermal and Electrical Performance: Designs with lower voltage drops, higher efficiency, and better thermal paths to allow for higher sustained brightness.
• Standardization: Growth of industry-standard digital protocols (e.g., DMX, Art-Net) interfacing with these pixel drivers for large-scale installations.

This component sits firmly in the mainstream of low-cost, digitally addressable RGB LEDs, balancing performance, simplicity, and cost effectively for a wide range of consumer and commercial applications.